KR20130023816A - Heating package test system - Google Patents

Abstract

PURPOSE: A heat generation package test system is provided to uniformly maintain temperature distribution and to simultaneously measure DC characteristic and luminance characteristic in a burn-in test by implementing a chamber by board. CONSTITUTION: A plurality of board chambers(100) consisting of an LED test board(110) and a chamber housing(120) is stacked on a shelf(130) in a burn-in chamber(16). A source measurement unit(141) is installed in a control rack(14) and tests the DC characteristic of an LED. An LED matrix board(142) is installed in the control rack and is connected with the board chamber. Boards mounted on the control rack are connected with a control PC(12) through a standard interface.

Description

Heat Package Test System {HEATING PACKAGE TEST SYSTEM}

The present invention relates to a heating package test system such as a light emitting diode (LED), and more particularly, to implement a chamber for each board, so that the temperature distribution is uniform and the DC characteristics and luminance characteristics can be measured together during the test. It is about an exothermic package test system.

In general, aging (also referred to as burn-in) of a semiconductor device is to predict the various quality levels of the semiconductor device over time by using various combinations of voltage, temperature and time to promote the life of the semiconductor device.

In the LED manufacturing process, the aging test is mainly performed to evaluate the life of the LED. In the conventional LED aging system, the LED is mounted in a test socket of a burn-in test board and burned in a large burn-in room. -in boards were to be stacked and tested. That is, the conventional light emitting diode aging system includes a heater next to the burn-in room, and then circulates the hot air heated by the heater through the inlet and exhaust ports of the burn-in room, thereby measuring the temperature of the burn-in room at a test temperature (eg, 80 ° C. to 80 ° C.). The electrical properties of the samples were tested while maintaining at 85 ° C.), and the luminance of each sample was measured separately at room temperature after the burn-in test was completed.

Conventional light-emitting diode aging systems stack and test burn-in boards in multiple layers in a large burn-in room, which takes time to stabilize the temperature and the temperature distribution in the burn-in room is not uniform even after stabilization. Due to the different temperature, the accuracy of the burn-in test is reduced, and the luminance measurement is performed separately from the electrical characteristic test, so that the process is complicated and takes a long time.

The present invention has been proposed to solve the above problems, the object of the present invention is to provide a test chamber uniformly by performing a temperature control after having a chamber individually for each test board, and the electrical characteristics and during the test By simultaneously performing luminance measurements, the test package provides an easy-to-use thermal package test system.

In order to achieve the above object, the system of the present invention comprises: a plurality of board chambers to be mounted on a plurality of heat generating packages in a plurality of test sockets and to burn-in test by adjusting the temperature of the internal air; Direct current characteristic measurement means for measuring direct current characteristics of the heat generating packages mounted on the board chamber; Chamber control means for adjusting an internal temperature of the board chamber; And a control computer that maintains the burn-in conditions of each board chamber through the chamber control means and measures the DC characteristics of the heat generating packages under burn-in test through the DC characteristic measuring means according to a set test condition and then manages it with a database. It is done.

Each board chamber is provided with a sensor for measuring the optical characteristics of the mounted heating package, the chamber control means to maintain the burn-in conditions of each board chamber and tested by the optical characteristic measuring means according to the set test conditions The optical characteristics of the heat generating packages are measured and managed by a database.

A plurality of heat generating packages are mounted in each of the board chambers so that the DC characteristic measuring means and the luminance characteristic measuring means are connected to a corresponding board chamber through a matrix board, and the board chamber has a test socket for mounting the heat generating package. Test board; A chamber housing coupled to the test board to form an internal space for a test; A heater for maintaining the internal space at a test temperature; And a temperature sensor for measuring a temperature inside the test socket or the heater or the chamber.

In addition, the test socket is exposed to the heat sink to the outside of the test board, the exposed heat sink discharges the internal heat of the board chamber, the internal space is divided into a single or multiple areas, the temperature sensor is installed in each area, The heater is installed in each chamber in the chamber housing, and configured to control the temperature by separating each zone.

The chamber housing is configured such that heat of the internal space does not leak to the outside through the heat insulating material, and the plurality of board chambers are stacked and coupled at intervals in a separate burn-in chamber, and the burn-in chamber is connected to the inside air through a ventilation means. The temperature and circulation can be controlled.

According to the present invention, each test board is provided with an individual chamber, and then the temperature control is precisely performed, thereby making the test temperature uniform, thereby improving the reliability of the test, and simultaneously performing the electrical characteristics and luminance measurement during the test. It can shorten the manufacturing cost.

1 is a perspective view schematically showing a heating package test system according to the present invention;
2 is a control system diagram of a heating package test system according to the present invention;
3 is a block diagram of a heating package test system according to the present invention;
4 is a schematic diagram illustrating a board chamber of a heating package test system according to the present invention;
5 is a diagram illustrating a board chamber divided into regions of a heating package test system according to the present invention;
6 is a flowchart illustrating a burn-in test procedure of the heating package test system according to the present invention;
7 is a first embodiment of a test socket mounted on a test board of a heating package test system according to the present invention;
8 is a second embodiment of a test socket mounted on a test board of a heating package test system according to the present invention;
9 is a third embodiment of a test socket mounted on a test board of the heating package test system according to the present invention.

The technical problems achieved by the present invention and the practice of the present invention will be more clearly understood by the preferred embodiments of the present invention described below. The following examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention. In addition, in the embodiment of the present invention, a light emitting diode (LED) will be described as an example of a heat generating package.

1 is a perspective view schematically showing a heating package test system according to the present invention, Figure 2 is a control system diagram of the heating package test system according to the present invention.

As shown in FIG. 1, the heating package test system 10 according to an exemplary embodiment of the present invention includes two burn-in rooms 16-1 and 16-2 having 12 board chambers 100, and a control PC ( 12) and one control rack 14 mounted with various boards for burn-in test. Each burn-in room (16-1, 16-2) may be provided with a ventilation passage (18-1, 18-2) for ventilation, in some cases through a separate heater or cooler You can also adjust the overall atmosphere of 16-2).

Referring to FIG. 2, in each burn-in chamber 16, a plurality of board chambers 100 including an LED test board 110 and a chamber housing 120 are stacked on a shelf 130, and a control rack 14 includes Source measurement unit (SMU) 141 for testing the DC characteristics of the light emitting diode, LED matrix board 142, power supply 143, luminance measurement board 144, chamber control for connection with the board chamber 100 The board 145 and the socket temperature monitoring board 146 are mounted, and the boards mounted in the control rack 14 are connected to the control PC 12 through a standard interface such as TCP / IP, USB, or RS-485. It is.

3 is a block diagram of a heating package test system according to the present invention, Figure 4 is a schematic diagram showing a board chamber of the heating package test system according to the present invention, Figure 5 is a board of the heating package test system according to the present invention The chamber is divided into regions.

As shown in FIG. 3, the heating package test system 10 according to the present invention includes a power supply 143, an LED driver 147, a source measuring unit 141, an LED matrix board 142, and a luminance measurement matrix. 144, the chamber control board 145, the control PC 12, and the board chamber 100.

Referring to FIG. 3, the power supply 143 supplies DC power required for burn-in test, and the LED driver 147 is mounted in a test socket of the LED test board 110 through the LED matrix board 142. Drive the LED elements. The source measuring unit (SMU) 141 is connected to the reverse current (IR) of the LED elements mounted in the test socket 112 of the LED test board 110 via the LED matrix board 142 under the control of the control PC 12. After measuring the current and forward voltage (VF) characteristics, the measured data is transferred to the control PC 12. Since the LED matrix board 142 mounts a plurality of test sockets 112 and LED elements for each LED test board 110 of each board chamber 100, the LED driver 147 and the source measuring unit for driving and testing the LEDs. 141 is connected to the corresponding LED elements.

The luminance measurement matrix 144 detects luminance of a corresponding LED element from a plurality of photodiodes 124 mounted in the chamber housing 120 of the board chamber 100 under the control of the control PC 12 to measure the luminance. The measurement data is transmitted to the control PC 12.

The chamber control board 145 detects the socket temperature for each region of the board chamber 100 from the socket temperature sensor 114 of each board chamber 100, measures the socket temperature, and transfers the temperature data to the control PC 12. And control the heater 122 according to the setting of the control PC 12 to control each board chamber 100 so as to maintain the burn-in test temperature at which the temperature of each region is set.

As described later, the control PC 12 sets various conditions for the burn-in test, monitors the burn-in environment of each board chamber 100 through the chamber control board 145 according to the set conditions, and sets the socket temperature. When the temperature is reached, the direct current characteristics of the corresponding LED elements are measured through the source measuring unit 141 automatically or manually. The measurement result data is received and managed by a database. When the set condition is reached, the luminance measurement matrix 144 is obtained. Through measuring the luminance characteristics of the corresponding LED elements through receiving the measurement result data is managed by a database to manage the entire burn-in test.

As shown in FIG. 4, the board chamber 100 includes a test board 110 in which a test socket 112 is mounted, and a chamber housing 120 that is combined with the test board 110 to form an internal space for a burn-in test. ), And a plurality of test sockets 112 are mounted on the test board 110 to mount the LED device to be burn-in-tested. Some sockets are provided with temperature sensors 114 for sensing socket temperatures. It is.

On the upper side of the chamber housing 120, holes 120a are formed at positions corresponding to the test sockets 112, and glass 120b is installed in each hole 120a to isolate the inner space from the outer space. The photodiode 124 for sensing the brightness of the LED element is installed outside the 120b).

In addition, as shown in FIG. 5, the chamber housing 120 is divided into five regions 1 to 5, and heaters 122 are installed in each region to fill the internal space of the board chamber 100 with five regions. It is possible to further improve the chamber uniformity for the burn-in test by controlling the temperature independently in each area.

The test socket 112 of the test board 110 includes a portion 112a for mounting the LED element in the inner space and a heat dissipation structure 112b for radiating heat generated from the LED element to the outside by being exposed to the outside. As an example of the test socket 112, the sockets illustrated in FIGS. 7 to 9 may be used. The test socket shown in FIG. 7 is a TPA type socket, the socket shown in FIG. 8 is a BPA type socket, and the test socket shown in FIG. 9 is a BMP type socket. Such a test socket may be used by selecting an appropriate type according to the type of the connection terminal of the LED device to be burned-in test.

6 is a flowchart illustrating a burn-in test procedure of the heating package test system according to the present invention.

Referring to FIG. 6, after mounting the LED elements to be burned-in to the test socket 112 of each board chamber 100, the tester sets burn-in test conditions on the control PC 12 (S1). Burn-in test conditions are the temperature of the board chamber 100, the burn-in time, the test method, the test interval, and the like.

When the burn-in test is started, the internal temperature of each board chamber 100 is monitored through the chamber control board 145 to maintain the temperature inside the chamber (S2). After monitoring the socket temperature and counting the test time to reach the test condition, the DC measurement characteristics of the corresponding LED elements, for example, reverse current (IR) and forward voltage (IR) of the LED elements are reached through the source measuring unit 141. After measuring the VF: Foward Voltage, the measurement data is received and stored in the database (S3 ~ S6).

In addition, the luminance is measured by sensing the luminance of the corresponding LED device through the luminance measurement matrix 144, and the measurement data is received and stored in the database (S7 and S8).

When the burn-in test is completed, the measured data of the database is statistically processed according to the tester's request and output in various types of graphs and tables.

The present invention has been described above with reference to one embodiment shown in the drawings, but those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

10: fever package test system 12: control PC
14: control rack 16-1,16-2: burn-in room
18-1, 18-2: Ventilation passage 100: Board chamber
110: test board 112: test socket
114: socket temperature sensor 120: chamber housing
122: heater 124: photodiode
141: source measurement unit 142: LED matrix board
143: power supply 144: luminance measurement matrix
145: chamber control board 147: LED driver

Claims (8)

A plurality of board chambers configured to mount a plurality of heating packages in a plurality of test sockets and then burn-in the test by adjusting the temperature of the internal air;
Direct current characteristic measurement means for measuring direct current characteristics of the heat generating packages mounted on the board chamber;
Chamber control means for adjusting an internal temperature of the board chamber; And
Maintain burn-in conditions of the respective board chambers through the chamber control means, and measure the DC characteristics of the heat generating packages under burn-in test through the DC characteristic measuring means according to a set test condition, and then control the database. Fever package test system. The method of claim 1, wherein each of the board chamber is provided with a sensor for measuring the optical characteristics of the mounted heating package,
Maintain burn-in conditions of the respective board chambers through the chamber control means, and measure the optical characteristics of the heating packages under test through the optical characteristic measuring means according to the set test conditions, and then manage them with a database. . The method of claim 1, wherein each of the board chambers
And a plurality of heat generating packages are mounted so that the DC characteristic measuring means and the luminance characteristic measuring means are connected to the corresponding board chamber through a matrix board. The method of claim 1, wherein the board chamber
A test board mounted with a test socket for mounting the heat generating package;
A chamber housing coupled to the test board to form an internal space for a test;
A heater for maintaining the internal space at a test temperature; And
Heating package test system, characterized in that it comprises a temperature sensor for measuring the temperature inside the test socket or heater or chamber. The method of claim 4, wherein the test socket
A heat package test system, characterized in that the heat sink is exposed to the outside of the test board, the exposed heat sink discharges the internal heat of the board chamber. The method of claim 4, wherein the internal space is divided into a single area or a plurality of areas, and a temperature sensor is installed in each area, and the heater is installed in each area in the chamber housing, and the temperature can be controlled by separating the area. Heating package test system, characterized in that configured to. The method of claim 4, wherein the chamber housing
Heating package test system, characterized in that configured to prevent the heat of the internal space from leaking through the insulation. The method of claim 1, wherein the plurality of board chambers
The burn-in package test system, wherein the burn-in chamber is laminated and coupled to a separate burn-in chamber at intervals so as to control the temperature and circulation of the internal air through ventilation means.

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