KR20120117474A - Apparatus for removing bubbles from photoresist - Google Patents

Abstract

PURPOSE: An apparatus for removing bubbles from photoresist solutions is provided to improve yield by efficiently removing the bubbles from the photoresist solutions. CONSTITUTION: An air trap tank(10) is connected to a photoresist solution reservoir(20) and removes bubbles included in the photoresist solutions from the photoresist solution reservoir. An air exhaust pipe(30,32) is located on the photoresist solutions of the air trap tank. A micro vacuum pump(40) is connected to the air exhaust pipe and inhales the bubbles through the air exhaust pipe. The air exhaust pipe includes an end part and an exhaust part which is located in the air trap tank and is connected to the end part.

Description

Photoresist Bubble Removal Device {APPARATUS FOR REMOVING BUBBLES FROM PHOTORESIST}

The present invention relates to an apparatus for removing photoresist bubbles. More specifically, the present invention relates to an apparatus for removing bubbles from a photoresist liquid used during a manufacturing process such as a semiconductor.

Typical semiconductor manufacturing processes include a thin film forming process, an ion implantation process, a photolithography process, a test process, and an assembly process. In the photolithography process, a photoresist (PR) is used to pattern a thin film formed on a wafer and form a pattern. The photoresist thinly coated on the wafer is formed into a photoresist pattern by an exposure process.

On the other hand, when bubbles are included in the photoresist, the voids are formed in the wafer manufactured in the semiconductor process, and thus the semiconductor yield is greatly reduced. Therefore, various apparatuses for removing bubbles from the photoresist liquid have been developed. For example, bubbles are removed from the photoresist liquid by manually operating a filter drain valve or the like.

An object of the present invention is to provide a photoresist bubble removing apparatus capable of efficiently removing bubbles from a photoresist liquid to improve the yield of semiconductors and the like.

Photoresist bubble removing apparatus according to an embodiment of the present invention, i) is connected to the photoresist liquid reservoir, ii) the photoresist liquid reservoir, and applied to remove bubbles contained in the photoresist liquid supplied from the photoresist liquid reservoir At least one air trap tank, iii) an air exhaust pipe positioned over the photoresist liquid in the air trap tank, and iv) a micro vacuum pump connected to the air exhaust pipe and sucking air bubbles through the air exhaust pipe. The air exhaust pipe includes: i) an end portion facing the upper surface of the photoresist liquid; and ii) an exhaust portion connected to the end portion and positioned inside the air trap tank. The cross-sectional area of the end may be larger than that of the exhaust.

The ratio of the cross-sectional area of the end to the cross-sectional area of the exhaust may be 1.2 to 2.0. The imaginary plane including the ends may form an angle of 33.6 ° to 60.0 ° with the top surface.

Photoresist bubble removing device according to an embodiment of the present invention, i) a bubble detection sensor is installed on top of the air trap tank to detect the generation of bubbles, ii) a control valve connected to the air trap tank through the air exhaust pipe, and iii) an exhaust manifold that further interconnects the control valve and the micro vacuum pump. When the bubble detection sensor detects bubbles, the micro vacuum pump may be operated after the control valve is opened to force the bubbles to be evacuated.

An apparatus for removing photoresist bubbles according to an embodiment of the present invention may further include i) another air exhaust pipe located on the photoresist liquid in the air trap tank, and ii) a manual valve interconnecting the air exhaust pipe and the exhaust manifold. Can be. The cross sectional area of another air exhaust pipe may be larger than the cross sectional area of the air exhaust pipe.

Photoresist bubble removing apparatus according to an embodiment of the present invention, i) is connected to the micro vacuum pump, the discharge pipe for discharging bubbles sucked by the micro vacuum pump, ii) is connected to the air trap tank, and the photoresist liquid And a photoresist liquid dispensing pump adapted to be supplied and distributed, and iii) a nitrogen oxide exhaust pipe connected to the discharge pipe and the photoresist liquid dispensing pump and discharging nitrogen oxides generated from the photoresist liquid. When the bubble detection sensor detects bubbles, the photoresist liquid can be continuously supplied to the photoresist liquid dispensing pump while the micro vacuum pump is operated after the control valve is opened to forcibly evacuate the bubbles.

The photoresist liquid reservoir may supply the photoresist liquid through the lower portion of the air trap tank, and the photoresist liquid distribution pump may receive the photoresist liquid through the lower portion of the air trap tank. The one or more air trap tanks include a plurality of air trap tanks, and the plurality of air trap tanks may be arranged side by side to each other.

The bubble contained in a photoresist liquid can be removed efficiently using a photoresist bubble removal apparatus. As a result, the yield of a semiconductor can be greatly improved in the semiconductor manufacturing process in which a photoresist liquid is used, and a semiconductor manufacturing process can be stabilized.

1 is a schematic diagram of an apparatus for removing photoresist bubbles according to an embodiment of the present invention.
FIG. 2 is a diagram schematically illustrating an enlarged internal structure of the air trap tank of FIG. 1.
3 is a schematic operational flowchart of the photoresist bubble removing apparatus of FIG. 1.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. As used herein, the term "comprising" embodies a particular characteristic, region, integer, step, operation, element, and / or component, and other specific characteristics, region, integer, step, operation, element, component, and / or group. It does not exclude the presence or addition of.

Unless defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Commonly used predefined terms are further interpreted as having a meaning consistent with the relevant technical literature and the present disclosure, and are not to be construed as ideal or very formal meanings unless defined otherwise.

As used herein, the meaning of "connection" is interpreted to include not only electrical connection but also all other connection states such as mechanical connection. Therefore, if objects are placed in the mutually influencing state even though no physical connection is established, the objects are interpreted as being in the interconnected state.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

1 schematically illustrates a photoresist bubble removing apparatus 100 according to an embodiment of the present invention. The structure of the photoresist bubble removing apparatus 100 of FIG. 1 is merely for illustrating the present invention, and the present invention is not limited thereto. Therefore, the structure of the photoresist bubble removing apparatus 100 may be modified differently.

As shown in FIG. 1, the photoresist bubble removing apparatus 100 includes an air trap tank 10, a photoresist liquid reservoir 20, air exhaust pipes 30 and 32, and a micro vacuum pump 40. do. In addition, the photoresist bubble removing apparatus 100 includes a bubble detection sensor 40, a control valve 50, and an exhaust manifold 60, a manual valve 70, a discharge pipe 80, and a photoresist liquid distribution pump 90. ), And a nitrogen oxide exhaust pipe (95). If necessary, the photoresist bubble removing apparatus 100 may further include other components.

The photoresist liquid P is stored in the photoresist liquid storage tank 20. The photoresist liquid P is used for a semiconductor manufacturing process or the like. The photoresist liquid reservoir 20 supplies the photoresist liquid P through the lower portion of the air trap tank 10. As a result, since the photoresist liquid P is supplied from the lower portion to the upper portion, the bubbles B contained in the photoresist liquid P are discharged to the upper portion of the photoresist liquid P due to the specific gravity difference, thereby causing the photoresist liquid ( Can be separated from each other more easily. Meanwhile, although only one photoresist liquid storage tank 20 is illustrated in FIG. 1, a plurality of photoresist liquid storage tanks 20 may be used.

As shown in FIG. 1, the air trap tank 10 is connected to the photoresist liquid reservoir 20. Although only one air trap tank 10 is shown in FIG. 1, a plurality of air trap tanks 10 may be installed. The air trap tank 10 removes the bubbles B included in the photoresist liquid P supplied from the photoresist liquid storage tank 20. Micro-sized bubbles B exist in the photoresist liquid P in the photoresist liquid storage tank 20, and the micro-sized bubbles B are transferred while the photoresist liquid P is transferred to the air trap tank 10. It is formed into a large bubble B and exists in the air trap tank 10. Accordingly, the bubble B is removed from the air trap tank 10 in order to prevent the bubble B from being mixed in the photoresist liquid P and being supplied to the semiconductor manufacturing apparatus.

The air exhaust pipes 30 and 32 include a first air exhaust pipe 30 and a second air exhaust pipe 32. Here, the 1st air exhaust pipe 30 is used when removing bubble B automatically, and the 2nd air exhaust pipe 32 is used when removing bubble B manually. The first air exhaust pipe 30 and the second air exhaust pipe 32 are positioned on the photoresist liquid P in the air trap tank 10. In the air trap tank 10, the photoresist liquid P is automatically adjusted at a constant height so as not to contact the first air exhaust pipe 30 and the second air exhaust pipe 32.

As shown in FIG. 1, the bubble detection sensor 40 is provided in the upper part of the air trap tank 10. As shown in FIG. The bubble detection sensor 40 detects bubbles B generated in the air trap tank 10 through the first air exhaust pipe 30. Since the bubble detection method of the bubble detection sensor 40 can be easily understood by those skilled in the art, detailed description thereof will be omitted. Meanwhile, the control valve 50 is connected to the air trap tank 10 through the first air exhaust pipe 30. The control valve 50 can operate according to the bubble B detection of the bubble detection sensor 40. The exhaust manifold 60 interconnects the control valve 50 and the micro vacuum pump 40. Since the plurality of air exhaust pipes 30 and 32 are connected to the exhaust manifold 60, the air bubbles B discharged through the plurality of air exhaust pipes 30 and 32 may be collected and collected together.

As shown in FIG. 1, the micro vacuum pump 40 is connected to the exhaust manifold 60 and connected to the first air exhaust pipe 30 and the second air exhaust pipe 32. The micro vacuum pump 40 suctions and removes the bubbles B in the air trap tank 10 through the first air exhaust pipe 30 and the second air exhaust pipe 32. Although not shown in FIG. 1, check valves are provided at the front and rear ends of the micro vacuum pump 40 to prevent the bubble B from flowing backward. The operation process by the interworking of the bubble detection sensor 40, the control valve 50, and the micro vacuum pump 40 will be described in more detail later with reference to FIG.

As shown in FIG. 1, the bubble B in the air trap tank 10 may be automatically discharged by the bubble detection sensor 40 through the first air exhaust pipe 30, while the second air exhaust pipe ( 32, the bubble B in the air trap tank 10 can be manually discharged. That is, a large amount of bubbles B can be discharged through the second air exhaust pipe 32 positioned on the photoresist liquid P in the air trap tank 10. That is, when the bubble detection sensor 40 detects the presence of a large amount of bubbles B in the air trap tank 10, the large amount of bubbles B is discharged using only the first air exhaust pipe 30. If it is difficult, it is possible to discharge the bubble (B) through the second air exhaust pipe (32). In this case, the air trap tank 10 is opened by opening the manual valve 70 connecting the second air exhaust pipe 32 and the exhaust manifold 60 to suck the bubbles B by the micro vacuum pump 40. A large amount of bubbles (B) generated in can be removed.

As shown in FIG. 1, the discharge pipe 80 is connected to the micro vacuum pump 40. The discharge pipe 80 discharges the bubble B sucked by the micro vacuum pump 40 to the outside. The discharge pipe 80 is connected to the nitrogen oxide exhaust pipe 95 by the joint 98 to discharge the bubbles B to the outside. The nitrogen oxide exhaust pipe 95 is connected to the photoresist liquid distribution pump 90 to discharge nitrogen oxides generated from the photoresist liquid distributed by the photoresist liquid distribution pump 90.

As shown in FIG. 1, the photoresist liquid dispensing pump 90 is connected to the air trap tank 10. The photoresist liquid distribution pump 90 receives the photoresist liquid P from which the bubbles B are removed from the air trap tank 10 and distributes the photoresist liquid P to the semiconductor manufacturing apparatus side. The photoresist liquid dispensing pump 90 receives the photoresist liquid P through the lower portion of the air trap tank 10. Since the bubble B in the air trap tank 10 is discharged to the outside through the air exhaust pipes 30 and 32 located above the photoresist liquid P, the photoresist liquid dispensing pump 90 is connected to the air trap tank 10. Through the lower portion of the bubble (B) can be supplied with a photoresist solution (P) well removed.

On the other hand, in the photoresist bubble removing apparatus 100, when the bubble detection sensor 40 detects the generation of the bubble B, the control valve 50 and the micro vacuum pump 40 are operated to forcibly evacuate the bubble B. Let's do it. In the meantime, the photoresist liquid distribution pump 90 can continuously supply the photoresist liquid P to the semiconductor manufacturing apparatus (not shown) without interruption. In the prior art, the distribution of the photoresist liquid P had to be discontinued during the process of removing the bubbles B contained in the photoresist liquid P, but by using the photoresist bubble removing apparatus 100 of the above-described structure, The photoresist liquid P can be continuously supplied even during the removal step (B). Hereinafter, the internal structure of the air trap tank 10 will be described in more detail with reference to FIG. 2.

FIG. 2 schematically shows an enlarged internal structure of the air trap tank 10 of FIG. 1. The enlarged source of FIG. 2 shows the 1st air exhaust pipe 30 enlarged. The internal structure of the air trap tank 10 of FIG. 2 is merely for illustrating the present invention, but the present invention is not limited thereto. Therefore, the internal structure of the air trap tank 10 can be modified differently.

As shown in FIG. 2, the air bubbles B may be removed using the plurality of air trap tanks 10. In this case, the plurality of air trap tanks 10 are arranged side by side spaced apart from each other along the x-axis direction. A plurality of air trap tanks 10, for example, six air trap tanks may be used to efficiently remove bubbles B included in the photoresist liquid P.

As shown in the enlarged source of FIG. 2, the first air exhaust pipe 30 includes an end portion 301 and an exhaust portion 303. Here, the end part 301 opposes the upper surface PU of the photoresist liquid P. As shown in FIG. The exhaust portion 303 is connected to the end 301. The exhaust part 303 is located inside the air trap tank 10. Here, the cross-sectional area S301 of the end 301 is larger than the cross-sectional area S303 of the exhaust part 303. That is, by forming a large cross-sectional area (S301) of the end 301, the bubble (B) discharged from the first photoresist liquid (P) can be sucked into the air exhaust pipe 30 through the end (301) Make it easy As a result, the bubble B contained in the photoresist liquid P can be easily sucked and removed through the air exhaust pipe 30.

More specifically, the ratio of the cross-sectional area S301 of the end 301 to the cross-sectional area S303 of the exhaust part 303 may be 1.2 to 2.0. When the ratio of the cross-sectional area S301 of the end 301 to the cross-sectional area S303 of the exhaust part 303 is too small, a large amount of cross-sectional area S301 of the end 301 is too small to be generated from the photoresist liquid P. Not suitable for inhaling bubble B. On the contrary, when the ratio of the cross-sectional area S301 of the end 301 to the cross-sectional area S303 of the exhaust part 303 is too large, the length and diameter of the first air exhaust pipe 30 inserted into the air trap tank 10 are determined. Consideration is difficult to design. Therefore, it is preferable to adjust the ratio of the cross-sectional area S301 of the end portion 301 to the cross-sectional area S303 of the exhaust part 303 in the above-described range.

As shown in the enlarged circle of FIG. 2, the virtual plane P301 including the end 301 may be considered. Although the virtual plane P301 is shown as a dotted line in the enlarged circle of FIG. 2, the virtual plane P301 actually has a two-dimensional plane shape. Here, the virtual plane P301 extends while including the end 301. In this case, the imaginary plane P301 forms an angle θ of 33.6 ° to 60.0 ° with the upper surface PU of the photoresist liquid P. FIG. If the angle Θ is too small, the cross-sectional area S301 of the end 301 is too small to effectively remove the bubbles B from the photoresist liquid P through the first air exhaust pipe 30. On the contrary, when the angle Θ is too large, the design is difficult considering the length and diameter of the first air exhaust pipe 30 inserted into the air trap tank 10. Therefore, it is preferable to adjust the angle Θ in the above-described range.

On the other hand, the cross-sectional area S32 of the second air exhaust pipe 32 is larger than the cross-sectional area of the cross-sectional area S303 of the first air exhaust pipe 30. If necessary, when a large amount of bubbles (B) is discharged through the second air exhaust pipe 32 rather than the first air exhaust pipe 30, the large amount of bubbles (B) contained in the photoresist liquid (P) more efficiently Can be removed Therefore, as described above, the cross-sectional area S303 of the first air exhaust pipe 30 and the cross-sectional area S32 of the second air exhaust pipe 32 are adjusted.

FIG. 3 is a schematic operation flowchart of the photoresist bubble removing apparatus 100 of FIG. 1. The operation process of the photoresist bubble removing apparatus 100 of FIG. 3 is merely for illustrating the present invention, and the present invention is not limited thereto. Therefore, the operation process of the photoresist bubble removing apparatus 100 may be modified in other forms. Operation of the photoresist bubble removing apparatus 100 of FIG. 3 may be performed through a controller (not shown) included in the photoresist bubble removing apparatus 100. Hereinafter, an operation process of each component included in the photoresist bubble removing apparatus 100 of FIG. 3 will be described in detail.

First, in step S10, the bubble detection sensor 40 (shown in FIG. 1, hereinafter same) detects whether there is a bubble B (shown in FIG. 1, hereinafter same). When it is detected that there is no bubble B, the photoresist liquid P (shown in FIG. 1, the same below) is continuously supplied in step S90. The photoresist liquid P is continuously supplied regardless of whether the bubble B is detected. On the contrary, when it is detected that there is bubble B, the process moves to step S20. In step S20, it is determined whether the generation amount of bubble B is more than predetermined value.

When the amount of generation of the bubble B is less than the preset value in step S20, the control valve 50 (shown in FIG. 1 and the same below) is opened in step S30. After opening the control valve 50, in step S40, the micro vacuum pump 40 (shown below in Fig. 1) is operated to suck bubbles B in the air trap tank 10. As a result, the bubble B can be forcibly evacuated in step S50.

When the flow returns to step S20 again, when the amount of bubbles B generated in step S20 is equal to or larger than the preset value, the bubbles B are efficiently passed through the first air exhaust pipe 30 (the same as shown in FIG. Can not be removed. Therefore, a large amount of bubbles B can be removed by using the second air exhaust pipe 32 (shown in FIG. 1, hereinafter same). In this case, only the second air exhaust pipe 32 may be used or the first air exhaust pipe 30 and the second air exhaust pipe 32 may be used together.

In the case of using the second air exhaust pipe 32, the manual valve 70 (shown in FIG. 1, hereinafter same) is opened in step S32. After opening the manual valve 70, the micro vacuum pump 40 is operated in step S42. As a result, the bubble B can be forced out in step S52. After forcibly evacuating the bubble B, it is determined in step S62 whether the amount of generation of the bubble B is lowered below the preset value. When the amount of generation of the bubble B is not lowered below the preset value, the step S42 is repeated again to continuously operate the micro vacuum pump 40 to remove the bubble B continuously.

On the contrary, when the generation amount of the bubble B is lowered below the preset value in step S62, it is determined in step S60 whether the bubble detection sensor 40 continues to detect the bubble (B). After the bubble B is forcibly evacuated in step 50, it is determined whether the bubble detection sensor 40 continues to detect the bubble B in step S60.

When the bubble detection sensor 40 continuously detects the bubble B, the flow returns to step S40 to continuously operate the micro vacuum pump 40 to remove the bubble B by suction. On the contrary, when the bubble detection sensor 40 does not continuously detect the bubble B, since the bubble B contained in the photoresist liquid P (shown in FIG. 1) has been removed well, the control in step S70 is performed. Close the valve 50 or the manual valve 70. Next, the micro vacuum pump 40 is stopped in step S80. Then, in step S90, the photoresist liquid P is continuously supplied. The photoresist liquid P is continuously supplied regardless of the operation of the photoresist bubble removing apparatus 100.

Hereinafter, the present invention will be described in more detail with reference to experimental examples. These experimental examples are only for illustrating the present invention, and the present invention is not limited thereto.

Experimental Example

A photoresist bubble removing apparatus of the structure shown in FIG. 1 including six air trap tanks was manufactured. The six air trap tanks were made of a polypropylene translucent cylindrical structure. That is, the air trap tank was manufactured in the film cylinder shape. The height of each air trap tank was 10 cm and its diameter was 5 cm. Here, the end of the air exhaust pipe having a diameter of 1cm was cut inclined so as to have a cross-sectional area of various sizes and installed in the air trap tank, the experiment was carried out. Here, the cross section of the end of the air exhaust pipe was elliptical. The photoresist liquid was supplied into the air trap tank, and the air exhaust pipe was connected to a micro vacuum pump to remove bubbles contained in the photoresist liquid for 10 minutes. Except for the air trap tank, since a part of the present invention can be easily understood by those skilled in the art, a detailed description thereof will be omitted.

Experimental Example  One

The end of the provided air exhaust pipe was cut inclined to 24.6 °. In this case, the cross-sectional area of the end part having an elliptical shape was 0.864 cm ² . The remaining experimental conditions were the same as the above-described experimental example.

Experimental Example  2

The end of the provided air exhaust pipe was cut inclined to 33.6 °. In this case, the cross-sectional area of the end part having an elliptical shape was 0.942 cm ² . The remaining experimental conditions were the same as in Experimental Example 1 described above.

Experimental Example  3

The end of the provided air exhaust pipe was cut inclined to 39.7 °. In this case, the cross-sectional area of the end part having an elliptical shape was 1.021 cm ² . The remaining experimental conditions were the same as in Experimental Example 1 described above.

Experimental Example  4

The end of the provided air exhaust pipe was cut inclined to 48.2 °. In this case, the cross-sectional area of the end part having an elliptical shape was 1.178 cm ² . The remaining experimental conditions were the same as in Experimental Example 1 described above.

Experimental Example  5

The end of the provided air exhaust pipe was cut inclined to 56.3 °. In this case, the cross-sectional area of the end part having an elliptical shape was 1.413 cm ² . The remaining experimental conditions were the same as in Experimental Example 1 described above.

Experimental Example  6

The tip of the provided air exhaust pipe was cut at an angle of 60.0 °. Due to the design limitations of the air exhaust pipe, it was not possible to cut the end of the air exhaust pipe at any angle. In this case, the cross-sectional area of the end part having an elliptical shape was 1.570 cm ² . Further remaining experimental conditions were the same as in Experiment 1 described above.

Experiment result

According to Experimental Example 1 to Experimental Example 6 described above, after forcibly evacuating the bubble with a micro vacuum pump, the bubble removal rate was calculated by measuring the amount of bubbles contained in the photoresist liquid. Since the process of measuring the bubble removal rate can be easily understood by those skilled in the art, detailed description thereof will be omitted. The measured bubble removal rate is shown in Table 1 below.

As shown in Table 1, the bubble removal rates in Experimental Examples 1 to 6 were 80%, 90%, 100%, 100%, 100% and 90%, respectively. Therefore, in Experimental Examples 1 to 6, a large amount of bubbles could be collected and removed. More specifically, it was possible to efficiently remove a relatively large amount of bubbles of Experimental Examples 2-6. Therefore, it was found that it is desirable to adjust the cutting angle and the cross-sectional area of the end to the above-mentioned range.

It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the following claims.

10. Air Trap Tank
20. Photoresist Storage Tank
30, 32.Air exhaust pipe
40. Micro Vacuum Pump
50. Control Valve
60. Exhaust Manifold
70. Manual Valve
80. Outlet pipe
90. Porous Resistant Dispensing Pump
95. Nitrogen oxide exhaust pipe
98. Joint
100. Photoresist Bubble Removal Device
301.End
303. Exhaust
B. Bubble
P. Photoresist Liquid
PU. Top surface of photoresist solution
S32, S301, S303. Cross section

Claims (10)

Photoresist liquid reservoir,
At least one air trap tank connected to the photoresist liquid reservoir and adapted to remove bubbles contained in the photoresist liquid supplied from the photoresist liquid reservoir;
An air exhaust pipe positioned above the photoresist liquid in the air trap tank, and
A micro vacuum pump connected to the air exhaust pipe and suctioning the bubbles through the air exhaust pipe
Including,
The air exhaust pipe,
An end portion opposing the upper surface of the photoresist liquid, and
An exhaust portion connected to the end portion and positioned inside the air trap tank
Including,
And a cross sectional area of the end portion is larger than a cross sectional area of the exhaust portion. The method of claim 1,
And a ratio of the cross-sectional area of the end portion to the cross-sectional area of the exhaust portion is 1.2 to 2.0. The method of claim 1,
And a virtual plane including the ends forms an angle of 33.6 ° to 60.0 ° with the top surface. The method of claim 1,
A bubble detection sensor installed at an upper portion of the air trap tank to detect generation of the bubbles;
A control valve connected to the air trap tank through the air exhaust pipe, and
Exhaust manifold interconnecting the control valve and the micro vacuum pump
Bubble removing device further comprising. The method of claim 4, wherein
And when the bubble detection sensor detects the bubble, the micro vacuum pump is operated after the control valve is opened to forcibly evacuate the bubble. The method of claim 4, wherein
Another air exhaust pipe located above the photoresist liquid in the air trap tank, and
A manual valve interconnecting the air exhaust pipe and the exhaust manifold
Bubble removing device further comprising. The method of claim 6,
And the cross sectional area of the another air exhaust pipe is larger than the cross sectional area of the air exhaust pipe. The method of claim 4, wherein
A discharge pipe connected with the micro vacuum pump and discharging the bubbles sucked by the micro vacuum pump,
A photoresist liquid dispensing pump connected to the air trap tank and adapted to receive and distribute the photoresist liquid;
A nitrogen oxide exhaust pipe connected to the discharge pipe and the photoresist liquid distribution pump and discharging nitrogen oxides generated from the photoresist liquid
More,
When the bubble detection sensor detects the bubble, the bubble is continuously supplied to the photoresist liquid dispensing pump while the micro vacuum pump is operated and the air is forced out of the bubble after the control valve is opened. Removal device. The method of claim 7, wherein
And the photoresist liquid reservoir supplies the photoresist liquid through a lower portion of the air trap tank, and the photoresist liquid distribution pump receives the photoresist liquid through a lower portion of the air trap tank. The method of claim 1,
The at least one air trap tank comprises a plurality of air trap tanks, the plurality of air trap tanks are arranged side by side spaced apart from each other.

Images