KR20130022955A - Photopolymerizable unsaturated resin, photosensitive resin composition comprising the same, and light shielding spacer and liquid crystal display device formed therefrom - Google Patents

Abstract

PURPOSE: Photopolymerizable unsaturated resin is provided to provide a block-shielding spacer with excellent resolution and elastic restitution while having a low dielectric constant. CONSTITUTION: Photopolymerizable unsaturated resin is a product which is obtained by reacting an epoxy adduct, which is obtained by reacting epoxy resin indicated in chemical formula 1 with an unsaturated basic acid, with a polybasic acid anhydride. A photosensitive resin composition comprises the photopolymerizable unsaturated resin, a functional monomer which has one or more ethylenically unsaturated bonds, a polymerization initiator, a black organic pigment, and a solvent. The black organic pigment includes one or more selected from a group consisting of aniline black, lactam black, and perylene black.

Description

PHOTOPOLYMERIZABLE UNSATURATED RESIN, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND LIGHT SHIELDING SPACER AND LIQUID CRYSTAL DISPLAY DEVICE FORMED THEREFROM}

The present invention relates to a photopolymerizable unsaturated resin, a photosensitive resin composition comprising the same, and a light blocking spacer and a liquid crystal display device formed therefrom. More particularly, the present invention relates to a novel photopolymerizable unsaturated resin, a photosensitive resin composition having excellent elastic recovery rate, low dielectric constant, and excellent light shielding property, and a spacer and a liquid crystal display device formed therefrom.

Liquid crystal display (LCD) is one of the widely used flat panel display devices. A thin film transistor substrate having a pixel electrode and a color filter substrate having a common electrode are opposed to each other, and a liquid crystal layer is interposed therebetween. It is composed. Such a liquid crystal display displays an image in a manner of controlling the amount of light transmitted through the liquid crystal layer by rearranging the liquid crystal molecules of the liquid crystal layer by applying a voltage to the pixel electrode and the common electrode.

In the 21st century information society, it is required to maximize the space utilization and to carry easily, because it is possible to realize low power consumption, light weight, thin and high picture quality as diversification of consumption pattern is pursued. As a result, several new attempts have been made to make it more thinner. As a part of this, technologies for forming a color filter layer directly in a TFT structure have been introduced in a method of separately manufacturing a conventional TFT lower substrate and a color upper substrate and bonding them together.

In a new technique for forming a color filter layer directly in a TFT structure, spacers are generally formed from the photosensitive composition using lithography. The spacer must be shielded from light by the incident light of the thin film transistor to prevent the thin film transistor from malfunctioning as a switching element. In order to manufacture such a light-shielding spacer, incorporation of carbon black into the photosensitive resin composition is proposed. However, when the spacer is made of a photosensitive resin composition containing carbon black, there arises a problem that electric distortion is caused by an electric field applied to the upper substrate and the lower substrate due to the high dielectric constant of the carbon black. Therefore, development of a spacer having excellent light shielding property and low dielectric constant is required.

In addition, the photosensitive resin composition used for manufacture of a light-shielding spacer is a black composition made mainly by mixing pigments of different colors or various kinds of pigments, and such pigments tend not to be dissolved in a developer. There is a problem that the developability is poor, the development takes a long time, or the desired resolution can not be obtained due to the low solubility of the pigment in the developer. Particularly, in the case where a colored independent dot (DOT) spacer pattern is to be formed, the importance of resolution is further increased.

In addition, since the spacer must have a step between the main spacer and the sub spacer, the height of the final spacer according to the exposure energy must be completed at a constant ratio, and in order to have resistance to pressure of the upper plate, specific properties such as elastic recovery rate are also required. It must be equipped.

Korean Patent Application Publication No. 2010-0066197 discloses a black photosensitive resin composition having a good pattern shape, which exhibits a low dielectric constant and a high compressive displacement and recovery rate while achieving excellent optical density when forming a thin film, but is formed from the composition. The resolution of the thin film is not considered at all, and the criterion of conformity determination is 70% in the recovery rate, which does not satisfy the level required in the art.

Japanese Patent Application Laid-Open No. 2002-040440 can form a spacer having excellent light shielding properties, high mechanical strength and heat resistance, and does not irreversibly deform when the panel is sealed and does not cause display defects due to gaps in the liquid crystal layer. Although a radiation sensitive composition is disclosed, the dielectric constant and the resolution are not considered at all in the spacer formed from the composition.

Korean Patent Application Publication No. 2010-0066197, Japanese Patent Application Publication No. 2002-040440

The present invention has been made to solve the above-mentioned conventional problems and to meet the technology required in the art, and the first problem is to provide a photopolymerizable unsaturated resin having a new structure included in the photosensitive resin composition.

The second object of the present invention is to form a dot spacer pattern of the size of 10 ~ 100 μm due to sufficient solubility in the developer before and after exposure, including the photopolymerizable unsaturated resin of the new structure, the dielectric constant of the formed dot spacer patterns It is providing the photosensitive resin composition which can maintain the outstanding light-shielding property while being low.

A third object of the present invention is to provide a light-shielding spacer having sufficient resolution and excellent elastic restoring force, which is formed of the photosensitive resin composition.

A fourth object of the present invention is to provide a liquid crystal display device having the light blocking spacer.

As a technical means for achieving the above technical problem, one aspect of the present invention is polybasic acid anhydride (C) to the epoxy adduct (AB) obtained by reacting the epoxy resin (A) and unsaturated basic acid (B) of formula (1) ) Or a product obtained by reacting a polybasic acid anhydride (C) with an epoxy adduct (AB) obtained by reacting a product (P1) obtained by reacting an epoxy resin (A) with an unsaturated basic acid (B) A photopolymerizable unsaturated resin, which is a product (P2) obtained by further reacting a monofunctional or polyfunctional epoxy compound (D) with P1).

[Formula 1]

Carbon labeled with * in Formula 1 is

,

,

또는

에 포함된 *로 라벨링된 탄소로 대체되고,

,

,

or

Replaced by carbon labeled with * in

L ¹ is C _{1 - 10} alkylene group, C _{3 - 10} is an alkylene group, _{- 20} cycloalkyl group or a C ₁

₁₄ is an aryl group, _- R ¹ to R ⁷ are the same, or different, and each independently represents a hydrogen atom, C ₁ to each other _{- 10} alkyl group, C _{1 - 10} alkoxy groups, C _{2 - 10} alkenyl or C ₆

R ⁸ is selected from the group consisting of a hydrogen atom, an ethyl group, CH ₃ CHCl—, CH ₃ CHOH—, CH ₂ = CHCH ₂ —, and a phenyl group,

n is an integer of 0-10.

Another aspect of the present invention is to provide a photosensitive resin composition comprising the photopolymerizable unsaturated resin, a functional monomer having at least one ethylenically unsaturated bond, a polymerization initiator, a black organic pigment, and a solvent.

Another aspect of the present invention is to provide a light-shielding spacer formed from the photosensitive resin composition.

Another aspect of the present invention is to provide a liquid crystal display device having the spacer.

The photosensitive resin composition including the photopolymerizable unsaturated resin according to the present invention may form a light blocking spacer in a dot spacer pattern having a size of 10 to 100 μm due to sufficient solubility in a developer before and after exposure. In addition, the formed light-shielding spacer has a low dielectric constant of 8 or less, and has an excellent light blocking property with an optical density of 1.0 or more per unit μm, and has sufficient resolution and excellent elastic restoring force.

Hereinafter, specific embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention.

One. Photopolymerization  Unsaturated resin

The photopolymerizable unsaturated resin of the present invention is a product obtained by reacting an epoxy adduct (AB) and a polybasic acid anhydride (C) obtained by adding an unsaturated basic acid (B) to an epoxy resin (A) represented by the formula (1) (P1). ) Or a product (P2) obtained by reacting a monofunctional or polyfunctional epoxy compound (D) with the product.

The epoxy adduct (AB) is 0.1 to 5 equivalent parts of the carboxyl group, more preferably 0.2 to 2 equivalent parts, still more preferably 0.4 to 1 equivalent part to the epoxy resin (A) corresponding to 1 equivalent part of the epoxy group. The said unsaturated basic acid (B) can be obtained by addition reaction by a well-known addition reaction.

The photopolymerizable unsaturated resin has 0.1 to 5 equivalent parts of acid anhydride group, more preferably 0.2 to 2 equivalent parts, and even more preferably 0.4 to 1 equivalent part in the epoxy adduct (AB) corresponding to 1 equivalent part of hydroxyl group. It is the product (P1) obtained by making the said polybasic acid anhydride (C) react. The said photopolymerizable unsaturated resin can be obtained by esterifying the said polybasic acid anhydride (C) with the said epoxy adduct (AB) by a well-known method.

Further, the photopolymerizable unsaturated resin is a monofunctional or polyfunctional epoxy compound (D) in the product (P1), 0.1 to 1 equivalent part of hydroxyl group of the epoxy adduct (AB) epoxy group in the monofunctional or polyfunctional epoxy compound To 5 equivalent parts, more preferably 0.2 to 2 equivalent parts, and still more preferably 0.3 to 1 equivalent part, to obtain an additional esterification reaction.

The esterification reaction of the product (P1) obtained by esterifying the polybasic acid anhydride (C) to the epoxy adduct (AB) with a monofunctional or polyfunctional epoxy compound (D) comprises a carboxyl group derived from a polybasic acid anhydride (C), It can be performed between the epoxy group of a monofunctional or polyfunctional epoxy compound (D).

In addition, in order to react efficiently between the carboxyl group derived from polybasic acid anhydride (C), and the epoxy group of a monofunctional or polyfunctional epoxy compound (D), the said photopolymerizable unsaturated resin corresponds to the said 1 equivalent part of hydroxyl group The sum of the acid anhydride group equivalent portion of the polybasic acid anhydride (C) and the equivalent portion of the epoxy group in the monofunctional or polyfunctional epoxy compound (D) is 1.0 equivalent part or more, more preferably 1.1 to 2.0 equivalents in the epoxy adduct (AB). The polybasic acid anhydride (C) may be reacted with the added content to obtain a product, and the monofunctional or polyfunctional epoxy compound (D) may be reacted with the product.

The photopolymerizable unsaturated binder resin preferably has a weight average molecular weight (Mw) of 1,500 to 20,000, more preferably 3,000 to 15,000. When the weight average molecular weight of the photopolymerizable unsaturated binder resin is in the above-described range, the fluidity of the resin is maintained in an appropriate range, so that handling is easy and pattern formation becomes easy.

In the photosensitive resin composition according to the present invention, the content of the photopolymerizable unsaturated binder resin may be 0.5 to 50% by weight based on the total weight of the photosensitive resin composition excluding the residual amount of solvent, and the content of the photopolymerizable unsaturated binder resin is If it is within the range, it is easy to form a pattern shape after exposure development, satisfies the basic physical properties that the light shielding material should have, process time such as development time and sensitivity is optimized, and characteristics such as compression characteristics and chemical resistance are improved.

(A) epoxy resin

The epoxy resin (A) used in the present invention has a 9H-xanthene skeleton as a compound represented by the following formula (1).

The 9H-xanthene skeleton structure of the epoxy resin (A) improves adhesion between the cured product and the substrate, alkali resistance, processability, strength, and the like, and develops a clear image in a fine pattern when developing and removing the uncured portion. It acts as a factor to form precisely.

[Formula 1]

Carbon labeled with * in Formula 1 is

,

,

또는

에 포함된 *로 라벨링된 탄소로 대체되고,

,

,

or

Replaced by carbon labeled with * in

L ¹ is C _{1 - 10} alkylene group, C _{3 - 10} is an alkylene group, _{- 20} cycloalkyl group or a C ₁

₁₄ is an aryl group, _- R ¹ to R ⁷ are the same, or different, and each independently represents a hydrogen atom, C ₁ to each other _{- 10} alkyl group, C _{1 - 10} alkoxy groups, C _{2 - 10} alkenyl or C ₆

R ⁸ is selected from the group consisting of a hydrogen atom, an ethyl group, CH ₃ CHCl—, CH ₃ CHOH—, CH ₂ = CHCH ₂ —, and a phenyl group,

n is an integer of 0-10.

Examples of the C _{1 -10} alkylene group, a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutyl group, a sec- butyl group, tert- butyl group, a pentyl group, an isopentyl group, a tert -Pentylene group, hexylene group, heptylene group, octylene group, isooctylene group, tert-octylene group, 2-ethylhexylene group, nonylene group, isononylene group, decylene group, isodecylene group, etc. are mentioned. .

The C _{3 - 20} Specific examples of the cycloalkyl group may be mentioned cyclopenten-propylene group, cyclobutyl group, cyclopentyl group, cyclohexylene group, a cycloheptyl group, a carbonyl group and having potassium adamantyl group.

Examples of the C _{1 -10} alkylene group is a methylene oxy group, ethylene group, propylene group, butylene group, sec- butylene group, tert- butylene group, a pentylene alkylene group, hexylene oxide group, Heptyleneoxy group, octyleneoxy group, 2-ethyl-hexyleneoxy group, etc. are mentioned.

The C _{1 - 10.} Examples of the alkyl group a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, sec- butyl group, tert- butyl group, a pentyl group, an isopentyl group, tert- pentyl, Hexyl group, heptyl group, octyl group, isooctyl group, tert-octyl group, 2-ethylhexyl group, nonyl group, isononyl group, decyl group, isodecyl group, etc. are mentioned.

The C _{1 -} methoxy Examples of the ₁₀ alkoxy group, ethoxy, propyl oxy group, butyl oxy group, sec- butoxy group, tert- butoxy group, pentoxy group, hexyloxy group, heptok time, octanoic tilok group, 2 -Ethyl-hexyloxy group, etc. are mentioned.

The C _{2 -} there may be mentioned vinyl group, allyl group, butenyl group, propenyl group, etc. Examples of the alkenyl group _10.

Examples of the C _{6 -14} aryl group, a phenyl group, a tolyl group, a xylyl group, a naphthyl group or the like.

(B) unsaturated Basic acid

The unsaturated basic acid (B) used by this invention is used in order to improve the sensitivity of the photosensitive resin composition containing the photopolymerizable unsaturated resin of this invention. Specific examples include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid, hydroxyethyl methacrylate maleate, hydroxyethyl acrylate maleate, hydroxypropyl methacrylate maleate, and hydroxypropyl acrylate. Maleates, dicyclopentadiene maleates, and polyfunctional (meth) acrylates having one carboxyl group and two or more (meth) acryloyl groups; and the like, but are not limited thereto. An unsaturated basic acid can be used 1 type or in combination of 2 or more types, and polyfunctional (meth) acrylate which has acrylic acid, methacrylic acid, and one carboxyl group and two or more (meth) acryloyl groups is preferable.

The polyfunctional (meth) acrylate having one carboxyl group and two or more (meth) acryloyl groups is, for example, a polyfunctional having one hydroxyl group and two or more (meth) acryloyl groups in one molecule. It can obtain by making (meth) acrylate, dibasic acid anhydride, or carboxylic acid react.

(C) Polybasic acid  anhydride

The polybasic acid anhydride (C) used in the present invention is used to increase the acid value of the photosensitive resin composition comprising the photopolymerizable unsaturated resin of the present invention to improve pattern formation, developability and development speed.

Examples of the polybasic acid anhydride (C) include succinic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, 2,2'-3,3'-benzophenonetetracarboxylic dianhydride, 3,3'-4, 4'-benzophenone tetracarboxylic dianhydride, ethylene glycol bis (anhydrotrimellitate), glycerol tris (anhydrotrimellitate), phthalic anhydride, hexahydrophthalic anhydride, methylhydrophthalic anhydride, tetrahydro phthalic anhydride , Nadic acid anhydride, methylnadic anhydride, trialkyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicar One or two or more selected from acid anhydrides, trialkyl tetrahydrophthalic anhydride-maleic anhydride adducts, dodecenyl anhydride succinic acid and methyl hybic anhydride, more preferably succinic anhydride, trimelliic acid But it can be used in combination of one or two or more selected from the group consisting of sumul and hexahydro phthalic anhydride, without being limited thereto.

(D) Monofunctional  or Multifunctional  Epoxy compound

The monofunctional epoxy compound used by this invention is used in order to adjust the acid value of the said photopolymerizable unsaturated resin, and to improve the developability of the photosensitive resin composition further. In the photosensitive resin composition according to the present invention, the acid value of the solid content is preferably in the range of 20 to 120 mgKOH / g, and the amount of the monofunctional epoxy compound is preferably selected to satisfy the acid value.

As a specific example of the said monofunctional epoxy compound, glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, isobutyl glycy Dyl ether, t-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, undecyl glycyl Cedyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, hexadecyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glyc Cydyl ether, propargyl glycidyl ether, 2-methoxyethylglycidyl ether, phenylglycidyl ether, p-methoxyphenylglycidyl ether, p-butylphenylglycidyl ether, cresylgly Cyl ether, 2-methylcrestilgle Lycidyl ether, 4-nonylphenyl glycidyl ether, benzyl glycidyl ether, p-cumylphenyl glycidyl ether, trityl glycidyl ether, 2,3-epoxypropyl methacrylate, epoxidized soybean oil, epoxy Flax linseed oil, glycidyl butyrate, vinyl cyclohexane monooxide, 1,2-epoxy-4-vinylcyclohexane, styrene oxide, pinene oxide, methyl styrene oxide, cyclohexene oxide, and propylene oxide.

The polyfunctional epoxy compound used in the present invention serves to control the development speed by increasing the molecular weight of the photopolymerizable unsaturated resin.

The polyfunctional epoxy compound may be a cyclohexene oxide or a cyclopentene obtained by epoxidizing a polyglycidyl ether of a polyhydric alcohol or an alkylene oxide adduct thereof, a polyglycidyl ether of a polybasic acid, a cyclohexene or a cyclopentene-containing compound with an oxidizing agent. Oxide-containing compounds, and more specifically, bisphenol A type epoxy resins, bisphenol B type epoxy resins, bisphenol C type epoxy resins, bisphenol E type epoxy resins, bisphenol F type epoxy resins, bisphenol M type epoxy resins, and bisphenols. Alkylidene bisphenol polyglycidyl ether type epoxy resins such as P type epoxy resin, bisphenol S type epoxy resin, and bisphenol Z type epoxy resin; Hydrogenated bisphenol type diglycidyl ether obtained by hydrogenating the alkylidene bisphenol polyglycidyl ether type epoxy resin; Ethylene glycol diglycidyl ether, 1,3-propylene glycol diglycidyl ether, 1,2-propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol di Glycidyl ether, 1,8-octanediol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol Diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1 -Tri (glycidyloxymethyl) propane, 1,1,1-tri (glycidyloxymethyl) ethane, 1,1,1-tri (glycidyloxymethyl) methane, 1,1,1,1 Tetra (glycidyloxymethyl) methane, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, sorbitol tetraglycidyl ether, dipentaerythritol hexaglycol Sidil ether of an aliphatic polyol glycidyl ether; Polyglycidyl ethers of polyether polyols obtained by adding two or more alkylene oxides to polyhydric alcohols such as propylene glycol, trimethylolpropane and glycerin; Novolak-type epoxy compounds, such as a phenol novolak-type epoxy compound, a biphenyl novolak-type epoxy compound, a cresol novolak-type epoxy compound, a bisphenol A novolak-type epoxy compound, and a dicyclopentadiene novolak-type epoxy compound; 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methyl Cyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane Carboxylate, 1-epoxyethyl-3,4-epoxycyclohexane, bis (3,4-epoxycyclohexylmethyl) adipate, methylenebis (3,4-epoxycyclohexane), isopropylidenebis (3, Alicyclic epoxy compounds such as 4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylenebis (3,4-epoxycyclohexanecarboxylate), and 1,2-epoxy-2-epoxyethylcyclohexane; Glycidyl esters of dibasic acids such as phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ether, and dimer acid glycidyl ester; Glycidyl amines such as tetraglycidyldiaminodiphenylmethane, triglycidyl P-aminophenol and N, N-diglycidyl aniline; Heterocyclic epoxy compounds such as 1,3-diglycidyl-5, 5-dimethyl hydantoin and triglycidyl isocyanurate; Dioxide compounds such as dicyclopentadiene dioxide; Naphthalene type epoxy compounds, triphenylmethane type epoxy compounds, dicyclopentadiene type epoxy compounds, and the like.

Commercially available products may be used as the polyfunctional epoxy compound, for example, BREN-S, EPPN-201, EPPN-501N, EOCN-1020, GAN, GOT (manufactured by Nippon Kayaku), Adeka Resin EP-4000 , Adeka Resin EP-4003S, Adeka Resin EP-4080, Adeka Resin EP-4085, Adeka Resin EP-4088, Adeka Resin EP-4100, Adeka Resin EP-4900, Adeka Resin ED-505, Adeka Resin ED-506, Adeka Resin KRM-2110, Adeka Resin KRM-2199, Adeka Resin KRM-2720 (manufactured by Adeka), R-508, R-531, R-710 (manufactured by Mitsui Chemicals), Epicoat 190P, Epicoat 191P, Epicoat 604, Epicoat801 , Epicoat 828, Epicoat 871, Epicoat 872, Epicoat 1031, Epicoat RXE15, Epicoat YX-4000, Epicoat YDE-205, Epicoat YDE-305 (manufactured by Japan Epoxy Resins), Sumiepoxy ELM-120, Sumiepoxy ELM-434 (SumitomoChemical) Products), Denacoal EM-150, Denacoal EX-201, Denacoal EX-211, Denacoal EX-212, Denacoal EX-313, Denacoal EX-314, Denacoal EX-322, Denacoal EX-411, Denacoal EX-421, Denacoal EX -512, Denacoal EX-521, Denacoal EX-614, Denacoal EX-711, Denacoal EX-721, Denacoal EX-731, Denacoal EX-811, Denacoal EX-821, Denacoal EX-850, Denacoal EX-851, Denacoal EX-911 (manufactured by Nagase ChemteX), Epolite 70P, Epolite 200P Epolite 400P, Epolite 40E, Epolite 100E, Epolite 200E, Epolite 400E, Epolite 80MF, Epolite 100MF, Epolite 1500NP, Epolite 1600, Epolite 3002, Epolite 4000, Epolite FR-1500, Epolite M-1230, Epolite EHDG-L (Kyoeisha Chemical company), SB-20 (Okamura Oil Mill), Epicron 720 (Dainippon Ink and Chemicals), UVR-6100, UVR-6105, UVR-6110, UVR-6200, UVR-6228 (Union Carbide) Products), Celoxide 2000, Celoxide 2021, Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, Celoxide 3000, Cycomer A200, Cycomer MlOO, Cycomer MlOl, Epolead GT-301, Epolead GT-302, Epolead 401, Epolead 403, Epolead HD300, EHPE-3150, ETHB, Epoblend (manufactured by Daicel Chemical Industries), PY-306, 0163, DY-022 (manufactured by Ciba Specialty Chemicals), Suntohto ST0000, Epotohto YD-011, Epotohto YD-115, Epotohto YD- 127, Epotohto YD-134 , Epotohto YD-172, Epotohto YD-6020, Epotohto YD-716, Epotohto YD-7011R, Epotohto YD-901, Epotohto YDPN-638, Epotohto YH-300, Neotohto PG-202, Neotohto PG-207 (Tohto Kasei) ) And Blenmer G (NOF).

2. at least one or more Ethylenic  Having an unsaturated bond Sensuality Monomer

The functional monomer having at least one ethylenically unsaturated bond, which is a reactive unsaturated compound, is a monomer or oligomer generally used in the photosensitive resin composition, and has a monofunctionality of acrylic acid or methacrylic acid having at least one ethylenically unsaturated double bond or Polyfunctional esters can be used.

The content of the functional monomer having at least one ethylenically unsaturated bond may be 1 to 50% by weight based on the total weight of the photosensitive resin composition excluding the residual amount of solvent, and the functional monomer having at least one ethylenically unsaturated bond. If the content of the above range is easy to form a pattern and does not occur at the bottom of the development phenomenon is advantageous in terms of development margin.

The functional monomer having at least one ethylenically unsaturated bond is an ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6- as a reactive unsaturated compound. Hexanediol diacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, ethylene glycol dimethacrylate and One, two or more selected from the group consisting of 1,6-hexanediol dimethacrylate may be used in combination, but is not limited thereto.

Commercially available functional monomers having at least one ethylenically unsaturated bond include commercially available products of monofunctional (meth) acrylate, such as Aronix M-101, Copper M-111, and Copper M-114 (Doagosei Chemical Co., Ltd.). AKAYARAD TC-110S, East TC-120S (manufactured by Nihon Kayaku Co., Ltd.), V-158, and V-2311 (manufactured by Osaka Yugaku Kagaku Kogyo Co., Ltd.). As a commercial item of twill (meth) acrylate, Aronix M-210, copper M-240, copper M-6200 (product of Toa Kosei Kagaku Kogyo Co., Ltd.), KAYARAD HDDA, copper HX-220, copper R-604 ( Nihon Kayaku Co., Ltd.), V260, V312, V335 HP (Osaka Yuki Kagaku Kogyo Co., Ltd. product), etc. are mentioned. Moreover, as a commercial item of the (meth) acrylate more than trifunctional, Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060 (Doa) Kosei Kagaku Kogyo Co., Ltd.), KAYARAD TMPTA, DONG DPCA-20, DONG-30, DONG-60, DONG-120 (Nippon Kayaku Co., Ltd.), V-295, DONG-300, DONG-360 , Copper-GPT, copper-3PA, copper-400 (manufactured by Osaka Yuki Kayaku Kogyo Co., Ltd.), and the like. The compounds may be used together in one or two.

The content of the functional monomer having at least one ethylenically unsaturated bond is 1 to 50% by weight, more preferably 1 to 20% by weight, even more preferably 1 to the total photosensitive resin composition excluding the residual amount of solvent. To 15% by weight. When the content of the functional monomer having an ethylenically unsaturated bond is in the range of 1 to 50% by weight, the sensitivity is improved in the presence of oxygen, the pattern is easily formed, the compatibility with the copolymer is improved, and the coating film is formed. The surface of the coating film is not rough, and over developing does not occur at the lower end during development, which is advantageous in terms of development margin.

3. Polymerization initiator

The polymerization initiator according to the present invention may be formed by the functional monomer having at least one or more ethylenically unsaturated bonds or a monofunctional or polyfunctional epoxy compound by exposure to radiation such as visible light, ultraviolet ray, far ultraviolet ray, electron ray, X-ray and the like. A compound that generates an active species capable of initiating polymerization.

As such a photoinitiator, an acetophenone type compound, a biimidazole type compound, a triazine type compound, O-acyl oxime type compound, an onium salt type compound, a benzoin type compound, a benzophenone type compound, a diketone type compound, the (alpha) -dike A ton compound, a polynuclear quinone compound, a thioxanthone compound, a diazo compound, an imide sulfonate compound, an oxime compound, a carbazole compound, a sulfonium borate compound and the like. These compounds may be used by mixing one or two or more as a component which generates an active radical or an active acid by exposure, or both an active radical and an active acid.

Examples of the acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, and pt- Butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropane-1- On, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one and the like can be used.

Examples of the benzophenone compound include benzophenone, benzoyl benzoic acid, benzoyl benzoic acid methyl, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis (dimethyl amino) benzophenone, and 4,4'- Bis (diethylamino) benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone and the like can be used.

Examples of the thioxanthone compound include thioxanthone, 2-chloro thioxanthone, 2-methyl thioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, and 2,4-diisopropyl tea. Orcanthone, 2-chloro thioxanthone and the like can be used.

Examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

Examples of the triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis (trichloromethyl) -s-triazine, and 2- (3 ', 4'-dimethoxy Styryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2- Biphenyl 4,6-bis (trichloromethyl) -s-triazine, bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphtho1-yl) -4,6-bis (Trichloromethyl) -s-triazine, 2- (4-methoxynaphtho1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2-4-trichloromethyl (pipe) Ronyl) -6-triazine, 2-4-trichloromethyl (4'-methoxystyryl) -6-triazine and the like can be used.

Preferably, p-dimethylaminoacetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, benzyl dimethyl ketal, benzophenone, benzoinpropyl ether, diethyl thioxane as the polymerization initiator Ton, 2,4-bis (trichloromethyl) -6-p-methoxyphenyl-s-triazine, 2-trichloromethyl-5-styryl-1,3,4-oxodiazole, 9-phenyl Acridine, 3-methyl-5-amino-((s-triazin-2-yl) amino) -3-phenylcoumarin, 2- (o-chlorophenyl) -4,5-diphenylimidazolyl dimer Sieve, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, o-benzoyl-4 '-(benzmercapto) benzoyl-hexyl-ketoxime, 2,4,6- One selected from the group consisting of trimethylphenylcarbonyl-diphenyl phosphonyl oxide, hexafluorophosphoro-trialkylphenylsulfonium salt, 2-mercaptobenzimidazole, 2,2'-benzothiazolyl disulfide and mixtures thereof The above may be used, but the present invention is not limited thereto.

The content of the polymerization initiator may be 0.1 to 10% by weight based on the total weight of the photosensitive resin composition excluding the residual amount of the solvent, and if the content of the polymerization initiator is in the above range, curing by exposure is sufficient to obtain a colored layer pattern. And, there is an advantage that the formed colored layer is in close contact with the substrate during development.

4. Black Organic Pigment

The black organic pigment is an organic pigment, and means blackened to exhibit a black color similar to carbon black, which is an inorganic pigment.

As the black organic pigment, one or more selected from aniline black, lactam black, and perylene black may be used, but is not limited thereto.

In addition, the photosensitive resin composition according to the present invention may further include a black inorganic pigment together with the black organic pigment, wherein the black inorganic pigment is at least one selected from the group consisting of carbon black, chromium oxide, iron oxide and titanium black. The content is 0.1 to 70 parts by weight based on 100 parts by weight of the black organic pigment.

When the content of the inorganic pigment is increased, the melt flow phenomenon becomes severe, and there is a problem that formation of a thick film pattern such as a column spacer is difficult. Therefore, it is important to control the mixing ratio of the organic pigment and the inorganic pigment as described above. .

The content of the black organic pigment, or the black organic pigment and the black inorganic pigment is 10 to 60% by weight based on the total weight of the photosensitive resin composition excluding the residual amount of the solvent. When the content of the black inorganic pigment is in the above range, the optical density can be prevented from being too low, and there is an effect of improving processability such as developability with achieving high optical density.

On the other hand, in dispersing a pigment in the photosensitive resin composition which concerns on this invention, a dispersing agent can be used. The dispersant may be added to the pigment internally in a manner of surface-treating the pigment in advance, or may be added and used in the preparation of the photosensitive resin composition together with the pigment.

5. Solvent

Solvents used in the present invention have compatibility with the above-mentioned photosensitive resin composition components, but do not react with them.

Alcohols such as methanol and ethanol as the solvent; Ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether and tetrahydrofuran; Glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate and diethyl cellosolve acetate; Carbitols such as methylethylcarbitol, diethylcarbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; Aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butylkenone, methyl-n-amyl ketone and 2-heptanone ; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate and propyl 2-oxypropionic acid; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters, such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, and 2-ethoxy-2- Monooxy monocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyls such as ethyl methyl propionate; Esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate and methyl 2-hydroxy-3-methylbutanoate; Compounds such as ketone acid esters, such as ethyl pyruvate, and N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, and N, N-dimethylacetic Amide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetonyl acetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate And high boiling point solvents such as ethyl benzoate, diethyl oxalate, diethyl maleate, gamma -butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

Considering the compatibility and reactivity with the other components of the resin composition of this invention among these solvents, Glycol ethers, such as ethylene glycol monoethyl ether; Ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; Esters such as 2-hydroxy ethyl propionate; Diethylene glycol such as diethylene glycol monomethyl ether; Preferred are propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate.

The solvent is used as the residual amount, it is preferably included in 50 to 90% by weight relative to 100% by weight of the total content of the photosensitive resin composition including the residual amount of the solvent content. When the content of the solvent is used in 50 to 90% by weight, there is an advantage that the processability is good as the resin composition has an appropriate viscosity.

6. Other additives

One) Silane Coupling agent

The photosensitive resin composition of the present invention further includes a silane coupling agent having one or more reactive substituents selected from the group consisting of carboxyl groups, methacryloyl groups, isocyanate groups, epoxy groups, and combinations thereof to improve adhesion to the substrate. can do.

Specific examples of the silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryloxypropyl trimethoxysilane, vinyltriacetoxysilane, vinyl trimethoxysilane, γ-isocyanatepropyl triethoxysilane, and γ-glycidoxy Cipropyl trimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and the like, and these may be used alone or in combination of two or more thereof.

When added, the amount of the silane coupling agent added is preferably used in an amount of 0.001 to 20 parts by weight based on 100 parts by weight of the photopolymerizable binder resin.

2) surfactant

The photosensitive resin composition of this invention may further contain surfactant for the effect of a coating improvement and the prevention of defect formation, as needed.

As said surfactant, for example, BM-1000, BM-1100 (made by BM Chemie company), Mecha pack F142D, copper F 172, copper F 173, copper F 183 (made by Dainippon Inky Chemical Co., Ltd.), Prorad FC-135, Copper FC-170C, Copper FC-430, Copper FC-431 (manufactured by Sumitomo 3M), Saffron S-112, Copper S-113, Copper S-131, Copper S-141, Fluorine-based interfaces sold under the names S-145 (manufactured by Asahi Glass Co., Ltd.), SH-28PA, copper-190, copper-193, SZ-6032, SF-8428 (manufactured by Toray Silicone Co., Ltd.). Active agents can be used.

When added, the amount of the surfactant is preferably used in 0.001 to 5 parts by weight based on 100 parts by weight of the photopolymerizable binder resin.

In addition, a certain amount of other additives such as antioxidants and stabilizers may be added to the photosensitive resin composition of the present invention within a range that does not impair physical properties.

According to another aspect of the present invention, the present invention provides a light-shielding spacer formed from the photosensitive resin composition. The spacer has a dielectric constant of 8 F / m or less and an optical density of 1.0 or more.

According to still another aspect of the present invention, there is provided a liquid crystal display device having the spacer.

Hereinafter, the configuration of the present invention will be described in more detail with reference to the following examples indicated as preferred examples.

[Example]

Synthetic example  1. Epoxy Resin Synthesis ( Xanten  Derivatives [a-1])

125.4 g of spiro [fluorene-9,9'-xanthene] -3 ', 6'-diol in a 3000 ml three-neck round flask and t 0.1386 g of -butylammonium bromide was mixed, 78.6 g of epichlorohydrin was added, and the mixture was heated and reacted at 90 ° C. When liquid chromatography was used to completely exhaust the spiro [fluorene-9,9'-xanthene] -3 ', 6'-diol, the mixture was cooled to 30 ° C and slowly added 50% aqueous NaOH solution (3 equivalents). Then, when the epichlorohydrin was completely exhausted, the reaction solution was extracted with dichloromethane and then washed three times. The organic layer was dried over magnesium sulfate, the dichloromethane was distilled off under reduced pressure, and dichloromethane and methanol were mixed at a ratio of 50:50 v: v).

Thus, 1 equivalent of the epoxy compound, 0.004 equivalent of t-butylammonium bromide, 0.001 equivalent of 2,6-diisobutylphenol, and 2.2 equivalent of acrylic acid were mixed, and 8.29 g of solvent propylene glycol monomethyl ether acetate was added thereto. The reaction solution was heated to 90 to 100 ° C while blowing air into the reaction solution at 25 ml / min to dissolve the reaction product. The reaction solution was completely dissolved in the cloudy state by heating to 120 ° C. When the solution becomes transparent and the viscosity becomes high, the acid value is measured and stirred until the acid value becomes less than 1.0 mg KOH / g. It took 11 hours until the acid value reached the target value (0.8). After completion of the reaction, the temperature of the reactor was lowered to room temperature to obtain a colorless transparent solid.

Synthetic example  2. Synthesis of Epoxy Resin ( Xanten  Derivatives [a-2])

In a 3000 ml three-neck round flask, 125.4 g of 9,9-diphenyl-9H-xanthene-3,6-diol and 0.1386 g of t-butylammonium bromide were mixed Then, 78.6 g of epichlorohydrin was added thereto, and the mixture was heated and reacted at 90 ° C. Analysis of the liquid chromatography showed that when 9,9-diphenyl-9H-xanthene-3,6-diol was completely consumed, the mixture was cooled to 30 ° C and slowly added 50% aqueous NaOH solution (3 equivalents). After epichlorohydrin was analyzed by liquid chromatography, the mixture was extracted with dichloromethane and washed three times. The organic layer was dried over magnesium sulfate, and dichloromethane was distilled off under reduced pressure. Recrystallized using: v).

Thus, 1 equivalent of the epoxy compound, 0.004 equivalent of t-butylammonium bromide, 0.001 equivalent of 2,6-diisobutylphenol, and 2.2 equivalent of acrylic acid were mixed, and 8.29 g of solvent propylene glycol monomethyl ether acetate was added thereto. The reaction solution was dissolved by heating the temperature to 90-100 ° C. while blowing air into the reaction solution at 25 ml / min. The reaction solution was completely dissolved in the cloudy state by heating to 120 ° C. When the solution becomes transparent and the viscosity becomes high, the acid value is measured and stirred until the acid value becomes less than 1.0 mg KOH / g. It took 11 hours until the acid value reached the target value (0.8). After completion of the reaction, the temperature of the reactor was lowered to room temperature to obtain a colorless transparent solid.

Synthetic example  3. Synthesis of Epoxy Resin ( Xanten  Derivatives [a-3])

3,6-dimethoxyspiro [fluorene-9,9'-xanthene] -3 ', 6'-diol (3,6-dimethoxyspiro [fluorene-9,9'-xanthene] -3 in a 3000 ml three-neck round flask 145.2 g of ', 6'-diol) and 0.1423 g of t-butylammonium bromide were mixed, 73.6 g of epichlorohydrin was added thereto, and the mixture was heated and reacted at 90 ° C. After liquid chromatography, 3,6-dimethoxyspiro [fluorene-9,9'-xanthene] -3 ', 6'-diol was completely exhausted and then cooled to 30 ° C. in a 50% aqueous solution of NaOH (3 equivalents). Was added slowly. After epichlorohydrin was analyzed by liquid chromatography, the mixture was extracted with dichloromethane and washed three times. The organic layer was dried over magnesium sulfate, and dichloromethane was distilled off under reduced pressure. Recrystallized using: v).

Thus, 1 equivalent of the epoxy compound, 0.004 equivalent of t-butylammonium bromide, 0.001 equivalent of 2,6-diisobutylphenol, and 2.2 equivalent of acrylic acid were mixed, and 8.29 g of solvent propylene glycol monomethyl ether acetate was added thereto. The reaction solution was dissolved by heating the temperature to 90-100 ° C. while blowing air into the reaction solution at 25 ml / min. The reaction solution was completely dissolved in the cloudy state by heating to 120 ° C. When the solution becomes transparent and the viscosity becomes high, the acid value is measured and stirred until the acid value becomes less than 1.0 mg KOH / g. It took 11 hours until the acid value reached the target value (0.8). After completion of the reaction, the temperature of the reactor was lowered to room temperature to obtain a colorless transparent solid.

Manufacturing example  One. Photopolymerization  Preparation of Unsaturated Resins

43 g of the polymerizable compounds (hereinafter referred to as compound a-1) obtained in Synthesis Example 1, 33.6 g of acrylic acid (hereinafter referred to as compound b-1), 2,6-di-tert-butyl-p-cresol, 0.04 g and tetrabutylammonium 0.21 g of acetate and 18 g of propylene glycol-1-monomethyl ether-2-acetate were placed in a reaction flask and stirred at 120 ° C for 13 hours. After cooling to room temperature, 24 g of propylene glycol-1-monomethyl ether-2-acetate and 10 g of succinic anhydride (hereinafter compound c-1) were added, followed by stirring at 100 ° C for 3 hours. 8 g of bisphenol Z glycidyl ether (hereinafter referred to as compound d-2) was further added, followed by stirring at 120 ° C for 4 hours, at 90 ° C for 3 hours, at 60 ° C for 2 hours, and at 40 ° C for 5 hours. Through reprecipitation, a photopolymerizable unsaturated resin having alkali developability, which is a target substance in powder form, was obtained. The weight average molecular weight of the obtained resin was 5,500, and the acid value was measured at 105 mgKOH / g.

Here, the reaction product contained in a photopolymerizable unsaturated resin is the compound c- which is (C) component to the epoxy adduct (AB) which addition-reacted compound b-1 which is (B) component with compound a-1 which is (A) component. 1 is esterified by 0.8 equivalent part with respect to 1 equivalent part of hydroxyl groups of an epoxy adduct (AB), and the compound d-2 which is (D) component is further added with respect to 1 equivalent part of hydroxyl groups of an epoxy adduct (AB). It is obtained by esterifying with 0.3 equivalent part of epoxy groups of compound d-2.

In addition, the said epoxy adduct (AB) has a structure in which the carboxyl group of compound b-1 was added in 1.0 ratio with respect to one epoxy group of compound a-1.

Manufacturing example  2. Photopolymerization  Preparation of Unsaturated Resins

16.95 g of the polymerizable compounds obtained in Synthesis Example 2 (hereinafter compound a-2), 4.43 g of acrylic acid (compound b-1), 2,6-di-tert-butyl-p-cresol 6 g, tetrabutylammonium acetate 0.11 g and propylene glycol-1-monomethyl ether-2-acetate were placed in a reaction flask, followed by stirring at 120 ° C. for 16 hours. After cooling to room temperature, 9.31 g of propylene glycol-1-monomethyl ether-2-acetate, 7.41 g of hexahydrophthalic anhydride (hereafter, compound c-2) and 0.25 g of tetra-n-butylammonium acetate were added thereto at 70 ° C. After stirring for 4 hours, water and alcohol was reprecipitated to obtain a photopolymerizable unsaturated resin having alkali developability which is a target product in powder form. The weight average molecular weight of the obtained resin was 4,500, and the acid value was measured at 110 mgKOH / g.

The reaction product contained in a photopolymerizable unsaturated resin here is the compound c- which is (C) component to the epoxy addition product (AB) which addition-reacted the compound b-2 which is (B) component with the compound a-2 which is (A) component. It is obtained by esterifying 2 to 0.8 equivalent part with respect to 1 equivalent part of hydroxyl groups of an epoxy adduct (AB).

Moreover, the said epoxy adduct (AB) has a structure in which the carboxyl group of compound b-1 was added in 1.0 ratio with respect to one epoxy group of compound a-2.

Manufacturing example  3. Photopolymerization  Preparation of Unsaturated Resins

16.95 g of the polymerizable compounds (hereinafter referred to as compound a-3) obtained in Synthesis Example 3, 4.43 g of acrylic acid (compound b-1), 6 g of 2,6-di-tert-butyl-p-cresol, and tetrabutylammonium acetate 0.11 g and propylene glycol-1-monomethyl ether-2-acetate were placed in a reaction flask, followed by stirring at 120 ° C. for 16 hours. After cooling to room temperature, 9.31 g of propylene glycol-1-monomethyl ether-2-acetate, 7.41 g of hexahydrophthalic anhydride (compound c-2) and 0.25 g of tetra-n-butylammonium acetate were added, and the mixture was stirred at 70 DEG C for 4 hours. The resultant was stirred and reprecipitated in water and alcohol to obtain a photopolymerizable unsaturated resin having alkali developability which is a target substance in powder form. The weight average molecular weight of the obtained resin was 3,500, and the acid value was measured at 105 mgKOH / g.

Here, the reaction product contained in a photopolymerizable unsaturated resin is the compound c- which is (C) component to the epoxy adduct (AB) which addition-reacted compound b-1 which is (B) component with compound a-3 which is (A) component. It is obtained by esterifying 2 to 0.8 equivalent part with respect to 1 equivalent part of hydroxyl groups of an epoxy adduct (AB).

Moreover, the said epoxy adduct (AB) has a structure in which the carboxyl group of compound b-1 was added in 1.0 ratio with respect to one epoxy group of compound a-2.

Manufacturing example  4. Preparation of Black Organic Pigment Composition

The ratio of organic black (black582 from ciba as lactam black), a dispersant, and a dispersing polymer is 50 parts by weight / 8 parts by weight / 8 parts by weight based on solids, respectively, and PGMEA (solvent) is used so that the concentration of solids is 25% by weight. Propylene glycol monomethyl ether acetate) was added. The total weight of the dispersion was 50 g. This was fully stirred with a stirrer and premixed. Next, it was disperse | distributed for 6 hours in 25-60 degreeC with the paint shaker. Beads were used with 0.3 mm diameter zirconia beads and the same weight as the dispersion was added. After completion of the dispersion, the beads and the dispersion were separated by a filter to prepare a black pigment composition.

Manufacturing example  5. Preparation of Black Organic Pigment and Inorganic Pigment Compositions

Instead of 50 parts by weight of lactam black in Preparation Example 4, except that 35 parts by weight of lactam black and 15 parts by weight of carbon black of Degussa were prepared in the same manner as in Preparation Example 4.

Manufacturing example  6. Preparation of Black Organic Pigment and Inorganic Pigment Compositions

A pigment composition was prepared in the same manner as in Preparation Example 4, except that 30 parts by weight of lactam black and 20 parts by weight of carbon black of Degussa were used instead of 50 parts by weight of lactam black.

Manufacturing example  7. Preparation of Black Organic Pigment and Inorganic Pigment Compositions

A pigment composition was prepared in the same manner as in Preparation Example 4, except that 25 parts by weight of lactam black and 25 parts by weight of carbon black of Degussa were used instead of 50 parts by weight of lactam black.

Manufacturing example  8. Preparation of Black Organic Pigment and Inorganic Pigment Compositions

A pigment composition was prepared in the same manner as in Preparation Example 4, except that 15 parts by weight of lactam black and 35 parts by weight of carbon black of Degussa were used instead of 50 parts by weight of lactam black.

Manufacturing example  9. Preparation of Black Inorganic Pigment Composition

A pigment composition was prepared in the same manner as in Preparation Example 4, except that 50 parts by weight of degusa carbon black was used instead of 50 parts by weight of lactam black in Preparation Example 4.

Example  One

1.0874 g of photopolymerizable unsaturated resin obtained in Production Example 1, 0.7249 g of dipentaerythritol hexaacrylate, OXE-02 0.0651 g of Ciba as an oxime photoinitiator, 0.0042 g of BYK's leveling surfactant (BYK 333 silicone surfactant), adhesion 0.0084 g of an auxiliary agent (Shin-Etsu Co., Ltd. KBE-9007) and 8.9 g of the black organic pigment composition (lactam black: carbon black = 50 parts by weight: 0 parts by weight) obtained in Production Example 4 were prepared with propylene glycol-1-monomethyl ether-2. -It stirred well to 9.2094 g of acetates and obtained the photosensitive resin composition which has black alkali developability.

Example  2

1.0874 g of photopolymerizable unsaturated resin obtained in Production Example 2, 0.7249 g of dipentaerythritol hexaacrylate, OXE-02 0.0651 g from Ciba, an oxime photoinitiator, 0.0042 g of BYK's leveling surfactant (BYK 333 silicone surfactant), adhesion 0.0084 g of an auxiliary agent (Shin-Etsu Co., Ltd. KBE-9007) and 8.9 g of the black organic pigment composition (lactam black: carbon black = 50 parts by weight: 0 parts by weight) obtained in Production Example 4 were prepared with propylene glycol-1-monomethyl ether-2. -It stirred well to 9.2094 g of acetates and obtained the photosensitive resin composition which has black alkali developability.

Example  3

1.0723 g of the photopolymerizable unsaturated resin obtained in Production Example 3, 0.7184 g of dipentaerythritol hexaacrylate, OXE-02 0.0651 g from Ciba, an oxime photoinitiator, 0.0042 g of BYK's leveling surfactant (BYK 333 silicone surfactant), adhesion 0.0084 g of an auxiliary agent (Shin-Etsu Co., Ltd. KBE-9007) and 8.9 g of the black organic pigment composition (lactam black: carbon black = 50 parts by weight: 0 parts by weight) obtained in Production Example 4 were prepared with propylene glycol-1-monomethyl ether-2. -It stirred well to 9.2094 g of acetates and obtained the black alkali developing type photosensitive resin composition.

Example  4

Example 1 except for using the black organic pigment and inorganic pigment composition of Preparation Example 5 (lactam black: carbon black = 35 parts: 15 parts by weight) instead of the black organic pigment composition of Preparation Example 4 in Example 1 An alkali developable photosensitive resin composition was prepared in the same manner.

Example  5

Example 1 except that the black organic pigment and inorganic pigment composition of Preparation Example 6 (lactam black: carbon black = 30 parts by weight: 20 parts by weight) instead of the black organic pigment composition of Preparation Example 4 in Example 1 and An alkali developable photosensitive resin composition was prepared in the same manner.

Comparative example  One

Nihon Kayaku Co., Ltd. bisphenol type binder ZFR-2041H 1.7538g, dipentaerythritol hexa acrylate 0.7249g, oxime photoinitiator Ciba's OXE-02 0.0651g, BYK's leveling surfactant (BYK 333 silicone surfactant) 0.0042 g, 0.0084 g of an adhesion aid (Shin-Etsu Co., Ltd. KBE-9007) and 8.9 g of the black organic pigment and inorganic pigment composition obtained in Preparation Example 6 were well stirred in 8.543 g of propylene glycol-1-monomethyl ether-2-acetate. The photosensitive resin composition which has black alkali developability was obtained.

Comparative example  2

2.398 g of cardo-type binder CBR-D07-3 manufactured by Kyungin Corporation, 0.7249 g of dipentaerythritol hexa acrylate, 0.0651 g of OXE-02, an oxime photoinitiator, and a leveling surfactant of BYK (BYK 333 silicone interface) Activator) 0.0042 g, adhesion aid (Shin-Etsu Co., Ltd. KBE-9007) 0.0084 g, and 8.9 g of the black organic pigment and inorganic pigment composition obtained in Preparation Example 6 were well mixed with 7.6 g of propylene glycol-1-monomethyl ether-2-acetate. It stirred and obtained the photosensitive resin composition which has black alkali developability.

Comparative example  3

Example 1 except that the black organic pigment and inorganic pigment composition (lactam black: carbon black = 25 parts by weight: 25 parts by weight) of Preparation Example 7 was used instead of the black organic pigment composition of Preparation Example 4 in Example 1 An alkali developable photosensitive resin composition was prepared in the same manner.

Comparative example  4

Example 1 except that the black organic pigment and inorganic pigment composition (lactam black: carbon black = 15 parts by weight: 35 parts by weight) of Preparation Example 8 was used instead of the black organic pigment composition of Preparation Example 4 in Example 1 An alkali developable photosensitive resin composition was prepared in the same manner.

Comparative example  5

Except for using the black inorganic pigment composition (lactam black: carbon black = 0 parts by weight: 50 parts by weight) of Preparation Example 9 instead of the black organic pigment composition of Preparation Example 4 in Example 1 in the same manner as in Example 1 An alkali developable photosensitive resin composition was prepared.

[Image pattern formation]

The photosensitive resin composition of the present invention is coated on a predetermined pretreated substrate by a method such as spin or slit coating method, roll coating method, screen printing method, applicator method or the like to a desired thickness, for example, a thickness of 2 to 25 탆 After coating, the solvent was removed by heating at a temperature of 70 to 90 DEG C for 1 to 10 minutes to form a coating film.

In order to form the pattern required for the coating film obtained above, 200-500 nm active rays were irradiated through the mask of a predetermined form. As a light source used for irradiation, a low pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a metal halide lamp, an argon gas laser, etc. can be used, and X-rays, an electron beam, etc. can also be used in some cases. Although exposure amount changes with the kind of each component of a composition, compounding quantity, and dry film thickness, when using a high pressure mercury lamp, it is 500 mJ / cm <^2> (by 365 nm sensor) or less.

Subsequent to the exposure step, an alkaline aqueous solution was used as a developer to dissolve and remove unnecessary portions, leaving only the exposed portions to form a pattern. After cooling the image pattern obtained by image development to room temperature, it post-baked for 20 minutes at 230 degreeC in the hot-air circulation drying furnace, and obtained the image pattern.

[resolution]

The resolution of each experimental example was measured by observing the minimum size of the colored spacers formed using a micro-optical microscope for resolution measurement of the image pattern obtained from the above.

[Optical Density Measurement]

After light of a certain wavelength with a certain intensity passes through a layer, the amount of light intensity at that constant intensity is called absorbance, and this value divided by thickness is called optical density. When light with I ₀ intensity in a specific wavelength band passes through a layer and the intensity becomes I, the amount is defined as log ₁₀ (I ₀ / I), so the value of optical density is obtained using this equation. Luminance of the specific wavelength range was measured using an optical density meter (X-lite, 361T Tabletop Transmission Densitometer).

[Elastic recovery rate measurement]

The black photosensitive resin composition prepared in the above Examples or Comparative Examples was applied onto a glass substrate by using a spin coater, and then dried at 90 ° C. for 2.5 minutes to form a coating film. The pattern film was used for the coating film thus obtained, and the light of 365 nm wavelength was irradiated at 100 mJ / cm <2>. Subsequently, the solution was developed at 23 ° C. for 1 minute in an aqueous solution of 1 wt% potassium hydroxide, and then washed with pure water for 1 minute. By this operation, unnecessary parts could be removed and only the spacer pattern could be left. The formed spacer pattern was cured by heating at 230 ° C. for 30 minutes in an oven to finally obtain a colored spacer pattern.

A colored spacer having a thickness (T) of 3.7 (± 0.2) μm and a width W of 35 (± 2) μm of a pattern formed from the black photosensitive resin composition prepared in the above Examples or Comparative Examples was prepared, and the mechanical properties thereof. In other words, the shape of the basic conditions for measuring the compression displacement and elastic recovery rate was determined. Compressive displacement and elastic recovery rate were measured using the elasticity measuring instrument (DUH-W201S) manufactured by Shimadzu, Japan, under the following measurement conditions.

As the indenter pressing the pattern, a 50 μm diameter flat indenter was used, and the principle of measurement was performed by a load-unload method. The test load was measured to obtain the discriminating force between the comparative groups by measuring the elastic recovery rate at 300mN and 400mN. The load speed was 0.45 gf / sec and the holding time was 3 seconds. In the case of the elastic recovery rate, the planar indenter was loaded for 3 seconds, and the actual recovery recovery rate of the front and rear pattern was measured and compared with a three-dimensional thickness measuring instrument. The elastic recovery rate refers to the ratio of the distance (D ₁ -D ₂ ) recovered after a 10-minute recovery time with respect to the length (D ₁ ) entered when given a certain force, it is represented by the following equation (1). At this time, D ₁ (㎛) means a compression displacement.

[Equation 1]

Elastic Recovery (%) = [(D ₁ -D ₂ ) X 100] / D ₁

[Measurement of dielectric constant]

A photoresist (PR) formed from the black photosensitive resin composition prepared in the above Examples or Comparative Examples was applied onto ITO (Indium Tin Oxide) glass and dried for 2.5 minutes at a temperature of 90 ° C. on a hot plate to obtain a final thickness. The coating film was manufactured so that it might be set to 1.5-2.5 micrometers. A gold (Au) electrode having a diameter of 300 μm was deposited on the coating film to prepare a final measurement sample. Capacitance value was measured using an HP 4294A Precision Impedance Analyzer, and the dielectric constant was calculated using the measured value and Equation 2 below.

&Quot; (2) &quot;

　　　　　　　

In Equation 2, C is capacitance, ε ₀ is the dielectric constant in the vacuum phase, ε is the dielectric constant of the coating film, A is the electrode area, d is the thickness of the photoresist (PR).

<Evaluation Criteria>

○: dielectric constant is 8 or less

×: dielectric constant is greater than 8

[Evaluation results]

The results of the experiment are summarized in Table 1 below.

[Table 1]

As can be seen in Table 1, Examples 1 to 5 it can be seen that the optical density, dielectric constant, elastic recovery rate, and the resolution is all excellent evenly.

In particular, when compared with Comparative Examples 1 to 5, Examples 1 to 5 are superior to Comparative Examples 1 and 2 in terms of resolution, superior to Comparative Examples 3, 4 and 5 in terms of dielectric constant, and 300mN and 400mN elasticity It was found that the recovery rate is superior to Comparative Examples 1 to 5.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

Claims (18)

A photopolymerizable unsaturated resin, which is a product (P1) obtained by reacting a polybasic acid anhydride (C) with an epoxy adduct (AB) obtained by reacting an epoxy resin (A) with an unsaturated basic acid (B).

[Formula 1]

Carbon labeled with * in Formula 1 is

,

,

or

Replaced by carbon labeled with * in
L ¹ is C _{1 - 10} alkylene group, C _{3 - 10} is an alkylene group, _{- 20} cycloalkyl group or a C _1
14 is an aryl group, _- R ¹ to R ⁷ are the same, or different, and each independently represents a hydrogen atom, C ₁ to each other _{- 10} alkyl group, C _{1 - 10} alkoxy groups, C _{2 - 10} alkenyl or C ₆
R ⁸ is selected from the group consisting of a hydrogen atom, an ethyl group, CH ₃ CHCl—, CH ₃ CHOH—, CH ₂ = CHCH ₂ —, and a phenyl group,
n is an integer of 0-10. Monofunctional or polyfunctional epoxy is further added to the product (P1) obtained by reacting the polybasic acid anhydride (C) with the epoxy adduct (AB) obtained by reacting the epoxy resin (A) with the unsaturated basic acid (B) of formula (1). The photopolymerizable unsaturated resin which is a product (P2) obtained by making compound (D) react.

[Formula 1]

Carbon labeled with * in Formula 1 is

,

,

or

Replaced by carbon labeled with * in
L ¹ is C _{1 - 10} alkylene group, C _{3 - 10} is an alkylene group, _{- 20} cycloalkyl group or a C _1
14 is an aryl group, _- R ¹ to R ⁷ are the same, or different, and each independently represents a hydrogen atom, C ₁ to each other _{- 10} alkyl group, C _{1 - 10} alkoxy groups, C _{2 - 10} alkenyl or C ₆
R ⁸ is selected from the group consisting of a hydrogen atom, an ethyl group, CH ₃ CHCl—, CH ₃ CHOH—, CH ₂ = CHCH ₂ —, and a phenyl group,
n is an integer of 0-10. The said unsaturated basic acid (B) is acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid, hydroxyethyl methacrylate maleate, hydroxyethyl acrylate maleate, A photopolymerizable unsaturated resin, characterized in that at least one selected from the group consisting of hydroxypropyl methacrylate maleate, hydroxypropyl acrylate maleate and dicyclopentadiene maleate. The polybasic acid anhydride (C) according to claim 1 or 2, wherein the polybasic acid anhydride (C) is succinic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, 2,2'-3,3'-benzophenonetetracarboxylic acid Dianhydrides, 3,3'-4,4'-benzophenonetetracarboxylic dianhydride, ethylene glycol bis (anhydrotrimellitate), glycerol tris (anhydrotrimellitate), phthalic anhydride, hexahydrophthalic anhydride , Methylhydrophthalic anhydride, tetrahydrophthalic anhydride, nadic acid anhydride, methylnadic anhydride, trialkyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3 At least one member selected from the group consisting of-cyclohexene-1,2-dicarboxylic acid anhydride, trialkyl tetrahydrophthalic anhydride-maleic anhydride adduct, dodecenyl anhydride succinic acid and methyl hymic anhydride , A photopolymerizable unsaturated resin as. The said monofunctional epoxy compound (D) is glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, and butyl glycid. Dyl ether, isobutyl glycidyl ether, t-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycyl Cedyl ether, undecyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, hexadecyl glycidyl ether, 2-ethylhexyl Glycidyl ether, allyl glycidyl ether, propargyl glycidyl ether, 2-methoxyethyl glycidyl ether, phenyl glycidyl ether, p-methoxyphenyl glycidyl ether, p-butylphenyl glyc Cydyl ether, cresyl glycidyl ether, 2-methylcre Silglycidyl ether, 4-nonylphenyl glycidyl ether, benzyl glycidyl ether, p-cumylphenyl glycidyl ether, trityl glycidyl ether, 2,3-epoxypropyl methacrylate, epoxidized soybean oil From epoxidized linseed oil, glycidyl butyrate, vinylcyclohexane monooxide, 1,2-epoxy-4-vinylcyclohexane, styrene oxide, pinene oxide, methyl styrene oxide, cyclohexene oxide and propylene oxide Photopolymerizable unsaturated resin, It is characterized by one or more selected. The polyfunctional epoxy compound (D) is a polyglycidyl ether of a polyhydric alcohol or an alkylene oxide adduct thereof, a polyglycidyl ether of a polybasic acid, a cyclohexene oxide-containing compound and a cyclopentene oxide-containing compound. It is one or more types chosen from the group which consists of, The photopolymerizable unsaturated resin. The said epoxy adduct (AB) adds the said unsaturated basic acid (B) corresponding to 0.1-5 equivalent part of carboxyl group to the said epoxy resin (A) corresponding to 1 equivalent part of epoxy groups, It is obtained, Photopolymerizable unsaturated resin. The said photopolymerizable unsaturated resin reacts the said polybasic acid anhydride (C) corresponding to 0.1-5 equivalent parts of acid anhydride groups with the said epoxy addition product (AB) corresponding to 1 equivalent part of hydroxyl groups. A photopolymerizable unsaturated resin, characterized in that obtained by. The monofunctional or polyfunctional epoxy compound (D) according to claim 2, wherein the monofunctional or polyfunctional epoxy compound (D) is 0.1 to 5 equivalents of the epoxy group in the monofunctional or polyfunctional epoxy compound (D) with respect to the epoxy adduct (AB) corresponding to 1 equivalent part of the hydroxyl group. A photopolymerizable unsaturated resin, characterized in that the reaction in a negative amount. The photopolymerizable unsaturated resin of Claim 1 or 2; Functional monomers having at least one ethylenically unsaturated bond; A polymerization initiator; Black organic pigments; And a photosensitive resin composition containing a solvent. The method of claim 10, wherein the functional monomer having at least one ethylenically unsaturated bond is ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, ethylene glycol dimethacryl Photosensitive resin composition, characterized in that at least one member selected from the group consisting of a rate and 1,6-hexanediol dimethacrylate. The method of claim 10, wherein the polymerization initiator is p-dimethylaminoacetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, benzyldimethyl ketal, benzophenone, benzoinpropyl ether, diethyl Thioxanthone, 2,4-bis (trichloromethyl) -6-p-methoxyphenyl-s-triazine, 2-trichloromethyl-5-styryl-1,3,4-oxodiazole, 9 -Phenylacridine, 3-methyl-5-amino-((s-triazin-2-yl) amino) -3-phenylcoumarin, 2- (o-chlorophenyl) -4,5-diphenylimida Zolyl dimer, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, o-benzoyl-4 '-(benzmercapto) benzoyl-hexyl-ketoxime, 2,4, 6-trimethylphenylcarbonyl-diphenyl phosphonyl oxide, hexafluorophosphoro-trialkylphenylsulfonium salt, 2-mercaptobenzimidazole, 2,2'-benzothiazolyl disulfide and mixtures thereof It is one or more types selected, The photosensitive resin composition. The photosensitive resin composition according to claim 10, wherein the black organic pigment comprises at least one selected from the group consisting of aniline black, lactam black and perylene black. The photosensitive resin composition of claim 10, wherein the photosensitive resin composition contains 0.1 to 70 parts by weight of one or more black inorganic pigments selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black, based on 100 parts by weight of the black organic pigment. It further comprises, Photosensitive resin composition. The method of claim 10, wherein the solvent is methanol, ethanol, dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate , Ethyl cellosolve acetate, diethyl cellosolve acetate, methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, di Ethylene glycol diethyl ether, propylene glycol methylether acetate, propylene glycol propylether acetate, toluene, xylene, methylethylketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propylketone , Methyl-n-butylkenone, methyl-n-amyl ketone, 2-heptanone, ethyl acetate, acetic acid-n-part Isobutyl acetate, methyl lactate, ethyl lactate, methyl oxy acetate, ethyl oxy acetate, oxy butyl acetate, methoxy methyl acetate, methoxy ethyl acetate, methoxy butyl acetate, ethoxy methyl acetate, ethyl ethoxy acetate, 3- Methyl oxypropionate, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, methyl 2-oxypropionate, ethyl 2-oxypropionate, 2-oxypropionate propyl, 2-methoxypropionate methyl, 2-methoxypropionate ethyl, 2-ethoxypropionate ethyl, 2-ethoxypropionate methyl, 2-oxy-2-methylpropionate, 2-oxy-2- Ethyl methyl propionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, 2 -Hydroxy-3- Methyl methyl butyrate, ethyl pyruvate, N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylacetamide, N-methylpyrrolidone , Dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetonyl acetone, isophorone, capronic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, A photosensitive resin composition, characterized in that at least one selected from the group consisting of diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate. The photosensitive resin composition according to claim 10, wherein the photosensitive resin composition is 0.5 to 50% by weight based on the total weight of the photosensitive resin composition excluding the solvent, and the functional monomer having at least one ethylenically unsaturated bond 1 to 50% by weight, 0.1 to 10% by weight of the polymerization initiator and 10 to 60% by weight of the black organic pigment, characterized in that the photosensitive resin composition. A light-shielding spacer made of the photosensitive resin composition of claim 10. A liquid crystal display device comprising the spacer of claim 17.