KR20130020519A - Light emitting modul, and array type pcb used for light emitting module and its manufacturing method - Google Patents

Abstract

PURPOSE: A light emitting module, an array type PCB(Printed Circuit Board) therefor, and a manufacturing method thereof are provided to improve the reliability of connection by connecting a plurality of unit PCBs with each other without an extra connector or wire bonding. CONSTITUTION: An array type PCB(102) is used for a light emitting module to embed a plurality of semiconductor optical devices. A plurality of unit PCBs are arrayed to have adjacent end surfaces to each other while having a gap. An insulating connection member(130) includes a filler unit and a base unit located in the gap. The base unit is integrally formed on the top of the filler unit while having bigger width than the filler unit to cover the top of the gap. A writing member(140) electrically connects conductive pattern layers of the unit PCBs facing each other on an insulating material.

Description

LIGHT EMITTING MODUL, AND ARRAY TYPE PCB USED FOR LIGHT EMITTING MODULE AND ITS MANUFACTURING METHOD}

The present invention relates to a light emitting module, an array type PCB used in the same, and a manufacturing method thereof. The present invention relates in particular to an array type MPCB used in a light emitting module. In the present specification, the term "metal printed circuit board (MPCB)" means a circuit board including at least one metal substrate, and includes, for example, a metal core printed circuit board (MCPCB).

As a circuit board for semiconductor devices, a printed circuit board (PCB) based on an insulator such as FR-4 is known. A typical PCB is based on an insulator such as FR-4, forming a conductive pattern on the insulator, and mounting a terminal thereon to form a desired circuit.

In recent years, light emitting diodes (LEDs) are emerging as new light sources. The LED is mounted on a circuit board at a package level or a chip level to configure a light emitting module, and the light emitting module is used for lighting equipment or a BLU (Back Light Unit).

LEDs generate a lot of heat during the light-emitting operation, even more so in the case of recently developed high-power LEDs. For this reason, when manufacturing a light emitting module including an LED, it is necessary to fully consider the heat dissipation problem. In the development of a light emitting module including a semiconductor optical device that generates a lot of heat, such as an LED, one approach to improving heat dissipation performance is to use a metal-based MPCB having good heat dissipation performance.

In order to make the light emitting module long or large, a plurality of PCBs must be used in a long line. In addition, electrical connection between long PCBs is required. However, if multiple MPCBs are to be used subsequently, electrical separation must be preceded between the metal substrates of neighboring MPCBs.

Conventionally, in making a long or large area light emitting module connected to a plurality of PCBs, in particular, MPCBs, for connecting electric circuits of neighboring MPCBs, a separate connector MPCB is installed at the edge or between the MPCBs. By electrically connecting. LEDs mounted on different MPCBs can be electrically connected through connector-to-connecting and / or wire bonding of successive MPCBs.

However, the prior art has complicated manufacturing processes by additional steps such as installation and connection of connectors or wirebonding. In addition, since the connector occupies a large volume on the top of the MPCB, the connector blocks and absorbs the light from the LED chip, causing a lot of light loss. In addition, the smaller the size of the MPCB and the larger the size of the light emitting module to be made, the more connections between the MPCB, which further exacerbates the problems as described above.

Accordingly, one problem to be solved by the present invention is to provide an array type PCB suitable for making a long or large area light emitting module by connecting several unit PCBs without a conventional connector or a separate wire bonding.

Another problem to be solved by the present invention is a fixed connection between the unit PCBs in a simple manner without a conventional connector or a separate wire bonding, the means of the fixed connection is less interference with light from the semiconductor optical device, between the unit PCBs To provide a reliable array-type PCB manufacturing method.

According to an aspect of the present invention, an array type printed circuit board (PCB) used in a light emitting module for mounting a plurality of semiconductor optical devices is provided. The array PCB includes a plurality of unit PCBs arranged to be adjacent to end surfaces with a gap therebetween, an insulating material at least partially disposed within the gap, and conductive pattern layers of neighboring unit PCBs on the insulating material. It includes a wiring means for connecting.

In an embodiment, the insulating material includes an insulating connecting member, and the insulating connecting member is formed integrally with an upper portion of the filler part at a width greater than that of the filler part and the filler part located in the gap, It includes a base portion covering the upper portion, the wiring means may include a wiring member in the form of a frame coupled to the base portion.

According to one embodiment, the insulating connecting member and the wiring member are integrally coupled by injection molding to form one connection unit, and the connection unit may be installed between neighboring unit PCBs.

The insulating connecting member may be integrally provided at a lower portion of the base portion with a positioning protrusion which is inserted into a positioning hole formed in the unit PCB. Alternatively, the insulating connecting member may be integrally provided with a side setting rib formed in contact with the side of the unit PCB.

According to another embodiment of the present invention, the insulating material is a filler portion formed by curing after filling the liquid or gel-like insulating material in the gap, and the liquid or gel-like insulating material that fills the gap and is cured so that A base portion formed to cover the upper portion, wherein the wiring means may include a wiring layer formed on the base portion.

In example embodiments, each of the unit PCBs may include a metal substrate, an insulating layer formed on the metal substrate, and a conductive pattern layer formed on the insulating layer, and the wiring means may be disposed between the conductive pattern layers of the neighboring unit PCBs. Can connect

In example embodiments, each of the unit PCBs may further include an insulating reflective film formed on the insulating film to cover the conductive pattern layer, and the insulating reflective film may expose the conductive pattern layer around the gap.

According to one embodiment, the ratio of the reflectance of the insulating reflective film and the reflectance of the wiring means is preferably in the range of 1: 0.8 to 1: 1.2.

According to one embodiment, the insulating reflective film may include a PSR. In addition, the wiring means may include Sn.

According to another aspect of the invention there is provided a light emitting module. The light emitting module includes an array type PCB; It includes a plurality of semiconductor optical device mounted on the array PCB. The array-type PCB may include a plurality of unit PCBs arranged to adjoin end surfaces with a gap therebetween, an insulating material at least partially disposed in the gap, and conductive pattern layers of neighboring unit PCBs on the insulating material. And wiring means for electrically connecting.

 The height of the upper end of the semiconductor optical device is preferably greater than the maximum height of the wiring means or the insulating material. The semiconductor optical device may be an LED chip or a package including the same.

According to still another aspect of the present invention, a method of manufacturing an array type PCB used in a light emitting module for mounting a plurality of semiconductor optical devices is provided. The method includes the steps of: arranging a plurality of unit PCBs such that end faces are adjacent to each other with a gap therebetween; Positioning an insulating material in a gap between neighboring unit PCBs, wherein the conductive pattern layers of the neighboring unit PCBs are electrically connected to each other by wiring means crossing the insulating material.

According to one embodiment, the step of placing the insulating material in the gap, the liquid or gel-like insulating material in the gap is filled, so that the liquid or gel-like insulating material fills the gap and overflows, The pillar part and the base part of the upper part of the pillar part are integrally formed, and the wiring means may include a wiring layer formed on the base part to connect conductive pattern layers of the neighboring unit PCBs.

According to another embodiment, before the step of placing the insulating material in the gap, a connection unit is formed comprising an insulating connecting member as the insulating material and a wiring member integrated with the insulating connecting member, and placing the insulating material in the gap. In the step, the wiring member may be contacted with the conductive pattern layer while inserting a portion of the insulating connecting member into the gap.

According to the present invention, a plurality of unit PCBs, in particular, unit MPCBs can be fixedly connected in a simple manner using a wiring means without a separate connector and wire bonding, and the height of the wiring means can be lowered, so that light from the semiconductor optical device can be reduced. An array-type PCB can be implemented with less interference and a good connection between unit PCBs.

1 is a perspective view showing an array-type MPCB and a light emitting module including the same according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view of a connection portion between unit MPCBs of the array type MPCB shown in FIG. 1; FIG.
FIG. 3 is a flowchart illustrating a method of manufacturing the array type MPCB shown in FIGS. 1 and 2.
Figure 4 is a cross-sectional view for explaining an array type MPCB according to another embodiment of the present invention.
5A and 5B are views for explaining various modifications of the present invention.
6 to 10 are diagrams for explaining other embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a perspective view illustrating an array type MPCB and a light emitting module including the same according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view illustrating a connection portion between unit MPCBs of the array type MPCB illustrated in FIG. 1. .

Referring to FIG. 1, the light emitting module 1 includes an array type MPCB 2 and a plurality of LED chips 3 mounted on the array type MPCB 2. The array type MPCB 2 is manufactured by connecting a plurality of unit MPCBs 20, 20, and 20 long. On each unit MPCB 20 LEDs 3 are arranged long to form a unit array. Although not shown in detail, the LED chips 3 are electrically connected to conductive patterns provided on the upper portion of each unit MPCB 20.

In addition, the array type MPCB 2 may include an insulating material connecting the neighboring unit MPCBs 20 and wiring layers 40 and 40 connecting the conductive pattern layers of the neighboring unit MPCBs 20 on the insulating material. Include.

The insulating material includes a filler portion 30 and a base portion 31 extending therefrom. In the present embodiment, the filler part 30 is formed by filling a gap between the neighboring unit MPCBs 20 with a liquid or gel adhesive material having heat dissipation and insulation. The filler unit 30 serves to bond the neighboring unit MPCBs 20 and ensure electrical insulation between metal substrates of the unit MPCBs 20.

The base portion 31 is integrally connected to the upper portion of the pillar portion 30 and is formed to have a larger width than the gap and the pillar portion 31. The base portion 31 may be formed by spreading the insulating material remaining after filling the gap around the gap on the upper surface of the unit MPCB 20. As described in more detail below, the base part 31 may support the wiring layers 40 and 40 connecting between the conductive pattern layers of the unit MPCBs 20.

As the insulating material constituting the filler portion 30 and the base portion 31, a resin material of silicone, acrylic or epoxy may be usefully used. In addition, the insulating material may further include additional additives to improve adhesion to the unit MPCB 20.

The upper height H of the LED chip 3 is preferably equal to or greater than the highest height h of the wiring layers 40 and 40, and thus, at the upper main emission surface of the LED chip 3. The emitted light is not disturbed by the wiring layers 40 and 40.

Referring to FIG. 2, each of the unit MPCBs 20 is based on a metal substrate 21, and has an insulating film 22 formed on the metal substrate 21 and a predetermined pattern on the insulating film 22. It includes the conductive pattern layer 23 formed to have. Each of the unit MPCBs 20 further includes an insulating reflective film 24 formed on the insulating film 22 to cover the conductive pattern layer 23. The insulating reflective film 24 may be formed of a photo solder resist (PSR).

The metal substrate 21 may be made of Cu, Zn, Au, Ni, Al, Mg, Cd, Be, W, Mo, Si, Fe, or at least one of these alloys. In addition, the metal substrate 21 has a thickness of approximately 0.2 mm to 10 mm. In addition, the insulating film 22 is formed on the metal substrate 21 in a stacked manner, and is made of at least one of silicon, acrylic, or ceramic materials having good heat dissipation. The insulating film 22 has a thickness of 50 μm to 500 μm.

The conductive pattern layer 23 is formed to have a predetermined pattern to form a circuit for operating the LED chip 3, and includes Ag, Cu, Au, Al, Ca, W, Zn, Ni, Fe, Pt, At least one of Sn, and has a structure stacked on the insulating film (22). The conductive pattern layer 23 has a thickness of approximately 10 μm to 150 μm.

As mentioned above, a fine size gap G exists between the neighboring unit MPCBs 20, and the filler part 30 is formed by filling the gap G with an adhesive material having heat dissipation and insulation. do. Optionally, an insulating material that fills the gap and overflows may form the base portion 31 on top of the gap. A portion of the insulating material, that is, the insulating reflective film 24 made of PSR is removed around the top gap of the unit MPCBs 20 in which the base portion 31 is present. As a result, the conductive pattern layer 23 is exposed around the upper portion of the gap. An end surface of the insulating reflective film 24 may serve as a dam that prevents overflow of the insulating material forming the pillar part 30 and the base part 31.

The wiring layers 40 and 40 are formed to electrically connect the conductive pattern layers 23 and 23 between two neighboring unit MPCBs 20 and 20. At this time, the wiring layers 40 and 40 are formed in layers by, for example, soldering or the like. The wiring layers 40 and 40 are formed of a metal material having good electrical conductivity and reflectivity, more preferably, metal including at least one of Pb, Sn, Ag, Co, Ni, Br, CU, Ti, and W. . The wiring layers 40 and 40 are firmly supported on the insulating material connecting the unit MPCBs 20, in particular, on the base portion 31.

In order to increase the light uniformity of the light emitting module, it is preferable to select the wiring layers 40 and 40 and the insulating reflective film 21 which are heterogeneous materials as materials having similar reflectances, and more preferably, the reflectances of the wiring layers 40 and 40 are selected. It is preferable that the ratio between the reflectances of the insulating reflective film 21 is in the range of 1: 0.8 to 1: 1.2. As a preferred example, when the PSR having the light reflectance of 80 to 85% is used as the insulating reflective film 21, Sn having a reflectance of 80% or a metal material including the same may be used. The reflectance may be more similarly adjusted by the type and amount of additive material entering the metal containing Sn. When using a Sn-Ag solder material, the reflectance can be changed according to the Ag content.

3 is a flowchart illustrating a method of manufacturing an array type MPCB for a light emitting module.

As shown in FIG. 3, first, a plurality of unit MPCBs 20 are arranged on a plane of a die D prepared in advance so that gaps G are formed.

As described above, each of the unit MPCBs 20 may include a metal substrate 21, an insulating layer 22 on the metal substrate 21, a conductive pattern layer 23 on the insulating layer 22, and the conductive pattern layer 23. ), An insulating reflective film 24 is covered. At this time, the insulating reflective film 24 is removed in a predetermined region from the gap G so as to expose the conductive pattern layer 23 thereunder.

Next, a liquid or gel insulating material is injected into the above (G). The injected insulating material fills the gap G while flowing over it and trapped by the end face of the insulating reflective film 24. A liquid or gel insulating material is cured so that a filler part 30 is formed in the gap G, and a base part 31 which closes the upper part of the gap G is above the filler part 30. It is formed in a large width. In this case, the amount of the insulating material supplied in the gap G may be controlled so that the insulating material is filled only in the insulating material G to form only the filler part 30.

Next, for example, the wiring layers 40 and 40 connecting the conductive pattern layers 23 of the adjacent unit MPCBs 20 are formed by a soldering process. The wiring layers 40 and 40 are formed to be in contact with the hardened insulating material, in particular, the base portion 31.

4 is a view for explaining an array type MPCB for a light emitting module according to another embodiment of the present invention.

Referring to FIG. 4, only a filler portion 30 is formed in the gap, and the base portion of the foregoing embodiment is omitted because the insulating material is filled only in the gap between neighboring unit MPCBs 20 and 20. The wiring layers 40 and 40 are formed to be in contact with the insulating layers 22 and 22, the conductive pattern layers 23 and 23, and the insulating material filling the gap, that is, the filler part 30, and the neighboring unit MPCBs ( The conductive pattern layers 23 and 23 of 20 and 20 are electrically connected to each other.

In order to increase the adhesion between the unit MPCB (20, 20), as shown in Figure 5 (a) and (b), by forming a step surface or a slope on the end surface of the unit MPCB (20, 20) After forming the gap of the stepped structure or the tapered structure, it is also conceivable to fill the gap with the adhesive insulating material 30, 31. In this case, the bonding surface area by the insulating materials 30 and 31 may be increased, thereby further increasing the adhesive force between the unit MPCBs 20 and 20.

The array type MPCB 2 according to the present invention prevents light propagation such as a connector and a wire between neighboring unit MPCBs 20 and 20, and furthermore, eliminates light absorbing elements, thereby reducing the light efficiency of the light emitting module. It is advantageous to increase. In particular, the array-type MPCB 2 according to the present invention can be very advantageously applied to the light emitting module of the chip-on-board structure, which is an LED chip 3 mounted without a package or reflector on the array-type MPCB 2. This is because the light is emitted at an angle so that the loss of light also occurs by the fine protrusions on the array type MPCB 2. According to the present invention, since the unit MPCBs 20 are connected to each other by an insulating material having good adhesion and heat dissipation characteristics, the unit MPCBs 2 form an array type MPCB 2. In addition, since the metal substrates 21 and 21 of the neighboring unit MPCBs 20 are reliably insulated by the insulating material, it is possible to fundamentally prevent the problem of defects due to the energization between short or unwanted metal substrates.

Now, another embodiment of the present invention will be described.

Referring to FIG. 6, there is shown an array type MPCB 102 of another embodiment in which a plurality of LED chips 3 (see FIG. 1) may be mounted. The array MCPCB 102 is manufactured by connecting a plurality of unit MPCBs 120 and 120 to be long. On each unit MPCB 120, LED chips are arranged long to form a unit array. A connection unit M is provided between the neighboring unit MPCBs 120 to mechanically and electrically connect the unit MPCBs 120.

The connection unit M is formed of an insulating material and connected to a neighboring unit MPCB 120 (hereinafter referred to as an “insulating connection member”) and coupled to the insulating connection member 130. And the metal frame type wiring members 140 and 140 connecting the conductive pattern layers of neighboring units MPCBs 120 to each other. The connection unit M may be manufactured, for example, by injection molding so that an insulating resin material supports the wiring members 140 and 140. By the injection molding process, the insulating resin material is molded into an insulating connecting member 130 having a specific structure as described below. The insulating connecting member 130 is preferably formed of a polymer resin material such as EMC or PC that can withstand high temperatures.

In the present exemplary embodiment, the wiring members 140 and 140 may be supported in contact with the surface of the insulating connecting member 130, but may be supported by penetrating the insulating connecting member 130.

The insulating connecting member 130 may include an upper base part 131 and a lower filler part 132 integrally formed therewith. The pillar part 132 is inserted and positioned in a gap between the unit MPCBs 120. The pillar part 132 ensures electrical insulation between metal substrates between two neighboring ends of the unit MPCBs 120.

The base part 131 of the insulating connecting member 130 is integrally connected to the upper part of the filler part 132 and is formed to have a width greater than the width of the gap and the width of the filler part 132. The base part 131 supports the wiring members 140 and 140 connecting between the conductive pattern layers of the unit MPCBs 120 and simultaneously the wiring members 140 and 140 and the unit MPCBs 120 and 120. It serves to insulate between the upper surfaces. Each of the wiring members 140 and 140 may be positioned at an intermediate portion 141 fixed to the base portion 131 of the insulating connecting member 130 and a bent portion at both ends of the intermediate portion 141. Ones 142 and 142. The terminal portions 142 and 142 are connected to terminals of the unit MPCB 120, that is, the ends of the conductive pattern layer or the conductive trace. A small amount of solder paste or solder cream is applied to the terminal portions 142 and 142 and the ends of the conductive pattern layer or the conductive trace, and then the terminal portions 142 and 142 are locally heated by a heating mechanism. And the conductive pattern layer (or conductive trace) can be soldered.

As in the previous embodiment, the upper height of the LED chip mounted on the MPCB is equal to or larger than the upper height of the M of the connection unit, so that light emitted from the upper main emission surface of the LED chip 3 is connected to the connection unit ( M) can not be disturbed. The upper height of the connection unit M may be the upper height of the wiring member 140 or the upper height of the insulating connecting member 130.

Each of the unit MPCBs 120 is based on the metal substrate 121 as in the previous embodiment, and has an insulating film 122 formed on the metal substrate 121 and a predetermined pattern on the insulating film 122. The formed conductive pattern layer 123 is included. As the conductive pattern layer 123, Cu traces were used in this embodiment. In addition, each of the unit MPCBs 120 may further include an insulating reflective film 124 formed on the insulating film 122 to cover the conductive pattern layer 123. The insulating reflective film 124 may be formed of a photo solder resist (PSR).

The material, size, and structure of the metal substrate 121, the insulating layer 122, and the conductive pattern layer 123 may be the same as or similar to those described in the above embodiments.

As mentioned above, a micro-sized gap exists between neighboring unit MPCBs 120, and the filler part 132 of the preformed insulating connecting member 130 is inserted into the gap to fill the gap. The insulating reflective film 24 made of PSR is removed from the lower region of the upper base portion 131 of the insulating connecting member 130 or around the upper surface gap of the unit MPCBs 20. The conductive pattern layer 123 exposed through the removal of the reflective film 124 is connected to the terminal portions 142 supported by the base portion 131.

In order to increase the light uniformity of the light emitting module, it is preferable to select the wiring members 140 and 140 which are different materials and the insulating reflective film 124 as materials having similar reflectivity, and more preferably, the wiring members 140 and 140. The ratio between the reflectance and the reflectance of the insulating reflective film 124 may be in the range of 1: 0.8 to 1: 1.2. In addition, the wiring members 140 and 140 may be coated with Ag, Au, or a soldering material to improve soldering characteristics of the conductive pattern layer.

An adhesive may be additionally used to increase the fixing force of the connection unit M with respect to the unit MPCBs 120 and 120.

7 to 10 are views for explaining various modifications of the connection unit (M) including a position setting means for accurate positioning and / or fixing to the MPCB.

The connection unit M is configured as shown in FIGS. 7 and 8 or as shown in FIGS. 9 and 10 for accurate placement and / or fixation of the unit MPCBs 120 and 120. It can have

7 and 8, the connection unit M further includes a positioning protrusion 135 integrally formed under the base 131 of the insulating connecting member 130. In addition, a positioning hole 129 fitted to the positioning projection 135 is formed on an upper surface of at least one of two neighboring MPCBs 120 and 120. By inserting the setting protrusion 135 into the position setting hole 129, the connection unit M may be set to the correct position, and the fixing force of the connection unit M may be further increased.

9 and 10, the connection unit M has a position setting rib 136 in common contact with side surfaces of two unit MPCBs 120 and 120 adjacent to the side surface of the insulating connecting member 130. 136). The position setting ribs 136 and 136 contact the side surfaces of the MPCBs 120 and 120 so that the connection unit M may be set to the correct position.

Claims (19)

An array type printed circuit board (PCB) used in a light emitting module for mounting a plurality of semiconductor optical devices,
A plurality of unit PCBs arranged to adjoin end faces with a gap therebetween;
An insulating material at least partially located within the gap; And
And wiring means for electrically connecting conductive pattern layers of neighboring unit PCBs on the insulating material. The method according to claim 1,
The insulating material may include an insulating connecting member, and the insulating connecting member may include a filler part disposed in the gap and a base part integrally formed on an upper part of the filler part with a width greater than that of the filler part to cover the upper part of the gap. and,
The wiring means array type PCB for a light emitting module, characterized in that it comprises a frame member of the frame coupled to the base portion. The light emitting module according to claim 2, wherein the insulating connecting member and the wiring member are integrally coupled by injection molding to form one connection unit, and the connection unit is installed between neighboring unit PCBs. Array PCB. The array type PCB for a light emitting module according to claim 2, wherein the insulating connecting member includes a positioning protrusion formed at a lower portion of the base part to be inserted into a positioning hole formed in the unit PCB. The array type PCB for a light emitting module according to claim 2, wherein the insulating connecting member includes a positioning rib formed on the side of the unit PCB. The method according to claim 1,
The insulating material may include a filler part formed by curing a liquid or gel insulating material in the gap, and a base part formed to cover the top of the gap by curing the liquid or gel insulating material overflowing the gap. The wiring means array type PCB for a light emitting module, characterized in that it comprises a wiring layer formed on the base portion. The method of claim 1, wherein each of the unit PCBs includes a metal substrate, an insulating layer formed on the metal substrate, and a conductive pattern layer formed on the insulating layer, and the wiring means connects the conductive pattern layers of the neighboring unit PCBs. Array type PCB for light emitting module, characterized in that. The light emitting device according to claim 7, wherein each of the unit PCBs further comprises an insulating reflective film formed on the insulating film to cover the conductive pattern layer, wherein the insulating reflective film exposes the conductive pattern layer around the gap. Array type PCB for modules. The array type PCB for a light emitting module according to claim 8, wherein the ratio of the reflectance of the insulating reflective film and the reflectance of the wiring means is in the range of 1: 0.8 to 1: 1.2. 8. The array type PCB of claim 7, wherein the insulating reflective film comprises a PSR. The array type PCB for light emitting modules according to claim 10, wherein the wiring means comprises Sn. An array type PCB;
It includes a plurality of semiconductor optical device mounted on the array PCB,
The array PCB,
A plurality of unit PCBs arranged to adjoin end faces with a gap therebetween;
An insulating material at least partially located within the gap; And
And wiring means for electrically connecting conductive pattern layers of neighboring unit PCBs on the insulating material. The light emitting module of claim 12, wherein each of the plurality of unit PCBs is an MPCB including a metal substrate. The unit PCB of claim 12, wherein the insulating material includes a pillar part positioned in the gap and a base part integrally formed at an upper part of the pillar part to cover an upper part of the gap, wherein the wiring means is adjacent to the unit PCB across the base part. Light emitting module for electrically connecting the conductive pattern layer of the. The light emitting module according to claim 12, wherein a height of an upper end of the semiconductor optical device is greater than a maximum height of the wiring means or the insulating material. The light emitting module according to claim 12, wherein the semiconductor optical device is an LED chip. A method of manufacturing an array type PCB used in a light emitting module for mounting a plurality of semiconductor optical devices,
Arranging a plurality of unit PCBs such that end surfaces are adjacent to each other with a gap therebetween;
Positioning an insulating material in a gap between neighboring unit PCBs,
And electrically connecting conductive pattern layers of neighboring unit PCBs with wiring means crossing the insulating material. 18. The method of claim 17,
Positioning the insulating material in the gap, filling the liquid or gel-like insulating material in the gap, the liquid or gel-like insulating material fills the gap and overflows, so that the filler portion and the filler portion in the gap The base portion of the upper portion is formed integrally,
And the wiring means comprises a wiring layer formed on the base to connect conductive pattern layers of the neighboring unit PCBs. 18. The method of claim 17,
Prior to the step of placing the insulating material in the gap, a connection unit is formed comprising an insulating connecting member as the insulating material and a wiring member integrated with the insulating connecting member,
Positioning the insulating material in the gap, the array member PCB manufacturing method for a light emitting module, characterized in that for contacting the wiring member with the conductive pattern layer while inserting a portion of the insulating connecting member in the gap.

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