JPS61169776A - Automatic measuring/selecting apparatus for semiconductor - Google Patents

Abstract

PURPOSE:To achieve a higher speed of an apparatus while enabling contact between an element to be measured and a measuring electrode with a sufficient strength and area by measuring the characteristic of the element being measured with a mobile electrode electrically linded to a socket with an extension lead and supported with an insulator and a fixed electrode to select it based on the results. CONSTITUTION:A mobile electrode 4 has a plurality of lower contactors 10 electrically linked to a socket 12 with an extension lead 14 and buried into an insulator 11. On the other hand, a fixed electrode 5 has an upper contactor 9 bent at the lower tip thereof held with an insulator 13. A conveying mechanism 1 is driven intermittently, then, an element 3 to be measured is striken into the mobile electrode 4 at the point (a) with a pusher 2 and the mobile electrode 4 bring in sliding contact with the fixed electrode 5 as moving holding the element 3 therein in contact therewith to measure the characteristic of the element 3 at the point (b). Further, the mobile electrode 4 moves to the point (c) to make an measurement with the element contacting the fixed electrode 6. At the point (d), based on the combination obtained by the measurement of the characteristic made twice, the element is stored, for example, into a box with a raking mechanism 7, defective products are raked out at the point (e) and those left at the point (f) are raked out to be sent to the sequent process.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to the measurement of the electrical characteristics of a semiconductor device, and more particularly, to the measurement of a plurality of electrical characteristics of a semiconductor device in a state in which the device is housed. The present invention also relates to an automatic semiconductor measuring and sorting device that can classify and sort devices with high efficiency based on measurement results.

[Background of the invention]

Conventional semiconductor device measurements have been performed using a method (hereinafter referred to as a crank method) in which a measurement electrode directly contacts a lead terminal of a device to be measured.

However, this clamp type requires operations such as clamping, contacting, unclamping, etc., and therefore has the disadvantage that high speed cannot be achieved. In addition, in order to obtain sufficient contact, it is necessary to make contact with a strong force, but in the clamp type, the lead is soft and weak, which may lead to deformation, which can easily cause contact failure. Ta. Furthermore, when measuring multiple characteristics, the lead must pass through multiple electrodes and must be re-grasped each time, making it difficult to stabilize contact reliability and easily promoting deformation of the lead. There were many shortcomings.

[Purpose of the invention]

The present invention has been made to solve the above-mentioned drawbacks of the prior art, and in view of the fact that power semiconductor devices require large currents to flow, the present invention provides a measurement electrode with sufficient strength and area. It is possible to contact the device to be measured with the device, to increase the speed of the device, and to measure multiple characteristics using multiple measurement electrodes, and to select and classify the device by combining arbitrary characteristics. The purpose of the present invention is to provide a new semiconductor automatic measurement and sorting device that can perform the following functions, and furthermore, supply, discharge, and sort devices to be measured while wrapping the time during measurement. .

[Summary of the invention]

To achieve this objective, the present invention first houses the device to be measured in a socket, and electrically conducts the device from the terminal of the socket via an extension lead to a strong lower contact while maintaining mutual insulation. In addition, although both the upper and lower contacts are made of copper alloy material, it is possible to control the frequency of parts replacement due to contact wear and tear by creating a difference in hardness in their properties. Furthermore, based on the knowledge that this is possible by devising the transportation method of the moving electrode so that all the time other than movement can be used for measurement or supplying, discharging, and sorting the elements to be measured, we have completed this work. This is what I did.

The present invention will be explained in detail below based on illustrated embodiments.

[Embodiments of the invention]

1 and 2 are block diagrams of the entire apparatus according to an embodiment of the present invention, with FIG. 1 being a plan view and FIG. 2 being a front view.

First, the operation of the apparatus will be briefly explained using the above drawings. The transport mechanism 1 is driven intermittently by moving and stopping nine times, and when it is stopped, the pusher 2 drives the element to be measured 3 onto the moving electrode 4 at point a. Thereafter, the movable electrode 4 moves by t1 pitches while contacting and holding the device to be measured 3 therein, reaches six points, and comes into sliding contact with the fixed electrode 5 during this movement process. Here, the characteristics of the device to be measured 3 are measured while the device is stopped, and after the measurement is completed, the device further moves to the 0 point, contacts the second fixed electrode 6 again in the same manner, and performs the measurement. Thereafter, the pixel element is moved by l pitch to reach point d, and at point d, the pixel element is stored in, for example, a box by the scraping mechanism 7 based on the characteristic combination generated by the two characteristic measurements.

Next, at point 0, defective products are scraped out in the same manner, and at point f, elements that were not scraped out at either point d or point 0 are scraped out and sent to the next process.

Next, the relationship between the device to be measured and the measurement electrodes (moving electrodes, fixed electrodes) will be described in detail. FIGS. 3 and 4 are diagrams showing the relationship between fixed electrodes and moving electrodes.

The moving electrode 4 has a socket 12 for accommodating the device to be measured 3 and a plurality of lower contacts 10, as shown in the third example) and FIG. 1
0 is electrically connected to the insulator 1 by the extension lead 14
1 and mounted on the transport mechanism 1. The device to be measured 3 is housed in a package having an adapted shape so that it can be easily fitted into and removed from the socket 12, and the package has a lead terminal structure that can be inserted in a certain direction as shown in FIG. Moreover, it is preferable that the upper part is open so that the lower contactor 9 of the fixed electrode 5 can be contacted.

On the other hand, the fixed terminal 5 has a structure in which an upper contact 9 having a bent lower tip is held by an insulator 13.

Note that the fixed electrode 5 can also be modified as shown in FIG. That is, the upper contactor 9 has a shape as shown in FIG. When the upper contactor 9 makes contact with the upper contactor 9, the upper contactor 9 moves slightly to the left through the insulator 16. This configuration has the advantage that the upper contact 9 can contact the lower contact 10 over a longer distance.

The transport mechanism 1 for the moving electrode 4 can be implemented using various transport methods. For example, as shown in FIG. 6, a plurality of movable electrodes 4 are mounted on a reciprocating table 17, and the elements are supplied and
Reciprocating type that discharges in the horizontal direction (a) or vertical direction (b), as shown in Figure 7, uses a rotating disk 1B to supply elements in the axial direction (a) or radial layer direction (b)・
There is a disk method for discharging, and a chain method for supplying and discharging elements in the axial direction (a) or radial direction (b) by mounting the movable electrode 4 on an endless chain or belt 19 as shown in Fig. 8. etc.

When measuring the characteristics of the wax element 3 to be measured by contact between the movable electrode 4 and the fixed electrode 5 having such a configuration, first, start from the state immediately before the contact between the electrodes 4 and 5 as shown in FIG. As the movable electrode 4 mounted on the transport mechanism 1 further moves to the left (in the direction of the arrow in the figure), the lower contact 11 of the movable electrode 4 comes into contact with the upper contact 9. Lower contact 1
1 is electrically coupled to the socket 12 by the extension lead 14 and further electrically connected to the device to be measured 3 inside the package, so that the characteristics can be measured in this state.

The first feature of this method is that the reliability of contact is high because sliding contact is made between the element and the moving ionization, and between the moving electrode and the fixed electrode. That is, when the element is driven into the moving electrode, dirt, oxide film, etc. on the surface of the element lead are removed. Also, a continuity test (
If you check the contact resistance (contact resistance check), the contact state of the lead clamp section will be maintained, so there is no risk of the contact resistance fluctuating due to re-clamping the clamp electrode every time you change the measurement station, as in the conventional clamp method. do not have.

The second feature is that the device can be operated at high speed. In other words, there is no complicated movement of the fixed electrode, the entire time other than movement can be devoted to measurement, the i-ding and unloading of the device under test can be done simultaneously at different stations during measurement time, and the number of measurement stations can be increased. This is because it is possible to measure a wide variety of characteristics without increasing takt time (particularly).

Furthermore, the third feature is that various types of classification can be easily performed. This is because by increasing the number of unloading (scraping) stations, it is possible to arbitrarily classify the sorted contents based on the measurement results.

In addition to the above-mentioned features, this method also has other features such as less deformation of the element because it does not require re-gripping each measurement electrode, and easy replacement adjustment when the electrode wears out because no clamping mechanism is involved in the fixed electrode.

〔Effect of the invention〕

As described in detail above, according to the present invention, since electrodes having sufficient strength and area can be brought into contact with each other, it is possible to achieve a highly reliable contact state of 1 d, and the device to be measured is fixed. The simple operation of repeatedly contacting and releasing by moving only in the lateral direction under the electrode makes it possible to increase the speed of the device. It is possible to measure the characteristics of the device, the measurement results can be stored up to the final part of the device, and arbitrary combinations and classifications can be performed.Furthermore, it is possible to supply, discharge, and sort the elements to be measured as measurement time wraps. There are other effects.

[Brief explanation of the drawing]

1 and 2 are block diagrams of the entire semiconductor automatic measurement and sorting device according to an embodiment of the present invention, in which FIG. 1 is a plan view, FIG. 2 is a front view, and FIGS. 3 to 5. 3 is a front view, FIG. 4 is a view taken along arrow A in FIG. 3, FIG. 5 is a side view showing a modified example of the electrode, and FIG. 8 to 8 are perspective views showing modified examples of the transport mechanism. DESCRIPTION OF SYMBOLS 1...Transportation mechanism, 2...Button, 3...Device to be measured, 4...Moving electrode, 5.6...Fixed electrode, 7.
... Scraping mechanism, 8... Storage box, 9... Upper contact, 10... Lower contact, 11, 13, 15. 16.
... Insulator, 12 ... Socket, 14 ... Chicken length lead, 17 ... Table, 18 ... lff1 & disc,
19... Endless chain (belt).

Claims (1)

[Claims] 1. A socket that accommodates and maintains contact with the device to be measured, a movable electrode that is electrically coupled to the socket via an extension lead and supported by an insulator, and that is electrically connected to the measuring device. 1. A semiconductor automatic measurement and selection device comprising a fixed electrode for guiding a signal, and a mechanism for selecting a device to be measured based on measurement results of characteristics of the device. 2. The semiconductor automatic measurement and sorting device according to claim 1, wherein the transport mechanism for the moving electrode is one of a reciprocating type, a rotating disk type, or a rotating chain type. 3. The semiconductor automatic measurement and sorting device according to claim 1, wherein the shape of the device to be measured is a shape that can be adapted to various packages having a lead terminal structure that is inserted in a certain direction.