KR20120127242A - Semiconductor inspection apparatus - Google Patents

Abstract

PURPOSE: A semiconductor inspection apparatus is provided to measure quantity of light in a state that is near to real specification by easily treating contact side radiation and contact rear side radiation. CONSTITUTION: An index table(2) moves a plurality of stages(21). A socket(6) is mounted on the stage. The socket supplies a predetermined voltage to each terminal of a plurality of LED element chips(5). A peaker(71) transfers the plurality of LED element chips to each socket on the stage. Peakers(72,73) transfer the LED device chips within the socket to a separate sheet according to inspection results. [Reference numerals] (81) Good quality product; (82) Defective product

Description

Semiconductor inspection device {SEMICONDUCTOR INSPECTION APPARATUS}

TECHNICAL FIELD This invention relates to the semiconductor test | inspection apparatus which inspects the amount of emitted light, etc. with respect to test | inspection target devices, such as LSI element, light emitting elements, such as an LED element and a laser element.

Conventionally, inspection of light emitting elements, such as LED elements and laser elements, includes DC inspection, light quantity inspection, and ESD inspection, for example, but light quantity inspection, for example, mixes light from adjacent light emitting elements, and can perform an accurate inspection. Since there was no, each device chip was implemented. After the element chip is separated, the pressure-sensitive adhesive sheet is stretched to form a gap between the element and the adjacent element, and the light quantity inspection is performed by bringing a probe into contact with each terminal of each element chip. In this manner, the periphery of the LED element is stretched to form a gap between the element and the adjacent element after the wafer is separated, and the light quantity measurement of the LED element is performed by probing each element chip from the upper surface in the sheet state. .

It is a schematic diagram for demonstrating the light quantity inspection method by the conventional semiconductor inspection apparatus.

As shown in FIG. 7, in the light quantity inspection method by the conventional semiconductor inspection apparatus 100, a plurality of semiconductor wafers 102 formed on a pressure-sensitive adhesive sheet 101 and formed a gap between an element and an adjacent element are formed. With each LED element chip 103 in the adhesive sheet state of the adhesive sheet 101, the respective probes 104 and 104 are dropped from above and each probe 104 to each terminal 103a and 103b of the LED element chip 103. , 104). Subsequently, a predetermined voltage is applied between each of the probes 104 and 104 to emit light, the light quantity is examined, and the same operation is repeated by moving to the adjacent element. Moreover, it picks up each chip | tip from the adhesive sheet 101, and positions it in a predetermined position. Next, the respective probes 104 and 104 are dropped from above with the positioned LED element chip 103 interposed therebetween, and the respective probes 104 and 104 to the respective terminals 103a and 103b of the LED element chip 103. ). Subsequently, a predetermined voltage is applied between each of the probes 104 and 104 to emit light to perform light quantity inspection. Then, the LED element chip is affixed on another adhesive sheet.

Next, Patent Literature 1 discloses an apparatus in which the adhesive sheet itself is provided with an electrode to enable back contact of the LED element chip.

FIG. 8: is a principal part longitudinal cross-sectional view for demonstrating the inspection method by the conventional semiconductor inspection apparatus disclosed by patent document 1. As shown in FIG.

In FIG. 8, in the conventional semiconductor inspection apparatus 200, the conductive adhesive sheet 202 is formed on the back surface 201a of the light emitting device chip 201 in a wafer in which a plurality of light emitting device chips 201 are formed by a wafer process. ), The wafer is divided, the conductive adhesive sheet 202 is extended, and the light emitting device chips 201 are separated. The lead 204 of the tester 203 is connected to the conductive adhesive sheet 202. The mobile light source 208 including the probe electrode 205, the optical path changing unit 206, and the light receiving element 207 is brought close to the separated light emitting device chip 201. The upper electrode 209 of the light emitting element chip 201 is pressed against the tip of the probe electrode 205 wired to the tester 203, and a driving current is supplied from the tester 203 through the probe electrode 205 to the upper electrode ( 209 flows to make the light emitting element chip 201 emit light. The light emitted laterally from the end face of the light emitting element chip 201 is received by the light receiving element 207 as the upward direction light in the optical path changing section 206. Further, the branched light from the optical path changing unit 206 is put into the spectrum analyzer 210 and the emission spectrum is irradiated. Thereafter, the movable stage 208 is lifted up, and the conductive stage 211 is moved laterally, and the inspection of the next light emitting element chip 201 is sequentially performed on the conductive adhesive sheet 202. Thereby, the frequency | count of chip conveyance is reduced, the conveyance system is simplified, the time and trouble with conveyance are reduced, and the possibility of the chip damage accompanying conveyance is reduced.

Japanese Laid-Open Patent Publication No. 2008-2858

In the said conventional semiconductor inspection apparatus 100, as shown in FIG. 7, it contacted with the probe 104, performing x-y- (theta) correction of the LED element chip 103 on the adhesive sheet 101. As shown in FIG. For this reason, since each LED element chip 103 formed in the semiconductor wafer 102 is sequentially inspected in the state which needs time of alignment and the adhesive sheet 101 is tensioned, LED element chip 103 According to the arrangement misalignment, there is a problem that the probe 104 cannot be contacted. In addition, since each LED element chip 103 formed in large number on the semiconductor wafer 102 was measured one by one, a long inspection time was required.

The light emitted from the LED element chip 103 is irradiated not only to the upper side but also to the lower side of the adhesive sheet 101. Even if the adhesive sheet 101 absorbs the light and measures the amount of light from the upper side, accurate light quantity inspection is performed. Can not. Usually, the reflecting plate is formed in the adhesive sheet 101 side, and the light irradiated downward from the LED element chip 103 is directed toward the front.

Next, in the conventional semiconductor inspection apparatus 200 disclosed in Patent Document 1, as shown in FIG. 8, although the electrode is provided on the adhesive sheet 202 itself, the backside contact is made possible, but the LED In the case of the element, since it is based on sapphire glass, it was very difficult to form an electrode in the back surface 201a of the light emitting element chip 201, such as shaving thinly by grinding of sapphire glass.

In addition, in the contact of the probe electrode 205 and the upper electrode 209 in a sheet state, in the case of measuring a large current chip, the adhesive sheet 202 is likely to be released by heat generation. At this time, the sheet temperature may be 200 degrees Celsius or more.

In addition, in the sheet state of the prior art, contact backside light emission (flip chip) is not supported, and in the existing apparatus, since the optical system is measured through the adhesive sheet 202, accurate measurement cannot be performed at all.

In addition, in the case of measuring the amount of emitted light in the sheet state, since the light emission is disturbed depending on the distance from the adjacent chip, the accurate amount of emitted light cannot be measured. In addition, when the adhesive sheet 202 is interposed, the reflected light from the back surface cannot be taken, resulting in an environmental measurement different from the actual specification.

In the sheet system, since the LED element chip 201 is inspected in the state where the adhesive sheet 202 is tensioned, θ shift due to the tension of the adhesive sheet 202 occurs in each LED element chip 201. There was a problem.

This invention solves the said conventional problem, The problem by the miss contact by the misalignment which arises at the time of light quantity inspection of the light emitting element in the state which tensioned the adhesive sheet, The problem of long test time, The back surface terminal preparation It is an object of the present invention to provide a semiconductor inspection apparatus that can solve the problem of heat generation, the problem of heat generation, and the problem of backside light emission, and can efficiently perform a more accurate light quantity inspection in accordance with actual specifications.

A semiconductor inspection apparatus of the present invention includes a plurality of stages formed with index table means for moving the plurality of stages, and inspection means for mounting a plurality of semiconductor chips in the plurality of stages and inspecting the plurality of semiconductor chips. The above object is thereby achieved.

Furthermore, it is preferable to further have a socket means mounted on the stage in the semiconductor inspection device of the present invention, the semiconductor chip being housed therein to enable energization.

Preferably, the socket means in the semiconductor inspection apparatus of the present invention is configured to be electrically connected to each terminal on the upper or lower surface of the semiconductor chip.

Preferably, in the semiconductor inspection apparatus of the present invention, among the plurality of semiconductor chips after the semiconductor wafer is separated into pieces, a plurality of semiconductor chips having fewer fewer than this are among the plurality of stages of the index table, which have fewer stages than this. It further has a 1st conveying means to convey to.

Preferably, the semiconductor chip in the semiconductor inspection apparatus of the present invention is a light emitting element chip, and the inspection means performs optical inspection and DC characteristic inspection of the light emitting element chip.

Preferably, in the socket means in the semiconductor inspection apparatus of the present invention, a reflecting plate is formed on the mounting surface of the semiconductor chip.

Preferably, in the socket means in the semiconductor inspection apparatus of the present invention, the peripheral portion of the semiconductor chip is opened or a light transmitting material is formed in the peripheral portion thereof.

Moreover, Preferably, it further has a 2nd transfer means which transfers the semiconductor chip in the socket means after the inspection in the semiconductor inspection apparatus of this invention to a separate sheet according to an inspection result.

Further, preferably, the first transfer means and the second transfer means in the semiconductor inspection apparatus of the present invention, when collectively transferring a plurality of semiconductor chips, the transfer destination and the transfer source. The pick-up pitches of the plurality of semiconductor chips are different.

Further, preferably, the socket means in the semiconductor inspection device of the present invention has a positioning mechanism for positioning the semiconductor chip therein.

Preferably, the inspection means in the semiconductor inspection device of the present invention has predetermined respective measurement functions at each stage of the index table means.

In addition, preferably, all the inspection means formed in each stage of the index table means in the semiconductor inspection device of the present invention are simultaneously driven and inspected at the same time.

Moreover, Preferably, the socket means in the semiconductor inspection apparatus of this invention opens and closes by a socket cover opening / closing mechanism.

Preferably, the index table means in the semiconductor inspection apparatus of the present invention preferably has a triangular shape, a square shape, a polygonal shape, a polygonal shape, and a semicircle with rounded corners, in addition to a circular shape, an ellipse shape, and a rectangular shape when the external shape is viewed in a plane. The shape is either one or a plurality of straight lines.

Further, preferably, the index table means in the semiconductor inspection apparatus of the present invention has a portion of which the stage is arranged in a straight line.

Moreover, Preferably, the index table means in the semiconductor inspection apparatus of this invention is arrange | positioned in the vicinity of the arrangement | positioning vicinity of the arrangement position of the some semiconductor chip which is the inspection target of the individualized semiconductor wafer.

With the above arrangement, the operation of the present invention will be described below.

In the present invention, a plurality of stages are formed, and index table means for moving the plurality of stages, and inspection means for mounting a plurality of semiconductor chips in the plurality of stages and inspecting the plurality of semiconductor chips.

As a result, instead of inspecting the adhesive sheet directly in the tensioned state, the inspection is performed through the index table means, so that the damage occurring during the light quantity inspection of the light emitting element in the tensioned state of the adhesive sheet is improved. For example, it solves the problem of miscontact due to misalignment, the problem of long inspection time, the problem of terminal backside fabrication and the heat generation, and the problem of backside light emission. It can be carried out by.

As described above, according to the present invention, a plurality of pieces can be simultaneously measured by the index method in a state where there is no chip shift. In addition, by employing the index table, the number of simultaneous measurements can be increased by arranging the DC characteristic test, the optical system test (integration sphere), and the number of installations thereof arbitrarily.

In addition, because of the socket system, the measurement can be performed without problems of heat generation and light shielding, and it is possible to easily cope with light emission on the contact surface and light emission on the back surface of the contact, so that the measurement can be performed in a state close to the actual specification.

As described above, problems caused by mis-contact due to misalignment occurring during light quantity inspection of the light emitting element in the state where the pressure-sensitive adhesive sheet is tensioned, problems of long inspection time, problems of device backside terminal production and heat generation, and back light emission In addition to solving the problem, more accurate light quantity inspection that meets the actual specifications can be efficiently performed.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram for demonstrating the semiconductor inspection method using the semiconductor inspection apparatus in Embodiment 1 of this invention.
(A) is a top view of the index table of FIG. 1 at the time of performing a 1st light quantity test and a 1st DC characteristic test, (b) is a 2nd after a 1st light quantity test and a 1st DC characteristic test. It is a top view of the index table of FIG. 1 at the time of performing a light quantity test and a 2nd DC characteristic test, (c)? (e) is a perspective view which shows typically each example of the socket of FIG.
(A) of FIG. (c) is a longitudinal cross-sectional view for demonstrating the positioning mechanism of the socket of FIG. 1 with respect to an LED element chip.
FIG. 4 is a side view illustrating the socket lid opening mechanism used in the semiconductor inspection device of FIG. 1. FIG.
FIG. 5 is a side view illustrating the socket lid pressing mechanism used in the semiconductor inspection device of FIG. 1. FIG.
FIG. 6: is a schematic diagram for demonstrating the semiconductor inspection method using the semiconductor inspection apparatus in Embodiment 2 of this invention.
It is a schematic diagram for demonstrating the light quantity inspection method by the conventional semiconductor inspection apparatus.
FIG. 8: is a principal part longitudinal cross-sectional view for demonstrating the inspection method by the conventional semiconductor inspection apparatus disclosed by patent document 1. As shown in FIG.

EMBODIMENT OF THE INVENTION Below, Embodiment 1, 2 of the semiconductor inspection apparatus of this invention is described in detail, referring drawings. In addition, each thickness, length, etc. of the structural member in each drawing are not limited to the structure shown from a viewpoint of drawing creation.

(Embodiment 1)

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram for demonstrating the semiconductor inspection method using the semiconductor inspection apparatus in Embodiment 1 of this invention.

In FIG. 1, the semiconductor inspection apparatus 1 of this Embodiment 1 has the index table 2 as a circular index table means in which the some stage 21 is formed and moves the some stage 21, and And a plurality of LEDs after separating the semiconductor wafer 4 and the socket 6 as a socket means mounted on the stage 21 and the LED element chip 5 as a semiconductor chip is housed therein and is capable of conducting electricity. One or more LED element chips 5 of the element chips 5 are smaller than this, and each socket on one or more stages 21 of the plurality of stages 21 of the index table 2 is smaller than this. Inspection means for inspecting the plurality of LED element chips 5 by mounting the plurality of LED element chips 5 in the picker 71 as the first transfer means to be transferred to the plurality of stages 21 and the plurality of stages 21 (not shown). (Omitted) and the LED element chip 5 in the socket 6 after the inspection. ) Has pickers 72 and 73 as second conveying means for conveying the sheet on a separate sheet according to the inspection result.

The index table 2 is a circular rotary table viewed in a plane in which a plurality of stages 21 are formed at equal intervals. The index table 2 rotates by one stage 21, and is mounted on each stage 21 so that the socket 6 can be freely detached.

The socket 6 sequentially positions and positions each LED element chip 5 formed on the semiconductor wafer 4 separated into pieces on the adhesive sheet 3, and is positioned at each terminal of the LED element chip 5. It is possible to apply a predetermined voltage. Thus, since the socket 6 has the positioning mechanism which positions the LED element chip 5 inside, it is comprised so that it may respond even if a chip size changes. The socket 6 opens and closes with the socket cover opening and closing mechanism mentioned later in detail.

The picker 71 sets the LED element chip 5 on the adhesive sheet 3 into the socket 6. The picker 71 picks up and pulls out the LED element chip 5 on the adhesive sheet 3 by suction, etc., and mounts the LED element chip 5 in the socket 6. The picker 72 transfers the LED element chip 5 in the socket 6 to the good sheet 81. The picker 73 transfers the LED element chip 5 in the socket 6 to the defective sheet 82. In the pickers 71 to 73, when transferring a plurality of LED element chips 5 in addition to the case of transferring one LED element chip 5, a plurality of LED elements of the transfer destination and the transfer source. The pick-up pitch of the chip 5 is different.

The inspection means performs optical inspection (for example, the integrating spheres 91 and 92 of the light quantity inspection), the DC characteristic inspection, and the like of the LED element chip 5 as the light emitting element chip. Inspection means having predetermined respective measurement functions is mounted in each stage 21 of the index table 2. In addition, all or more inspection means formed in each stage 21 of the index table 2 are driven separately or simultaneously and inspected separately or simultaneously.

FIG. 2 (a) is a plan view of the index table of FIG. 1 in the case of performing the first light quantity test and the first DC characteristic test, and FIG. 2 is a plan view of the index table in FIG. 1 when the light quantity inspection and the second DC characteristic inspection are performed, and FIG. 2 (c)? FIG. 2E is a perspective view schematically showing each example of the socket 6 of FIG. 1.

As shown to Fig.2 (a), after first taking out the LED element chip 5 on the adhesive sheet 3 with the picker 71, and placing the taken out LED element chip 5 in the socket 6, Close the cover 61 of the socket 6. Next, the index table 2 rises after rotating by one stage and coalesces the upper opening of the socket 6 in the lower opening of the integrating sphere 91 to the LED element chip 5 in the socket 6. The amount of light that has been energized and emitted is accurately measured by the integrating sphere 91. Subsequently, after moving downward with the socket 6 on the stage 21 and releasing the union of the lower opening of the integrating sphere 91 and the window portion 62 of the socket 6, the index table 2 is removed. It rotates by one stage and performs DC characteristic test | inspection which measures the electric current value etc. which flows when the predetermined voltage is applied to the LED element chip 5 in the socket 6. As shown in FIG.

Then, after the index table 2 is rotated by one stage, the cover of the socket 6 is opened, and the LED element chip 5 is a good product in the first light quantity inspection and the first DC characteristic inspection. The LED element chip 5 is taken out from the inside by the picker 72 and is transferred to the predetermined position of the good sheet 81. In addition, after the index table 2 is rotated further by one stage, in the picker 73 when the LED element chip 5 is defective in at least one of the first light quantity inspection and the first DC characteristic inspection. As a result, the LED element chip 5 is taken out from the inside, and is divided into defective items at a predetermined position of the defective article sheet 82 and placed thereon.

Thus, the optical system measuring stage (light quantity test) and the electrical property test stage (DC characteristic test) are formed in the arbitrary stage 21 of the index table 2, and it has a mechanism which can easily increase or decrease the number of simultaneous measurements. have. In addition, in FIG.2 (b), the 2nd light quantity test and the 2nd DC characteristic test are shown after the above-mentioned 1st light quantity test and 1st DC characteristic test.

Next, each case of the socket 6 will be described.

As shown in FIG. 2 (c), the socket 6 is configured such that the lid 61 is opened and closed with respect to the case 64. The cover 61 of the socket 6 is provided with a window 62 for taking out the emitted light. The window portion 62 may be open or a light transmitting material may be formed in the window portion 62. In other words, the socket 6 may be open to the peripheral portion of the LED element chip 5 for light extraction, or a light transmitting material may be formed in the peripheral portion for the light extraction.

The socket 6 has a positioning mechanism for positioning the LED element chip 5 therein. Probes or terminals 63a and 63b protrude downward from the back surface of the lid 61 corresponding to the window portion 62. By closing the lid 61, the LED element chip accommodated in the recessed part 65 of the case 64, fixed by the suction part 67 in the state which was pressed by the pin 66, approached one side, and was positioned ( The probe or the terminals 63a and 63b are in contact with each terminal on the surface side of 5), respectively. Thereby, each terminal of the surface side of the LED element chip 5 is energized through the probe or each terminal 63a, 63b, and the LED element chip 5 can be made to emit light. As for the socket 6, the reflecting plate is formed in the mounting surface side of the LED element chip 5, and light emission from the LED element chip 5 is irradiated to the window part 62 side by the reflecting plate. By using this socket 6, even if the chip size of the LED element chip 5 changes, it can respond easily.

As shown to Fig.2 (d), also in the socket 6A, the cover 61 is opened and closed with respect to the case 64. The cover 61 of the socket 6A is provided with a window portion 62A for taking out the emitted light. Probes or respective terminals 63a and 63b protrude upward from the bottom surface of the recess 65 of the case 64. The LED is provided by inserting the LED element chip 5 into the recess 65 of the case 64 while closing the lid 61 with the back side facing up and each terminal on the front side facing downward. The element chip 5 can be positioned internally by the positioning mechanism. In this way, by closing the lid 61, the pin 66 constituting the positioning mechanism is protruded, and the suction part 67 is positioned in the state where the LED element chip 5 is positioned close to one side by pressing the pin 66. To be fixed by The probe or the terminals 63a and 63b are brought into contact with each terminal of the LED element chip 5 from the bottom surface of the recess 65 of the case 64 so that light emission from the LED element chip 5 is upward. Can be easily taken out from the window portion 62A. Also in this case, as for the socket 6A, the reflecting plate is formed in the mounting surface side of the LED element chip 5, and the light emission from the LED element chip 5 is irradiated to the window part 62A side by the reflecting plate. By using this socket 6A, even if the chip size of the LED element chip 5 changes, it can respond easily.

The above sockets 6 and 6A are configured to be electrically connected to respective terminals on the upper or lower surface of the LED element chip 5.

As shown to FIG. 2 (e), the upper side of the pedestal member 69 is open | released by the socket 6B. The socket 6B has a positioning mechanism for positioning the LED element chip 5. The L-shaped member 68 disposed at the diagonal position on the two corner portions in the diagonal direction of the square in plan view is configured to be able to freely move its inner corner portion toward the diagonal direction center side. At the time when the probe or each terminal 63a, 63b protrudes upward from the center part of the pedestal member 69, and the LED element chip 5 is mounted on the pedestal member 69, two of the diagonal positions are shown. The L-shaped member 68 is moved with the LED element chip 5 to the center side in the diagonal direction (the reverse direction to each other) to position the LED element chip 5. The LED element chip 5 is fixed by the adsorption part 67 in this positioning state. Thereby, the probe or the terminals 63a and 63b protruding from the pedestal member 69 and the respective terminals of the LED element chip 5 are brought into contact with each other so as to conduct the light, and the light emission from the LED element chip 5 is easily taken out. can do. The socket 6B opens the peripheral part of the LED element chip 5. Also in this case, even if the chip size of the LED element chip 5 changes, it can respond easily.

Next, the positioning mechanism of the socket 6 with respect to the LED element chip 5 is shown in FIG. It will be described in more detail using Fig. 3 (c).

3 (a)? FIG. 3C is a longitudinal cross-sectional view for explaining the positioning mechanism of the socket 6 of FIG. 1 with respect to the LED element chip 5.

As shown in FIG. 3A, in the socket 6, the LED element chip 5 is transferred by the picker 71 while the lid 61 is opened by the hinge 61a, and the case 64 is provided. It is mounted in the recessed part 65 of.

As shown in FIG. 3 (b), when the cover 61 is closed by the hinge 61a with respect to the case 64, in conjunction with this, the pin 66 protrudes and the side surface of the LED element chip 5. Press to position the LED element chip 5 close to one side. In this case, if the taper adheres to the inner surface of the recess 65 of the case 64 in plan view, the LED element chip 5 can also be approached in the direction orthogonal to the direction in which the pin 66 protrudes. The element chip 5 can be accurately positioned.

As shown in FIG. 3 (c), in the socket 6, when the lid 61 is closed by the hinge 61a with respect to the casing 64, the hook 61b at the tip of the lid 61 is closed. It is fixed by being hooked on (64). In this case, the probe or each terminal 63a, 63b and each terminal of the LED element chip 5 correspond to each other in a one-to-one correspondence. Thereby, probe or each terminal 63a, 63b and each terminal of the LED element chip 5 are made to conduct, and light emission from the LED element chip 5 can be taken out easily through the upper window part 62. FIG. When the cover 6 is closed, the socket 6 is engaged with the case 64 by the hook 61b of the tip thereof, and the cover 61 remains closed. When the cover 61 is pressed again, The hook 61b is comprised so that the cover 61 may be easily opened from the engaging part of the case 64. As shown in FIG.

Here, the socket cover opening and closing mechanism which opens and closes the socket 6 is demonstrated. The socket cover opening and closing mechanism has a socket cover opening mechanism 10A of FIG. 4 and a socket cover pressing mechanism 10B of FIG. 5.

FIG. 4: is a side view which shows 10A of socket cover opening mechanisms used for the semiconductor test | inspection apparatus 1 of FIG.

In FIG. 4, the socket cover opening mechanism 10A is formed in the upper end of the rotating shaft 11 so that the arm 12 can rotate freely with the rotating shaft 11, and the tip part of the arm 12 is downward. By pressing the cover 61 of the socket 6 by the tip portion 13 which is bent in an L shape, the hook 61b can be pulled out and the cover 61 of the socket 6 can be opened. The socket cover opening mechanism 10A is formed on the downstream side of the index table 2 and serves as a mechanism for pressing the cover 61 of the socket 6 to open the LED element chip 5 after the inspection.

FIG. 5: is a side view which shows the socket cover pressing mechanism 10B used for the semiconductor inspection apparatus 1 of FIG.

In FIG. 5, the socket cover pressing mechanism 10B is formed in the upper end of the rotating shaft 15 so that the arm 16 can rotate freely with the rotating shaft 15, and the tip part of the arm 16 is downward. The tip portion 17 bent in an L shape and the corner portion 18 are used to close the cover 61 of the socket 6 to the edge portion 18 halfway and press the tip portion 17 to close it completely. . Thereby, the cover 61 of the socket 6 can be closed easily. The socket cover pressing mechanism 10B is formed on the upstream side of the index table 2, and after the LED element chip 5 before the inspection is transferred by the picker 71 and accommodated in the socket 6, the socket 6 Is to close the cover 61.

By the above configuration, the operation will be described below.

First, the socket 6 according to the chip size is detachably mounted to each stage 21 of the index table 2.

Next, each LED element chip 5 formed in the semiconductor wafer 3 separated into pieces on the adhesive sheet 2 in the state which pulled out the adhesive sheet 2 is picker for every chip from the adhesive sheet 2 per chip. Picked up and taken out by 71, the LED element chip 5 taken out is placed in the socket 6 on the predetermined stage 21 of the index table 2. In this case, since the socket 6 has a positioning mechanism after the LED element chip 5 is transferred into the socket 6 by the picker 71, the chip transfer by the picker 71 does not require precision, and therefore the high speed is not required. Transfer is possible.

Next, while rotating the index table 2 for one stage, the cover 61 of the socket 6 is closed to the edge portion 18 halfway by the socket cover pressing mechanism 10B to the tip portion 17. To close the cover 61 of the socket 6 completely.

Subsequently, the index table 2 ascends and coalesces the window portion 62 of the socket 6 in the lower opening of the integrating sphere 91 so that the amount of light that is energized by the LED element chip 5 in the socket 6 and emits light. The light quantity inspection which measures this by the integrating sphere 91 correctly is performed.

Further, the index table 2 moves downward with the socket 6 on the stage and releases the union of the lower opening of the integrating sphere 91 and the window portion 62 of the socket 6, and then the index table ( 2) rotates by one stage and performs a DC characteristic test for measuring the current value or the like that flows when a predetermined voltage is applied to the LED element chip 5 in the socket 6.

In addition, after the index table 2 is rotated by one stage, when the LED element chip 5 is a good product in the light quantity inspection and the DC characteristic inspection, the socket cover opening mechanism 10A allows the socket 6 to be opened. The cover is opened, and the LED element chip 5 is taken out from the inside by the picker 72 and transferred to the predetermined position of the good sheet 81. In this case, the LED element chip 5 determined by the measurement is transferred to the article sheet 81 for each article rank.

Further, after the index table 2 is further rotated by one stage, the socket cover opening mechanism 10A when the LED element chip 5 is defective in at least one of the light quantity inspection and the first DC characteristic inspection. The LED element chip 5 is taken out by the picker 73 from the inside of the socket 6 in which the lid 61 is opened, and divided into defective items at a predetermined position of the defective sheet 82.

As described above, according to the first embodiment, a plurality of stages 21 are formed, and are mounted on the index table 2 for moving the plurality of stages 21 and the stage 21, and the LEDs as semiconductor chips. One or a plurality of LED element chips having a smaller number than the socket 6 in which the element chip 5 is housed therein and allowing the electricity to flow, and the plurality of LED element chips 5 after the semiconductor wafer 4 is separated into pieces. The picker 71 which transfers (5) to each socket 6 on the one or several stage 21 of the several stage of the index table 2 which is smaller than this, and one or several stage 21 It has a test | inspection means which mounts one or several LED element chip | tip 5 in 1, and inspects one or several LED element chip | tip 5.

Thereby, one or more can be measured simultaneously by the index system in the state without a chip shift. Moreover, the position shift of the LED element chip 5 does not generate | occur | produce by the system which forms a positioning mechanism in the socket 6, and it can reliably test | inspect. In addition, by employing the index table 2, since the arrangement of the DC characteristic inspection, the optical system inspection (integrating sphere) and the number of installation thereof can be arbitrarily arranged, the number of simultaneous measurements can be increased.

In addition, because of the socket system, the measurement can be performed without problems of heat generation and light shielding, and it is possible to easily cope with light emission on the contact surface and light emission on the back surface of the contact, so that the measurement can be performed in a state close to the actual specification. In addition, conventional sheet heating is not affected by the index method.

In addition, by making the socket 6 itself a reflection specification, it becomes close to an actual specification and can measure the exact amount of light which is not influenced by shading | shielding.

Therefore, as a conventional case, problems caused by mis-contact due to misalignment occurring during light quantity inspection of the light emitting element in a state where the pressure-sensitive adhesive sheet is tensioned, problems of long inspection time, problems of terminal backside production and heat generation problem, backside The problem of light emission can be solved, and more accurate light quantity inspection meeting the actual specification can be performed efficiently.

(Embodiment 2)

In the first embodiment, one or more (for example, two) LED element chips 5 are moved sequentially or simultaneously to the sockets 6 on the respective stages 21 of the circular index table 2. Although the case of test | inspection was demonstrated, in this Embodiment 2, the predetermined | prescribed number of each LED element chip 5 is collectively put into the some socket 6 on each stage 21A of the long table index table 2A. In the following description, a case of sequentially or simultaneously inspecting the same will be described. In this Embodiment 2, it can respond more to mass production.

FIG. 6: is a schematic diagram for demonstrating the semiconductor inspection method using the semiconductor inspection apparatus in Embodiment 2 of this invention. In addition, in FIG. 6, the member which exhibits the same effect as the structural member of FIG. 1 is attached | subjected, and the same member code | symbol is demonstrated.

In FIG. 6, the semiconductor inspection apparatus 1A of the second embodiment includes a plurality of stages formed, an index table 2A as index table means for moving the plurality of stages 21 in a straight line, and The plurality of LED elements which are mounted on the stage 21A and which separate the semiconductor wafer 4 and the socket 6 as the socket means in which the LED element chip 5 as the semiconductor chip is housed therein and can conduct electricity. Among the chips 5, one or more LED element chips 5 with fewer numbers are provided to each socket 6 on one or more stages 21 with fewer numbers among the plurality of stages of the index table 2. The picker 74 as a 1st conveyance means which conveys collectively simultaneously and one or some LED element chip 5 are mounted in several stage 21, and one or several LED element chip 5 is sequentially Or batch sword Inspection means and, for the LED element chip 5 in the inspection after the socket (6) has a picker (72, 73) as a second transfer means for transferring in accordance with the test results on a separate sheet.

The index table 2A is an oblong rotary table viewed in a plane in which a plurality of stages 21A are formed at equal intervals. The index table 2A is rotated by one stage or by a predetermined number of stages, and each stage 21 is mounted so that the socket 6 can be freely detached from each other. The index table 2A is oblong in plan view and can form the plurality of stages 21 in a straight portion.

The socket 6 is the same as the case of the said Embodiment 1, is arrange | positioned on each stage 21A of this index table 2A, and enables the electricity supply drive of the LED element chip 5.

The picker 74 can set the predetermined number (plural number) of LED element chips 5 on the adhesive sheet 3 in each socket 6 arranged at the same time at the same time as a rectangular straight line. Even in the case of the first embodiment, even if the plurality of LED element chips 5 can be simultaneously transferred simultaneously, the two LED element chips 5 or at most several because the index table 2 is circular. . On the other hand, in the index table 2A, since many stages 21 can be formed in a linear part, it is advantageous for more simultaneous inspection.

The picker 74 is formed by a plurality of adsorption nozzles 74a arranged in one row at an arrangement pitch of a predetermined number (plural numbers) of the LED element chips 5 on the adhesive sheet 3, and thus, a plurality of one rows on the adhesive sheet 3. At the same time, the LED element chips 5 are simultaneously sucked out, and a predetermined number of LED element chips 5 in one row are arranged at an arrangement pitch of a plurality of sockets 6 arranged in a straight line of the index table 2A. The pitch of the predetermined number of adsorption nozzles 74a can be widened, and the predetermined number (plural) of LED element chips 5 can be mounted simultaneously in each of the predetermined number of sockets 6 by the respective adsorption nozzles 74a.

By the said structure, first, in the state which tensioned the adhesive sheet 3, the predetermined number (a large number) of LED element chips 5 of 1 row on the adhesive sheet 3 are collectively taken out by the picker 74, and an index The pitch of each adsorption nozzle 74a is widened by the pitch of each stage of the table 2A, and a predetermined number (multiple) of each adsorption nozzle 74a is arranged in each socket 6 on each stage 21A, respectively. The LED element chips 5 are collectively placed at the same time. In this manner, after the picker 74 adsorbs a plurality of chips at the chip size on the adhesive sheet 3, a predetermined number of adsorption nozzles 74a can be opened by the stage size of the index table 2A. Therefore, the predetermined number (large number) of LED element chips 5 can be placed in the respective sockets 6 simultaneously and collectively by one movement. Thereafter, it is the same as the case of the first embodiment.

By the above, according to this Embodiment 2, it is set as the structure which provided two or more adsorption nozzles 74a of the picker 74, and the stage of the linear part of the index table 2A from the chip space which extended the adhesive sheet 3 By having a mechanism which widens a space | interval by an interval, pick-and-place time which speed | rates by inspection processing ability can be reduced significantly. Furthermore, an optical system measurement and an electrical property test stage may be provided in arbitrary stage 21A, and it may have a mechanism which can easily increase or decrease the number of simultaneous measurements.

In addition, in the said Embodiment 1, the index table 2 is comprised so that an external shape may be circular in plan view, and the stage 21 will be formed in the outer peripheral side at predetermined intervals, In the said Embodiment 2, the index table Although 2A has been configured so that its shape is an oblong shape when viewed in plan, and the stage 21A has a plurality of consecutively arranged portions in a straight line, it is not limited to this, and the shape is a corner part in addition to the elliptic shape when it is seen in plan view. As viewed from the rounded plane, any of a triangular shape, a square shape, a polygonal shape, and a semicircle shape may be used, or one or a plurality of straight lines may be used. That is, it is advantageous at the time of a batch inspection process, when it is comprised so that several stage 21 or 21A may have the part arranged in a straight line in plurality.

In addition, in the said Embodiment 1, the index table 2, 2A is the thing of the several LED element chip 5 (for example, 100,000 pieces) as a some semiconductor chip which is the inspection target of the semiconductor wafer 4 which separated into pieces. Although the case where one is arrange | positioned in the vicinity of an arrangement position was demonstrated, it is not limited to this, The some table | surface of the LED element chip 5 which is the inspection object of the semiconductor wafer 4 in which the index tables 2 and 2A were separated into pieces. ) (For example, 100,000 pieces), and may be arranged around two points on opposite sides facing each other. In short, either of the index tables 2 and 2A may be formed on both sides of the separated semiconductor wafer 4. In other words, the index table 2 may be formed on one side of the separated semiconductor wafer 4, and the index table 2A may be formed on the other side of the separated semiconductor wafer 4. In short, even if the index table 2, 2A is arrange | positioned in the vicinity of the periphery of the arrangement | positioning position of several LED element chip 5 (for example, 100,000 pieces) which are the inspection target of the separated semiconductor wafer 4, do.

As mentioned above, although this invention was illustrated using preferred embodiment 1, 2 of this invention, this invention is not limited to this embodiment 1, 2, and should not be interpreted. It is understood that the present invention should be interpreted only by the claims. It is understood that those skilled in the art can implement equivalent ranges based on the description of the present invention and common technical knowledge from the description of the specific preferred embodiments 1 and 2 of the present invention. It is understood that the patents, patent applications, and documents cited in the present specification should be incorporated by reference as if the contents themselves are specifically described herein.

The present invention is, for example, in the field of a semiconductor inspection apparatus for inspecting the amount of emitted light for inspection target devices such as LSI elements, light emitting elements such as LED elements and laser elements, a plurality of chip shifts by an index method. Can be measured simultaneously without. In addition, by employing the index table, the arrangement of the DC characteristic inspection, the optical system inspection (integrating sphere), and the number of installation thereof can be arbitrarily arranged, thereby increasing the number of simultaneous measurements. In addition, because of the socket system, the measurement can be performed without problems of heat generation and light shielding, and it is possible to easily cope with light emission on the contact surface and light emission on the back surface of the contact, so that the measurement can be performed in a state close to the actual specification. Therefore, problems caused by mis-contact due to misalignment occurring during light quantity inspection of the light emitting element in a state where the adhesive sheet is tensioned, problems of long inspection time, problems of device backside terminal production or heat generation, and problems of backside light emission In addition to this, it is possible to efficiently perform a more accurate light quantity inspection in accordance with the actual specifications.

1, 1A: semiconductor inspection device
2, 2A: index table
21, 21A: stage
3: adhesive sheet
4: semiconductor wafer
5: LED element chip
6, 6A, 6B: socket
61: cover
61a: hinge
61b: Hook
64: case
62, 62A: window
63a, 63b: probe or each terminal
65: recess of the case
66: pin
67: adsorption unit
68: L-shaped member
69: pedestal member
71? 74: picker
74a: adsorption nozzle
81: good sheet
82: defective sheet
91, 92: integrating sphere
10A: socket cover opening mechanism
11:
12: arm
13: tip
10B: Socket Cover Pushing Mechanism
15: axis of rotation
16: arm
17: tip
18: corner

Claims (17)

A semiconductor inspection apparatus comprising: index table means for forming a plurality of stages and moving the plurality of stages, and inspection means for mounting a plurality of semiconductor chips in the plurality of stages and inspecting the plurality of semiconductor chips. The method of claim 1,
And a socket means mounted on the stage, wherein the semiconductor chip is housed therein to enable energization. The method of claim 2,
The socket means is a semiconductor inspection device configured to be electrically connected to respective terminals on the upper or lower surface of the semiconductor chip. The method of claim 1,
The semiconductor inspection apparatus which further has the 1st conveyance means which conveys fewer semiconductor chips among several semiconductor chips after individual-ized semiconductor wafer to several less stages among the several stages of the said index table. . The method of claim 1,
The semiconductor chip is a light emitting element chip, and the inspection means performs an optical inspection and a DC characteristic inspection of the light emitting element chip. The method according to claim 2 or 3,
The said socket means is a semiconductor inspection apparatus in which the reflecting plate is formed in the mounting surface of the said semiconductor chip. The method according to claim 2 or 3,
The socket means is a semiconductor inspection apparatus in which a peripheral portion of the semiconductor chip is opened or a light transmitting material is formed in the peripheral portion. The method according to claim 1 or 4,
And a second transfer means for transferring the semiconductor chip in the socket means after the test to a separate sheet according to the test result. The method of claim 4, wherein
The said 1st conveyance means is a semiconductor inspection apparatus in which the pick-up pitch of the some semiconductor chip of a transfer destination and a transfer source differs, when conveying a some semiconductor chip collectively. The method of claim 8,
At least the second conveying means of the first conveying means and the second conveying means has a different pick-up pitch of the plurality of semiconductor chips of the transfer destination and the conveying source when the plurality of semiconductor chips are collectively conveyed. Semiconductor inspection device. The method according to claim 2 or 3,
And the socket means has a positioning mechanism for positioning the semiconductor chip therein. The method of claim 1,
And said inspection means has predetermined respective measurement functions at each stage of said index table means. 13. The method of claim 12,
And inspecting all of the inspection means formed at each stage of the index table means at the same time for inspection. The method according to claim 2 or 3,
The said socket means is a semiconductor inspection apparatus which opens and closes by a socket cover opening / closing mechanism. The method of claim 1,
The index table means may be any one of a triangular shape, a rounded shape, a square shape, a polygonal shape, a semicircle shape, and one or a plurality of straight lines in addition to the circular shape, the ellipse shape, and the oblong shape when viewed from a plane. Semiconductor inspection device. The method of claim 15,
The said index table means is a semiconductor test | inspection apparatus which has the part by which the stage was arranged in linear form in series. The method of claim 1,
The said index table means is a semiconductor inspection apparatus arrange | positioned one or more in the circumference | surroundings of the arrangement | positioning position of the some semiconductor chip which is the inspection target of the separated semiconductor wafer.

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