KR20130005801A

KR20130005801A - Led package and manufacturing method thereof

Info

Publication number: KR20130005801A
Application number: KR1020110067423A
Authority: KR
Inventors: 김규한; 성정화; 김주호
Original assignee: 김규한
Priority date: 2011-07-07
Filing date: 2011-07-07
Publication date: 2013-01-16

Abstract

PURPOSE: An LED package and a manufacturing method thereof are provided to improve the durability of the LED package by preventing heating due to the conversion of light which is not emitted. CONSTITUTION: A housing(20) is symmetrically formed around a floodlight board(50). The floodlight board is made of light transmitting materials. An LED chip module(30) is formed on one of both outer sides of the floodlight board. An electrode pattern(60) made of the light transmitting materials supplies power to the LED chip module. The electrode pattern is composed of an external connection part(61) and a chip connection part(63).

Description

LED package and manufacturing method thereof

The present invention relates to an LED package, and more particularly, to an LED package in which light is irradiated in both directions from a light source and a method for manufacturing the same.

Light Emitting Diodes (LEDs), or LEDs, are semiconductors that generate light in a variety of colors when an electric current is applied. They have a long life and low power consumption. . In addition, in recent years, LED is used as a backlight unit of a liquid crystal display device, and in addition, its range of use is widening in everyday life such as indoor and outdoor lighting.

As the application range of LEDs is expanded, development of highly efficient LED packages capable of small size, high brightness and high power is being actively made.

In this regard, for example, various technologies are disclosed, including Korean Patent Application Nos. 2006-0098861 and 2007-0014392.

1 is an exploded perspective view of an LED package according to the prior art. As shown, the LED package emits light after mounting the LED element on a substrate and electrically connecting it to a power source.

In such an LED package, the LED element generates light and heat at the same time according to its characteristics, and heat dissipation is an important problem because the efficiency of the heat is reduced when the external emission of the heat is not smooth.

The LED package 200 mounts the LED element 215 as a light source on a circuit board 210 having a fixing electrode pattern 205, and the front surface of the substrate 210 has an external size and a substrate 210. It is a structure which is substantially similar and integrally fixes the reflecting member 220 which has a radial reflecting surface 222 inside by epoxy resin etc.

The conventional LED package 200 has a reflective surface 222 that is inclined through the reflective member 220, and reflects the light from the LED element 215 to the front through the reflective surface 222. will be.

However, in the LED package according to the related art as described above, since light is irradiated only one direction from the LED element, there is a problem in that efficiency is lowered. More precisely, in the case of an LED element itself, light can be irradiated in various directions, whereas a housing and a reflecting member on which the LED element is installed induce light emitted from the LED element in only one direction, thereby reducing light efficiency. will be.

In addition, the light generated from the LED element is irradiated only in one direction, and the rest which is not emitted is converted into heat, resulting in a large amount of heat generated by the LED package, and in some cases, the LED element is damaged.

The present invention has been made to solve the conventional problems as described above, an object of the present invention is to allow the light generated from the LED element to be irradiated in both directions of the LED package.

Another object of the present invention is to lower the heat generation of the LED package.

It is still another object of the present invention to precisely mold a mounting portion of a substrate for mounting an LED chip.

According to a feature of the present invention for achieving the above object, the present invention is an LED package for performing a light emitting function using the LED chip, the housing is formed in the hollow penetrating along the longitudinal direction therein, and the housing At least one of a light-transmitting substrate made of a light-transmitting material provided to cross the hollow, an electrode pattern of a light-transmitting material having a conductivity, and provided on at least one side of both outer surfaces of the light-transmitting substrate, and at least both outer surfaces of the light-transmitting substrate. It is configured to include an LED chip module provided on one side and electrically connected to the electrode pattern.

A plurality of LED chip modules are provided on both outer surfaces of the light transmitting substrate, respectively, and the LED chip module is composed of a plurality of blue chips, and a molding part including a yellow phosphor is filled in the housing.

The LED chip module is provided on the outer surface of both sides of the light emitting substrate, respectively, the LED chip module is composed of a red (R) chip, a green (G) chip and a blue (B) chip to form a white light source and the housing The molding part is filled.

The light-transmitting substrate is coupled to at least one of a light-transmitting first panel having an electrode pattern on an outer surface thereof and an outer surface of both sides of the first panel, and is exposed to a center for exposing the chip connection portion of the electrode pattern and mounting the LED chip module. The second panel is formed with a through hole in the.

The LED chip module includes a zener diode.

The housing and the hollow formed in the housing are formed in a circular or polygonal shape.

The electrode pattern has at least a portion exposed to the outside of the housing and electrically connected to an external parent substrate or an adjacent other LED package, and connected to the external connection and extended into the light transmitting substrate to extend the inside of the LED chip. It comprises a chip connection that is electrically connected.

Both ends of the translucent substrate protrude outwardly of the housing, and the external connection portion of the electrode pattern is formed on an outer surface of the transmissive substrate protruding outward of the housing.

According to another feature of the present invention, the present invention provides a light emitting substrate having a mounting portion and a light-transmitting electrode pattern is mounted on the LED chip in the manufacturing method of the LED package to perform a light emitting function using the LED chip. And manufacturing a housing so as to protrude to both sides with respect to the light transmitting substrate, and coupling the housing to the light transmitting substrate, mounting an LED chip to a mounting portion of the light transmitting substrate, and electrically connecting the LED chip to the electrode pattern. It is configured to include forming a molding to surround the.

The manufacturing of the light-transmitting substrate may include a first step of forming a transparent electrode pattern on an outer surface of the first panel having transparency, and a second step of manufacturing a second panel having a circular or polygonal through hole formed in the center thereof. And a third step of coupling the second panel to at least one of both outer surfaces of the first panel to expose the chip connection part of the electrode pattern through the through hole.

The second panel is made of any one material of ceramic, synthetic resin, or metal, or is made of a light transmissive substrate.

In the LED package according to the present invention as described above and a manufacturing method thereof, the following effects can be expected.

In the present invention, the housing of the LED package is formed by opening in both directions and the substrate and the electrode pattern is made of a light-transmissive material, through which the light generated from the LED is irradiated in both directions up and down instead of one direction, it is lost by the structure of the LED package The amount of light can be reduced to a minimum, and as a result, the efficiency of the LED package is improved.

In addition, in the present invention, since the light generated from the LED is irradiated in both directions, a portion of the light that is not irradiated is converted into heat, thereby preventing heat generation, thereby improving durability of the LED package.

In addition, in the present invention, the light-transmissive substrate is composed of a plurality of panel layers, and the grooves on which the LEDs are mounted are indirectly formed by through-holes formed in some panels without being directly etched or physically processed on the substrate, and thus are relatively easy to process. And precise molding is possible.

1 is an exploded perspective view showing the configuration of the LED package according to the prior art.
Figure 2 is a perspective view showing the configuration of a preferred embodiment of the LED package according to the present invention.
3 is a plan view showing the configuration of an embodiment of the present invention.
Figure 4 is a perspective view showing the configuration of another embodiment of the LED package according to the present invention.
5 is a plan view showing the configuration of the embodiment shown in FIG.
6 is a plan view showing the configuration of a light-transmitting substrate constituting an embodiment of the present invention.
7 is a cross-sectional view showing the configuration of a translucent substrate constituting an embodiment of the present invention.
8 and 9 are a plan view showing the configuration of a multi-package using the preferred embodiment of the present invention.
10 and 11 are a plan view showing the configuration of a multi-package using another embodiment of the present invention.

Hereinafter will be described in detail with reference to the accompanying drawings, a specific embodiment of the LED package and a manufacturing method according to the present invention as described above.

2 is a perspective view showing the configuration of a preferred embodiment of the LED package according to the present invention, Figure 3 is a configuration of the embodiment of the present invention in a plan view.

As shown in these figures, the appearance and shape of the LED package 10 according to the present invention is formed by the housings 20 and 20 '. As shown in Figure 2, the housing (20, 20 ') is formed in a substantially rectangular frame shape, in this embodiment is made of a synthetic resin material. The housings 20, 20 ′ may be manufactured separately and then bonded to the translucent substrate 50 to be described below, or may be manufactured through insert injection (double injection) together with the transmissive substrate 50.

The housings 20 and 20 'are symmetrically formed at both sides with respect to the translucent substrate 50. That is, the housings 20 and 20 'are formed to protrude to both sides of the translucent substrate 50, as shown in FIG. 2, so that the light generated from the LED chip module 30 to be described later can be irradiated in both directions. It is to. More precisely, the light generated from the LED chip module 30 is irradiated upward and downward with reference to FIG. 2, and the shape of the housings 20 and 20 ′ is centered on the light-transmitting substrate 50 to express such a function. As it extends in the vertical direction.

Hollow S is formed in the housings 20 and 20 '. The hollow S is formed to penetrate through the housings 20 and 20 ', and is shown in a state of being blocked by the light transmitting substrate 50 in FIGS. 2 and 3. The hollow (S) is to penetrate along the longitudinal direction of the housing (20, 20 '), whereby the light generated from the LED chip module 30 can be irradiated in the vertical direction, respectively.

The transparent substrate 50 is coupled to the housings 20 and 20 '. The light transmitting substrate 50 is an electrode pattern 60 is formed on the upper surface, the LED chip module 30 is mounted, as shown in Figure 2 is provided to cross the hollow (S). The light transmitting substrate 50 may be manufactured in a state of being coupled to the housings 20 and 20 'by insert injection or the like, or may be coupled to the housings 20 and 20' by an adhesive or the like after being manufactured.

In this case, the light transmitting substrate 50 is made of a light transmissive material. This is to allow the light generated from the LED chip module 30 to be irradiated up and down the housings 20 and 20 ', and may be made of glass or transparent synthetic resin. Of course, the light transmittance of the light transmitting substrate 50 may be adjusted according to the use of the LED package 10.

2 and 3, both ends of the light transmitting substrate 50 protrude outwardly of the housings 20 and 20 ′, respectively. It is electrically connected to other external components, for example, a mother substrate or another adjacent LED package 10 by an electrode pattern 60 formed on an upper surface of the transparent substrate 50 protruding outwardly of the housings 20 and 20 '. It is intended to be.

An electrode pattern 60 is formed on the light transmitting substrate 50. The electrode pattern 60 is for electrical connection with the LED chip module 30 and the outside, and serves to supply power to the LED chip module 30. The electrode pattern 60 may be formed on the light-transmitting substrate 50 by deposition (SPUTTER, DEPOSITION), printing (roll-to-roll, screen printer) or a film method.

In this case, the electrode pattern 60 has a light transmittance similar to the transparent substrate 50. This is for transmitting the light emitted from the LED chip module 30 in both up and down directions of the light-transmitting substrate 50. To this end, the electrode pattern 60 may be made of a conductive coating material, for example, indium tin oxide (ITO), zinc oxide (ZnO), indium zinc oxide (IZO), or a liquid polymer. In the case of ITO, when the light transmitting substrate 50 is made of a glass material, it may be formed by vacuum deposition. The light transmitting substrate 50 is excellent in light transmittance and conductivity. In this case, in order to prevent Sodaim elution of Soda glass, a separate SiO ₂ layer may be provided between the ITO material electrode pattern 60 and the transparent substrate 50.

6 and 7 show examples of the electrode pattern 60. As shown in the drawing, the electrode pattern 60 is composed of an external connection portion 61 and a chip connection portion 63. At least a portion of the external connection portion 61 is exposed to the outside of the housings 20 and 20 '. It is to be electrically connected to the external mother substrate or adjacent other LED package 10. To this end, the external connection portion 61 is formed at a portion protruding to the outside of the housing 20, 20 'of the outer surface of the transparent substrate 50.

The chip connection part 63 is connected to the external connection part 61 and extends inwardly of the light transmitting substrate 50, and is a part electrically connected to the LED chip module 30. In the present embodiment, four chip connection units 63 are connected to one external connection unit 61, three of which may be connected to an LED chip to be described below, and the other one may be connected to a zener diode (not shown). have. Of course, the number of the chip connection portion 63 is not necessarily limited to four may vary depending on the configuration of the LED chip module 30 is coupled.

The electrode pattern 60 is provided in pairs to face each other as shown, which is for connecting the power of different poles, respectively. In addition, a portion 65 of the electrode pattern 60 may serve as a ground.

On the other hand, the light transmitting substrate 50 and the electrode pattern 60 provided thereon may be configured to be made of a plurality of panels. In FIG. 7, an example of the light transmitting substrate 50 and the electrode pattern 60 coupled thereto is illustrated, and a side cross-sectional view of the light transmitting substrate 50 and the electrode pattern 60 is shown.

As shown in FIG. 7A, the light-transmitting substrate 50 is formed of a single substrate, and a groove-shaped mounting portion 51 recessed in an upper surface thereof is formed, and the electrode pattern (eg) is formed on the mounting portion 51. 60) can be combined. In this case, a kind of dam is formed by the recessed mounting part 51, and a part of the electrode pattern 60 and the LED chip module 30 are seated and electrically connected to the dam. The recessed groove may be formed by etching the floodlight substrate 50 or by using a laser and other equipment.

In FIG. 7B, mounting portions 51 and electrode patterns 60 are provided on the top and bottom surfaces of the light transmitting substrate 50, respectively. As shown in the figure, an electrode pattern 60 and an LED chip module 30 are provided on the top and bottom surfaces of the light transmitting substrate 50, respectively. This is applied when the high brightness and high output of the LED package 10 is required, and the LED chip module 30 provided on the upper surface and the LED chip module 30 provided on the bottom surface irradiate light in both up and down directions. Therefore, since the amount of light generated from one LED package 10 is increased, it can be applied to a place where high space utilization is required.

In FIG. 7C, a light transmissive substrate 50 including a plurality of panels is illustrated. As described above, the light transmitting substrate 50 is composed of a first panel 50 'and a second panel 50' ', and the first panel 50' is provided with an electrode pattern 60 on an outer surface thereof. , Is located in the center. The second panel 50 ″ is coupled to at least one of the outer surfaces of both sides of the first panel 50 ′ and exposes the chip connecting portion 63 of the electrode pattern 60 and the LED chip module 30. Through hole (S ') is formed in the center for mounting.

As described above, when the transparent substrate 50 is composed of a plurality of layers, the second panel 50 'does not need to be directly etched or physically processed on the transparent substrate 50 to form the mounting portion 51. Since the hole is formed through ') and coupled to the first panel 50', more precise dam shape processing is possible.

In particular, in general, the thickness of the substrate is very thin, and it is not easy to form the mounting portion 51 for mounting the LED chip module 30 again on such a thin substrate, and thus indirectly using a plurality of layers of panels. It can be processed with.

Finally, FIG. 7 (d) shows a structure in which mounting parts 51 for mounting the LED chip module 30 are formed on the top and bottom surfaces of the light transmitting substrate 50 including the plurality of panels, respectively. The second panel 50 ″ is coupled to both sides with respect to the center first panel 50 ′. In addition, through holes S ′ are formed in the second panel 50 ″, respectively, to secure a space for mounting the LED chip module 30, that is, a mounting unit 51.

In this case, the second panel 50 ″ may be made of any one material of ceramic, synthetic resin, or metal, or may be made of a substrate made of a light transmissive material. For reference, FIGS. 7C and 7D show the LED chip module 30 omitted from the mounting unit 51 of the light transmitting substrate 50.

Referring to FIG. 2 again, an LED chip module 30 is installed on the light transmitting substrate 50. The LED chip module 30 is a light source composed of one or a plurality of LEDs, and is electrically connected to the electrode pattern 60 to receive power.

Both ends of the LED chip module 30 are electrically connected to the chip connecting portion 63 of the electrode pattern 60. As the connection method, various methods such as solder ball bonding, wire bonding, thermocompression, or adhesive are possible. Do.

In this embodiment, the LED chip module 30 is composed of a total of three, they are composed of red (R), green (G), blue (B) chip (hereinafter referred to as 'RGB chip'), and output from the RGB chip White light may be realized by mixing the respective lights.

Alternatively, the LED chip module 30 may be composed of three blue (B) chips. In this case, a yellow phosphor is applied to the molding part to be described below to implement white light. In other words, the light emitted from the blue (B) chip LED is passed through the phosphor, and the short wavelength is changed to light of various long wavelengths to realize pseudo white.

Although not shown, a molding part is formed in the housings 20 and 20 '. The molding part is intended to surround and protect the transparent substrate 50 and the LED chip module 30 mounted thereon, and is made of a transparent polymer material. As the transparent polymer material, for example, a silicone resin, an epoxy resin, an epoxy molding compound (EMC), or the like may be used.

In this case, when the LED chip module 30 is composed of a blue chip, a yellow phosphor is included in the molding part. This is to implement white light from the blue (B) chip as described above. Of course, the yellow phosphor may be included in the molding part, but may be separately applied to the inner surface 21 of the housings 20 and 20 ', the outer surface of the transparent substrate 50, and the outer surface of the molding part.

In addition, a yellow phosphor may be applied to the inner surfaces of the housings 20 and 20 ', or a separate reflector is provided on the inner surfaces of the housings 20 and 20' to radiate light emitted from the LED chip module 30. It can also reflect efficiency.

In addition, a zener diode may be mounted on the light transmitting substrate 50 together with the LED chip module 30. The zener diode is for protecting the high power LED package 10 from electrostatic discharge (ESD).

On the other hand, the housing 20, 20 'is not only a rectangular frame shape, but also various polygonal shapes, or as shown in Figures 4 and 5, the LED package 110 according to the present invention may be formed in a circular shape. In addition, the chip connecting portion 63 of the electrode pattern 60 and the corresponding LED chip module 30 may also be variously arranged, including a circular shape with the shape of the housings 20 and 20 '. That is, in the present embodiment, the LED chip module 30 is mounted in parallel in a parallel direction, but is not limited thereto and may be arranged to form various angles with adjacent LEDs.

In addition, a reflective plate (not shown) may be provided at one side of the housings 20 and 20 '. This is for guiding the light of the LED chip module 30 irradiated in both directions back to one side, the reflector is installed to shield any one of the open both sides of the housing (20, 20 '), or the LED It may be coupled to the outside of the package 10.

8 to 11 illustrate a plurality of LED packages 10 installed on the mother substrate P. Referring to FIG. As shown in the drawing, the LED package 10 may be used by forming a plurality of multi-packages together instead of one. In this case, the external connection portions 61 of the LED package 10 may be grounded portions P of the mother substrate P, respectively. Is electrically connected to the In addition, the mother substrate P may be formed of an FR4 substrate, a metal core PCB, a ceramic substrate, or the like.

Next, a method of manufacturing the LED package according to the present invention will be described.

First, a manufacturing process of the light emitting substrate 50 constituting the LED package 10 will be described. The light emitting substrate 50 may include a mounting unit 51 on which the LED chip module 30 is mounted and an electrode pattern having light transparency. 60). The mounting portion 51 is directly etched to the substrate or molded by other physical processing methods when the light transmitting substrate 50 is composed of one panel, but the light transmitting substrate 50 is composed of a plurality of panel layers. In this case, it is formed as follows (see FIGS. 7C and 7D).

First, a light transmissive electrode pattern 60 is formed on the outer surface of the first panel 50 'having light transmissivity. In this case, the electrode pattern 60 may be formed in such a manner that the electrode pattern 60 is deposited, printed, or already patterned by an adhesive.

Next, a second panel 50 ″ having a circular or polygonal through hole S ′ is formed in the center. The through hole S ′ is formed to completely penetrate through the second panel 50 ″, and indirectly implements the mounting unit 51 without directly processing the light transmitting substrate 50.

Finally, the second panel 50 ″ is coupled to one surface (FIG. 7C) or both sides (FIG. 7D) of both outer surfaces of the first panel 50 ′. In this case, the chip connecting portion 63 of the electrode pattern 60 is exposed through the through hole S ′ formed in the second panel 50 ″, and is separated from the step by the through hole S ′. The mounting part 51 is formed indirectly. As described above, since the mounting portion 51 is indirectly formed by combining a plurality of panels without forming the mounting portion 51 directly on a very thin substrate, processing is relatively easy and the mounting portion 51 The shape of can be processed finely.

Next, a process of coupling the housings 20 and 20 'to the light transmitting substrate 50 is continued. The housings 20 and 20 'are formed in a polygonal frame or a circular frame shape, and are manufactured by injection in this embodiment. In this case, the coupling between the light transmitting substrate 50 and the housings 20 and 20 'is made through double injection of the light transmitting substrate 50 and the housings 20 and 20', or the light transmitting substrate 50 is manufactured, respectively. And the housings 20, 20 'are made in such a manner as to couple through an adhesive or the like.

When the housings 20 and 20 'and the light transmitting substrate 50 are coupled to each other, the LED chip module 30 is mounted on the mounting portion 51 formed indirectly by the through hole S', and the LED chip module ( 30 is electrically connected to the chip connecting portion 63 of the electrode pattern 60 to finish.

When the LED chip module 30 is mounted, a process of finally forming a molding part is continued. The molding part is to surround and protect the LED chip module 30. As described above, a yellow phosphor may be included in the material for forming the molding part.

It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. It is self-evident.

10: LED package 20,20 ': housing
30: LED chip module 50: floodlight substrate
50 ': 1st panel 50'': 2nd panel
51: mounting portion 60: electrode pattern
61: external connection 63: chip connection

Claims

In the LED package to perform the light emitting function using the LED chip,
A housing formed with a hollow penetrating along the longitudinal direction therein;
A light transmitting substrate made of a light transmissive material provided to cross the hollow in the housing;
An electrode pattern provided on at least one side of both outer surfaces of the light-transmitting substrate, the electrode pattern being made of a light-transmissive material, and
An LED package comprising an LED chip module provided on at least one side of the outer surface of both sides of the light-transmitting substrate and electrically connected to the electrode pattern.

The method of claim 1, wherein the light transmitting substrate
A translucent first panel having an electrode pattern on an outer surface thereof;
And a second panel coupled to at least one of both outer surfaces of the first panel and having a through hole formed at a center thereof for exposing the chip connection part of the electrode pattern and mounting of the LED chip module.

The method of claim 2, wherein the electrode pattern
An external connection portion at least partially exposed to the outside of the housing and electrically connected to an external mother substrate or another adjacent LED package;
LED package, characterized in that it comprises a chip connection portion connected to the external connection and extending into the inside of the transparent substrate and electrically connected to the LED chip module.

The method of claim 1, wherein both ends of the translucent substrate protrude outwardly of the housing, and an external connection portion of the electrode pattern is formed on an outer surface of the transmissive substrate protruding outward of the housing. LED package.

The LED package of claim 4, wherein the housing and the hollow formed in the housing are formed in a circular or polygonal shape.

The LED chip module of claim 4, wherein a plurality of LED chip modules are provided on both outer surfaces of the light transmitting substrate, and each of the LED chip modules includes a plurality of blue (B) chips, and a molding part including a yellow phosphor in the housing. LED package, characterized in that the filling.

5. The LED chip module of claim 4, wherein a plurality of LED chip modules are provided on outer surfaces of both sides of the light-transmitting substrate, and each of the LED chip modules includes a red (R) chip, a green (G) chip, and a blue (B) chip. And a molding part is filled in the housing.

In the manufacturing method of the LED package to perform a light emitting function using the LED chip,
Manufacturing a light-transmitting substrate on which a mounting portion on which the LED chip module is mounted and a light-transmissive electrode pattern are formed;
Manufacturing and coupling the housing to the transmissive substrate so as to protrude to both sides with respect to the translucent substrate;
Mounting an LED chip module to a mounting portion of the light-transmitting substrate and electrically connecting the LED chip module to the electrode pattern;
And forming a molding part to surround the LED chip module.

The method of claim 8, wherein the manufacturing of the floodlight substrate is performed.
A first step of forming a transparent electrode pattern on the outer surface of the first panel having a light transmission,
A second step of manufacturing a second panel having a circular or polygonal through hole formed at the center thereof;
And a third step of coupling the second panel to at least one of both outer surfaces of the first panel to expose the chip connection part of the electrode pattern through the through hole. .

The method of claim 9, wherein the second panel is made of any one material of ceramic, synthetic resin, or metal, or is made of a light transmissive substrate.