KR20130045749A - Manufacturing method of flexible dislay panel and fixing and supporting substrate for manufacturing flexible dislay panel - Google Patents

Abstract

PURPOSE: A method for manufacturing a flexible display panel and a fixing/supporting substrate for manufacturing the flexible display panel are provided to reduce costs by reusing a sub substrate. CONSTITUTION: A lower substrate is formed in the upper part of a sacrificial layer. An upper substrate is attached to the lower substrate(S22). A barrier film and a polarization film are adhered to the upper part of a unit panel region(S33). A sub substrate is overturned to be mounted on the upper part of a fixing supporter(S44). The sacrificial layer is delaminated from a substrate to remove the sacrificial layer and the sub substrate(S66). A rear surface film is adhered to a surface where the sacrificial layer is removed from the substrate(S77). Gas is injected through the holes of the fixing supporter to separate the substrate from the fixing supporter(S88). The boundary region of the substrate is cut into unit panels(S110). [Reference numerals] (AA) Start; (BB) End; (S11) Prepare a sub substrate and form a sacrificial layer; (S110) Form a plurality of unit panels; (S22) Form and attach an upper substrate and a lower substrate; (S33) Attach a barrier film and a polarization film; (S44) Mount the overturned sub substrate on the upper part of a fixing supporter; (S55) Irradiate laser to the upper part of the sub substrate; (S66) Delaminate the sacrificial layer; (S77) Form a rear surface film on the upper part of the lower substrate; (S88) Separate the substrate, the barrier film, and the polarization film from the fixing supporter; (S99) Cut the substrate

Description

Manufacturing method of Flexible Dislay Panel And Fixing and supporting Substrate for manufacturing Flexible Dislay Panel}

Embodiments of the present invention relate to a method for manufacturing a flexible display panel and a fixing support for manufacturing a flexible display panel, and more particularly, to a method for manufacturing a flexible display panel for reducing costs by recycling a mother substrate and a fixing support for manufacturing a flexible display panel. .

 With the development of the information society, in recent years, various types of liquid crystal display (LCD), plasma display panel (PDP), electro luminescent display (VFD), and vacuum fluorescent display (VFD) Flat panel display devices have been studied.

Recently, in accordance with the demand for adopting a flat panel display device for portable products such as electronic sheets, arm bands, wallets, notebook computers, and the like, development of a display device having flexibility has been in progress. .

Such display devices mounted on portable products, such as electronic paper, arm bands, wallets, notebook computers, and e-books, must have flexible characteristics to bend in response to external forces.

Therefore, in recent years, a flexible display manufactured to bend using a substrate made of a flexible material such as plastic instead of a glass substrate having no flexibility is emerging as a next-generation display device.

The flexible display is one of the next generation displays, which is implemented on a thin substrate such as plastic and is not damaged even when folded or rolled up like paper. Currently, organic light emitting diodes (OLED) and liquid crystal displays that can be made thinner than 1 mm are present. The device is promising.

The organic EL has excellent visibility even in dark places or outside light because the device itself emits light, and the response speed, which is an important criterion for determining the performance of a mobile display, is the fastest among existing displays. You can make the perfect video.

In addition, the organic EL has an ultra-thin design and can slim down various mobile devices such as mobile phones.

On the other hand, the liquid crystal display device is an apparatus for expressing an image using optical anisotropy of liquid crystal. It is attracting attention as a display device.

Then, a method for manufacturing such a flexible display will be described with reference to the drawings.

1 is a flowchart illustrating a method of manufacturing a flexible display according to the prior art. 2A to 2C are partial cross-sectional views of a flexible display manufacturing method according to the prior art.

First, a large area of the auxiliary substrate 1 is prepared. (S1) The auxiliary substrate 1 may be a glass substrate, adhered to the back surface of the substrates 20 and 30, and the substrates 20 and 30. The substrate is stably supported so that its shape is fixed without being easily bent or twisted during this process. The auxiliary substrate 1 facilitates the handling of the substrate, and the subsequent lower array forming process may be performed more precisely and stably.

Then, the sacrificial layer 10 is formed on the auxiliary substrate 1. (S2) The sacrificial layer 10 may be formed of amorphous silicon, and the lower substrate attached to the upper portion of the sacrificial layer 10 ( 20) and the role of enabling the removal. When the laser is irradiated on the sacrificial layer 10, the surface of the sacrificial layer 10 may be roughened or hydrogen may be generated by a chemical reaction, and thus may be peeled off from the lower substrate 20 attached to the upper portion.

Then, the lower substrate 20 is adhered through an adhesive process. (S3) As the flexible display substrate, a plastic substrate may be used, and polycarbon, polyimide, polyether sulfone (PES), and polya It may be made of a relate (PAR), polyethylene naphthalate (PEN), polyethylene terephthalate (PET) and the like.

In addition, a lower array is formed on the lower substrate 20 (S4). At this time, the lower array includes a thin film transistor or an organic thin film transistor for each unit panel region to form a plurality of unit panels on the large area lower substrate 20. Patterns such as light emitting diodes can be formed. The lower array pattern may be formed through a series of processes such as exposure, development, and etching.

Subsequently, an upper array corresponding to the lower array may be patterned on the upper substrate 30. The upper substrate 30 may be supported by a failure turn to be bonded to face the lower array. (S5) The upper array may be a color filter pattern, which is also through a series of exposure, development, and etching processes. Can be done.

In addition, the drive integrated circuit may be connected to one side of the lower substrate 20 by a flexible circuit film.

Referring to FIG. 2A, the sacrificial layer 10, the lower substrate 20, and the upper substrate 30 are sequentially stacked on the auxiliary substrate 1, and the plurality of unit panel regions are divided by dotted lines.

Thereafter, the substrates 20 and 30 are cut for each unit panel (S7). That is, a plurality of unit panels may be formed by cutting the interface between the unit panels on the lower substrate and the upper substrate. Referring to FIG. 2B, the sacrificial layer 10 and the auxiliary substrate 1 may be cut during the cutting process. Therefore, the unit panel includes the sacrificial layer 10 and the auxiliary substrate 1.

Subsequently, a laser is irradiated to the sacrificial layer 10 for each unit panel to generate hydrogen on the contact surface between the sacrificial layer and the lower substrate, thereby peeling the sacrificial layer 10 from the lower substrate 20 (S8).

In addition, the rear film is attached to the lower surface of the lower substrate 20 to protect the flexible display.

As discussed above, the flexible display requires the use of the auxiliary substrate 1 without warpage and the sacrificial layer 10 for detachment due to the property of using a flexible substrate.

However, at this time, the cutting process is to cut to the auxiliary substrate 1, the auxiliary substrate 1 is cut in the manufacturing process of producing a flexible display in a large area substrate at the same time can not be recycled again.

Therefore, the auxiliary substrate 1 is used as a new one at a time, thereby increasing the cost in the manufacturing process and increasing the product cost.

Therefore, in order to solve the above problems, embodiments of the present invention provide a cutting process for forming a plurality of unit panels by proceeding the process after the auxiliary substrate is peeled off, the purpose of recycling the auxiliary substrate without cutting There is this.

In addition, other objects and features of the present invention will be described in the description and claims for carrying out the invention described below.

In order to achieve the above object of the present invention, the flexible display panel manufacturing method according to an embodiment of the present invention to provide an auxiliary substrate to which a substrate having a plurality of unit panel region and the boundary region is defined through a sacrificial layer step; Mounting the substrate on an upper part of the fixing support having a plurality of holes formed thereon; Forming a vacuum through a plurality of holes of the fixed support, thereby adsorbing and fixing the substrate to the fixed support; Irradiating the sacrificial layer with a laser to remove the sacrificial layer from the substrate to remove the sacrificial layer and the auxiliary substrate; Attaching a back film to a surface from which the sacrificial layer is separated from the substrate; Injecting gas through a plurality of holes of the fixed support to separate the substrate from the fixed support; And cutting the boundary area of the substrate to form a plurality of unit panels.

Preferably, the removed auxiliary substrate is reused in the process of forming a plurality of other unit panels.

In addition, the step of seating the substrate on the fixed support is characterized in that the upper substrate is inverted up and down seated so that the upper portion of the substrate in contact with the top of the fixed support.

In addition, the providing of the auxiliary substrate may include sequentially attaching a barrier film and a polarizing film to upper surfaces of the plurality of unit panel regions of the substrate.

In addition, the upper surface of the substrate is formed with a step higher than the boundary area of the plurality of unit panel areas to which the barrier film and the polarizing film is attached, the step of the upper surface of the fixing support is engaged with the upper surface of the substrate It is characterized by being formed.

In addition, the step of the upper surface of the substrate and the step of the upper surface of the fixed support is characterized in that the same height.

The plurality of holes of the fixing support may be formed in at least one of an area corresponding to the plurality of unit panel areas and an area corresponding to a boundary area on the fixing support.

In addition, the sacrificial layer is formed of amorphous silicon material, and the step of removing the sacrificial layer and the auxiliary substrate is hydrogen uniformity in the surface in contact with the substrate of the sacrificial layer by the laser uniformity of the contact surface Is destroyed so that the sacrificial layer is separated from the substrate.

In addition, the step of attaching the back film is characterized in that the lamination method using any one of rolling, vacuum bonding method and front bonding method.

In addition, the gas in the step of separating the substrate from the fixed support is characterized in that any one of air, nitrogen and argon.

Meanwhile, a fixing support for manufacturing a flexible display panel according to an embodiment of the present invention may be divided into a plurality of cell regions and a cell boundary region, and the plurality of cell boundary regions may include a support formed higher than the plurality of cell regions; A plurality of holes formed in at least one of a plurality of cell regions or cell boundary regions of the support portion; And a gas injection control unit connected to the plurality of holes and the pipes inside the support unit and configured to vacuum the inside of the plurality of holes or to emit gas into the plurality of holes.

At least one embodiment of the present invention configured as described above,

By performing the cutting process after the auxiliary substrate is peeled off, it is possible to prevent the cutting of the auxiliary substrate and to recycle the auxiliary substrate to increase the efficiency of the manufacturing process and reduce the cost.

1 is a flowchart illustrating a method of manufacturing a flexible display according to the prior art.
2A to 2C are partial cross-sectional views of a flexible display manufacturing method according to the prior art.
3A to 3I are cross-sectional views illustrating a method of manufacturing a flexible display panel according to an exemplary embodiment of the present invention.
4A is a plan view illustrating a plurality of unit panel regions and boundary regions on a lower substrate of FIGS. 3A to 3I.
FIG. 4B is a schematic diagram schematically illustrating a unit panel in FIGS. 3A to 3I.
Figure 4c is a perspective view of the fixing support according to an embodiment of the present invention.
4D is a schematic diagram illustrating a cutting area in the cutting process of FIG. 3H.
5 is a flowchart illustrating a method of manufacturing a flexible display panel according to an exemplary embodiment of the present invention.

Hereinafter, a method of manufacturing a flexible display panel and a fixing support for manufacturing a flexible display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the present specification, the same reference numerals are given to the same components in different embodiments, and the description thereof is replaced with the first explanation.

As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise.

In addition, it should be considered that elements of the drawings attached to the present specification may be enlarged or reduced for convenience of description.

3A to 3H are cross-sectional views illustrating a method of manufacturing a flexible display panel according to an exemplary embodiment of the present invention. 4A is a plan view illustrating a plurality of unit panel regions and boundary regions on the lower substrate of FIGS. 3A to 3I, and FIG. 4B is a schematic view of the unit panels in FIGS. 3A to 3I and FIG. 4C is a schematic view of the present invention. 4 is a schematic view illustrating a cutting area during a cutting process in FIG. 3H.

Referring to FIG. 3A, first, a sacrificial layer is formed on the auxiliary substrate.

Because of the flexibility of the substrate of the flexible display panel, it is difficult to fix the shape of the substrate during the manufacturing process, thus making it difficult to precisely proceed the manufacturing process. Accordingly, in order to precisely proceed the manufacturing process on the flexible substrate, an auxiliary substrate 100 for adhering the lower substrate 120 is prepared.

The auxiliary substrate 100 is adhered to the rear surface of the lower substrate 120 to stably support the lower substrate 120 so that the lower substrate 120 is fixed in shape without being easily bent or twisted during the process. Due to the auxiliary substrate 100, the lower substrate 120 may be easily handled, and a subsequent thin film pattern forming process may be performed more precisely and stably.

The auxiliary substrate 100 may be made of metal or glass, but in one embodiment of the present invention is preferably made of glass.

Then, the sacrificial layer 110 is formed on the auxiliary substrate 100. The sacrificial layer 110 is formed by depositing amorphous silicon (a-Si: H) having a feature of breaking uniformity of a film by laser beam irradiation or generating hydrogen gas to be detachable from a plastic substrate. .

3B, the lower substrate 120 is adhered by applying an adhesive to the upper portion of the sacrificial layer 110. The lower substrate 120 is formed of any one of polycarbon, polyimide, polyether sulfone (PES), polyarylate (PAR), polyethylene naphthalate (PEN), and polyethylene terephthalate (PET). Can be. However, one embodiment of the present invention preferably uses a polyimide. In this case, the lower substrate 120 may have a thickness of about 10 μm to about 50 μm in order to have very excellent and flexible characteristics.

In this case, a thin film transistor which is a switching element may be formed on the lower substrate 120.

On the other hand, the flexible display panel is manufactured using an auxiliary substrate 100 having an area several times to tens of times larger than the size of the flexible display panel and a lower substrate 120 formed on the front side thereof to improve productivity per unit time. have. Therefore, dozens of flexible display panels may be manufactured for one lower substrate 120.

Accordingly, according to FIG. 4A, the lower substrate 120 is defined as a plurality of unit panel U regions divided into dozens of flexible display panels, and a boundary region B that borders the unit panel regions. By cutting the region B, a plurality of unit panels U can be manufactured.

Therefore, an element may be formed in the plurality of unit panel U regions on the front surface of the lower substrate 120, and a thin film transistor may also be formed in the plurality of unit panel U regions.

Here, the method and structure of the thin film transistor shown in FIG. 3B will be described.

First, a gate line, a gate electrode 121a and a lower storage electrode 121b are formed on the lower substrate 120. The components may be formed of a metal, and may be patterned through a series of processes such as an exposure process using a mask and a developing and etching process.

A gate insulating layer 122 is formed on the gate line, the gate electrode 121a and the lower storage electrode 121b, and a channel is formed on the gate insulating layer 122 to correspond to the gate electrode 121a. An active layer 123 to be formed, an ohmic contact layer 124 formed on the active layer 123, and a source electrode 125a in ohmic contact with the active layer 123 through the ohmic contact layer 124. And a drain electrode 125b may be further formed. In this case, the source electrode 125a may be connected to the data line to receive a data voltage, and the drain electrode 125b may extend to an upper portion of the lower storage electrode 121b to serve as an upper storage electrode.

Subsequently, the passivation layer 126 is formed on the source and drain electrodes 125a and 125b and serves to protect the active layer 123 forming the channel from moisture, scratches, and the like.

In addition, the passivation layer 126 may include a plurality of contact holes (not shown) formed through a mask process, and the contact holes (not shown) illustrated in the drawing may pass through the passivation layer 126 to drain the electrode 125b. Serves to expose.

In addition, a pixel electrode 127 is formed on the passivation layer 126, and the pixel electrode 127 may be electrically connected to the drain electrode 125b and the upper storage electrode through a contact hole (not shown).

The thin film transistor charges the pixel signal of the data line 130 to the pixel electrode 127 in response to the gate signal of the gate line, and may switch a voltage applied to the liquid crystal.

The storage capacitor includes a lower storage electrode 121b, an upper storage electrode, and a pixel electrode 127. The storage capacitor maintains a voltage applied to the liquid crystal when the thin film transistor is turned off.

Subsequently, the upper substrate 130 having the color filter pattern formed thereon may be opposed to the upper portion of the lower substrate 120 by supporting the seal pattern at the edge thereof. The color filter pattern may include a color filter for filtering a plurality of colors, a black matrix absorbing light and an overcoat layer for flattening an upper surface of the upper substrate 130 to be formed in a non-opening area that forms a boundary between pixel areas, and the like. It may be configured as.

Meanwhile, the lower substrate 120 and the upper substrate 130 have been described as forming a liquid crystal display pattern. However, the flexible display panel is not only a liquid crystal display (LCD) but also a p-Si of an organic light emitting diode (OLED). For example, an oxide TFT, an ELA, or an electrophoretic display may be used, and thus the pattern of the lower substrate 120 and the upper substrate 130 may vary according to the types of the aforementioned displays.

Thereafter, a drive circuit portion for driving the inside of the panel is connected to each of the plurality of unit panels.

Referring to FIG. 4B, a flexible circuit film 129b (eg, a tape carrier package (TCP), etc.) is attached to one surface of the array area 128 where the gate line and the data line are patterned to drive the gate line. The gate driver 129c and the data driver 129a for driving the data line may be connected to the panel, wherein a portion shown by a dotted line is a screen display unit on which a screen is displayed in the unit panel U. FIG.

Then, the barrier film 140 or the barrier film 140 and the polarizing film 150 may be sequentially attached to the plurality of unit panel areas on the upper substrate 130.

The barrier film 140 is attached to block oxygen and moisture, and the polarizing film 150 is for polarizing light transferred from the outside of the panel to improve the contrast ratio (CR).

The barrier film 140 and the polarizing film 150 are bonded to each unit panel by using an adhesive or the like, so that a plurality of unit panel areas are formed on the upper surface of the upper substrate 130 with a step higher than a boundary area. Can be.

Then, according to Figure 3c, the components formed on the upper substrate 100 and the upper substrate 100 is inverted up and down to be seated on the upper portion of the fixed support 200.

The fixed support 200 may be formed in a stepped structure in a predetermined region of the upper surface as shown in Figure 4c.

The fixed support includes a support formed by being divided into a plurality of cell regions and a cell boundary region, a plurality of holes, and a gas injection control unit (not shown) connected to the plurality of holes and pipes (not shown) inside the support. .

In the support portion, the plurality of cell regions is lower than the cell boundary region to form a step. The step is formed because the step is formed by the top surface of the upper substrate 130 is attached to the barrier film 140 and the polarizing film 150 to seat the inverted substrate (120, 130) This is because a step corresponding to the step of the upper substrate 130 must be formed to be fixed.

Accordingly, the plurality of cell regions 210 may be formed lower than the cell boundary region 220 corresponding to the boundary region corresponding to the plurality of unit panel regions. In this case, the step of the fixing support 200 may have the same height as the step of the upper surface of the upper substrate 130.

On the other hand, the fixing support 200 may be a method of fixing the auxiliary substrate 100 may be a vacuum adsorption method. Therefore, a vacuum may be formed in the plurality of holes 230 to adsorb and fix the substrates 120 and 130.

The plurality of holes 230 may be formed in any region of the upper surface of the fixed support 200. However, the plurality of holes 230 may be formed in at least one of the plurality of cell regions 210 or the cell boundary regions 220, and all of them may be formed at uniform intervals.

In addition, the gas injection control unit (not shown) may be disposed inside or outside the fixed support 200, and is connected to a pipe (not shown) inside the fixed support 200 to vacuum a plurality of holes 230. Or gas may be injected through the plurality of holes 230.

When the substrates 120 and 130 are seated on the fixing support 200, the fixing support 200 fixes the substrates 120 and 130 by using a step structure of the upper surface and vacuum suction. can do. That is, the stepped structure of the fixing support 200 is engaged with the upper substrate 130 to prevent the left and right movement of the substrates (120, 130), the vacuum adsorption is fixed to the substrates (120, 130) It is possible to prevent the departure from the support 200.

After the substrates 120 and 130 are fixed to the fixing support 200, the laser is irradiated onto the upper surface of the auxiliary substrate 100 according to FIG. 3D. The laser is irradiated to peel the sacrificial layer 110. Since the auxiliary substrate 100 is made of glass and is transparent, the laser irradiated to the upper surface of the auxiliary substrate 100 is directed to the sacrificial layer 110. Can be incident.

The laser may use a wavelength such as ultraviolet light or visible light. In order to destroy the surface of the sacrificial layer 110 or generate hydrogen, an ultraviolet (UV) region or a green region wavelength of 308 nm to 550 nm may be preferably used.

After the laser is irradiated, the sacrificial layer 110 may be peeled from the lower substrate 120 as shown in FIG. 3E. At this time, the surface of the sacrificial layer 110 has a uniformity is destroyed and become a rough surface, at the same time, at the same time, a chemical reaction occurs in the sacrificial layer 110 formed of amorphous silicon to generate hydrogen.

Therefore, a space is formed in a surface where the sacrificial layer 110 and the lower substrate 120 contact, and the sacrificial layer 110 can be peeled off from the lower substrate 120.

Accordingly, not only the sacrificial layer 110 but also the auxiliary substrate 100 may be removed.

In this case, the auxiliary substrate 100 is not cut and can be reused when a process of forming a plurality of other unit panels thereafter is performed.

In the prior art, since the cutting process was performed in a state including the auxiliary substrate 100, the cut auxiliary substrate 100 could not be reused, resulting in process inefficiency and cost increase. However, one embodiment of the present invention can be reused again without cutting the auxiliary substrate 100 by performing the cutting process after attaching the rear film 160 as described above. Therefore, it is possible to increase the efficiency of the process and to reduce the process cost.

3, the rear film 160 may be attached to the top surface of the sacrificial layer 110 and the lower substrate 120 peeled off.

When the flexible display panel is manufactured as a single product, the rear film 160 is disposed under the flexible display panel to support the flexible display panel and to prevent foreign substances from being inserted into the rear film 160.

The back film 160 may be attached to the back film 160 after applying an adhesive resin (resin) to the upper surface of the lower substrate 120 by lamination (lamination). However, in this case, as shown in the drawing, the rear film 160 may be gradually attached from one surface of the lower substrate 120 to the front surface using the roller 165 as shown in the drawing. The front bonding method may be used to attach the entire surface at one time, or the vacuum bonding method may be used for bonding using a vacuum. Therefore, laminators according to the above methods may be provided depending on which method is used.

Thereafter, the substrates 120 and 130 are separated from the fixing support 200 as shown in FIG. 3G. At this time, the vacuum maintained from when the substrates 120 and 130 are seated until the sacrificial layer is removed is removed, and gas is injected into the plurality of holes 230. In addition, the fixed support 200 and the substrates 120 and 130 may be separated by lifting the substrates 120 and 130 using an upper lift mechanism (not shown).

The fixed support 200 may inject a gas such as air, nitrogen, argon, or the like into the plurality of holes 230, or may use other gases.

Subsequently, the substrates 120 and 130 are inverted and cut according to FIG. 3H. In this case, a region for cutting the substrates 120 and 130 is a boundary region, as shown in FIG. 4D.

Referring to FIG. 4D, the barrier film 140 and the polarizing film 150 are attached only to the upper surface of each unit panel on the upper substrate 130. At this time, since the cutting should be performed so that the unit panels are divided, the cutting line is configured to form an edge of the unit panel.

At this time, the cutting method may be made using a laser, ultraviolet rays, scissors or small beans.

Finally, according to FIG. 3I, the back film 160, the lower substrate 120, and the upper substrate 130 may be cut along the cutting lines to form a plurality of unit panels.

Hereinafter, a method of manufacturing a flexible display panel according to an exemplary embodiment of the present invention will be described with a flowchart. 5 is a flowchart illustrating a method of manufacturing a flexible display panel according to an exemplary embodiment of the present invention.

First, an auxiliary substrate is prepared, and a sacrificial layer is formed on the auxiliary substrate. (S11) The auxiliary substrate is preferably provided with a glass substrate for the transmission of the laser, the sacrificial layer may be formed of hydrogenated amorphous silicon, in addition to the generation of gas by the injection of laser or cracks on the surface It may also be formed from components that can be generated.

A lower substrate is formed on the sacrificial layer, and the upper substrate is bonded to the upper substrate. The lower substrate may be made of polyimide as a plastic material and formed on the lower substrate and the upper substrate. The pattern may vary in shape depending on how the flexible display panel uses a display device such as an LCD, an OLED, an electrophoretic device, or the like. In this case, the patterns formed on the upper substrate and the lower substrate are formed only in an area defined by a plurality of unit panels.

Thereafter, a barrier film and a polarizing film are attached to the plurality of unit panel regions. (S33) At this time, a step is formed in the plurality of unit panel regions in the upper portion of the upper substrate due to the thickness of the barrier film and the polarizing film. .

Subsequently, the auxiliary substrate is turned upside down to be seated on the fixing support. (S44) The fixing support includes a step shape that engages with the step of the upper substrate as a means for removing the sacrificial layer and attaching the rear film. The substrates may be vacuum adsorbed through a plurality of holes.

And irradiate a laser on the upper portion of the auxiliary substrate (S55).

The surface of the sacrificial layer is destroyed by the laser irradiation, and hydrogen is generated on the surface of the sacrificial layer to form a space between the lower substrate and the sacrificial layer, thereby allowing the sacrificial layer to be peeled off (S66). Removed together with, and the removed auxiliary substrate can be reused in the process for forming a plurality of other unit panels.

Subsequently, the rear film is attached to the surface on which the sacrificial layer is separated from the lower substrate by lamination or the like (S77).

In order to proceed with the cutting process, the substrates are separated from the fixing support (S88). In this case, the substrates may be separated by injecting gas into a plurality of holes of the fixing support and lifting the substrates from above.

Finally, substrates are cut along the cutting lines shown in FIG. 4D to form a plurality of unit panels. (S99, S110)

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

Accordingly, the scope of the present invention is not limited thereto, but various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims are also within the scope of the present invention.

100: auxiliary substrate 110: sacrificial layer
120: lower substrate 130: upper substrate
140: barrier film 150: polarizing film
160: rear film 200: fixed support
230: hole U: unit panel
B: boundary area

Claims (11)

Providing an auxiliary substrate to which a substrate having a plurality of unit panel regions and boundary regions defined is attached through a sacrificial layer;
Mounting the substrate on an upper part of the fixing support having a plurality of holes formed thereon;
Forming a vacuum through a plurality of holes of the fixed support, thereby adsorbing and fixing the substrate to the fixed support;
Irradiating the sacrificial layer with a laser to remove the sacrificial layer from the substrate to remove the sacrificial layer and the auxiliary substrate;
Attaching a back film to a surface from which the sacrificial layer is separated from the substrate;
Injecting gas through a plurality of holes of the fixed support to separate the substrate from the fixed support; And
Cutting the boundary area of the substrate to form a plurality of unit panels;
Flexible display panel manufacturing method comprising a. The method of claim 1,
The removed auxiliary substrate is reused in the process of forming a plurality of other unit panels. The method of claim 1, wherein
The mounting of the substrate on the fixing support may include inverting the auxiliary substrate up and down so that the upper part of the substrate is in contact with the upper part of the fixing support. The method of claim 3, wherein
Providing the auxiliary substrate,
And manufacturing a barrier film and a polarizing film sequentially on upper surfaces of the plurality of unit panel regions of the substrate. The method of claim 4, wherein
In the upper surface of the substrate, a plurality of unit panel regions to which the barrier film and the polarizing film are attached have a step higher than the boundary region,
The upper surface of the fixed support is a flexible display panel manufacturing method, characterized in that the step is formed so as to engage with the upper surface of the substrate. The method of claim 5, wherein
The step of the upper surface of the substrate and the step of the upper surface of the fixed support is a flexible display panel manufacturing method, characterized in that the same height. The method of claim 1,
And a plurality of holes of the fixing support are formed in at least one of an area corresponding to the plurality of unit panel areas and an area corresponding to a boundary area on the fixing support. The method of claim 1,
The sacrificial layer is formed of amorphous silicon material,
The removing of the sacrificial layer and the auxiliary substrate may include generating hydrogen at the contact surface of the sacrificial layer with the substrate or breaking the uniformity of the contact surface with the laser to remove the sacrificial layer from the substrate. Flexible display panel manufacturing method. The method of claim 1,
And attaching the rear film by lamination using any one of a rolling method, a vacuum bonding method, and a front bonding method. The method of claim 1,
And in the separating of the substrate from the fixed support, the gas is one of air, nitrogen, and argon. A support portion divided into a plurality of cell regions and a cell boundary region, the plurality of cell boundary regions being higher than the plurality of cell regions;
A plurality of holes formed in at least one of a plurality of cell regions or cell boundary regions of the support portion; And
A gas injection control unit connected to the plurality of holes and the pipes inside the support unit and configured to vacuum the inside of the plurality of holes or to emit gas into the plurality of holes;
Flexible support for producing a flexible display panel comprising a.

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