KR20130002246A - Device test socket and probe pin therefor - Google Patents

Abstract

PURPOSE: A device test socket and a probe pin used in the same are provided to minimize weight about a test module when a probe portion is pressurized for an inspection performance about a device by forming a probe portion by a plunger portion and a spring. CONSTITUTION: A device test socket comprises a frame portion, a pin coupling portion, and a probe portion. The pin coupling portion includes silicon or synthetic resin. The probe portion includes a plunger portion(210) and a spring portion(220). A first end portion(211) is contacted with the terminal of a device in the one end of the plunger portion. A second end portion(212) is formed in the other end of the plunger portion. A part of the second end portion is inserted into the spring portion. When the plunger portion is pressurized downwards, the spring portion is contacted with the terminal of a test module.

Description

Device test socket and probe pin therefor}

The present invention relates to a device test socket, and more particularly, a device having a plurality of probes corresponding to respective terminals of a device, and installed in a test module to allow a terminal of the device to come into contact with a probe to perform a test on the device. A test socket and a probe used therefor.

Devices such as SDRAM, flash ram, LSI, camera module, etc. are generally shipped to the market after various tests are performed by the inspection apparatus, such as normal operation under normal conditions such as high temperature environment.

An inspection apparatus for inspecting the device includes a test module such as a test board, and the test module is provided with a device test socket for connection between terminals of the devices.

On the other hand, the conventional device test socket is configured to include a pin is coupled to the frame and the frame portion is installed in the test module and a plurality of pin insertion holes are formed, and the probe is inserted into each of the plurality of pin insertion holes.

1 is a conceptual diagram showing a probe of a conventional device test socket.

As an example of a conventional probe unit, the probe unit of Korean Utility Model No. 448254, as shown in FIG. 1, has a cylindrical barrel 2 and a first installed at an upper end and a lower end so as to be movable in the barrel 2, respectively. A pin 1 and a second pin 3 and a spring 4 provided between the first pin 1 and the second pin 3 in the barrel 2.

As another example of the conventional probe part, the probe part may be formed integrally with the pin coupling part up and down at a position contacting the terminal.

However, the conventional probe unit as described above has the following problems.

When the probe portion of Korean Utility Model No. 448254 is excessively moved due to the pressurization of the terminal 6 of the device, the load is transmitted to the terminal 6 of the test board constituting the test module, and thus the test board is damaged.

In addition, the probe portion of Korean Utility Model No. 448254 has a problem in that there is a limitation in minimizing the probe portion due to the limitation of the barrel 2 manufacturing.

In addition, the probe part of Korean Utility Model No. 448254 has a high resistance of the probe part due to the point contact or the surface contact of the first pin 1, the second pin 3, and the spring 4, thereby making it difficult to perform inspection on the device. There is a problem.

On the other hand, in the case of the probe part in which the conductive member is formed integrally with the pin coupling part, due to the characteristics of the manufacturing process due to the arrangement of the conductive material, a short circuit occurs in the conductive member, thereby making the inspection itself impossible or increasing the overall resistance of the probe part, thereby inspecting the device. There is a problem that performance is not smooth.

It is an object of the present invention to provide a device test socket and a probe used therein that can minimize the load on the test module when the probe is pressed to perform the inspection of the device to solve the above problems.

Another object of the present invention is to provide a device test socket having a structure that can minimize the overall resistance when connecting the terminal of the device and the terminal of the test module and the probe used therefor.

Another object of the present invention is to provide a device test socket having a structure capable of minimizing the pitch between neighboring probes and a probe used therefor.

The present invention has been created in order to achieve the object of the present invention as described above, the present invention and the frame unit 20 is installed in the test module 10; A pin coupling part 100 coupled to the frame part 20 and having a plurality of pin insertion holes 110 formed therein; And a probe part 200 inserted into each of the plurality of pin insertion holes 110, wherein the pin coupling part 100 includes silicon or synthetic resin, and the probe part 200 has one end of the device. The first end portion 211 is formed in contact with the terminal and the plunger portion 210 having the second end portion 212 formed at the other end portion, and a portion of the second end portion 212 of the plunger portion 210 is inserted. The device test socket is characterized in that it comprises a spring portion 220 which is in contact with the terminal 11 of the test module 10 when the plunger portion 210 is pressed downward.

The first end of the plunger portion may be formed with a plurality of protrusions for smooth contact with the terminal of the device. The protrusions preferably form a wedge shape.

The plunger portion may include a body portion connecting the first end portion and the second end portion, and the body portion may be formed with at least one protrusion having an outer diameter.

The outer diameter of the protrusion is preferably larger than the inner diameter of the pin insertion hole.

The plunger portion connects the first end portion and the second end portion and includes a body portion, and the outer diameter of the second end portion is preferably smaller than the outer diameter of the body portion.

The second end may be formed with one or more locking projections further protruding the outer diameter in order to prevent the spring portion from being separated.

A portion of the spring portion may be located between the body portion and the locking jaw than the end of the second end portion.

The spring portion may have a tapered portion whose inner diameter decreases at an end portion smaller than the outer diameter of the second end portion.

The tapered portion may be in close contact with a neighboring coil of the coil forming the spring portion.

The pin fixing part may include a support plate part made of a metal material in which a plurality of openings are formed corresponding to the pin insertion hole; The pin insertion holes may be formed and may include a pin support part made of a silicone material or a synthetic resin material integrally coupled with the support plate.

The support plate may include a first support plate having a plurality of first slots corresponding to a part of the openings; The first support plate may include a second support plate laminated with the first support plate and formed with at least one second slot crossing the first slot to form the openings.

The pin fixing part may be manufactured by injecting silicone or synthetic resin into the mold in a state in which the support plate is fixed to a mold in which pin forming members for forming the plurality of pin insertion holes are installed.

The present invention also discloses a probe comprising a probe of a device test socket having the above configuration.

The device test socket and the probe used therein according to the present invention comprise a plunger part having one end contacting the terminal of the device and a spring inserted into the other end of the plunger part and contacting the terminal of the test module to perform the inspection of the device. In order to minimize the load on the test module when the probe is pressurized.

In addition, the device test socket according to the present invention and the probe used therein comprise a plunger part having one end contacted to a terminal of the device, and a probe part made up of a spring inserted into the other end of the plunger part and contacting the terminal of the test module. This has the advantage of minimizing the overall resistance when connecting the terminals of the module.

In particular, by maximizing the contact area between the spring and the plunger portion constituting the device test socket, there is an advantage that the required resistance of the probe can be reached even if a small load is applied to the device.

As a result of testing the probe having the configuration as shown in FIG. 4, a low resistance value of 32 mΩ was measured by a relatively small load of 30 g, a maximum current of 2.5 A, and a deformation amount of about 0.4 mm (strain amount of the entire probe pin).

For reference, when a probe having a fin structure shown in FIG. 1 is tested under similar conditions, the probe has a resistance value of about 80 mΩ.

In addition, compared to the conventional probe having a structure as shown in Figure 1, since there is no barrel, there is an advantage that can minimize the pitch between neighboring probes.

In addition, the device test socket according to the present invention is composed of a support plate made of a metal material coupled to the frame portion and a pin support portion made of a silicon material (or a synthetic resin material) integrally coupled to the support plate. In addition to having structural rigidity by the plate and facilitating the installation of the probe pin by a silicon material (or a synthetic resin material), the probe pin is stably supported and the replacement of the defective probe pin is easy.

In addition, the device test socket according to the present invention has the advantage that the pin support portion is composed of a pin support portion of a silicon material (or synthetic resin material), so that the installation and replacement of the probe pin is easy to manufacture and maintain.

In addition, it is possible to manufacture a device test socket having a smaller pitch between the probe pins by stacking plate members having slots forming openings crossing each other.

1 is a conceptual diagram showing a probe of a conventional device test socket.
2 is a cross-sectional view showing a device test socket according to the present invention.
3 is a plan view of the device test socket of FIG.
4 is a cross-sectional view illustrating a probe installed in the device test socket of FIG. 1.
5A and 5B are sectional views taken along the line I-I of FIG. 2, showing the operation state of the device test socket.
6A through 6C are conceptual views illustrating a manufacturing process of the pin coupling portion of the device test socket of FIG. 1.

Hereinafter, a device test socket and a probe used therein according to the present invention will be described in detail with reference to the accompanying drawings. For convenience of description in the drawings, the dimensions of some of the members are large or small, unlike the actual examples.

2 to 6c according to the present invention, the frame unit 20 is installed in the test module 10; A pin coupling part 100 coupled to the frame part 20 and having a plurality of pin insertion holes 110 formed therein; Probe portion 200 is inserted into each of the plurality of pin insertion holes (110).

The test module 10 is configured to test the device 30 as a test target, and various configurations are possible according to a test type, a purpose, and the like.

For example, the test module 10 may include a circuit board on which a chip or the like for performing a test is installed and a plurality of terminals 11 for connecting to the probe unit 200 are installed.

The device 30 to be tested may be any object as long as it is an electronic product having a terminal such as an SD RAM, an LSI, a camera module, and the like.

The frame unit 20 may be configured in various ways as a structure for coupling the pin coupling unit 100 to the test module 10 in order to perform a test on the device 30.

For example, the frame portion 20 may be processed by aluminum or aluminum alloy, as shown in Figures 2 and 3, the receiving space (S) for the installation of the pin coupling portion 100 is formed In addition, the guide part 22 may be formed to guide the terminals 31 of the device 30 to be positioned at each probe part 200 installed in the pin coupling parts 100.

In addition, the frame part 20 may further include a receiving part for accommodating the accessory member when the accessory member is coupled, such as a CCD module, in addition to a chip having a terminal such as a camera module.

In addition, the frame part 20 is an installation environment in which the test module 10 is installed, that is, a manual inspection environment in which an element is manually loaded by an inspector and then unloaded again manually after inspection, element loading and unloading, inspection, etc. Various configurations are possible according to this automatic environment.

In addition, the frame portion 20 may be further provided with a cover member for pressing the device to the pin coupling portion 110 by the inspection object after loading the device.

The pin coupling part 100 is coupled to the frame part 20 and a plurality of pin insertion holes 110 into which the probe parts 200 are inserted are formed, and various configurations are possible.

In particular, the pin coupling portion 100 preferably includes a silicon material or a synthetic resin material.

As an example in which the pin coupling part 100 includes a silicon material or a synthetic resin material, the pin coupling part 100 corresponds to the pin insertion hole 110 to support a metal plate having a plurality of openings 123 formed therein. 120; The pin insertion holes 110 may be formed and may include a pin support part 130 made of a silicon material or a synthetic resin material which is integrally coupled with the support plate part 120.

The support plate 120 is formed of a thin metal plate such as stainless, and a plurality of openings 123 are formed by etching or the like.

On the other hand, as the openings 123 are formed in the support plate 120 by etching, it is not easy to minimize the interval, that is, the pitch, with the neighboring pin insertion holes 110.

Accordingly, as shown in FIG. 6A, the support plate 120 includes a first support plate 121 having a plurality of first slots 124 formed to correspond to a part of the openings 123; The second support plate 122 may be formed to be stacked with the first support plate 121 to form one or more second slots 125 intersecting the first slot 124 to form the openings 123.

The first support plate 121 and the second support plate 122 are formed of a thin metal plate such as stainless steel.

The first slot 124 and the second slot 125 may be formed in various ways according to the position and number of the opening 123 to be formed to cross each other, and are preferably formed orthogonal to each other, but is not limited thereto. .

When the support plate 120 is composed of the first support plate 121 and the second support plate 122 having the first slot 124 and the second slot 125, respectively, the opening 123 of various patterns Can be formed and the pitch between the openings 123 can also be refined, such as 0.2 mm.

On the other hand, the support plate 120 may be formed with one or more screw holes 127 for coupling with the frame portion 20, one or more holes 128 for weight and material savings may be formed. In addition, the hole 128 facilitates silicon injection in the molds 310 and 320 as shown in FIG. 6B.

The pin support part 130 is integrally coupled with the support plate part 120 and the pin insertion holes 110 are formed at positions corresponding to the openings 123 of the support plate part 120. .

For example, the pin support 130 may be formed of a material that is elastically deformable, such as silicon, synthetic resin, and the like, and is integrally coupled with the support plate 120 by a mold or the like.

Meanwhile, as shown in FIGS. 6B and 6C, the pin coupling part 100 having the above configuration includes molds 310 and 320 in which pin forming members 330 are formed to form a plurality of pin insertion holes 110. The support plate 120 may be manufactured by injecting silicone or synthetic resin into a mold in a fixed state.

On the other hand, the frame portion 20 is elastically deformed so that the pin coupling portion 100 is movable downward when the pin coupling portion 100 is pressed downward by the element 30, and the restoring force when the element 30 is removed The elastic member 260 for moving the pin coupling portion 100 to the upper side may be additionally installed.

At this time, the pin coupling portion 100 is installed to be movable in the vertical direction to the frame portion (20).

For example, the pin coupling portion 100 is inserted into the screw hole 127 as shown in FIG. 6A by the coupling screw 250 to move the frame portion 20 in the vertical direction. Can be coupled to the bottom.

A coil spring inserted into the coupling screw 250 as an elastic member 260 may be installed between the bottom of the pin coupling portion 100 and the head of the coupling screw 250.

On the other hand, when the support plate 120 of the pin coupling portion 100 is composed of a thin plate is elastically deformable, it can perform the function of the elastic member without the installation of a separate elastic member.

The probe unit 200 is inserted into each of the plurality of pin insertion holes 110 to electrically connect the terminal 31 of the device 30 and the terminal 11 of the test module 10. Configuration is possible.

For example, as illustrated in FIGS. 2 to 5B, the probe part 200 has a first end portion 211 formed at one end thereof in contact with the terminal 31 of the device 30 and a second end portion at the other end thereof. The plunger portion 210 having the end portion 212 formed therein, and a part of the second end portion 212 of the plunger portion 210 are inserted and the terminal of the test module 10 when the plunger portion 210 is pressed downwards ( It may include a spring portion 220 in contact with 11).

The plunger portion 210 may be any material as long as it is a conductive material such as BeCu, and may be plated with gold (Au) to increase conductivity.

The plunger portion 210 has a first end 211 at one end thereof in contact with the terminal 31 of the element 30, a second end 212 at the other end thereof, a first end 211 and It may include a body portion 213 connecting the second end.

The first end 211 is a part in contact with the terminal 31 of the device 30, and may be formed of a plurality of protrusions 211a for smooth contact with the terminal 31 of the device 30. Here, the protrusions 211a vary depending on the terminal 31 of the device 30, and when the terminal 31 is BGA, it is preferable to form a wedge shape.

In addition, the first end 211 may have a tapered shape to reduce the outer diameter while going to the end in consideration of the size of the terminal 31 of the device 30.

The body portion 213 connects the first end 211 and the second end 212 to have a substantially cylindrical shape, and at least one protrusion 213a having an outer diameter may be formed. At this time, the outer diameter of the protrusion 213a is preferably larger than the inner diameter of the pin insertion hole 110.

When the protruding portion 213a having an outer diameter larger than the inner diameter of the pin insertion hole 110 is formed in the body portion 213, the probe part 200 is pin-inserted by the elastic part of the pin coupling part 100. In the inserted state and the inserted state is pressed by the portion of the elastically deformed pin coupling portion 110 is fixed to the probe unit 200 stably.

The second end 212 is a portion to be inserted into the spring 220, which will be described later, any structure can be inserted into the spring 220.

In particular, the second end portion 212 preferably has an outer diameter smaller than that of the body portion 213 to prevent the spring portion 220 from being inserted into the body portion 213. At this time, the inner diameter of the spring portion 220 is preferably larger than the outer diameter of the second end 212, it is preferably formed substantially the same.

On the other hand, the second end 212 may be formed with one or more locking jaw (212a) is further protruded in the outer diameter in order to prevent the spring portion 220 is separated. At this time, a portion of the spring portion 220 is located between the body portion 213 and the locking step 212a is prevented from being separated from the second end (212).

In addition, the second end 212 is preferably formed with a convex end, for example, a convex curved surface 212b so as to maximize the area in contact with the spring portion 220 to be described later. Here, the area where the curved surface 212b of the second end portion 212 is in contact with the tapered portion 221 formed to reduce the inner diameter of the spring portion 220 is in contact with the second end portion 212 and the spring portion 220. It can be maximized.

In particular, the tapered portion 221 of the spring 220 has a shape corresponding to the shape of the end of the second end 213, for example, when the end of the second end 213 forms a convex curved surface 212b. The inner circumferential surface formed by the 221 may have the same curvature as the convex curved surface 212b.

The spring 220 is formed of a coil spring to insert the second end 212 of the plunger 210 and is elastically deformed when contacting the terminal 11 of the test module 10 so that The first terminal 211, the body 213, and the second end 212 of the plunger portion 210 may be electrically connected without impacting the terminal 11.

The spring unit 220 may be any material as long as it is a conductive material such as stainless steel, copper, or copper alloy. In particular, the spring 220 is preferably plated with gold to improve conductivity.

In addition, the spring 220 is preferably in close contact with the coil adjacent to the coil forming the spring at the top and bottom. In this case, the number of close turns may vary depending on a moving distance between the first end 211 and the terminal 11 of the test module 10.

In addition, the spring 220 may have a tapered portion 221 in which the inner diameter of the end portion is smaller than the outer diameter of the second end portion 212.

When the taper portion 221 is formed, the area in contact with the second end portion 212 and the spring portion 220 may be maximized to minimize the overall resistance of the probe portion 220.

As shown in FIG. 5A, the spring part 220 may be positioned in contact with an end thereof, or as shown in FIG. 2.

Here, the spring portion 220 is installed to protrude more than the bottom of the pin fixing part 100, wherein the end of the second end portion 212 is substantially on the same surface as the bottom of the pin fixing part 100 or pin fixing part 100 Can be located inside.

Hereinafter, the operation of the device test socket having the above configuration will be described.

First, the device test socket is installed on the test module 10. At this time, the probe unit 200 of the device test socket is positioned corresponding to each terminal 11.

Here, the test module 10 in which the device test socket is installed may be installed in a manual environment in which device loading, inspection and unloading are manually performed by a user, or in a device handler in which device loading, inspection and unloading is automatically performed. Can be under the environment.

After the device test socket is mounted on the test module 10, the loading, inspection and unloading of the device 30 are continuously performed.

In this case, when the device 30 is loaded in the device test socket, the device 30 is guided to the guide part 22 of the frame part 20 to be in a state as shown in FIG. 2 or 5A.

And the device 30 loaded in the device test socket is as shown in Figure 5b by a pressing member (not shown) or a pressing member (not shown) installed on the cover member coupled to the frame portion 20, Pressed downward and moved downward in contact with each probe unit 200.

As the probe part 200 and the pin coupling part 100 coupled to the probe part 200 descend, the spring part 220 contacting the terminal 11 of the test module 10 is in a state as illustrated in FIG. 5B. Elastic deformation.

At this time, the spring 220 is in close contact with the terminal 11 of the test module 10 as well as the second end 212 of the plunger 210 by the elastic deformation to increase the contact area.

Therefore, the total resistance of the probe pin 200 connecting the terminal 31 of the device 30 and the terminal 11 of the test module 10 is reduced.

On the other hand, there is a need to maintain a constant gap between the upper surface of the test module 10 and the pin coupling portion 100 (?) At this time, the length of the spring 220 also increases, so that the terminal 11 of the test module 10 during elastic deformation The spring unit 220 may be deformed by sliding in the lateral direction.

Therefore, it is more preferable to shorten the length of the spring portion 220 protruding from the bottom surface of the pin coupling portion 100.

Accordingly, the frame portion 20 is elastically deformed so that the pin coupling portion 100 is movable downward when the pin coupling portion 100 is pressed downward by the element 30, and when the element 30 is removed, the pin coupling portion 100 is elastically deformed. It is preferable that the elastic member 260 for moving the pin coupling portion 100 upwards is additionally installed.

When the elastic member 260 is installed as described above, in the state as shown in FIG. 2, when the device 30 is pressed and moved downward, the probe pin is pressed by the pressure of the device 30 and the elastic deformation of the elastic member 260. The pin coupling portion 100 to which the 200 is coupled is first lowered as shown in FIG. 5A.

In addition, when the spring 220 of the probe pin 200 contacts the terminal 11 of the test module 10, the spring portion 220 is in the state shown in FIG.

As a result, the length of the spring part 220 protruding from the bottom of the pin coupling part 100 may be reduced, so that the spring part 220 is deformed by sliding in the transverse direction from the terminal 11 of the test module 10 when elastic deformation is performed. There is an advantage that can be extended to prevent the life of the probe unit 200.

Meanwhile, the elastic member 260 prevents a pressure member from applying a load for pressing the element 30 directly to the probe unit 200 and the terminal 11 of the test module 10 so that the probe unit due to impact ( 200) and / or to prevent damage to the test module 10.

As described above is only a pipe as a part of a preferred embodiment that can be implemented by the present invention, the scope of the present invention, as is well known is not limited to the above embodiment should not be interpreted, the present invention described above All of the technical ideas together with the technical idea of the base will be included in the scope of the present invention.

10: test module 20: frame part
30: device
100: pin coupling portion 200: probe portion

Claims (1)

A frame unit 20 installed on the test module 10;
A pin coupling part 100 coupled to the frame part 20 and having a plurality of pin insertion holes 110 formed therein;
Probe portion 200 is inserted into each of the plurality of pin insertion holes 110,
The pin coupling portion 100 includes silicon or synthetic resin,
The probe portion 200 has a plunger portion 210 having a first end portion 211 formed at one end thereof in contact with a terminal of the device and a second end portion 212 formed at the other end portion thereof, and the plunger portion 210. A part of the second end 212 of the device is characterized in that it comprises a spring portion 220 which is in contact with the terminal 11 of the test module 10 when the plunger portion 210 is pressed downward Test socket.

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