KR20120130638A - Multi layer fpcb and manufacting methods thereof - Google Patents

Multi layer fpcb and manufacting methods thereof Download PDF

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Publication number
KR20120130638A
KR20120130638A KR1020110048733A KR20110048733A KR20120130638A KR 20120130638 A KR20120130638 A KR 20120130638A KR 1020110048733 A KR1020110048733 A KR 1020110048733A KR 20110048733 A KR20110048733 A KR 20110048733A KR 20120130638 A KR20120130638 A KR 20120130638A
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KR
South Korea
Prior art keywords
conductive pattern
layer
adhesive sheet
substrate
adhesive
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KR1020110048733A
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Korean (ko)
Inventor
이영일
Original Assignee
주식회사 아모그린텍
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Priority to KR1020110048733A priority Critical patent/KR20120130638A/en
Priority to PCT/KR2011/009356 priority patent/WO2012074345A2/en
Publication of KR20120130638A publication Critical patent/KR20120130638A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: A multi-layer flexible printed circuit board(PCB) and a manufacturing method thereof are provided to minimize usage of metal nano particles by forming a conductive pattern by performing an inkjet patterning. CONSTITUTION: A first conductive pattern(20) is transferring patterned on one side of an adhesive sheet. A second conductive pattern(30) is transferring patterned on the other side of the adhesive sheet. A first adhesive layer(42) is attached on one side of the adhesive sheet to bury the first conductive pattern. A second adhesive layer(44) is attached on the other side of the adhesive sheet to bury the second conductive pattern. The first conductive pattern and the second conductive pattern include a seed layer(22) and a plating layer(24) plated on a surface of the seed layer. A first cover layer(46) and a second cover layer(48) are laminated on a surface of the first adhesive layer and the second adhesive layer, respectively.

Description

Multilayer flexible printed circuit board and its manufacturing method {MULTI LAYER FPCB AND MANUFACTING METHODS THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (FPCB), and more particularly, to a multilayer flexible printed circuit board laminated on both sides or a plurality by a transfer method and a method of manufacturing the same.

Recently, with the development of electronic components and component embedding technology, multilayer printed circuit boards which overlap circuit conductors have been continuously developed. The rapid development of semiconductor integrated circuits in the electronics industry has led to the development of surface-mounting technology that directly mounts small chips and their components. As electronic components become thinner and smaller, they are embedded in more complex and narrow spaces. It is necessary to make this easy.

In response to this demand, FPCBs are being developed. In particular, in the case of multi-layered FPCB, which is easy to stack and has high usage, due to the technical development of cameras, mobile phone batteries, printers, disk drives, small measuring instruments, LCDs, and medical devices, the use of the FPCB rapidly increases, and the technology development thereof And demands are increasing.

Conventionally, in order to manufacture a multilayer FPCB, copper foils on both sides were formed in a pattern using double-sided flexible copper clad laminate (FCCL) having copper foils attached to both sides of an insulating substrate.

Since the conventional double-sided FPCB using the double-sided FCCL to form a circuit pattern using a process for patterning copper, the overall thickness of the substrate is thickened with the problem of emitting a large amount of pollutants caused by copper pattern etching to form a high-density pattern There is a problem that is difficult to do, the manufacturing process is complicated, and the processing time is long.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer flexible printed circuit board and a method of manufacturing the same, which can simplify the manufacturing process by forming a conductive pattern using a transfer method and make a thin multilayered structure.

Another object of the present invention is to provide a multi-layer flexible printed circuit board and a method for manufacturing the same, which can minimize the amount of metal nanoparticles by performing inkjet patterning, thereby reducing manufacturing costs.

Multi-layer printed circuit board according to an embodiment of the present invention for achieving the above object is an adhesive sheet, a first conductive pattern transferred to one surface of the adhesive sheet, and a second conductive pattern transferred to the other surface of the adhesive sheet And a first adhesive layer attached to one surface of the adhesive sheet so that the first conductive pattern is buried, and a second adhesive layer attached to the other surface of the adhesive sheet so that the second conductive pattern is buried. can do.

The first conductive pattern and the second conductive pattern are manufactured by inkjet patterning, including a seed layer patterned on the surface of the substrate by conductive ink, and a plating layer plated on the surface of the seed layer.

In accordance with another aspect of the present invention, a method of manufacturing a multilayer printed circuit board includes transferring a first conductive pattern to one surface of an adhesive sheet, transferring a second conductive pattern to the other surface of the adhesive sheet, and performing the first conductive pattern. Compressing a first adhesive layer having a first cover layer laminated on one surface of the adhesive sheet so that the pattern is buried, and a second adhesive layer having a second cover layer laminated on the other surface of the adhesive sheet so that the second conductive pattern is buried Comprising the step of pressing.

The transferring of the first conductive pattern may include forming a first conductive pattern on the surface of the substrate, adhering the surface of the first conductive pattern to one surface of the adhesive sheet, and forming the first conductive pattern and the substrate. Separating between.

The forming of the first conductive pattern on the substrate may include forming a pattern using a conductive ink on the surface of the substrate and heat treating the pattern to form a seed layer, and plating a plating layer on the surface of the seed layer. do.

The separating between the first conductive pattern and the substrate may be performed by increasing the adhesive force between the adhesive sheet and the first conductive pattern as compared with the adhesive force between the substrate and the first conductive pattern to separate the substrate from the adhesive sheet. Characterized in that the first conductive pattern is transferred to one surface.

The transferring of the second conductive pattern may include forming a second conductive pattern on the surface of the substrate, removing the release paper attached to the other surface of the adhesive sheet, and then attaching the second conductive pattern to the other surface of the adhesive sheet. And separating the second conductive pattern from the substrate.

The first adhesive layer and the second adhesive layer may be pressurized while applying heat so that the first conductive pattern and the second conductive pattern are buried in the first adhesive layer and the second adhesive layer, respectively.

According to another exemplary embodiment, a multilayer printed circuit board includes an adhesive sheet, a first conductive pattern transferred to one surface of the adhesive sheet, and a second conductive pattern transferred to the other surface of the adhesive sheet, and are stacked at regular intervals. A plurality of adhesive layers stacked between the conductive pattern module and the plurality of conductive pattern modules, wherein the first conductive pattern and the second conductive patterns are buried, a first cover stacked on an upper adhesive layer, and a lower stacked adhesive layer 2 covers.

In another embodiment, a method of manufacturing a multilayer printed circuit board includes transferring a first conductive pattern to one surface of an adhesive sheet, and transferring a second conductive pattern to the other surface of the adhesive sheet to manufacture a plurality of conductive pattern modules. Disposing an adhesive layer between a plurality of conductive pattern modules, disposing an upper adhesive layer and a lower adhesive layer on which upper and lower cover layers are stacked, respectively, on top and bottom of the conductive pattern module; Embedding the first conductive patterns and the second conductive patterns by applying pressure and heat to the adhesive sheet.

Therefore, the multi-layer flexible printed circuit board of the present invention can transfer the first conductive pattern and the second conductive pattern on both sides of one adhesive sheet, thereby reducing the thickness and reducing the number of parts, thereby reducing the manufacturing cost. There is an effect that can simplify the manufacturing process.

In addition, the multilayer flexible printed circuit board of the present invention forms an electrically conductive pattern by performing inkjet patterning, thereby minimizing the amount of metal nanoparticles, thereby reducing manufacturing costs.

1 is a cross-sectional view of a multilayer flexible printed circuit board according to an exemplary embodiment of the present invention.
2 to 9 are cross-sectional views sequentially illustrating a manufacturing process of a multilayer flexible printed circuit board according to an exemplary embodiment of the present invention.
10 is a cross-sectional view of a multilayer flexible printed circuit board according to another exemplary embodiment of the present invention.
11 to 12 are cross-sectional views illustrating a manufacturing process of a multilayer flexible printed circuit board according to another exemplary embodiment of the present invention.

Hereinafter, a multilayer flexible printed circuit board and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of a flexible printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a flexible printed circuit board according to an embodiment may include an adhesive sheet 10, a first conductive pattern 20 transferred to one surface of the adhesive sheet 10, and a second surface of the adhesive sheet 10. The second conductive pattern 30 to be transferred, the first adhesive layer 42 attached to one surface of the adhesive sheet 10 so that the first conductive pattern 20 is buried, and the second conductive pattern 20 are buried together And a second adhesive layer 44 attached to the other surface of the sheet 10.

The first conductive pattern 20 and the second conductive pattern 30 may include a seed layer 22 in which conductive ink is patterned on a surface of a substrate by an inkjet patterning method, and a plating layer 24 plated on a surface of the seed layer 22. It includes.

Here, the seed layer 22 may be a seed role for forming the plating layer 24, so that the thickness of the seed layer 22 is sufficient to be a thin thickness of 1 μm or less.

In addition to the copper, the plating layer 24 may use any one of conductive metals such as Au, Ag, Al, Ni, and Sn, and the plating method is performed by wet plating.

On the surfaces of the first adhesive layer 42 and the second adhesive layer 44, a first cover layer 46 which protects the first adhesive layer 42 and the second adhesive layer 44 and serves as an outer cover when the product is finished, and The second cover layers 48 are stacked, respectively.

Here, the first conductive pattern 20 is buried in the first adhesive layer 42, and the second conductive pattern 30 is buried in the second adhesive layer 44 to be protected.

Here, an insulating layer may be coated instead of the first cover layer 46 provided with the first adhesive layer 42 and the second cover layer 48 provided with the second adhesive layer 44. As the insulating layer, PSR (Photo Solder Resist) or PSI may be used.

2 to 9 are cross-sectional views sequentially showing a double-sided FPCB manufacturing process according to an embodiment of the present invention.

First, the first conductive pattern 20 is formed on one surface of the substrate 50.

The substrate 50 is formed of a transparent glass substrate, a flexible plastic substrate, or an opaque insulating substrate, for example, a polyimide film. Here, the thickness of the substrate 50 is preferably 8 μm to 1 mm.

The first conductive pattern 20 includes a seed layer 22 patterned on the surface of the substrate 50 by an inkjet printing method, and a plating layer 24 plated on the surface of the seed layer 22.

First, referring to the process of patterning the seed layer 22, as shown in FIG. 2, the electronic ink 52 made of metal nanoparticles, for example, silver nanoparticles, is formed on the substrate 50. Ejected from the nozzle (not shown) and stacked on the substrate 50 in a predetermined pattern to perform inkjet patterning.

At this time, the stacking thickness of the electronic ink 52 (that is, the thickness of the seed layer 22 to be a seed metal layer later) may be determined by the size of the opening of the nozzle, the opening / closing degree of the valve, the viscosity of the electronic ink 52, the print head ( 54) and the speed of the movement. By appropriately controlling these elements, a seed layer 22 of desired thickness or size is formed. In this case, the seed layer 22 may be a seed for plating in the future, so that the thickness of the seed layer 22 is sufficient to be 1 μm or less.

Then, curing is performed to remove the solvent component in the seed layer 22 and to sinter the nano metal powder. Curing is typically accomplished by heating or irradiating the patterned seed layer 22 below 200 ° C., wherein the amount of heat or light applied is the viscosity of the electronic ink in the seed layer 22 or the stacked seed layer. And the thickness of (22). The seed layer 22 is deposited on the substrate 50 with the solvent component removed by curing, wherein the seed layer 22 becomes a seed metal layer for plating.

The plating layer 24 is plated to be wrapped around the surface of the seed layer 22, as shown in FIG. That is, the seed layer 22 is surrounded by the plating layer on both sides and the top surface except for one surface of the substrate 50 attached.

The plating layer 24 is formed of a copper plating layer, for example. Here, in addition to copper, the plating layer 24 may use any one of conductive metals such as Au, Ag, Al, Ni, and Sn, and the plating method is performed by wet plating.

After the seed layer 22 is formed, a photosensitive film such as a photoresist may be patterned between the seed layers 22. The photoresist film is to prevent the plating layer 24 from growing laterally on the seed layer 22 to realize a more precise pattern. Therefore, it is preferable that the thickness of the photoresist film is thicker than or equal to the thickness of the seed layer 22 and the thickness of the plating layer 24.

Then, after plating the plating layer 24 to a predetermined thickness and size on the surface of the seed layer 22 except for the photoresist region, the photoresist layer may be removed.

When the process of forming the first conductive pattern 20 on the surface of the substrate 50 is completed, the first conductive pattern 20 is transferred to one surface of the adhesive sheet 10.

Looking at the process of transferring the first conductive pattern 20 to the adhesive sheet 10, first, as shown in Figure 4, the adhesive sheet (the adhesive sheet (S) on the surface of the first conductive pattern 20 attached to the substrate 50 10).

 Then, when a predetermined amount of heat is applied to one surface of the adhesive sheet 10 for a predetermined time, the first conductive pattern 20 is adhered to the adhesive sheet 10.

In this state, when the substrate 50 is separated, as illustrated in FIG. 5, the first conductive pattern 20 is transferred to one surface of the adhesive sheet 10.

That is, when the first conductive pattern 20 is adhered to one surface of the adhesive sheet 10 and then the substrate 50 is separated, the first conductive pattern is compared with the adhesive force between the first conductive pattern 20 and the substrate 50. Since the adhesive force between the 20 and the adhesive sheet 10 is strong, the first conductive pattern 20 is separated from the substrate 50 and adhered to the adhesive sheet 10.

Here, the adhesive sheet 10 is preferably used to maintain the solid state at room temperature and the adhesive is generated while the melt is applied when a certain amount of heat is applied.

Since the other surface of the adhesive sheet 10 is protected by the release paper 12, even if one surface of the adhesive sheet 10 is melted by applying heat to the adhesive sheet 10, the other surface of the adhesive sheet 10 is not melted.

When the process of transferring the first conductive pattern 20 to one surface of the adhesive sheet 10 is completed by performing the above process, the above process is repeated in the same manner so that the second conductive pattern 30 is attached to the adhesive sheet 10. Perform the process of transferring to the other side of the.

That is, as shown in FIG. 6, the second conductive pattern 30 is formed on the surface of the substrate 50.

A pattern is formed on the surface of the substrate 50 by using conductive ink, and the pattern is heat-treated to form the seed layer 32, and the plating layer 34 is plated on the surface of the seed layer 32 to form the seed layer 32. The second conductive pattern 30 is formed on the surface.

Here, the process of making the seed layer 32 and the process of plating the plating layer 34 are the same as the process of forming the first conductive pattern 20 described above on the substrate 50, and thus a detailed description thereof will be omitted.

Referring to the process of transferring the second conductive pattern 30 to the adhesive sheet 10, as shown in FIG. 7, the release paper 12 attached to the other surface of the adhesive sheet 10 is removed and the adhesive sheet 10 is removed. The second conductive pattern 30 is adhered to the other surface of the adhesive sheet 10 by applying a predetermined heat to the other surface of the adhesive sheet 10.

In this state, as shown in FIG. 8, when the adhesive sheet 10 is separated from the substrate 50, the second conductive pattern 30 is transferred to the other surface of the adhesive sheet 10.

As such, since the first conductive pattern 20 and the second conductive pattern 30 can be transferred to both surfaces of the adhesive sheet 10, the thickness of the FPCB can be reduced and the manufacturing cost can be reduced accordingly. .

9, the first adhesive layer 42 having the first cover layer 46 stacked thereon is attached to one surface of the adhesive sheet 10, and the second cover layer is attached to the other surface of the adhesive sheet 10. The second adhesive layer 44 on which 48 is laminated is attached.

Then, when the set heat is applied while pressing the first cover layer 46 and the second cover layer 48 for a predetermined time, the first adhesive layer 42 is melted and adhered to the adhesive sheet 10, and the first The first conductive pattern 20 is embedded in the adhesive layer 42. The second adhesive layer 44 is melted and adhered to the adhesive sheet 10, and the second conductive pattern 30 is buried inside the second adhesive layer 44.

Here, it is preferable that the first adhesive layer 42 and the second adhesive layer 44 maintain a solid state at room temperature and use an adhesive that generates adhesive force while melting when heat is applied to a predetermined level or more.

At this time, the adhesive sheet 10 has a different melting temperature with the first adhesive layer 42 and the second adhesive layer 44, even if the first adhesive layer 42 and the second adhesive layer 44 are melted, the adhesive sheet 10. Does not melt.

The double-sided FPCB, which has been completed by the manufacturing process, has the first conductive pattern 20 and the second conductive pattern 30 disposed on both sides of the adhesive sheet 10, respectively, so that the two conductive patterns 20 are formed on the single adhesive sheet 10. 30 can be disposed to reduce the thickness and to reduce the manufacturing cost by minimizing the number of parts.

In addition, the first conductive pattern 20 and the second conductive pattern 30 are completely buried in the first adhesive layer 42, the second adhesive layer 44, and the adhesive sheet 10 by using a transfer method. It can be more completely protected to prevent damage to the conductive pattern and improve the contact performance of the plating layer.

In addition, the first cover layer 46 and the second cover layer 48 may be disposed on both sides of the FPCB to protect the FPCB from impact from the outside.

In addition, since the conductive pattern is formed on the adhesive sheet using a transfer method, the adhesiveness may be improved and the manufacturing process may be simplified.

10 is a cross-sectional view of a multilayer flexible printed circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 10, the multilayer flexible printed circuit board according to another exemplary embodiment includes a plurality of conductive pattern modules 60 and 62 and conductive patterns 90 and 100 formed on both surfaces thereof and arranged at regular intervals, and the conductive pattern module 60. A plurality of adhesive layers 80 stacked between the layers 62 and the first cover layer 72 are stacked, and an upper adhesive layer 72 and a second cover layer 78 are stacked on the conductive pattern module. A lower adhesive layer 74 is attached to the lower side of the conductive pattern module.

The conductive pattern modules 60 and 62 may include an adhesive sheet 82, a first conductive pattern 90 transferred to one surface of the adhesive sheet 82, and a second conductive pattern transferred to the other surface of the adhesive sheet 82. 100).

The first conductive pattern 90 and the second conductive pattern 100 are seed layers 92 and 102 in which conductive ink is patterned on a surface of a substrate by an inkjet patterning method, and plating layers 94 and 104 plated on surfaces of the seed layers 92 and 102. It includes. The structures of the seed layers 92 and 102 and the plating layers 94 and 104 are the same as those of the seed layers 22 and 32 and the plating layers 24 and 34 described in the above embodiment, and thus detailed description thereof will be omitted.

As described above, in the multilayer flexible printed circuit board according to another embodiment, a plurality of conductive pattern modules 60 and 62 are made by using a transfer method, and an adhesive layer 80 is disposed between the conductive pattern modules 60 and 62. When heat and pressure are applied, conductive patterns are embedded in the adhesive layer 80 and have a stacked structure at a predetermined interval.

Next, a method of manufacturing a multilayer flexible printed circuit board according to another exemplary embodiment configured as described above will be described.

11 and 12 are cross-sectional views illustrating a manufacturing process of a multilayer flexible printed circuit board according to another exemplary embodiment of the present invention.

First, as shown in FIG. 11, the first conductive pattern module 60 and the second conductive pattern module 62 are manufactured.

The first conductive pattern module 60 and the second conductive pattern module 62 have the same structure. The first conductive pattern 90 is transferred to one surface of the adhesive sheet 82, and the first conductive pattern module 60 and the second conductive pattern module 62 are formed on the other surface of the adhesive sheet 82. The first conductive pattern 90 and the second conductive pattern 100 are bonded to both surfaces of the adhesive sheet 82 by transferring the two conductive patterns 100.

The manufacturing method of the first conductive pattern module 60 and the second conductive pattern module 62 may include the first conductive pattern 20 and the second conductive pattern on both surfaces of the adhesive sheet 10 described in the above embodiment. 30) is the same as the method for transferring the detailed description thereof will be omitted.

Here, the third conductive pattern module and the fourth conductive pattern module may be further prepared according to the number of stacked conductive patterns.

As shown in FIG. 12, the adhesive layer 80 is disposed between the first conductive pattern module 60 and the second conductive pattern module 62, and the first conductive pattern module 60 is disposed outside the first conductive pattern module 60. The upper adhesive layer 72 in which the cover layer 76 is stacked is disposed, and the lower adhesive layer 74 in which the second cover layer 78 is stacked is disposed outside the second conductive pattern module 62.

In this state, when heat is applied for a predetermined time while applying pressure through the first cover layer 76 and the second cover layer 78, the upper adhesive layer 72 adheres to the first conductive pattern module 60. The first conductive pattern 90 of the first conductive pattern module 60 is buried in the upper adhesive layer 72, and adhered to one surface of the sheet 82.

In addition, the adhesive layer 80 is adhered to the other surface of the adhesive sheet 82 of the first conductive pattern module 60, and the second conductive pattern 100 of the first conductive pattern module 60 is bonded to the inside of the adhesive layer 80. Buried.

The adhesive layer 80 is adhered to the other surface of the adhesive sheet 82 of the second conductive pattern module 62, and the second conductive pattern 100 of the second conductive pattern module 62 is bonded to the inside of the adhesive layer 80. Buried.

The lower adhesive layer 74 is attached to one surface of the adhesive sheet 82 of the second conductive pattern module 62, and the first conductive pattern 90 of the second conductive pattern module 62 is attached to the lower adhesive layer 74. It is buried inside.

As such, in the multilayer flexible printed circuit board according to another exemplary embodiment of the present invention, since one adhesive layer 80 is disposed between the conductive pattern module 60 and the conductive pattern module 62, the thickness of the product may be greatly reduced. .

In addition, the conductive patterns 90 and 100 stacked in plurality may be completely buried in the upper adhesive layer 72, the lower adhesive layer 74, and the adhesive layer 80, and the adhesive sheet 82. Therefore, it is possible to prevent damage to the conductive pattern and to improve the contact performance of the plating layer.

The double-sided FPCB using the transfer method of the present invention, the multilayer FPCB using the same, and a manufacturing method thereof may be used for various substrates including RFID tags, FPCB, FCCL, and ceramic circuit boards.

10: adhesive sheet 20: first conductive pattern
22: seed layer 24: plating layer
30: second conductive pattern 32: seed layer
34: plating layer 42: first adhesive layer
44: first adhesive layer 46: first cover layer
48: second cover layer 50: substrate

Claims (16)

Adhesive sheet;
A first conductive pattern transferred to one surface of the adhesive sheet;
A second conductive pattern transferred to the other surface of the adhesive sheet;
A first cover layer attached to one surface of the adhesive sheet so that the first conductive pattern is buried; And
And a second cover layer attached to the other surface of the adhesive sheet so that the second conductive pattern is buried. The method of claim 1,
The first conductive pattern and the second conductive pattern are seed layers patterned on the surface of the substrate by a conductive ink,
A multilayer flexible printed circuit board comprising a plating layer plated on a surface of the seed layer. The method of claim 2,
The plating layer is a multilayer flexible printed circuit board, characterized in that any one of a conductive metal of Cu, Au, Ag, Al, Ni, Sn. Transferring the first conductive pattern to one surface of the adhesive sheet;
Transferring a second conductive pattern to the other surface of the adhesive sheet;
Pressing a first cover layer having a first adhesive layer on one surface of the adhesive sheet so that the first conductive pattern is buried; And
And compressing a second cover layer having a second adhesive layer on the other surface of the adhesive sheet so that the second conductive pattern is buried. 5. The method of claim 4,
The transferring of the first conductive pattern may include forming a first conductive pattern on a surface of the substrate;
Adhering to one surface of the adhesive sheet on a surface of the first conductive pattern; And
Method of manufacturing a multi-layer flexible printed circuit board comprising the step of separating between the first conductive pattern and the substrate. The method of claim 5,
The forming of the first conductive pattern on the substrate may include forming a pattern using a conductive ink on a surface of the substrate and heat treating the pattern to form a seed layer; And
The method of manufacturing a multilayer flexible printed circuit board comprising the step of plating a plating layer on the surface of the seed layer. The method of claim 5,
The forming of the first conductive pattern on the substrate may include forming a pattern using a conductive ink on a surface of the substrate and heat treating the pattern to form a seed layer;
Patterning a photoresist on the seed layer;
Plating a plating layer on a surface of the seed layer except for the photosensitive film; And
The method of manufacturing a multilayer flexible printed circuit board comprising the step of removing the photosensitive film. The method of claim 5,
The separating between the first conductive pattern and the substrate may be performed by increasing the adhesive force between the adhesive sheet and the first conductive pattern as compared with the adhesive force between the substrate and the first conductive pattern to separate the substrate from the adhesive sheet. The method of manufacturing a multilayer flexible printed circuit board, characterized in that the first conductive pattern is transferred to one surface. 5. The method of claim 4,
The transferring of the second conductive pattern may include forming a second conductive pattern on a surface of the substrate;
Removing the release paper attached to the other surface of the adhesive sheet and then attaching the second conductive pattern to the other surface of the adhesive sheet; And
Method of manufacturing a multi-layer flexible printed circuit board comprising the step of separating between the second conductive pattern and the substrate. 5. The method of claim 4,
The first adhesive layer and the second adhesive layer is pressurized while applying heat so that the first conductive pattern and the second conductive pattern are buried in the first adhesive layer and the second adhesive layer, respectively. . A plurality of conductive pattern modules including an adhesive sheet, a first conductive pattern transferred to one surface of the adhesive sheet, and a second conductive pattern transferred to the other surface of the adhesive sheet, and stacked at regular intervals;
One or more adhesive layers attached between the plurality of conductive pattern modules;
A first cover layer attached to an uppermost end of the plurality of conductive pattern modules and having an upper adhesive layer; And
And a second cover layer attached to a lowermost end of the plurality of conductive pattern modules and having a lower adhesive layer. The method of claim 11,
The first conductive pattern and the second conductive pattern are seed layers patterned on the surface of the substrate by a conductive ink,
A multilayer flexible printed circuit board comprising a plating layer plated on a surface of the seed layer. The method of claim 11,
The plating layer is a multilayer flexible printed circuit board, characterized in that any one of a conductive metal of Cu, Au, Ag, Al, Ni, Sn. Manufacturing a plurality of conductive pattern modules by transferring a first conductive pattern to one surface of the adhesive sheet and a second conductive pattern to the other surface of the adhesive sheet;
Disposing an adhesive layer between the plurality of conductive pattern modules;
Disposing an upper adhesive layer and a lower adhesive layer having a first cover layer and a second cover layer, respectively, on top and bottom of the conductive pattern module;
And embedding the first conductive patterns and the second conductive patterns by applying pressure and heat to the adhesive layer and the adhesive sheet. 15. The method of claim 14,
The manufacturing of the conductive pattern module may include forming a first conductive pattern on a surface of a substrate;
Forming a second conductive pattern on the surface of the substrate;
Adhering to one surface of the adhesive sheet on a surface of the first conductive pattern;
Adhering the other surface of the adhesive sheet to a surface of the second conductive pattern; And
And separating the first conductive pattern and the substrate from each other and between the second conductive pattern and the other substrate. 16. The method of claim 15,
The forming of the first conductive pattern on the substrate may include forming a pattern using a conductive ink on a surface of the substrate and heat treating the pattern to form a seed layer; And
And plating a plating layer on the surface of the seed layer.
KR1020110048733A 2010-12-03 2011-05-23 Multi layer fpcb and manufacting methods thereof KR20120130638A (en)

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Application Number Priority Date Filing Date Title
KR1020110048733A KR20120130638A (en) 2011-05-23 2011-05-23 Multi layer fpcb and manufacting methods thereof
PCT/KR2011/009356 WO2012074345A2 (en) 2010-12-03 2011-12-05 Flexible printed circuit board and a production method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110048733A KR20120130638A (en) 2011-05-23 2011-05-23 Multi layer fpcb and manufacting methods thereof

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US11256377B2 (en) 2020-04-06 2022-02-22 Samsung Display Co., Ltd. Display device

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* Cited by examiner, † Cited by third party
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US11256377B2 (en) 2020-04-06 2022-02-22 Samsung Display Co., Ltd. Display device

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