KR20120116490A - 탑재대 구조체 및 처리 장치 - Google Patents

탑재대 구조체 및 처리 장치 Download PDF

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Publication number
KR20120116490A
KR20120116490A KR1020127021449A KR20127021449A KR20120116490A KR 20120116490 A KR20120116490 A KR 20120116490A KR 1020127021449 A KR1020127021449 A KR 1020127021449A KR 20127021449 A KR20127021449 A KR 20127021449A KR 20120116490 A KR20120116490 A KR 20120116490A
Authority
KR
South Korea
Prior art keywords
mounting
mounting table
mount
mount structure
electrode
Prior art date
Application number
KR1020127021449A
Other languages
English (en)
Korean (ko)
Inventor
히로오 가와사키
데츠야 사이토우
히데키 나가오카
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20120116490A publication Critical patent/KR20120116490A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020127021449A 2010-02-09 2011-02-08 탑재대 구조체 및 처리 장치 KR20120116490A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-026987 2010-02-09
JP2010026987A JP2011165891A (ja) 2010-02-09 2010-02-09 載置台構造及び処理装置

Publications (1)

Publication Number Publication Date
KR20120116490A true KR20120116490A (ko) 2012-10-22

Family

ID=44367754

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127021449A KR20120116490A (ko) 2010-02-09 2011-02-08 탑재대 구조체 및 처리 장치

Country Status (4)

Country Link
JP (1) JP2011165891A (zh)
KR (1) KR20120116490A (zh)
CN (1) CN102714172A (zh)
WO (1) WO2011099481A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11950329B2 (en) 2018-02-16 2024-04-02 Niterra Co., Ltd. Holding device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6150557B2 (ja) * 2013-02-27 2017-06-21 日本特殊陶業株式会社 セラミックヒーター
KR101773749B1 (ko) * 2015-01-20 2017-08-31 엔지케이 인슐레이터 엘티디 샤프트 단부 부착 구조
JP6674800B2 (ja) * 2016-03-07 2020-04-01 日本特殊陶業株式会社 基板支持装置
US10973088B2 (en) * 2016-04-18 2021-04-06 Applied Materials, Inc. Optically heated substrate support assembly with removable optical fibers
JP7057103B2 (ja) * 2017-02-14 2022-04-19 日本特殊陶業株式会社 加熱装置
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
JP7374103B2 (ja) * 2018-01-31 2023-11-06 ラム リサーチ コーポレーション 静電チャック（ｅｓｃ）ペデスタル電圧分離
US11086233B2 (en) 2018-03-20 2021-08-10 Lam Research Corporation Protective coating for electrostatic chucks
KR102098556B1 (ko) * 2018-07-09 2020-04-17 주식회사 테스 기판지지유닛 및 이를 구비한 기판처리장치
US11062887B2 (en) * 2018-09-17 2021-07-13 Applied Materials, Inc. High temperature RF heater pedestals
JP2020092195A (ja) * 2018-12-06 2020-06-11 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP7248607B2 (ja) 2020-02-03 2023-03-29 日本碍子株式会社 セラミックヒータ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278322A (ja) * 1987-05-11 1988-11-16 Fujitsu Ltd 気相成長装置
JP3955813B2 (ja) * 2002-12-25 2007-08-08 日本発条株式会社 ステージ
KR100747957B1 (ko) * 2003-04-18 2007-08-08 가부시키가이샤 히다치 고쿠사이 덴키 반도체 제조 장치 및 반도체 장치의 제조 방법
JP4133958B2 (ja) * 2004-08-04 2008-08-13 日本発条株式会社 ワークを加熱または冷却するための装置と、その製造方法
JP4768699B2 (ja) * 2006-11-30 2011-09-07 キヤノンアネルバ株式会社 電力導入装置及び成膜方法
JP2009054871A (ja) * 2007-08-28 2009-03-12 Tokyo Electron Ltd 載置台構造及び処理装置
JP4450106B1 (ja) * 2008-03-11 2010-04-14 東京エレクトロン株式会社 載置台構造及び処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11950329B2 (en) 2018-02-16 2024-04-02 Niterra Co., Ltd. Holding device

Also Published As

Publication number Publication date
CN102714172A (zh) 2012-10-03
WO2011099481A1 (ja) 2011-08-18
JP2011165891A (ja) 2011-08-25

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E902 Notification of reason for refusal
E601 Decision to refuse application