KR20130048606A - Method and apparatus for bonding semiconductor device using uv or micro short wave - Google Patents

Method and apparatus for bonding semiconductor device using uv or micro short wave Download PDF

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Publication number
KR20130048606A
KR20130048606A KR1020110113544A KR20110113544A KR20130048606A KR 20130048606 A KR20130048606 A KR 20130048606A KR 1020110113544 A KR1020110113544 A KR 1020110113544A KR 20110113544 A KR20110113544 A KR 20110113544A KR 20130048606 A KR20130048606 A KR 20130048606A
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KR
South Korea
Prior art keywords
ultraviolet
substrate
semiconductor chip
adhesive
semiconductor device
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Application number
KR1020110113544A
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Korean (ko)
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KR101274674B1 (en
Inventor
김영부
김영배
안도석
김동성
Original Assignee
에스케이하이이엔지 주식회사
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Priority to KR1020110113544A priority Critical patent/KR101274674B1/en
Publication of KR20130048606A publication Critical patent/KR20130048606A/en
Application granted granted Critical
Publication of KR101274674B1 publication Critical patent/KR101274674B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

Abstract

A mounting part to mount a substrate and a semiconductor chip to be bonded onto the substrate; An ultraviolet adhesive coating unit for applying an ultraviolet adhesive to be filled between the substrate and the semiconductor chip; An ultraviolet irradiator for irradiating ultraviolet rays for curing the ultraviolet adhesive; A micro short wave irradiation unit generating a micro short wave for bonding between the metal material of the substrate and the metal material of the semiconductor chip and irradiating the semiconductor device; And a semiconductor device bonding apparatus using ultraviolet or micro shortwave is provided, including a pressing portion for pressing the semiconductor chip when the substrate and the semiconductor chip are bonded.

Description

Semiconductor device bonding apparatus using ultraviolet rays or micro shortwaves and its method {METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR DEVICE USING UV OR MICRO SHORT WAVE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device bonding apparatus and a method thereof, and more particularly, to perform bonding between semiconductor devices at low or normal temperatures, effectively preventing damage to the semiconductor device, and using ultraviolet or micro shortwaves, which can ensure the reliability of the bonding. A semiconductor device bonding apparatus and its method.

With the recent increase in the use of small multimedia devices such as mobile phones, portable multimedia players (PMPs) and notebooks, the electronic packaging industry is developing into high performance, high integration, miniaturization and light weight.

In addition, to reduce the loss of electrical signals, the flexible and flexible flexible printed circuit boards (FPCBs) and the cheap and reliable rigid printed circuit boards are used in the electrical and electronics industries. There is much interest in direct splicing.

Korean Patent Publication No. 10-2009-0028160 (Chip Bonder) describes a technique for bonding a semiconductor chip on a substrate, and Republic of Korea Patent No. 10-0487998 (Flip Chip Bonder and Bonder method) for bonding flipping The technique is described.

Usually, in order to bond a semiconductor chip to a board | substrate, the method of thermofusion is used, pressurizing by giving a fixed temperature, pressure, and time.

In addition, it serves as an adhesive that bonds the semiconductor chip and the substrate and at the same time

An adhesive resin that prevents vaginal penetration and is an anisotropic conductive film (ACF), anisotropic conductive adhesive (ACA), non-conductive polymer (NCP) or non-conductive film (non-conductive). film, NCF) and the like.

The method of heating a substrate or a semiconductor chip at a constant temperature includes a method using a device equipped with a hot bar equipped with a heater (thermal compression method), a method of using friction heat of a contact part using a micro short wave (micro short wave method), or using a laser. Method (laser method) and the like can be used.

The thermocompression method can damage the mounted components due to the high bonding temperature. For example, when a PET or plastic substrate is used as the material of the flexible printed circuit board, the substrate may be melted. In the case of metal bonding, the bonding process temperature is high, and components mounted on the substrate may be damaged.

Also, adhesives such as anisotropic conductive films (ACFs), anisotropic conductive adhesives (ACAs), or non-conductive polymers (NCP) or non-conductive films (NCF) The joining method using is a problem of high bonding pressure and low reliability.

The problem to be solved by the present invention is to solve the problems of the conventional methods used to bond the semiconductor devices to each other, and to perform the bonding between the semiconductor devices at a low temperature or room temperature to effectively prevent damage to the semiconductor device while improving the reliability of the bonding The present invention provides a semiconductor device bonding apparatus and method thereof that can be ensured.

According to an aspect of the invention, the mounting portion for mounting a substrate and a semiconductor chip to be bonded on the substrate; An ultraviolet adhesive coating unit for applying an ultraviolet adhesive to be filled between the substrate and the semiconductor chip; An ultraviolet irradiator for irradiating ultraviolet rays for curing the ultraviolet adhesive; A micro short wave irradiation unit generating a micro short wave for bonding between the metal material of the substrate and the metal material of the semiconductor chip and irradiating the semiconductor device; And a semiconductor device bonding apparatus using ultraviolet or micro shortwave is provided, including a pressing portion for pressing the semiconductor chip when the substrate and the semiconductor chip are bonded.

The ultraviolet rays irradiated from the ultraviolet irradiator may have a peak wavelength band of 350 nm to 480 nm.

The semiconductor device bonding apparatus may further include a coating unit coating graphite or carbon on at least one side of a metal material of the substrate and a metal material of the semiconductor chip.

The ultraviolet adhesive may be ultraviolet, thermosetting combined adhesive mixed with an ultraviolet curing component to a thermosetting adhesive.

The ultraviolet irradiation unit may be installed to irradiate a portion of the ultraviolet adhesive filled between the substrate and the semiconductor chip flowed out to the edge.

According to another aspect of the invention, the step of mounting the substrate in the mounting portion; Applying an ultraviolet adhesive on the substrate; Placing a bumped semiconductor chip on the substrate to which the ultraviolet adhesive is applied; And irradiating ultraviolet rays for curing the ultraviolet adhesive while pressing the semiconductor chip from the top, and irradiating micro short waves for bonding the bumps of the semiconductor chips and metal pads formed on the substrate. A semiconductor device bonding method is provided.

The ultraviolet light may have a peak wavelength band of 350 nm to 480 nm.

The method of bonding a semiconductor device using the ultraviolet rays or the micro shortwave may further include coating graphite or carbon on at least one side of a metal pad of the substrate and a bump of the semiconductor chip.

According to the present invention, the microshort wave is irradiated by the microshort wave irradiation unit at the same time as the crimping of the crimping unit to bond the bump formed on the semiconductor chip to the pad formed on the substrate, and the ultraviolet adhesive is cured to lower the temperature or room temperature. Bonding between semiconductor devices can be performed on the substrate to effectively prevent damage to the semiconductor device while ensuring the reliability of the bonding.

1 is a block diagram illustrating a semiconductor device bonding apparatus using ultraviolet light or micro shortwave waves according to an embodiment of the present invention.
2 is a view illustrating a semiconductor device for explaining a method of bonding a semiconductor device using ultraviolet rays or microshort waves according to an embodiment of the present invention.
3 is a flowchart illustrating a method of bonding a semiconductor device using ultraviolet rays or microshort waves according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, etc. of constituent elements can be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a block diagram illustrating a semiconductor device bonding apparatus using ultraviolet light or micro shortwave waves according to an embodiment of the present invention.

Referring to FIG. 1, the semiconductor device bonding apparatus 100 using ultraviolet rays or micro short waves according to an embodiment of the present invention may include an ultraviolet irradiation unit 110, a micro short wave irradiation unit 120, a mounting unit 130, and a crimping unit ( 140, the ultraviolet adhesive applying unit 150, the coating processing unit 160, the transfer unit 170, may be configured to include a controller 180.

The ultraviolet irradiation unit 110 irradiates ultraviolet rays for curing the ultraviolet adhesive. At this time, the ultraviolet ray used preferably has a peak wavelength band of 350 nm to 480 nm.

The micro short wave irradiation part 120 generates a micro short wave and irradiates a semiconductor device. The micro short wave irradiated from the micro short wave irradiation unit 120 may perform bonding between metal materials through the micro short wave. The metal material may correspond to the pad 211 formed on the substrate 210 and the bump 240 formed on the semiconductor chip 220.

The mounting unit 130 may include a support for mounting the substrate 210 and the semiconductor chip 220 to be bonded onto the substrate 210, and a holder for fixing the mounted substrate 210 and the semiconductor chip 220. Can be.

The crimping unit 140 performs a function of compressing the semiconductor chip 220 and the substrate 210 from the top in a state in which the substrate 210 and the semiconductor chip 220 are mounted on the mounting unit 130. The crimping unit 140 performs a function of pressing until the substrate 210 and the semiconductor chip 220 are completely bonded.

The ultraviolet adhesive applying unit 150 applies the ultraviolet adhesive 230 to the bonding portion of the substrate 210 to which the semiconductor chip 220 is to be bonded.

The ultraviolet adhesive 230 is an ultraviolet-ray and thermosetting combined type adhesive agent which mixed the ultraviolet curable component with the thermosetting adhesive. Specifically, a urethane acrylate resin may be blended with benzoin alkyl ether as the photopolymerization initiator and acrylic acid ester as the thermosetting initiator. The ultraviolet adhesive 230 is preferably an insulating material.

The coating processing unit 160 coats carbon or graphite when irradiating micro shortwaves for bonding between metals.

The controller 180 applies the ultraviolet irradiation unit 110, the micro short wave irradiation unit 120, the mounting unit 130, the pressing unit 140, and the ultraviolet adhesive to drive the semiconductor device bonding apparatus 100 using ultraviolet rays or micro short waves. The operation of the unit 150, the coating processing unit 160, and the transfer unit 170 is controlled.

2 is a view illustrating a semiconductor device for explaining a method of bonding a semiconductor device using ultraviolet rays or microshort waves according to an embodiment of the present invention.

Referring to FIG. 2, a substrate 210 is mounted on the mounting unit 130, and a semiconductor chip 220 to be bonded on the substrate 210 is disposed through the bump 221. The ultraviolet adhesive 230 is interposed between the substrate 210 and the semiconductor chip 220. Ultraviolet adhesive 230 may be used as an under fill. The bump 221 is bonded to the pad 211 formed on the substrate 210.

3 is a flowchart illustrating a method of bonding a semiconductor device using ultraviolet rays or microshort waves according to an embodiment of the present invention.

2 and 3, the transfer unit 170 positions the substrate 210 on the mounting unit 130 (S1). The pad 211 is formed on the substrate 210 (S2). The pad 211 is a portion electrically bonded to the bumps 240 of the semiconductor chip 220, for example, Au may be used.

The ultraviolet adhesive applying unit 150 applies the ultraviolet adhesive 230 on the substrate 210. The ultraviolet adhesive applying unit 150 is applied to a sufficient thickness in consideration of the thickness of the bump 240 and the pad 211 when applying the ultraviolet adhesive 230 on the substrate 210 (S3).

The bump 240 is formed on the semiconductor chip 220. The bump 240 may be made of Au for bonding to the pad 211. The transfer unit 170 transfers the semiconductor chip 220 onto the substrate 210 coated with the ultraviolet adhesive 230 so that the bump 240 and the pad 211 of the semiconductor chip 220 face each other and coincide with each other. Position alignment is performed (S4).

The pressing unit 140 applies a force from the upper portion of the semiconductor chip 220 toward the substrate 210 to compress the semiconductor chip 220 and the substrate 210 (S5). The force applied to the upper portion of the semiconductor chip 220 by the crimping unit 140 is pressed and fixed to sufficiently bond the bump 240 and the pad 211 by the micro short wave irradiated from the micro short wave irradiation unit 120. If the pressure is enough.

The pressure is applied to the upper portion of the semiconductor chip 220 by the crimping unit 140, and the micro short wave irradiation unit 120 irradiates the short 240 and the pad 211 to the micro short wave (S6). The junction between the bump 240 and the pad 211 is achieved by the micro short wave.

As the pressure is applied to the upper portion of the semiconductor chip 220 by the crimping unit 140, the ultraviolet adhesive 230 is pressed around the semiconductor chip 220 to spread toward the edge.

In addition, the ultraviolet irradiation unit 110 irradiates ultraviolet rays to the ultraviolet adhesive 230 (S7). The ultraviolet adhesive 230 is an ultraviolet-ray and thermosetting combined type adhesive agent which mixed the ultraviolet curable component with the thermosetting adhesive. Therefore, the ultraviolet adhesive 230 is cured by the ultraviolet adhesive 230 irradiated from the ultraviolet irradiation part 110. On the other hand, the ultraviolet irradiation unit 110 may be installed to irradiate the edge when the ultraviolet adhesive 230 is pressed and spread toward the edge. However, the present invention is not limited thereto and may change the position of the ultraviolet irradiation part 110 as necessary.

When the semiconductor chip 240 is pressed by the crimping unit 140, the operation of pressing and spreading the ultraviolet adhesive 230 is performed smoothly so that the bump 240 is normally pressed to the pad 211. The micro short wave irradiation of the micro short wave irradiation unit 120 is continued for several seconds. Moreover, hardening of the part which flowed out from the peripheral edge of the semiconductor chip 220 in the ultraviolet adhesive 230 advances. As such, since the exposed portion of the ultraviolet adhesive 230 from the peripheral edge of the semiconductor chip 220 is cured, the ultraviolet adhesive 230 is required to the outside of the substrate when irradiating the micro short wave in the micro short wave irradiation unit 120. Abnormal flow out is prevented.

Thereafter, a heat treatment process may be performed to improve the curing rate of the ultraviolet adhesive 230 on the substrate 210. The heat treatment process is optional and the present invention is not limited thereto. Heat treatment may be supplied to the heat through a hot plate installed in the lower portion of the mounting unit 130, or may be heat treatment by transferring the substrate to a separate heating furnace.

At the same time as the crimping unit 140 is pressed, the micro short wave is irradiated by the micro short wave irradiation unit 120 to bond the bump 240 formed on the semiconductor chip 220 and the pad 211 formed on the substrate 210. Therefore, since the ultraviolet adhesive 230 does not flow much outward from the semiconductor chip 220, the bonding between the bump 240 and the pad 211 by a micro short wave can be performed favorably.

In addition, since the peripheral portion of the adhesive is to be cured by light or heat, the peripheral portion of the insulating adhesive pressed and spread between the semiconductor chip and the substrate can be quickly and stably cured.

Meanwhile, at least one of the bumps 240 or the pads 211 before the bumps 240 and the pads 211 are bonded in order to improve the bonding speed and local heating by the micro short wave between the bumps 240 and the pads 211. Carbon or graphite coating may be made on either surface.

When carbon or graphite is coated on the surface of the bump 240 or the pad 211, the bonding performance may be further improved during the bonding by the micro short wave. Such carbon or graphite coating may be made by the coating treatment unit 160.

The invention being thus described, it will be obvious that the same way may be varied in many ways. Such modifications are intended to be within the spirit and scope of the invention as defined by the appended claims.

For example, in the embodiment of the present invention, a semiconductor device having flip chip bonding has been described. However, the present invention is not limited thereto and can be modified as many as possible. In addition, in the embodiments of the present invention, the bonding between the substrate and the semiconductor chip has been described, but the present invention is not limited thereto, and the present invention may be modified and applied to the bonding between the substrate and another substrate. In addition, although the bonding between the pads and the bumps of the substrate has been described with respect to the bonding between the metal materials in the embodiment of the present invention, the present invention is not limited thereto, and the present invention is not limited thereto. It can be modified and applied.

100 semiconductor device bonding apparatus 110 ultraviolet irradiation unit
120: micro short wave irradiation unit 130: mounting part
140: crimping section 150: UV adhesive coating
160: coating treatment unit 170: transfer unit
180 control unit 210 substrate
211: pad 220: semiconductor chip
230: ultraviolet adhesive 240: bump

Claims (8)

A mounting part to mount a substrate and a semiconductor chip to be bonded onto the substrate;
An ultraviolet adhesive coating unit for applying an ultraviolet adhesive to be filled between the substrate and the semiconductor chip;
An ultraviolet irradiator for irradiating ultraviolet rays for curing the ultraviolet adhesive;
A micro short wave irradiation unit generating a micro short wave for bonding between the metal material of the substrate and the metal material of the semiconductor chip and irradiating the semiconductor device; And
And a crimping part for crimping the semiconductor chip at the time of bonding the substrate and the semiconductor chip. The method according to claim 1,
The ultraviolet-ray irradiated from the said ultraviolet irradiation part has a peak wavelength band of 350 nm-480 nm, The semiconductor device bonding apparatus using ultraviolet-ray or a micro short wave. The method according to claim 1,
And a coating part for coating graphite or carbon on at least one side of the metal material of the substrate and the metal material of the semiconductor chip. The method according to claim 1,
The ultraviolet adhesive is a semiconductor device bonding apparatus using ultraviolet or micro shortwave, characterized in that the ultraviolet-ray, a thermosetting combined type adhesive agent mixed with an ultraviolet curing component to a thermosetting adhesive. The method according to claim 1,
The ultraviolet irradiation unit is a semiconductor device bonding apparatus using ultraviolet or micro shortwave, characterized in that the ultraviolet adhesive filled between the substrate and the semiconductor chip to irradiate the portion flowing out to the edge. Mounting a substrate on the mounting unit;
Applying an ultraviolet adhesive on the substrate;
Placing a bumped semiconductor chip on the substrate to which the ultraviolet adhesive is applied;
Irradiating ultraviolet rays for curing the ultraviolet adhesive while pressing the semiconductor chip from the top, and irradiating microshort waves for bonding the bumps of the semiconductor chip and the metal pad formed on the substrate. Semiconductor device bonding method used. The method according to claim 6,
The ultraviolet light has a peak wavelength band of 350nm ~ 480nm, the semiconductor device bonding method using ultraviolet or micro shortwave. The method of claim 6,
And coating graphite or carbon on at least one side of the metal pad of the substrate and the bump of the semiconductor chip.
KR1020110113544A 2011-11-02 2011-11-02 Method and apparatus for bonding semiconductor device using uv or micro short wave KR101274674B1 (en)

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Application Number Priority Date Filing Date Title
KR1020110113544A KR101274674B1 (en) 2011-11-02 2011-11-02 Method and apparatus for bonding semiconductor device using uv or micro short wave

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KR101274674B1 KR101274674B1 (en) 2013-06-17

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Publication number Priority date Publication date Assignee Title
KR100628900B1 (en) * 2000-04-25 2006-09-27 후지쯔 가부시끼가이샤 Method of mounting semiconductor chip
JP2005033053A (en) * 2003-07-08 2005-02-03 Lintec Corp Manufacturing method of semiconductor device and semiconductor device
TWI391037B (en) * 2009-11-09 2013-03-21 Advance Materials Corp Pad structure and manufacturing method thereof

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