CN207398579U - A kind of ageing system of chip of laser - Google Patents
A kind of ageing system of chip of laser Download PDFInfo
- Publication number
- CN207398579U CN207398579U CN201721288304.8U CN201721288304U CN207398579U CN 207398579 U CN207398579 U CN 207398579U CN 201721288304 U CN201721288304 U CN 201721288304U CN 207398579 U CN207398579 U CN 207398579U
- Authority
- CN
- China
- Prior art keywords
- laser
- chip
- ageing system
- temperature
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The utility model is related to fields of communication technology, more particularly to a kind of ageing system of chip of laser, the chip of laser passes through ageing system imitated aging process, the ageing system is equipped at least one placement region, the ageing system includes main control module, and the temperature measurement module and flow measurement module being connected with main control module, the temperature measurement module and flow measurement module are arranged in placement region;The chip of laser is arranged in placement region, the temperature value of the temperature measurement module testing laser device chip, and temperature value is sent to main control module, the current value of the flow measurement module testing chip of laser, and current value is sent to main control module.The ageing system can realize the temperature accuracy controlling to each chip of laser;Also, the ageing system can need to carry out arbitrary dilatation according to production capacity, improve yield;Moreover, because the ageing system uses circuit controling temperature, and it is simple in structure easy to operate, processing cost can be reduced.
Description
Technical field
The utility model is related to fields of communication technology, and in particular to a kind of ageing system of chip of laser.
Background technology
At present, laser is widely used in the various aspects of production and processing, particularly vertical cavity surface emitting laser, vertically
Cavity surface emitting lasers are developed based on gallium arsenide semiconductor material, be different from light emitting diode and laser diode etc. its
His light source, it is large area to have small, circular output facula, single longitudinal mode output, small, cheap, easy of integration threshold current
The advantages that array, extensively using with the fields such as optic communication, light network, optical storage.
And, it is necessary to carry out ageing process to it in the process of manufacture of chip of laser.In the prior art, high-volume
When carrying out ageing process, ageing system is needed respectively to each for chip of laser or the chip of laser of small lot costliness
Chip of laser carries out burn-in test, this aging techniques inefficiency, high processing costs, test difficulty.Or batch finished product
And semi-finished product chip of laser carries out aging survey when carrying out ageing process, it is necessary to chip of laser is uniformly put into oven
Examination, this aging techniques can not be directed to each chip of laser and realize temperature accuracy controlling, cause section laser chip
Defect, which cannot sort out, to be come, and quality problems occurs so as to cause chip of laser.Or existing ageing system is controlled by TEC
Temperature, but this kind of ageing system can not high temperature resistant, easily disturbed be subject to temperature, working life is short, and circuit is complicated.
Therefore, design is a kind of realizes each chip of laser temperature accuracy controlling, and simple in structure, processing cost
One of the problem of low ageing system is always those skilled in the art's primary study.
Utility model content
The technical problems to be solved in the utility model is, for the drawbacks described above of the prior art, provides a kind of laser
The ageing system of chip, each chip of laser can not be directed to by, which solving the problems, such as, realizes temperature accuracy controlling.
To solve the technical problem, the utility model provides a kind of ageing system of chip of laser, the chip of laser
By ageing system imitated aging process, the ageing system is equipped at least one placement region, and the ageing system includes master
Control module and the temperature measurement module and flow measurement module being connected with main control module, the temperature measurement module and flow measurement module are arranged at
In placement region;The chip of laser is arranged in placement region, the temperature value of the temperature measurement module testing laser device chip, and
Temperature value is sent to main control module, the current value of the flow measurement module testing chip of laser, and current value is sent to master control
Module.
Wherein, preferred version is:The ageing system further includes the temperature-regulating module for being arranged on placement region, the temperature-regulating module
Including PWM temperature controls submodule and adding thermal resistance, which is connected respectively with main control module and adding thermal resistance, the master
Control the heating time of module control PWM temperature controls submodule adjustment adding thermal resistance.
Wherein, preferred version is:The temperature-regulating module further includes the heat conduction between adding thermal resistance and chip of laser
Gasket.
Wherein, preferred version is:The ageing system further includes alarm module, which connects the master control mould
Block, the alarm module include preset temperature value and pre-set current value;When the temperature value that temperature measurement module is sent is more than preset temperature value
When, which sends alarm signal;Alternatively, when the current value that flow measurement module is sent is more than predetermined current
During value, which sends alarm signal.
Wherein, preferred version is:The ageing system further includes the timing module for being arranged on placement region, the timing module
Connect the main control module;The timing module tests the heating time of adding thermal resistance, and heating time will be sent to main control module.
Wherein, preferred version is:The ageing system further includes the power module for being arranged on placement region, the power module
The main control module is connected, which powers for chip of laser.
Wherein, preferred version is:The PWM temperature controls submodule includes switch mosfet, which sends pwm signal
Control closure or the disconnection of switch mosfet.
Wherein, preferred version is:The ageing system is arranged in an oven, if the oven is equipped with dried layer, every layer side by side
Equipped with multiple placement regions, the chip of laser is arranged in placement region.
The beneficial effects of the utility model are that compared with prior art, the utility model is by designing a kind of laser
The ageing system of chip, the ageing system can realize the temperature accuracy controlling to each chip of laser;Also, the aging
System can need to carry out arbitrary dilatation according to production capacity, improve yield;In addition, fixed form and the monitoring of each chip of laser
Mode is all identical, and interchangeability enhancing copes with the requirement of mass production;Moreover, because the ageing system uses circuit
Temperature control, it is simple in structure easy to operate, processing cost can be reduced.
Description of the drawings
Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing:
Fig. 1 is the schematic diagram of the utility model ageing system;
Fig. 2 is the schematic diagram of the utility model alarm module;
Fig. 3 is the schematic diagram of the utility model temperature-regulating module;
Fig. 4 is the schematic diagram of the utility model timing module;
Fig. 5 is the schematic diagram of the utility model heat-conducting pad;
Fig. 6 is the schematic diagram of the utility model switch mosfet;
Fig. 7 is the schematic diagram of the utility model power module.
Specific embodiment
In conjunction with attached drawing, elaborate to the preferred embodiment of the utility model.
As shown in Figures 1 to 7, the utility model provides a kind of preferred embodiment of the ageing system of chip of laser.
Specifically, and with reference to figure 1, a kind of ageing system of chip of laser 200, the ageing system is equipped at least one
Placement region 110,110 parallel arranged of placement region and equipped with main control module 100, temperature measurement module 111 and flow measurement module
112, each placement region 110 is placed with a temperature measurement module 111 and flow measurement module 112, and the temperature measurement module 111 and flow measurement mould
Block 112 connects main control module 100;The placement region 110 is equipped with chip of laser 200, the 111 testing laser device core of temperature measurement module
The temperature value of piece 200, and temperature value is sent to main control module 100;The electricity of the flow measurement module subscriber line test chip of laser 200
Flow valuve, and current value is sent to main control module 100.The main control module 100 is realized prolonged to each chip of laser 200
Data tracing records, and obtains the temperature value and current value of each chip of laser 200;In addition, the main control module 100 is also connected with one
Display screen, the display screen show the temperature value and current value of chip of laser 200, and operating personnel can be directly by observing master control mould
Block 100 obtains the temperature value and current value of each chip of laser 200.The ageing system can need to carry out arbitrary according to production capacity
Dilatation improves yield;Also, the fixed form and monitor mode of each chip of laser 200 are identical, interchangeability enhancing,
Cope with the requirement of mass production.
Further, and with reference to figure 2, the ageing system is additionally provided with alarm module 120, the alarm module 120 connection institute
Main control module 100 is stated, which includes preset temperature value and pre-set current value;When the temperature that temperature measurement module 111 is sent
When value is more than preset temperature value, the main control module 100 control alarm module 120 sends alarm signal, reminds operating personnel's adjustment
The temperature value of chip of laser 200;Alternatively, when the current value that flow measurement module 112 is sent is more than pre-set current value, the master control mould
Block 100 controls alarm module 120 to send alarm signal, and operating personnel is reminded to adjust the current value of chip of laser 200.
Wherein, the utility model provides the connection mode of two kinds of alarm modules 120 and main control module 100.
Mode one:The quantity of the alarm module 120 is consistent with the quantity of chip of laser 200 and corresponds setting, should
Alarm module 120 connects the main control module 100 respectively, which is set according to its corresponding chip of laser 200
Preset temperature value and pre-set current value, when the temperature value of corresponding chip of laser 200 is more than preset temperature value or current value
During more than pre-set current value, which sends alarm signal and reminds operating personnel;Further enhance ageing system
Interchangeability ensures that each chip of laser 200 can individually carry out ageing process.
Mode two:The alarm module 120 is provided with one, the main control module 100 is connected, when some laser core
When the temperature value of piece 200 is more than pre-set current value more than preset temperature value or current value, which sends alarm
Signal reminds operating personnel;Only set an alarm module 120 that can reduce cost, and personnel easy to operation repair and behaviour
Make.
Further, and with reference to figure 3, the ageing system further includes the temperature-regulating module for being arranged on placement region 110
130, the temperature-regulating module 130 include PWM temperature controls submodule 131 and adding thermal resistance 132, the PWM temperature controls submodule 131 respectively with master
Control module 100 and adding thermal resistance 132 connect, which heats for chip of laser 200, which controls
PWM temperature controls submodule 131 adjusts the heating time of adding thermal resistance 132, so as to control the temperature value of chip of laser 200.The PWM
Temperature control submodule 131 is consistent with the quantity of chip of laser 200 with the quantity of adding thermal resistance 132 and corresponding setting, the temperature adjustment
Module 130 can adjust the temperature value of each chip of laser 200;Using PWM temperature controls submodule 131, ensure temperature-controlled precision, energy
Enough reach ± 1.5 DEG C;And circuit structure is simple, easy to operation and repair.Since the ageing system is under the high temperature conditions
Ageing process is carried out to chip of laser 200, therefore, working life can be improved using PWM temperature controls submodule 131, reduce and add
Work cost.
In the present embodiment, and with reference to figure 4, the ageing system further includes the timing module for being arranged on placement region 110
113, the chip of laser 200 is all connected with a timing module 113, and the timing module 113 connection main control module 100;The meter
When module 113 test adding thermal resistance 132 heating time.The main control module 100 is realized to each chip of laser 200 for a long time
Data tracing record, obtain the heating time of each adding thermal resistance 132, be the heating for obtaining each chip of laser 200
Time;Operating personnel obtain the heating time of adding thermal resistance 132 by timing module 113, consequently facilitating passing through temperature-regulating module 130
Adjust the heating time of adding thermal resistance 132.
Wherein, and with reference to figure 5, the temperature-regulating module 130 further include arranged on adding thermal resistance 132 and chip of laser 200 it
Between heat-conducting pad 133, since in ageing process, adding thermal resistance 132 is constantly in the condition of high temperature, which can
Adding thermal resistance 132 is avoided to contact directly chip of laser 200, so as to avoid chip of laser 200 because damage caused by high temperature.
The quantity of the heat-conducting pad 133 is consistent with the quantity of chip of laser 200 and corresponding setting.
Specifically, and with reference to figure 6, the PWM temperature controls submodule 131 includes switch mosfet 1311, the main control module 100
Closure or the disconnection of pwm signal control switch mosfet 1311 are sent, so as to adjust the heating time of adding thermal resistance 132.
Wherein, and with reference to figure 7, the ageing system further includes the power module 140 for being arranged on placement region 110, the electricity
The quantity of source module 140 is consistent with the quantity of chip of laser 200, and each chip of laser 200 is all connected with a power module
140, which individually powers for chip of laser 200, further enhances the interchangeability of ageing system,
Ensure that each chip of laser 200 can individually carry out ageing process.
In the present embodiment, the ageing system is arranged in an oven, if the oven is equipped with dried layer, every layer is equipped with side by side
Multiple placement regions 110, the chip of laser 200 are arranged in placement region 110.Due to each chip of laser 200
Control mode and fixed form are identical, and the ageing system can be individually to a chip of laser in placement region 110
200 carry out ageing process, obtain the temperature value and current value of chip of laser 200, carry out environment adjustment and data tracing record,
Over-pressed, under-voltage and overcurrent protection is carried out to chip of laser 200, interchangeability is high, can carry out arbitrary dilatation according to demand,
Suitable for producing in enormous quantities.
In conclusion the above is only the preferred embodiments of the present utility model only, the utility model is not intended to limit
Protection domain.Any modification made within the spirit and principle of the utility model, equivalent substitution, improve etc., it should all wrap
Containing within the protection scope of the present utility model.
Claims (8)
1. a kind of ageing system of chip of laser, the chip of laser are existed by ageing system imitated aging process, feature
In:The ageing system is equipped at least one placement region, and the ageing system includes main control module and and main control module
The temperature measurement module of connection and flow measurement module, the temperature measurement module and flow measurement module are arranged in placement region;The laser core
Piece is arranged in placement region, the temperature value of the temperature measurement module testing laser device chip, and temperature value is sent to main control module,
The current value of the flow measurement module testing chip of laser, and current value is sent to main control module.
2. ageing system according to claim 1, it is characterised in that:The ageing system, which further includes, is arranged on placement region
Temperature-regulating module, the temperature-regulating module include PWM temperature controls submodule and adding thermal resistance, the PWM temperature controls submodule respectively with master control mould
Block is connected with adding thermal resistance, and master control module controls PWM temperature controls submodule adjusts the heating time of adding thermal resistance.
3. ageing system according to claim 2, it is characterised in that:The temperature-regulating module further include arranged on adding thermal resistance and
Heat-conducting pad between chip of laser.
4. ageing system according to any one of claims 1 to 3, it is characterised in that:The ageing system further includes alarm mould
Block, the alarm module connect the main control module, which includes preset temperature value and pre-set current value;Work as temperature measurement module
When the temperature value of transmission is more than preset temperature value, which sends alarm signal;Alternatively, when flow measurement mould
When the current value that block is sent is more than pre-set current value, which sends alarm signal.
5. ageing system according to claim 4, it is characterised in that:The ageing system, which further includes, is arranged on placement region
Timing module, which connects the main control module;The timing module is tested the heating time of adding thermal resistance, and will be added
The hot time is sent to main control module.
6. ageing system according to claim 5, it is characterised in that:The ageing system, which further includes, is arranged on placement region
Power module, which connects the main control module, which is chip of laser power supply.
7. the ageing system according to Claims 2 or 3, it is characterised in that:The PWM temperature controls submodule is opened including MOSFET
It closes, which sends closure or the disconnection of pwm signal control switch mosfet.
8. ageing system according to claim 1, it is characterised in that:The ageing system is arranged in an oven, this is roasting
If case is equipped with dried layer, every layer is equipped with multiple placement regions side by side, and the chip of laser is arranged in placement region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721288304.8U CN207398579U (en) | 2017-09-30 | 2017-09-30 | A kind of ageing system of chip of laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721288304.8U CN207398579U (en) | 2017-09-30 | 2017-09-30 | A kind of ageing system of chip of laser |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207398579U true CN207398579U (en) | 2018-05-22 |
Family
ID=62331488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721288304.8U Expired - Fee Related CN207398579U (en) | 2017-09-30 | 2017-09-30 | A kind of ageing system of chip of laser |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207398579U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110007214A (en) * | 2019-04-25 | 2019-07-12 | 中国电子科技集团公司第四十三研究所 | A kind of pulse width modulation amplifier ageing process energy recycling system |
CN111289881A (en) * | 2020-03-30 | 2020-06-16 | 上海菲莱测试技术有限公司 | Chip reliability testing method, device, apparatus, system and storage medium |
CN112448761A (en) * | 2019-09-02 | 2021-03-05 | 武汉永鼎光通科技有限公司 | Automatic aging monitoring optical module system |
CN113055086A (en) * | 2019-12-26 | 2021-06-29 | 中兴通讯股份有限公司 | Optical module aging testing device |
CN114079221A (en) * | 2020-08-12 | 2022-02-22 | 武汉锐晶激光芯片技术有限公司 | Laser chip aging test system and method |
-
2017
- 2017-09-30 CN CN201721288304.8U patent/CN207398579U/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110007214A (en) * | 2019-04-25 | 2019-07-12 | 中国电子科技集团公司第四十三研究所 | A kind of pulse width modulation amplifier ageing process energy recycling system |
CN112448761A (en) * | 2019-09-02 | 2021-03-05 | 武汉永鼎光通科技有限公司 | Automatic aging monitoring optical module system |
CN113055086A (en) * | 2019-12-26 | 2021-06-29 | 中兴通讯股份有限公司 | Optical module aging testing device |
WO2021129161A1 (en) * | 2019-12-26 | 2021-07-01 | 中兴通讯股份有限公司 | Optical module aging test apparatus |
CN111289881A (en) * | 2020-03-30 | 2020-06-16 | 上海菲莱测试技术有限公司 | Chip reliability testing method, device, apparatus, system and storage medium |
CN114079221A (en) * | 2020-08-12 | 2022-02-22 | 武汉锐晶激光芯片技术有限公司 | Laser chip aging test system and method |
CN114079221B (en) * | 2020-08-12 | 2024-05-14 | 武汉锐晶激光芯片技术有限公司 | Laser chip aging test system and method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207398579U (en) | A kind of ageing system of chip of laser | |
CN102193053B (en) | Method for measuring relation curve of forward voltage and junction temperature of LED (Light Emitting Diode) in lamp | |
CN103162856A (en) | Non-contact high-power light-emitting diode (LED) junction temperature test method | |
CN101872933B (en) | Semiconductor pumped full-cavity microchip laser device with stable output wavelength | |
CN101266280A (en) | High power light-emitting diode heat resistance and junction temperature test system | |
CN107271878A (en) | Pass through the hot properties method of testing and device of electric current heating semiconductor | |
CN103630820A (en) | High-power LED heat resistance measuring device and method of measuring high-power LED heat resistance thereby | |
CN201273934Y (en) | Portable LED heat resistance test apparatus | |
CN103245923A (en) | Quick batch test device for light, color and electricity performance of LED | |
KR101261759B1 (en) | Heating package test system | |
CN217954518U (en) | Drawer type aging test device for optical chip | |
Shi et al. | Thermal investigation of LED array with multiple packages based on the superposition method | |
CN109709470A (en) | A kind of multi-chip combined power amplifier crust thermo-resistance measurement method | |
CN209432282U (en) | A kind of laser power test macro | |
CN104748885A (en) | Method for measuring LED (Light Emitting Diode) junction temperature based on I-V feature curve | |
CN108226733B (en) | Hybrid power cycle detection device for IGBT module and detection method thereof | |
CN208255745U (en) | Digital APD temperature control equipment | |
CN206945819U (en) | A kind of test device for chip frequency response characteristic | |
CN210222199U (en) | Laser chip testing device | |
CN104464546A (en) | System for controlling LED display screen to lower LED junction temperature | |
KR101261724B1 (en) | Board chamber for heating package | |
RU149884U1 (en) | DEVICE FOR THERMAL TESTING OF RADIO ELEMENTS | |
CN203519777U (en) | LED light bar aging tool | |
CN104361835A (en) | Method for reducing LED junction temperature by LED display screen | |
CN204882038U (en) | Light capability test system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 Termination date: 20210930 |
|
CF01 | Termination of patent right due to non-payment of annual fee |