KR20130052353A

KR20130052353A - Support apparatus for electroplating

Info

Publication number: KR20130052353A
Application number: KR1020110117753A
Authority: KR
Inventors: 류한웅
Original assignee: 삼성전기주식회사
Priority date: 2011-11-11
Filing date: 2011-11-11
Publication date: 2013-05-22

Abstract

PURPOSE: An electroplating support apparatus is provided to apply an auxiliary cathode which is arranged onto an area of a panel on which current is concentrated, thereby minimizing thickness deviation by removing the phenomenon in which current is concentrated on the edge of the panel. CONSTITUTION: An electroplating support apparatus includes a supporting unit(120), and a first and a second auxiliary cathode(131,133), and a connection unit(135). The supporting unit fixes a panel(110) which has a first side and a second side. The first and the second cathode are separated to be inserted into the panel, and formed respectively on the first and the second side of the panel in a vertical direction. The connection unit connects the first and the second auxiliary cathode, and fixes the first and the second auxiliary cathode on the supporting unit. The first and the second auxiliary cathode are formed multiply on both sides of the panel.

Description

Support Apparatus for Electroplating {Support Apparatus for Electroplating}

The present invention is of the vertical type It relates to a support device for electroplating.

As disclosed in Document 1, an electroplating apparatus for performing electroplating on a plating target such as a panel is applied.

In addition, in order to form the circuit of the tenting method, the panel is electroplated and then etched to form a circuit. When the panel is plated, current is concentrated at the edge of the panel, so that the plating growth is applied to the edge of the panel. Acceleration results in variations in the plating thickness of the panel.

The above-described thickness variation of the panel has a problem of causing short defects by energizing electricity between independent circuit patterns.

Document 1 KR 10-2010-0115294 A 2010. 10. 27

The present invention is to solve the above problems of the prior art, an aspect of the present invention is to provide an electroplating support device for improving the plating thickness variation of the panel during electroplating.

Electroplating support apparatus according to an embodiment of the present invention, the support for fixing the panel having a first surface and the second surface;

First and second auxiliary cathodes formed to be spaced apart from each other so that the panel can be inserted and formed in a direction perpendicular to the first and second surfaces of the panel; And

A connection part connecting the first and second auxiliary cathodes and fixing the first and second auxiliary cathodes to the support part, wherein the first and second auxiliary cathodes are formed on both sides of the panel. Can be.

Here, the panel may be a printed circuit board.

In addition, the first and second auxiliary cathodes may be made of SUS.

In addition, the first and second auxiliary cathodes may have a plate shape.

In addition, a plurality of through holes may be formed in the first and second auxiliary cathodes.

In addition, the connection portion may be in the form of detachable to the support.

In addition, the connecting portion is characterized in that fixed to the support portion via a connecting member.

In addition, the connection part may be formed to connect and fix the spaced area between the first and second auxiliary cathodes.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Since the electroplating support apparatus according to the embodiment of the present invention applies an auxiliary cathode disposed in a region where current is concentrated in the panel, an effect of minimizing thickness variation by eliminating current concentration at the panel edge can be expected. have.

In addition, since the embodiment of the present invention applies the auxiliary cathode in the vertical direction of the panel, there is no need for additional play between the panel and the panel, thereby controlling the thickness variation without reducing the production capacity.

In addition, the embodiment of the present invention is generated in the edge region of the panel due to the reduction in the plating thickness variation There is an advantage in that the non-etching defect can be reduced.

In addition, the embodiment of the present invention can simplify the etching procedure after plating by reducing the thickness variation of the panel plating, and thus can be expected to improve the product production capacity.

1 is a view showing the configuration of an electroplating support apparatus according to an embodiment of the present invention,
FIG. 2 is a view showing a part of the electroplating support apparatus of FIG. 1 in detail; FIG.
3 is a view showing a configuration of an electroplating support apparatus before mounting an auxiliary cathode according to an embodiment of the present invention;
4 is a view showing an example of current distribution of a general electroplating apparatus;
5 is a view for explaining an example of the current distribution in the case of applying the electroplating support apparatus according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In this specification, terms such as first and second are used to distinguish one component from another component, and a component is not limited by the terms.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Electroplating Support Device

1 is a view showing a configuration of an electroplating support apparatus according to an embodiment of the present invention, FIG. 2 is a view showing a part of the electroplating support apparatus of FIG. 1 in detail, and FIG. 3 is an embodiment of the present invention. 4 is a view showing the configuration of the electroplating support apparatus before mounting the auxiliary cathode according to the present invention, FIG. 4 is a diagram showing an example of current distribution of a general electroplating apparatus, and FIG. The figure for explaining the example of current distribution in the case of applying the apparatus.

As shown in FIGS. 1 and 2, the electroplating support device 100 may include a support 120 and a panel 110 for fixing the panel 110 having first and second surfaces. The first and second auxiliary cathodes 131 and 133 and the first and second auxiliary cathodes 131 and 133 which are formed to be spaced apart from each other and are formed in a direction perpendicular to the first and second surfaces of the panel 110, respectively. The connection unit may include a connection unit 135 for fixing the first and second auxiliary cathodes 131 and 133 to the support unit 120.

Here, the plurality of first and second auxiliary cathodes 131 and 133 may be formed on both sides of the panel.

That is, the first and second auxiliary cathodes 131 and 133 are installed on both sides of the panel 110 corresponding to the area where the electroplating thickness variation occurs, and are installed in a vertical type with respect to the panel surface.

In addition, the formation regions of the first and second auxiliary cathodes 131 and 133 are not limited to both sides of the panel described above, and may be formed in other regions of the panel 110 as required by the operator. .

In addition, the panel 110 may be a printed circuit board.

In addition, the first and second auxiliary cathodes 131 and 133 may be made of SUS, and the present invention is not limited thereto.

In more detail, the first and second auxiliary cathodes 131 and 133 may be made of a material that prevents current concentration at the edge portion of the panel 110.

In addition, as illustrated in FIGS. 1 and 2, the first and second auxiliary cathodes 131 and 133 may have a plate shape.

Here, the first and second auxiliary cathodes 131 and 133 have a plate shape, and it is possible to vary the area of the auxiliary cathode according to the specifications of the panel (for example, plating thickness specification and design).

In addition, a plurality of through holes 137 may be formed in the first and second auxiliary cathodes 131 and 133.

Here, the through holes 137 formed in the first and second auxiliary cathodes 131 and 133 serve to enlarge the areas of the first and second auxiliary cathodes 131 and 133.

This may increase the area of the first and second auxiliary cathodes 131 and 133, thereby acting as an advantage of maximizing the auxiliary cathode effect.

In addition, as shown in FIGS. 1 and 2, the connection part 135 may be formed to connect and fix the separation area between the first and second auxiliary cathodes 131 and 133.

In addition, the connecting portion 135 may be in a form that can be detached to the support 120.

In addition, the connection part 135 may be fixed to the support part 120 through a connection member (not shown).

For example, the connection member may be in the form of coupling the connection portion 135 to the support portion 120, such as a screw, or may be in the form of fitting the connection portion 135 to the support portion 120, such as a clip, but is not limited thereto.

In FIG. 1, for convenience of description, only one panel 110 fixed to the support 120 is described as an example, but is not limited thereto.

For example, as shown in FIG. 3, a structure in which a plurality of panels 110 are connected to the support 120 is also possible.

In this case, a phenomenon occurs in which current is concentrated in a region A spaced between the panel 110 and the panel 110 and at the same time as the edge region of the panel, thereby causing variation in plating thickness of the panel.

Thus, as shown in FIG. 1, the first and second auxiliary cathodes 131 and 133 may be fastened between the panel 110 and the panel 110.

This may prevent concentration of current in the edge region of the panel 110, thereby improving the plating thickness variation of the panel 110.

In more detail, FIGS. 4 and 5 are views illustrating a state of current after arranging a copper ball corresponding to a positive (+) state and a panel 110 in a negative (-) state to face each other.

As shown in FIG. 4, in general, current is concentrated in edge regions corresponding to both sides of the panel 110. As illustrated in FIG. 5, an embodiment of the present invention includes auxiliary cathodes on both sides of the panel 110. Since the 131 and 133 are formed in the vertical direction, the current distribution is dispersed due to the auxiliary cathode, thereby eliminating the current concentration phenomenon in the edge region of the panel 110.

In addition, in the embodiment of the present invention, as the plating thickness of the panel 110 is uniformly grounded by the auxiliary cathodes 131 and 133, the amount of etching performed on the entire panel 110 is also uniform.

This is because the plating thickness is partially unbalanced on the surface of the panel 110 so that an area in which etching is not performed does not occur, and thus, a short defect can be minimized.

In addition, embodiments of the present invention can simplify the etching conditions due to the reduction in panel plating thickness variation.

In more detail, after the panel plating, the process is performed in the order of developing, etching, and peeling to form a circuit layer, wherein the design process (for example, plating thickness specification, circuit line width, and circuit line width, etc.) is performed in the etching process. The etching conditions are variously set accordingly.

In the embodiment of the present invention, since the plating thickness variation of the panel after the electroplating is uniform, the etching conditions can be minimized, so that the effect of saving the processing time and improving the skipping ability can be expected.

Although the present invention has been described in detail through specific embodiments, it is intended to describe the present invention in detail, and the electroplating support apparatus according to the present invention is not limited thereto, and the technical features of the present invention may be used. It is obvious that modifications and improvements are possible by those skilled in the art.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: electroplating support device
110: Panel
120: support
131 and 133: first and second auxiliary cathodes
135 connection
137: through hole

Claims

A support for fixing a panel having a first side and a second side;
First and second auxiliary cathodes formed to be spaced apart from each other so that the panel can be inserted and formed in a direction perpendicular to the first and second surfaces of the panel; And
A connection part connecting the first and second auxiliary cathodes and fixing the first and second auxiliary cathodes to the support part;
And a plurality of first and second auxiliary cathodes formed on both sides of the panel.

The method according to claim 1,
The panel is a electroplating support device for a printed circuit board.

The method according to claim 1,
The first and second auxiliary cathodes are electroplating support device made of SUS.

The method according to claim 1,
The first and second auxiliary cathodes are electroplating support device in the form of a plate.

The method according to claim 1,
The first and second auxiliary cathodes are electroplating support device formed with a plurality of through holes.

The method according to claim 1,
The connecting part is an electroplating support device that is removable form the support.

The method according to claim 1,
The connecting portion is electroplating support device is fixed to the support via a connecting member.

The method according to claim 1,
And the connection part is configured to connect and fix the spaced area between the first and second auxiliary cathodes.