KR102023925B1 - Method for fabricaturing liquid crystal display panel - Google Patents

Method for fabricaturing liquid crystal display panel Download PDF

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Publication number
KR102023925B1
KR102023925B1 KR1020120104480A KR20120104480A KR102023925B1 KR 102023925 B1 KR102023925 B1 KR 102023925B1 KR 1020120104480 A KR1020120104480 A KR 1020120104480A KR 20120104480 A KR20120104480 A KR 20120104480A KR 102023925 B1 KR102023925 B1 KR 102023925B1
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South Korea
Prior art keywords
flexible substrate
substrate
carrier substrate
forming
separating
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KR1020120104480A
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Korean (ko)
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KR20140038135A (en
Inventor
이경묵
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엘지디스플레이 주식회사
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Priority to KR1020120104480A priority Critical patent/KR102023925B1/en
Publication of KR20140038135A publication Critical patent/KR20140038135A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Abstract

The present invention provides a method for manufacturing a liquid crystal display panel which can recycle a carrier substrate.
A method of manufacturing a liquid crystal display panel according to the present invention includes forming an upper flexible substrate on an upper carrier substrate and forming a lower flexible substrate on the lower carrier substrate; Forming an upper array on the upper flexible substrate and forming a lower array on the lower flexible substrate; Cutting each of the upper flexible substrate and the lower flexible substrate in panel units; Bonding the upper flexible substrate and the lower flexible substrate to each other; Separating the upper carrier substrate from the upper flexible substrate; Attaching an upper polarizer on a front surface of the upper flexible substrate; Separating the lower carrier substrate from the lower flexible substrate; Attaching a lower polarizer on a rear surface of the lower flexible substrate so as to overlap a display area and a pad area of the lower flexible substrate; And forming a driving integrated circuit or a signal transmission film in the pad region of the lower flexible substrate.

Description

Manufacturing method of liquid crystal display panel {METHOD FOR FABRICATURING LIQUID CRYSTAL DISPLAY PANEL}

The present invention relates to a method for manufacturing a liquid crystal display panel which can recycle a carrier substrate.

Recently, the display device market is rapidly changing, especially for flat panel displays, which can be easily and large in size. Such flat panel displays include a liquid crystal display (LCD), a plasma display panel (PDP), an organic electroluminescent display (OLED), and the like. This flat panel display uses a glass substrate as a support for supporting a plurality of thin films. Glass substrates have limitations in thinning the thickness thereof, and there is a problem in that the glass substrate is easily broken due to lack of durability and flexibility.

Therefore, recently, a flexible display device using a thin and durable material such as plastic or metal foil as a substrate has emerged in place of a glass substrate having no durability and flexibility.

Such a flexible display device performs a manufacturing process by attaching a flexible substrate such as a plastic, which is thin and light, which is inconvenient to manufacture, to a carrier substrate. That is, the upper flexible substrate is attached to the upper carrier substrate, the lower flexible substrate is attached to the lower carrier substrate, the upper flexible substrate and the lower flexible substrate are bonded together, and then scribed in the panel unit. In this scribing process, the upper and lower carrier substrates as well as the upper and lower flexible substrates are scribed. Accordingly, there is a problem in that the upper carrier substrate and the lower carrier substrate cannot be recycled and disposed of.

In order to solve the above problems, the present invention is to provide a method for manufacturing a liquid crystal display panel that can recycle the carrier substrate.

In order to achieve the above technical problem, a method of manufacturing a liquid crystal display panel according to the present invention includes forming an upper flexible substrate on the upper carrier substrate, and forming a lower flexible substrate on the lower carrier substrate; Forming an upper array on the upper flexible substrate and forming a lower array on the lower flexible substrate; Cutting each of the upper flexible substrate and the lower flexible substrate in panel units; Bonding the upper flexible substrate and the lower flexible substrate to each other; Separating the upper carrier substrate from the upper flexible substrate; Attaching an upper polarizer on a front surface of the upper flexible substrate; Separating the lower carrier substrate from the lower flexible substrate; Attaching a lower polarizer on a rear surface of the lower flexible substrate so as to overlap a display area and a pad area of the lower flexible substrate; And forming a driving integrated circuit or a signal transmission film in the pad region of the lower flexible substrate.

The forming of the upper flexible substrate on the upper carrier substrate and forming the lower flexible substrate on the lower carrier substrate may include attaching the upper flexible substrate on the upper carrier substrate through an upper adhesive and attaching the upper flexible substrate on the lower carrier substrate. It is characterized in that the step of attaching the lower flexible substrate through the lower adhesive.

In this case, the separating of the upper carrier substrate from the upper flexible substrate is a step of separating the upper carrier substrate from the upper flexible substrate by irradiating a laser on the front surface of the upper carrier substrate so that the adhesive force of the upper adhesive is weakened. The separating of the lower carrier substrate from the lower flexible substrate may include separating the lower carrier substrate from the lower flexible substrate by irradiating a laser onto the front surface of the lower carrier substrate so that the adhesive force of the lower adhesive is weakened. It is done.

The forming of the upper flexible substrate on the upper carrier substrate and forming the lower flexible substrate on the lower carrier substrate may include sequentially forming an upper sacrificial layer and the upper flexible substrate on the upper carrier substrate, and forming the lower flexible substrate. Forming a lower sacrificial layer and the lower flexible substrate sequentially on a carrier substrate, wherein the upper sacrificial layer and the lower sacrificial layer is formed of hydrogenated amorphous silicon.

In this case, the separating of the upper carrier substrate from the upper flexible substrate may be performed by irradiating a laser onto the front surface of the upper carrier substrate so that hydrogen bonding between the upper sacrificial layer and the upper flexible substrate is interrupted. Separating the carrier substrate, and separating the lower carrier substrate from the lower flexible substrate is irradiated with a laser on the front surface of the lower carrier substrate so that hydrogen bonding between the lower sacrificial layer and the lower flexible substrate is broken And separating the lower carrier substrate from the flexible substrate.

Meanwhile, the manufacturing method of the liquid crystal display panel may further include forming an outer protective film made of a silicone resin on a pad region where at least one of the driving integrated circuit and the signal transmission film is formed.

According to the present invention, the upper flexible substrate is attached to the upper carrier substrate, and the lower flexible substrate is attached to the lower carrier substrate to form the upper array and the lower array, and then each of the upper flexible substrate and the lower flexible substrate is selectively scribed in panel units. Ice. Accordingly, since the upper carrier substrate and the lower carrier substrate are not scribed in the scribing process, the upper carrier substrate and the lower carrier substrate can be recycled without discarding, thereby reducing the process cost.

1 is a flowchart illustrating a method of manufacturing a liquid crystal display panel according to a first embodiment of the present invention.
2A to 2I are cross-sectional views illustrating a method of manufacturing the liquid crystal display panel illustrated in FIG. 1 in detail.
3A to 3C are cross-sectional views illustrating a method of manufacturing a liquid crystal display panel according to a second embodiment of the present invention.
4A and 4B are cross-sectional views illustrating a modification of the manufacturing method of the liquid crystal display panel according to the first embodiment of the present invention.
5A and 5B are cross-sectional views illustrating a modification of the manufacturing method of the liquid crystal display panel according to the second exemplary embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings and embodiments.

1 is a flowchart illustrating a method of manufacturing a display device according to a first embodiment of the present invention, and FIGS. 2A to 2I are cross-sectional views illustrating a method of manufacturing the display device shown in FIG. 1.

First, as shown in FIGS. 1 and 2A, the upper flexible substrate 114 is attached to the upper carrier substrate 110 (S11), and the lower flexible substrate 124 is attached to the lower carrier substrate 120. (Step S12).

In detail, the upper flexible substrate 114 is attached onto the upper carrier substrate 110 through the upper adhesive layer 112. In this case, the upper carrier substrate 110 allows the upper flexible substrate 114 to be fixed without being easily bent or twisted during a subsequent process so that a later process may be performed more precisely and stably. Then, a black matrix for preventing light leakage on the upper flexible substrate 114, a color filter for realizing color, a common electrode forming a vertical electric field with the pixel electrode, and an upper alignment layer coated thereon for liquid crystal alignment. An upper array is formed (step S21).

The lower flexible substrate 124 is attached onto the lower carrier substrate 120 through the lower adhesive layer 122. In this case, the lower carrier substrate 120 allows the lower flexible substrate 124 to be fixed without being easily bent or twisted during a subsequent process so that a later process may be performed more precisely and stably. Then, gate lines and data lines formed on the lower flexible substrate 124 to cross each other, thin film transistors (TFTs) formed at their intersections, pixel electrodes connected to the thin film transistors, and liquid crystals on them. A lower array including a lower alignment layer coated for alignment, a gate pad for supplying a gate signal to the gate line, and a data pad for supplying a data signal to the data line is formed (step S22).

Here, the upper flexible substrate 114 and the lower flexible substrate 124 include polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyether sulfone, and the like. A metal foil (metal foil) including plastic or stainless steel (SUS) is used. The upper carrier substrate 110 and the lower carrier substrate 120 are thicker than the upper flexible substrate 114 and the lower flexible substrate 124.

Then, the upper flexible substrate 114 on the upper carrier substrate 110 is cut in units of panels (step S31), and the lower flexible substrate 124 on the lower carrier substrate 120 is scribed in units of panels (S32). step). Specifically, since only the upper flexible substrate 114 is scribed in units of panels through a laser cutting process, only the upper flexible substrate 114 is selectively damaged without damaging the upper carrier substrate 110 under the upper flexible substrate 114. Is scribed. In addition, since only the lower flexible substrate 124 is scribed in units of panels through a laser cutting process, only the lower flexible substrate 124 may be selectively damaged without damaging the lower carrier substrate 120 under the lower flexible substrate 124. Scribed.

Then, as illustrated in FIGS. 1 and 2B, a main binder 132 and an auxiliary binder 134 are formed on at least one of the upper flexible substrate 114 and the lower flexible substrate 124. Accordingly, the upper flexible substrate 114 on the upper carrier substrate 110 and the lower flexible substrate 124 on the lower carrier substrate 120 are bonded (step S4).

Then, with the scribed upper flexible substrate 114 attached to the upper carrier substrate 110, as shown in FIG. 2C, the upper laser irradiation apparatus ( 136) to irradiate the laser. Then, the adhesive force of the adhesive layer 112 between the upper carrier substrate 110 and the upper flexible substrate 114 is weakened above a certain temperature, so that the upper carrier substrate 110 may have the upper flexible substrate 114 as shown in FIG. 2D. It is separated from (step S5). As such, the upper carrier substrate 110 separated from the upper flexible substrate 114 may not be cut during the scribing process and may be recycled.

Then, as illustrated in FIGS. 1 and 2E, the upper polarizer 116 is attached to the front surface of the upper flexible substrate 114 from which the upper carrier substrate 110 is separated (step S6). Since the lower carrier substrate 120 is attached to the lower flexible substrate 124 when the upper polarizer 116 is attached, the supporting force is secured by the lower carrier substrate 120, and thus the main binder 132 and the auxiliary due to the poor support are supported. A burst phenomenon of the binder 134 may be prevented.

Then, the back surface of the lower carrier substrate 120 through the lower laser irradiation device 138 with the lower flexible substrate 124 scribed on the lower carrier substrate 120 as shown in FIG. 2F. The laser is irradiated to the entire area of the. Then, the adhesive force of the adhesive layer 122 between the lower carrier substrate 120 and the lower flexible substrate 124 is weakened, so that the lower carrier substrate 120 is removed from the lower flexible substrate 124 as shown in FIGS. 1 and 2G. It is separated (step S7). As such, the lower carrier substrate 120 separated from the lower flexible substrate 124 may not be scribed during the scribing process and may be recycled.

Then, as shown in FIGS. 1 and 2H, the lower polarizer 126 is attached to the front surface of the lower flexible substrate 124 from which the lower carrier substrate 120 is separated (S8). Since the upper polarizing plate 116 is attached to the upper flexible substrate 114 when the lower polarizing plate 126 is attached, the supporting force is secured by the upper polarizing plate 116 to prevent the main binder 132 from bursting due to poor support. It can prevent. In addition, the lower polarizer 126 is attached to the pad region where the gate pad and the data pad of the lower flexible substrate 124 are formed.

1 and 2I, a plurality of driving integrated circuits supplying driving signals to the gate pads and the data pads of the lower flexible substrate 124 are connected (step S9). Specifically, a flexible printed circuit may include a driving integrated circuit attached to each of the gate pad and the data pad by a chip on glass (COG) method, or a driving integrated circuit mounted on each of the gate pad and the data pad; A signal transmission film 140 such as an FPC) is attached. At this time, during the mounting process of the driving integrated circuit and the attaching process of the signal transmission film 140, the supporting force may be secured by the lower polarizing plate 126 attached to the pad region, thereby minimizing the defect due to the lowering of the supporting force.

Then, an outer passivation layer 142 made of a silicone resin is formed on the lower flexible substrate 124 and the signal transmission film 140 on which the driving integrated circuit located outside the main adhesive 132 is formed. Accordingly, corrosion of signal lines and driving integrated circuits exposed to the outside may be prevented, and warpage of the lower flexible substrate 114 may be prevented.

3A to 3C are cross-sectional views illustrating a method of manufacturing a liquid crystal display panel according to a second embodiment of the present invention.

The manufacturing method of the liquid crystal display panel according to the second exemplary embodiment of the present invention is the same except that the sacrificial layers 152 and 162 are used instead of the adhesive layer as compared to the manufacturing method of the liquid crystal display panel according to the first exemplary embodiment of the present invention. With components. Accordingly, detailed description of the same components will be omitted.

Specifically, as shown in FIG. 3A, the upper sacrificial layer 152 is formed on the upper carrier substrate 110, and the upper flexible substrate 114 is formed on the upper sacrificial layer 152. The lower sacrificial layer 162 is formed on the lower carrier substrate 120, and the lower flexible substrate 124 is formed on the lower sacrificial layer 162. Here, each of the upper sacrificial layer 152 and the lower sacrificial layer 162 may be hydrogenated amorphous silicon (a-Si: H) or hydrogenated and doped amorphous silicon (a-Si: H; n + or a-Si). : H; p +). Hydrogen H of the upper sacrificial layer 152 is chemically bonded with silicon Si of the upper flexible substrate 114, and hydrogen H of the lower sacrificial layer 162 is silicon of the lower flexible substrate 124. It is chemically bonded with (Si).

Then, the above-described upper array and lower array forming process, the scribing process of the upper flexible substrate 114 and the lower flexible substrate 124, the bonding process of the upper flexible substrate 114 and the lower flexible substrate 124 is performed. .

Then, as illustrated in FIG. 3B, the laser beam is irradiated to the entire area of the front surface of the upper carrier substrate 110 through the upper laser irradiation device 136, thereby hydrogen and the upper flexible layer of the upper sacrificial layer 152. The upper flexible substrate 114 is separated from the upper sacrificial layer 152 and the upper carrier substrate 110 by breaking the chemical bond between the silicon of the substrate 114. As such, since the upper carrier substrate 110 may be separated from the upper flexible substrate 114 without applying a physical force to the upper carrier substrate 110, damage to the upper array formed on the upper flexible substrate 114 may be prevented. have.

Then, the attachment process of the upper polarizing plate 116 described above is performed.

Then, as illustrated in FIG. 3C, the hydrogen beam H and the lower flexible part of the lower sacrificial layer 162 are irradiated with the laser beam to the entire area of the rear surface of the lower carrier substrate 120 through the lower laser irradiation device 138. The lower flexible substrate 124 is separated from the lower sacrificial layer 162 and the lower carrier substrate 120 by breaking the chemical bond between the silicon of the substrate 124. As such, since the lower carrier substrate 120 may be separated from the lower flexible substrate 124 without applying a physical force to the lower carrier substrate 120, damage to the lower array formed on the lower flexible substrate 124 may be prevented. have.

Then, the above-described lower polarizing plate attaching process, driving integrated circuit mounting process, and external protective film forming process are sequentially performed.

Meanwhile, in the method of manufacturing the liquid crystal display panel according to the first and second embodiments of the present invention, when the upper carrier substrate 110 and the upper flexible substrate 114 are separated, the entire area of the front surface of the upper carrier substrate 114 is lasered. Although the beam is irradiated as an example, as illustrated in FIGS. 4A and 5A, a laser is disposed on the front surface of the upper carrier substrate 110 overlapping the pad region where the gate pad and the data pad of the lower flexible substrate 124 are formed. The beam may not be irradiated. In this case, the upper flexible substrate 114 overlapping the pad region is also removed when the upper carrier substrate 110 is separated so that the pad region of the lower flexible substrate 124 is exposed to the outside.

In addition, in the method of manufacturing the liquid crystal display panel according to the first and second embodiments of the present invention, when the lower carrier substrate 120 and the lower flexible substrate 124 are separated, a laser is formed on the entire area of the rear surface of the lower carrier substrate 114. Although the beam is irradiated and described as an example, as shown in FIGS. 4B and 5B, the laser beam may not be irradiated on the rear surface of the lower carrier substrate 120 corresponding to the auxiliary binder 134. In this case, the lower flexible substrate 124 and the upper flexible substrate 114 bonded together with the auxiliary adhesive 124 therebetween are removed together when the lower carrier substrate 120 is separated.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

110, 120: carrier substrate 112, 122: adhesive layer
114 and 124: plastic substrates 116 and 126: polarizing plates
132, 134: binder 136, 138: laser irradiation device
152, 162: sacrificial layer

Claims (9)

Forming an upper flexible substrate on the upper carrier substrate, and forming a lower flexible substrate on the lower carrier substrate;
Forming an upper array on the upper flexible substrate and forming a lower array on the lower flexible substrate;
Cutting each of the upper flexible substrate and the lower flexible substrate except for the upper carrier substrate and the lower carrier substrate in panel units;
Bonding the upper flexible substrate and the lower flexible substrate to each other;
Separating the upper carrier substrate from the upper flexible substrate;
Attaching an upper polarizer on a front surface of the upper flexible substrate;
Separating the lower carrier substrate from the lower flexible substrate;
Attaching a lower polarizer on a rear surface of the lower flexible substrate so as to overlap a display area and a pad area of the lower flexible substrate;
Forming a signal transmission film in a pad region of the lower flexible substrate;
And forming an outer passivation layer on the lower flexible substrate having the signal transmission film and the signal transmission film. The method of claim 1,
Forming an upper flexible substrate on the upper carrier substrate, and forming a lower flexible substrate on the lower carrier substrate
Attaching an upper flexible substrate to the upper carrier substrate through an upper adhesive, and attaching a lower flexible substrate to the lower carrier substrate through a lower adhesive. The method of claim 2,
Separating the upper carrier substrate from the upper flexible substrate
Irradiating a laser on the entire surface of the upper carrier substrate to separate the upper carrier substrate from the upper flexible substrate so that the adhesive force of the upper adhesive is weakened.
Separating the lower carrier substrate from the lower flexible substrate
And separating the lower carrier substrate from the lower flexible substrate by irradiating a laser to the entire surface of the lower carrier substrate so that the adhesive force of the lower adhesive is weakened. The method of claim 1,
Forming an upper flexible substrate on the upper carrier substrate, and forming a lower flexible substrate on the lower carrier substrate
Sequentially forming an upper sacrificial layer and the upper flexible substrate on the upper carrier substrate, and sequentially forming a lower sacrificial layer and the lower flexible substrate on the lower carrier substrate.
The upper sacrificial layer and the lower sacrificial layer are formed of hydrogenated amorphous silicon. The method of claim 4, wherein
Separating the upper carrier substrate from the upper flexible substrate
Separating the upper carrier substrate from the upper flexible substrate by irradiating a laser onto the front surface of the upper carrier substrate so that hydrogen bonding between the upper sacrificial layer and the upper flexible substrate is interrupted;
Separating the lower carrier substrate from the lower flexible substrate
And separating the lower carrier substrate from the lower flexible substrate by irradiating a laser onto a front surface of the lower carrier substrate so that hydrogen bonding between the lower sacrificial layer and the lower flexible substrate is interrupted. The method of claim 1,
The outer protective film is a method of manufacturing a liquid crystal display panel made of a silicone resin. delete The method of claim 1,
Separating the upper carrier substrate from the upper flexible substrate
And irradiating a laser to the upper carrier substrate that overlaps with the rest of the lower flexible substrate except for the pad region of the lower flexible substrate. The method of claim 1,
Bonding the upper flexible substrate and the lower flexible substrate to each other
Bonding the upper flexible substrate and the lower flexible substrate to each other using a main adhesive agent and an auxiliary binder formed on at least one of the upper flexible substrate and the lower flexible substrate;
Separating the lower carrier substrate from the lower flexible substrate
And irradiating a laser to the lower carrier substrate corresponding to the remaining region except for the auxiliary bonding agent.
KR1020120104480A 2012-09-20 2012-09-20 Method for fabricaturing liquid crystal display panel KR102023925B1 (en)

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KR102131091B1 (en) * 2014-09-26 2020-07-08 엘지디스플레이 주식회사 Laser irradiation apparatus for manufacturing of flexible display device
KR102327466B1 (en) * 2014-12-18 2021-11-16 엘지디스플레이 주식회사 Method for manufacturing a flexible display device
KR102260873B1 (en) * 2015-02-02 2021-06-04 삼성디스플레이 주식회사 Method of manufacturing display panel
KR102504133B1 (en) 2018-02-20 2023-02-28 삼성디스플레이 주식회사 Display apparatus and the fabrication method thereof

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KR0169443B1 (en) * 1996-06-04 1999-03-20 김광호 Liquid crystal display
KR20090108951A (en) * 2008-04-14 2009-10-19 삼성전자주식회사 Method of manufacturing display device
KR101458901B1 (en) * 2008-04-29 2014-11-10 삼성디스플레이 주식회사 Method of manufacturing flexible display device

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