SU999127A1 - Method and apparatus for sorting semiconductor devices - Google Patents

Description

The invention relates to the manufacture of semiconductor devices, in particular to sorting them by electrical parameters.

A known method of sorting semiconductor devices, including the operation of feeding each semiconductor device, connecting to the contact mechanism, measuring the electrical parameters of the semiconductor device, disconnecting it from the contact mechanism and unloading £ 1].

However, this method is inefficient due to the incomplete use of the measurement unit.

This is due to the fact that the used method of sequential, combined execution of operations and devices implementing the method use the meter only 60%.

A device for sorting semiconductor devices is also known, <containing a loading mechanism connected to the drive, transporting a mechanism, a contact mechanism with contact elements connected to a unit for measuring electrical parameters of semiconductor devices and rae> load trays (2).

However, the known device is not very productive.

The purpose of the invention is to increase productivity.

This goal is achieved by the fact that according to the method of sorting semiconductor devices, including feeding each semiconductor device, connecting to the contact mechanism, measuring the electrical parameters of the semiconductor device, disconnecting it from the contact mechanism and unloading, the operation of connecting one semiconductor device 15 and the contact mechanism is carried out simultaneously with operations of disconnecting from the contact mechanism and unloading another semiconductor’s new device.

²⁰ A device for implementing the method, comprising a loading mechanism connected to the drive, a contact mechanism with contact elements connected to · 25 mi with a unit for measuring electrical parameters of semiconductor devices "and discharge chutes, the contact mechanism is made on-off and equipped with an independent reciprocating drive movement relative to the loading mechanism, and the contact elements of the contact mechanism of each position are installed with the possibility of their simultaneous relocation.

Figure 1 schematically shows a device that implements the proposed (sorting method, figure 2 - contact * ⁽ ny mechanism.

The device comprises a loading mechanism, including a yibrobunker 1 and 10 tray 2 for the oriented supply of semiconductor devices to a dual-posipion contact mechanism 3, which serves to connect sorted semiconductor devices to the measuring unit 15 (not shown) of their electrical parameters. The contact mechanism 3 is installed with the possibility of reciprocating movement relative to the tray 2 with the help of 20 autonomous drive 4. For receiving and supplying the rejected devices to the appropriate container, there is a carousel 5, the pockets 6 of which are combined with one-, load trays 7 (one 25 tray is shown ) for which the rejected. the devices are supplied in the appropriate container 8 in groups. The contact mechanism comprises a housing 9 in which loading grooves 10 and 11 are made. Jq The front parts of the side surfaces of the housing form supporting platforms 12 and 13 for the terminals 14 of the measured semiconductor devices. Contact elements 15 and 16 are mounted symmetrically with respect to the housing 9 and are fixed in the rack 17 of the housing 9 of the contact mechanism 3. The flange 17 also has a movable fork 18, the longitudinal generators of which (levers) at their ends interact with ^ 0 contact elements 15 and 16. The plug 18 through the levers 19 and the strap 20 is connected to its drive 21. The contact elements 15 and 16 can be mounted separately from the contact 145 of the mechanism 3 and equipped with a drive.

The device operates as follows. . ·. "

From the vibratory hopper 1 through the tray 2, the device is fed into the loading groove 11 of the contact mechanism (first position). This groove is combined with the tray 2 and with one of the pockets of the carousel 5. At this time, the drive 21 of the fork 18 translates the ends of its generators 22 (levers) 55 to the leftmost position. In this case, the right contact elements 15 due to their elasticity are pressed against the terminals 14 of the device located in the groove 11 and the measurement unit begins to measure 60 parameters. Simultaneously with the contacting of the device, the actuator 4 of the contact mechanism 3 is turned on and it moves to the right position (second position). In the process of movement, £ 5 measurements of the electrical parameters of the device are performed. In the position of the contact mechanism 3 in the second position in the groove.

the next device is fed from tray 2, and the drive'21 of the plug 18 moves its ends to the extreme right position, while the contact elements 15 and the contact ele- ments are withdrawn from the terminals of the device located in the groove 11. cops 16 are in contact with the terminals of another semiconductor device located in the groove 10. The device from the groove is fed into one of the pockets of the carousel 5 and transported for unloading into the container of the corresponding group. Next, the cycle repeats. For measurements using the two-wire Kelvin system, reference pads 12 and 13 can be used. In this case, they are carried out locally conductive and connected to the measurement unit. The contact mechanism 3 can have a swing axis parallel to the plane of rotation of the carousel 5 and perpendicular to it, it can return - progressive movement in the plane of rotation of the carousel. The essence of its function does not change from this. Contact elements can be pressed both under the action of forces of their own elasticity, and under the action of · spring or mechanical clamps. Thus, the device has virtually no idle, and the downtime of the meter is determined by the response time of the contact elements, which allows the operation of connecting one semiconductor device to the contact mechanism at the same time as disconnecting from the contact mechanism and unloading another semiconductor device.

Claims (2)

relative to the loading mechanism, and the contact elements of the contact mechanism of each position are installed with the possibility of their simultaneous relocation. 1 shows a schematic representation of a device implementing the proposed sorting method; FIG. 2 - contact mechanism. The device contains a Zagrucki mechanism, including a jibbunker1 and a tray 2 for the oriented supply of semiconductor devices to a two-position contact mechanism 3, which serves to connect sortable semiconductor devices to a measuring unit (not shown) of their electrical parameters. The contact mechanism 3 is installed with the possibility of return translational movement relative to the tray 2 using. an autonomous drive 4. A carousel 5 serves in it for receiving and feeding the appropriate container of the disassembled instruments, the pockets of which are combined with the discharge chutes 7 (one tray is shown), which have been rejected. devices are fed to the appropriate container 8 in groups. The contact fur, the base contains a body 9, in which the loading slots 10 and 11 are made. The front parts of the side surfaces of the body form the bearing pads 12 and 13 for the terminals 14 of the measured semiconductors of the devices. The contact elements 15 and 16 are installed symmetrically with respect to the housing 9 and fixed in the rack 17 of the housing 9 of the contact mechanism 3. In the rack 17 there is also a movable plug 18 whose longitudinal generators (levers), with their ends, interact with the contact elements 15 and 16. The plug 18 is through levers 19 and the strip 20 is connected to its drive 21. The contact elements 15 and 16 can be mounted separately from the contact mechanism 3 and provided with a drive. The device works as follows: - From the vibrating hopper 1 through tray 2, the device is fed to the loading slot 11 of the contact mechanism (first position). This groove is aligned with tray 2 and with one of the pockets of the carousel 5. At this time, the drive 21 of the fork 18 transfers the ends of its forming 22 (levers) to the far left position. At the same time, the right contact elements 15, due to their elasticity, are pressed against the outputs 14 of the device located in the groove 11 and the measurement unit starts measuring the parameters. Simultaneously with the contacting of the device, the actuator 4 of the contact mechanism 3 is turned on and it moves to the right position (second position). In the process of movement, measurements of electrical nt are made; aMeTrov instrument. In the position of the contact mechanism 3 in the second position in the groove. 10 is fed from tray 2 to the next pick-up device, and the actuator 21 of the plug 18 moves its ends to the extreme right position, while the contact elements 15 are retracted from the terminals of the device located in the groove 11, and the contact elements. The cells 16 are in contact with the leads of another semiconductor device located in the groove 10. The device from the groove 11 is fed into one of the pockets of the carousel 5 and transported for unloading into a container of the corresponding group. Then the cycle repeats. For the two-wire Kelvin system measurement, reference platforms 12 and 13 can be used. In this case, they are localized by conducting and connected to the measurement unit. The contact mechanism 3 can have a swing axis parallel to the plane of rotation of the carousel 5 or perpendicular to it. , can reciprocate in the plane of rotation of the carousel. The essence of its function does not change. Contact elements can be pressed both by the action of the forces of their own elasticity, and by the action of spring or mechanical clamps. Thus, the device has practically no idle strokes, and the time of the simple meter is determined by the response time of the contact elements, which allows the operation of connecting the single semiconductor device to the contact mechanism simultaneously with the disconnection operations from the contact mechanism and unloading of another semiconductor device. Claim 1. Method of sorting semiconductor devices, including the operation of supplying each semiconductor device, connecting to the contact mechanism, measuring the electrical parameters of the semiconductor device, disconnecting it from the contact mechanism and unloading, characterized in that, in order to increase productivity, the operation of connecting one semiconductor device to the contact mechanism is carried out simultaneously with the operations of disconnecting from the contact mechanism and unloading another semiconductor th unit. 2. A device for carrying out the method of Claim 1, comprising a transporting mechanism connected to the drive of the loading mechanism, a contact mechanism with contact elements, connected to a unit for measuring electrical parameters of semiconductor devices, and a discharge lot, ki, characterized in that the contact the mechanism is complete. two-position and equipped with an autonomous drive of its reciprocating; th movement relative to the loading mechanism, and the contact elements The contact mechanism with a keicd position is set with the possibility of their single-shift. Sources of information taken into account in the examination 1 „Doutags' Prospectus, USA, 1971, model 3235. 2. AiBTopCKoe certificate of the USSR 472486, KLGI- € 15 -K 13/027 1972. Phi2 2