KR20120109371A - Method of producing adhesive composition, adhesive composition, and adhesive tape using the same - Google Patents

Abstract

PURPOSE: A manufacturing method of an adhesive composition is provided to restrain deterioration of a surface resistance on a transparent conductive film, and to manufacture an adhesive composition for an adhesive tape without generating cloudiness in an environment of high temperature and high humidity. CONSTITUTION: A manufacturing method of an adhesive composition comprises: a step of mixing a photo-polymerization initiator and at least one kind selected from hydroxyl group-containing (meth)acrylate monomers into a pressure-sensitive adhesive composition consisting of an acryl-based resin; a step of controlling raw composition for an adhesive; and a step of obtaining an adhesive composition by polymerization by light irradiation by using the raw composition for an adhesive.

Description

Manufacturing method of pressure-sensitive adhesive composition, pressure-sensitive adhesive composition, adhesive tape using the same {METHOD OF PRODUCING ADHESIVE COMPOSITION, ADHESIVE COMPOSITION, AND ADHESIVE TAPE USING THE SAME}

The present invention relates to a transparent conductive laminate in which a transparent conductive film (hereinafter sometimes referred to as ITO) made of ITO (abbreviation for indium tin oxide) is formed on a surface of a transparent substrate, and relates to an adhesive tape bonded to the surface of the ITO. . In more detail, the manufacturing method of the adhesive composition of the adhesive tape of the adhesive tape which suppresses the change of the surface resistivity of a transparent conductive film, and does not produce a white cloud in an adhesive layer after a test in a high temperature, high humidity environment, an adhesive composition, and adhesiveness using the same It is about providing a tape. This application claims priority based on Japanese Patent Application No. 2011-067884 for which it applied to Japan on March 25, 2011, and uses the content here.

In recent years, the transparent conductive laminated body in which the thin film of ITO was formed as a transparent conductive film in one surface of the transparent base material which consists of a transparent resin film or a glass plate is used for various uses.

As a use of a transparent conductive laminated body, the transparent electrode etc. which are used for a touch panel, a liquid crystal display, an organic EL display, a solar cell, etc. are mentioned, for example.

The present invention relates to a transparent conductive laminate. To this end, the technical background to the completion of the present invention will be described below by taking a touch panel in which a transparent conductive laminate is used as an example.

In the touch panel in which the transparent conductive laminate is included as a member, various improvements have been made in the past in order to improve the operability and durability of the touch panel. For example, in order to prevent damage or deterioration of the touch panel surface, the surface protection film used by bonding to the surface of a touch panel is proposed (for example, refer patent document 1, 2).

As a transparent conductive laminated body used for a conventional general touch panel, the hard conductive film in which the hard coating layer was formed in the single side | surface of the base material which consists of a transparent resin film, and the transparent conductive laminated body in which the transparent conductive film was formed in the single side | surface of the transparent base material A transparent conductive laminate (so-called bonded transparent conductive laminate) in which a sieve is opposed to a surface on which a hard coating layer of a hard coat film is not formed and a surface on which a transparent conductive film of a transparent conductive laminate is not formed and bonded through an adhesive. Was known.

However, as the use of the transparent conductive laminate increases in recent years, a reduction in manufacturing cost is required. Moreover, the improvement of the electroconductivity of a transparent conductive laminated body, and the ease of use are calculated | required. Moreover, the thinning of the whole transparent conductive laminated body by reduction of the number of members, etc. is calculated | required. As one method for solving these problems, one transparent base material and an adhesive layer are omitted in the member structure of the bonded transparent conductive laminate. As a result, by forming the conductive thin film on one side of the transparent base material and the hard coating layer on the other side, the transparent conductive laminate can be thinned and the manufacturing cost can be reduced.

About the transparent conductive laminated body, the protective film used by bonding on a transparent conductive film layer and protecting a transparent conductive film is also proposed (for example, refer patent document 3).

Moreover, in recent years, in the touch panel which uses a transparent conductive laminated body, it is calculated | required that the finishing appearance and dimensional precision at the time of manufacture are further improved.

Moreover, in the process of manufacturing the optical element or optical device containing a transparent conductive laminated body, the adhesive layer of the adhesive tape bonded on the transparent conductive film is suppressed from changing the surface resistivity of the transparent conductive film which comprises the transparent conductive laminated body, Furthermore, it is calculated | required that the turbidity does not generate | occur | produce in an adhesive layer even after the test in high temperature, high humidity environment.

To this end, the adhesive sheets, adhesive tapes, and adhesive compositions used for bonding optical parts have been improved to reduce cloudiness even when tested in a high temperature and high humidity environment (for example, a patent). References 4 to 7).

Japanese Patent Laid-Open No. 8-329767 Japanese Patent Laid-Open No. 2-066809 Japanese Patent Laid-Open No. 7-068691 Japanese Patent Publication No. 2007-246882 Japanese Patent Publication No. 2007-161908 Japanese Patent Publication No. 2008-248221 Japanese Patent Publication No. 2008-001739

In the process of manufacturing the optical element and optical device containing a transparent conductive laminated body, using the protective film of the transparent conductive film layer as disclosed in patent document 3 as an optical element or an optical device using a transparent conductive laminated body. In the process of processing, even in the heating process of 120 degreeC or more, there is no damage by heat and damage of a transparent conductive film does not occur, and it is effective at the point which can be processed by the manufacturing process by roll to roll.

However, since the heat resistant resin film is used for the protective film for transparent conductive film layers shown by patent document 3, it can use in the point which prevents a transparent conductive film from being damaged by the heating process of 120 degreeC or more. However, it does not help as a solution to the problem that the surface resistivity of a transparent conductive film changes in the process of processing with an optical element or an optical device using a transparent conductive laminated body.

In addition, Patent Literature 4 discloses a resin composition which is less in the amount of gas that causes a malfunction of the electronic member, does not corrode the precision electronic member, and causes poor appearance, and has excellent adhesion properties, among other things, adhesion to the metal and adhesion. In particular, a resin composition for pressure-sensitive adhesives and pressure-sensitive adhesive compositions and pressure-sensitive adhesive sheets using the same are disclosed. As for the adhesive sheet shown in patent document 4, the acrylic adhesive composition which does not use acrylic acid is used, the adhesive sheet is bonded to the copper plate for corrosion test, and it is left to stand for 7 days under the environmental conditions of 60 degreeC x 90% RH of temperature, and copper plate It is said that no corrosion is found even when the corrosion state is determined by the presence or absence of discoloration.

However, Patent Document 4 does not have a description about not causing cloudiness in the pressure-sensitive adhesive layer after the test in a high temperature and high humidity environment, and is not useful as a solution for the problem that cloudiness occurs in the pressure-sensitive adhesive layer.

Patent Document 5 also discloses a photopolymerizable pressure-sensitive adhesive composition which can be easily peeled off even when used as a pressure-sensitive adhesive composition for a front filter bonded to the front side of a PDP (plasma display), and hardly causes clouding even under an environment of high temperature and high humidity. The used adhesive sheet is disclosed. However, in Patent Document 5, there is no description of not adversely affecting the change in the surface resistivity of the transparent conductive film when bonded to the ITO surface. Moreover, although the acrylic adhesive contains 4 weight% of acrylic adhesive compositions which are effective in the prevention of cloudiness in the Example of patent document 5, the said adhesive composition affects corrosion of an ITO surface and increases the surface resistivity of an ITO film | membrane. I'm concerned.

In addition, Patent Document 6 discloses an optical resin composition and an optical resin composition using the same, which are transparent and have proper adhesive force and shock absorption necessary for protection of an image display device, and which do not corrode constituent materials such as a panel for an image display device. have. Specifically, it is an optical resin composition containing an acrylic acid derivative, an acrylic acid derivative polymer, and a high molecular weight crosslinking agent. However, Patent Literature 6 does not have a description of preventing cloudiness from occurring in the pressure-sensitive adhesive layer after the test in a high temperature and high humidity environment, and is not useful as a solution for the problem of cloudiness occurring in the pressure-sensitive adhesive layer.

In addition, Patent Document 7 discloses a pressure-sensitive adhesive composition comprising a copolymer and / or a mixture of a (meth) acrylic acid alkyl ester monomer and a monomer containing a carboxyl group. Is disclosed. However, in the case of bonding to the surface of ITO, in patent document 7, there is no description about not adversely affecting the change of the surface resistivity of a transparent conductive film, and it is unclear whether the said adhesive composition can be used by bonding to the surface of ITO.

As mentioned above, in the prior art, in the adhesive tape for transparent conductive film layers used for a transparent conductive laminated body, the adhesive tape which prevents the change of the surface resistivity of a transparent conductive film, and does not produce turbidity after the test in a high temperature, high humidity environment is Not known.

That is, the objective of this invention is the adhesive tape bonded to the ITO surface of the transparent conductive laminated body in which the transparent conductive film was formed, WHEREIN: The adhesion which suppresses the change of the surface resistivity of a transparent conductive film, and does not produce turbidity after a test in high temperature, high humidity environment. It is providing the manufacturing method of the adhesive composition of a tape, an adhesive composition, and the adhesive tape using the same.

In order to prevent aggregation of water molecules due to a sudden external environment change and to prevent clouding of the pressure-sensitive adhesive layer, in the present invention, even when bonded to the surface of ITO, the pressure-sensitive adhesive can suppress the change in the surface resistivity of the transparent conductive film. A pressure-sensitive adhesive having a higher functionality by adding a new function of crosslinking a monomer having a hydroxyl group to a pressure-sensitive adhesive composition composed of an acrylic polymer having an acid value of 0 to 33 that can be used as it is, so that moisture molecules are invisibly dispersed. It is technical idea to obtain a composition.

That is, in this invention, at least 1 sort (s) of the (meth) acrylate monomer containing a hydroxyl group is bridge | crosslinked and introduce | transduced into the pressure-sensitive adhesive composition which consists of acrylic polymer whose acid value is 0-33, and it participates in the prevention of aggregation of moisture. By doing so, even when it is bonded to ITO which is a to-be-adhered body, the change of the surface resistivity of a transparent conductive film is suppressed, and after the test in a high temperature, high humidity environment, the adhesive composition of the adhesive tape which does not produce a turbidity in an adhesive layer, and the adhesive tape using the same are provided. can do.

Therefore, in this invention, in order to solve the said problem, it is a manufacturing method of the adhesive composition for adhesive tapes joined to the said ITO surface of the transparent conductive film which consists of ITO, Comprising: The physical property by passing through the process of at least following (1)-(2) The manufacturing method of the adhesive composition which obtains the adhesive composition (polymer C) which has (K) is provided.

(1) Pressure sensitive adhesive formed by mixing at least one type (monomer B) of a (meth) acrylate monomer containing a hydroxyl group with a pressure-sensitive adhesive composition (polymer A) made of acrylic resin having an acid value of 0 to 33 and a photopolymerization initiator. Process of adjusting raw material composition for process.

(2) Process of making the adhesive composition (polymer C) which has physical property (K) by making the polymerization reaction by light irradiation using the said raw material composition for adhesives.

Properties (K): After applying the pressure-sensitive adhesive composition (polymer C) to the surface of ITO to form a thin film having a thickness of 200 μm after drying, in a test oven in a high temperature and high humidity environment for 500 hours in an environment of a temperature of 85 ° C. × 85% RH. After taking out, the change ratio of an ITO membrane resistance value is 1.7 times or less with respect to an initial value, and turbidity does not generate | occur | produce in an adhesive composition (polymer C) layer immediately after taking out from the said oven.

Moreover, in this invention, as a manufacturing method of the adhesive composition for adhesive tapes joined to the said ITO surface of the transparent conductive film which consists of ITO, the adhesive which has physical property (K) by going through the process of at least following (1)-(3) The manufacturing method of the adhesive composition which obtains a composition (polymer C) is provided.

(1) At least 1 type (monomer B) of the (meth) acrylate monomer containing a hydroxyl group in the pressure-sensitive adhesive composition (polymer A) which consists of acrylic resin whose acid value is 0-33, and mixes a photoinitiator, Process of adjusting the raw material composition for pressure-sensitive adhesives.

(2) The process of apply | coating the said raw material composition for adhesives to the base film which consists of a elongate thermoplastic resin so that the thickness after drying may be set to 20-500 micrometers, and drying, and obtaining a long coating film.

(3) Process of making the polymerization reaction by light irradiation using the said elongate coating film, and obtaining the adhesive composition (polymer C) which has physical property (K) on the said base film.

Properties (K): After applying the pressure-sensitive adhesive composition (polymer C) to the surface of ITO to form a thin film having a thickness of 200 μm after drying, in a test oven in a high temperature and high humidity environment for 500 hours in an environment of a temperature of 85 ° C. × 85% RH. After taking out, the change ratio of an ITO membrane resistance value is 1.7 times or less with respect to an initial value, and turbidity does not generate | occur | produce in an adhesive composition (polymer C) layer immediately after taking out from the said oven.

Pressure sensitive adhesive composition (polymer A) which consists of acrylic resin whose acid value is 0-33: 100 weight part of solid content, and at least 1 type (monomer B) of the (meth) acrylate monomer containing a hydroxyl group: 5-15 weight part And a photopolymerization initiator: 0.01 to 0.5 parts by weight, comprising a pressure-sensitive adhesive composition (polymer C) having physical properties (K).

Properties (K): After applying the pressure-sensitive adhesive composition (polymer C) to the surface of ITO to form a thin film having a thickness of 200 μm after drying, in a test oven in a high temperature and high humidity environment for 500 hours in an environment of a temperature of 85 ° C. × 85% RH. After taking out, the change ratio of an ITO membrane resistance value is 1.7 times or less with respect to an initial value, and just after taking out from the said oven, turbidity does not arise in an adhesive composition (polymer C) layer.

Furthermore, the adhesive tape (polymer C) manufactured by the said method is provided by laminating | stacking on the base film.

Moreover, the adhesive composition (polymer C) provides the adhesive tape formed by laminating | stacking on a base film.

Moreover, this invention is suitable for the adhesive tape of the use which bonds a member to a display.

According to the present invention, a pressure-sensitive adhesive composition having a conventional acid value of 0 to 33 is modified to provide a pressure-sensitive adhesive composition in which a hydroxyl group for adsorbing water molecules is dispersed. As a result, moisture under high temperature and high humidity conditions can be adsorbed to the hydroxyl group-containing polymer, and even if the pressure-sensitive adhesive layer is thickened to increase the buffering property, it is possible to prevent the occurrence of cloudiness due to the aggregation of the absorbed moisture. You can.

Moreover, by adjusting the fluidity | liquidity of an adhesive coating liquid suitably, it is possible to thicken an application | coating thickness to a base material, can form a thick adhesive tape, and can improve buffering property.

It is sectional drawing which shows typically an example of the single sided adhesive tape which has an adhesive layer formed using the adhesive composition of this invention.
It is sectional drawing which shows typically an example of the transfer tape which has an adhesive layer formed using the adhesive composition of this invention.
It is explanatory drawing which shows an example of the manufacturing method of the adhesive film of this invention typically.
3A is a graph showing changes in haze value immediately after taking out of a test oven in a high temperature and high humidity environment for Example 1 and Comparative Example 2, and as a result of the present invention, no cloudiness occurs after the test in a high temperature and high humidity environment. It is shown for reference.
FIG. 3B is an enlarged graph of FIG. 3A in a range of 0 to 40 minutes.

EMBODIMENT OF THE INVENTION Hereinafter, preferable embodiment of this invention is described.

The manufacturing method of the adhesive composition (polymer C) which concerns on this invention is demonstrated below. The raw material composition for pressure-sensitive adhesives formed by mixing at least one type (monomer B) of a hydroxyl group-containing (meth) acrylate monomer and a photopolymerization initiator with a pressure-sensitive adhesive composition (polymer A) made of acrylic resin is adjusted. Then, the polymerization reaction by light irradiation is performed using the said raw material composition for adhesives, and the adhesive composition (polymer C) which has physical property (K) can be obtained.

Properties (K): After applying the pressure-sensitive adhesive composition (polymer C) to the surface of ITO to form a thin film having a thickness of 200 μm after drying, in a test oven in a high temperature and high humidity environment for 500 hours in an environment of a temperature of 85 ° C. × 85% RH. After taking out, the change ratio of the resistance value of an ITO film | membrane is 1.7 times or less compared with an initial value, and just after taking out from the said oven, cloudyness does not arise in an adhesive composition (polymer C) layer.

To prepare the pressure-sensitive adhesive composition of the present invention, at least one hydroxyl group-containing monomer (monomer B) is first mixed with a pressure-sensitive adhesive composition (polymer A) made of a polymerization initiator and an acrylic resin for polymerizing the monomer B. The raw material composition for pressure-sensitive adhesives is adjusted. This raw material composition for pressure-sensitive adhesives contains at least one hydroxyl group-containing (meth) acrylate (monomer B) as a photopolymerizable compound polymerized by energy rays. The (meth) acrylate monomer B is a polymerizable compound having a photopolymerization initiator and a (meth) acryl group which is a vinyl group capable of radical polymerization, and is, for example, an ultraviolet curable resin material having curability against ultraviolet rays within a range of 300 nm to 400 nm.

In addition, in this specification, (meth) acrylate is a general term of acrylate and methacrylate.

The polymer A may be an acrylic monomer (monomer B) having an acid value of 0 to 33 and containing a hydroxyl group, while becoming a main ingredient of the pressure-sensitive adhesive composition of the present invention.

It is preferable that polymer A is an acryl-type polymer in order for monomer B to disperse easily, and it is more preferable to copolymerize a hydrophilic monomer. This is because monomer B is acrylic and contains a hydroxyl group. Moreover, since the adhesive composition of this invention needs to have transparency in the point which is used for optical use, and also the polymer A is preferable in the point that it is easy to control the intensity | strength of adhesive force, acrylic polymer is preferable.

An acid value is derived from the carboxyl group and other acidic groups (sulfonic acid group, phosphoric acid group, etc.) which a (meth) acrylate type copolymer has. The acid value refers to the number of mg of potassium hydroxide required to neutralize the free fatty acid and the resin acid contained in 1 g of the sample, and the acid value is measured by potentiometric titration.

Specifically, based on JIS-K-2501: 2003 (Japanese Industrial Standard No.), the pressure-sensitive adhesive is dissolved in a suitable solvent mixed with toluene and methanol (1 + 1) (volume ratio), and titrated with 0.1 mol / L potassium hydroxide solution. , The inflection point on the titration curve is the end point. The acid value is calculated from the appropriate amount up to the end point of the potassium hydroxide methanol solution.

Using the adhesive composition of this invention, after apply | coating and drying to a base material (or separator: may be a peeling paper), if it irradiates and light-polymerizes, an adhesive tape can be obtained.

In addition, in this specification, the adhesive tape does not require the distinction by width especially, and includes all the adhesive tapes and adhesive sheets which are prescribed | regulated by JISKZZ0109 (Japanese Industrial Standard No.). As a specific example, the single-sided adhesive tape (or single-sided adhesive sheet) which has an adhesive layer on the single side | surface of a base material, the double-sided adhesive tape (or double-sided adhesive sheet) which has an adhesive layer on both sides of a base material, or an adhesive layer does not have a base material is a film And transfer tapes (transfer tapes) formed in a shape. An adhesive sheet can also be made into large area shape, it may be used with the width | variety wide, and it may be cut | disconnected in tape shape, and may be used as an adhesive tape. In particular, an adhesive sheet and an adhesive tape wound in a roll shape are suitably used for the purpose of bonding the member to the display.

An example of the single-sided adhesive tape 5 which has the adhesive layer 2 formed using the adhesive composition of this invention in FIG. 1A is typically shown. In the single-sided adhesive tape 5, the adhesive layer 2 is formed in the single side | surface of the base material 1 used as the support body of the adhesive layer 2, and the adhesive surface of the adhesive layer 2 is protected by the separator 3. At the time of use, the separator 3 is peeled off, the adhesive face is exposed, and the adhesive layer 2 in which the base material 1 is laminated on the back face is bonded to the adherend.

Although the structure of the double-sided adhesive tape which has a base material is not specifically shown in figure, an adhesive layer is formed in both surfaces of a base material, and the adhesive surface of each adhesive layer has the structure protected by the separator.

An example of the transfer tape 6 which has the adhesive layer 2 formed using the adhesive composition of this invention in FIG. 1B is typically shown. The transfer tape 6 is provided with separators 3 and 3 on both sides of the pressure-sensitive adhesive layer 2. At the time of use, one separator 3 is peeled off and the other adhesive surface is exposed and joined to a to-be-adhered body. Moreover, only the film-form adhesive layer 2 can be transferred (transfer) to a to-be-adhered body by peeling the other separator 3 off. After peeling off the other separator 3, another to-be-adhered body can be bonded also to a new adhesive surface.

In this invention, about the improvement effect which can prevent the occurrence of cloudiness under the environmental conditions of high temperature, high humidity, the to-be-adhered body bonded in the form of a transfer tape is bad in water permeability, such as glass (inorganic glass) and acrylic resin (acrylic glass). Especially in the case of a material, a remarkable effect can be obtained. This is based on the following reasons.

When joining the resin film with good water permeability, when the water | moisture content dispersed in the adhesive tape layer is a resin film, it can simply permeate and escape. As a result, the probability of agglomeration of the water molecules is reduced, and even if the water molecules are agglomerated, they immediately exit through the resin film. Therefore, the time that cloudiness occurs is short. However, in the case of joining a material having poor water permeability, when water molecules aggregate and white turbidity occurs, water turbidity dissipates after dispersing to the peripheral end of the adhesive tape.

(Pressure-sensitive adhesive composition (polymer A))

In the present invention, the pressure-sensitive adhesive composition (polymer A) made of acrylic resin is preferably manufactured using at least one kind of acrylic monomer having an ester group (-COO-). An acrylic monomer having an ester group (-COO-), for example, the general formula CH ^₂ = CR ¹ -COOR ₂ (wherein, R ¹ is (Meth) acrylates, such as an alkyl (meth) acrylate represented by hydrogen or a methyl group, R <^2> represents a C1-C14 alkyl group, and a hydroxyl group containing (meth) acrylate.

General formula CH ^₂ = CR ¹ -COOR ₂ are methyl specifically with alkyl (meth) acrylate represented by (wherein, R ¹ is hydrogen or a methyl group, R ² has a carbon number of 1 to 14 represents the alkyl group.) (Meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (Meth) acrylate, n-pentyl (meth) acrylate, isopentyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate Isooctyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate or dodecyl (meth) acrylate. Among these, single or 2 types or more can be used together. Among these, 2-ethylhexyl (meth) acrylate or n-butyl (meth) acrylate is used preferably.

Alkyl (meth) acrylate has 1 to 14 carbon atoms of alkyl group R ² from the viewpoint of adhesive force. Since the adhesive force may fall that carbon number of an alkyl group is 15 or more, it is unpreferable. The alkyl group R ² preferably has 1 to 12 carbon atoms, preferably 4 to 12 carbon atoms, and more preferably 4 to 8 carbon atoms.

In addition, among the alkyl (meth) acrylates having 1 to 14 carbon atoms of the alkyl group R ² , alkyl (meth) acrylates having 1 to 3 or 13 to 14 carbon atoms of the alkyl group R ² may be used as part of the monomer. It is preferable to use essentially the alkyl (meth) acrylate of 4-12 carbon atoms of alkyl group R <^2> (for example, 50-100 mol%).

In addition, these alkyl groups R ² may be linear or branched.

(Monomer B)

Moreover, as (meth) acrylate containing a hydroxyl group, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acryl Elate, polyethyleneglycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, cyclohexane dimethanol mono (meth) acrylate, etc. are mentioned.

Moreover, as an acryl-type monomer containing a carboxyl group, acrylic acid, methacrylic acid, maleic acid, itaconic acid, 2-acryloyl ethyl succinic acid, etc. are mentioned, for example.

The mixing ratio between the acrylic monomer having an ester group and the acrylic monomer having a carboxyl group crosslinks the adhesive to the extent that it can follow the deformation of the adherend to impart heat resistance and to prevent it from floating or peeling off from the adherend. It is preferable that at least 1 sort (s) of a monomer is 85-95 weight part and at least 1 sort (s) of 5-15 weight part of acryl-type monomer which has a carboxyl group.

Other monomers may be added to the raw material monomer for producing the pressure-sensitive adhesive composition (polymer A) made of acrylic resin. For example, the monomer which has hydrophilic groups, such as a carboxyl group, an alkoxy silyl group, an amino group, a hydroxyl group, or a sulfonic acid group, can be selected and used.

The compounding ratio of alkyl (meth) acrylate and the monomer which has a hydrophilic group among the monomers which comprise polymer A also changes with the characteristic calculated | required by an adhesive, the kind of monomer, and the weight ratio which a hydrophilic group occupies in 1 molecule. It is preferable that the said compounding ratio is a monomer which 5-50 weight% has a hydrophilic group, for example, and 95-50 weight% is alkyl (meth) acrylate.

Moreover, as an acryl-type monomer containing an alkoxy silyl group, (gamma)-trimethoxy silyl propyl (meth) acrylate, (gamma)-methyl dimethoxy silyl propyl (meth) acrylate, or (gamma)-triethoxy silyl propyl ( Meth) acrylate, etc. are mentioned.

Moreover, as a non-acrylic-type monomer containing an alkoxy silyl group, vinyl methoxysilane, vinyl trimethoxysilane, etc. are mentioned, for example.

Moreover, as an acryl-type monomer containing an amino group, for example, dimethylaminoethyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, t-butylaminoethyl (meth) acrylate, and monomethylaminoethyl (meth) In addition to (meth) acrylate containing amino groups, such as acrylate, (meth) acrylic acid amide, itaconic acid amide, dimethyl aminopropyl (meth) acrylamide, dimethylaminoethyl (meth) acrylamide, N-methoxymethyl acrylamide , N-ethoxymethyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide or N-butoxymethyl (meth) acrylamide, and the like.

Polymer A is preferably composed of an acrylic monomer (alkyl (meth) acrylate, and an acrylic monomer having a hydrophilic group) whose main portion (for example, 50% by weight or more, more preferably 80% by weight or more). You may use together a monomer (non-acrylic monomer) other than an acryl-type monomer so that the effect of this invention may not be impaired.

In order to superpose | polymerize the acryl-type monomer which comprises polymer A, and the non-acrylic-type monomer arbitrarily mix | blended, it can carry out by well-known methods, such as solution polymerization, block polymerization, suspension polymerization, or emulsion polymerization. Of these, solution polymerization in which heat removal is easy is preferably used. Specific examples of the organic solvent used in the solution polymerization reaction include aromatic hydrocarbons such as toluene and xylene, aliphatic esters such as ethyl acetate and butyl acetate, and alicyclic hydrocarbons such as cyclohexane, or hexane and pentane. Although aliphatic hydrocarbons, such as these, etc. are mentioned, It will not specifically limit, if the said polymerization reaction is not inhibited. One type of these solvents may be used, or two or more types may be mixed and used. What is necessary is just to determine the usage-amount of a solvent suitably.

In general, in a solution polymerization reaction, as the polymerization temperature increases, the molecular weight of the resulting polymer decreases. When performing a polymerization reaction at the reflux temperature of a solvent, the polymer A can be obtained, removing the heat of polymerization reaction by using the solvent which has a boiling point temperature suitable for a polymerization reaction.

In addition, the pressure-sensitive adhesive composition (polymer A) made of the acrylic resin of the present invention can suppress the change in the surface resistivity of the transparent conductive film even when used as an adhesive composition for the adhesive tape bonded to the ITO surface of the transparent conductive laminate having a transparent conductive film. Can be. Since the said adhesive composition is what is called an acid free adhesive composition, it is preferable.

In this case, it is more preferable that the acid value of polymer A is 0-33 as an index which can suppress the change of the surface resistivity of a transparent conductive film.

Commercially available pressure-sensitive pressure-sensitive adhesives may be used for polymer A, which is a pressure-sensitive adhesive composition composed of acrylic resin of the present invention. As such a commercially available pressure sensitive adhesive, what is called an acid free adhesive composition, such as an acrylic adhesive which does not have a carboxyl group and acrylic acid, can be used. As a commercially available acid-free adhesive composition, for example, SK Dyne 2147 (made by Soken Chemical Co., Ltd.), the adhesive tape with little change of the surface resistivity of commercially available ITO, For example, CS9621 (made by Nitto Denko Co., Ltd.), MHM-F25, MHM-F50, MHM-F125 (made by Nichei Chemical Co., Ltd.), ZB7032W (made by DIC Corporation), etc. are mentioned.

As for the molecular weight distribution of polymer A, it is preferable that a number average molecular weight (Mn) is 70,000 or more, and a weight average molecular weight (Mw) is 1 million or more. Moreover, it is more preferable that weight average molecular weights (Mw) are 12 million or more.

Thus, when the molecular weight of polymer A is large, it is excellent in heat resistance and weather resistance.

When molecular weight is too big | large, the viscosity of an adhesive composition will become high too much and a processing speed will fall when laminating | stacking an adhesive composition on a base film. Although it is thought that the upper limit of the molecular weight can be further increased by devising a coating method such as raising the temperature of the coating material (adhesive coating liquid), when coating at room temperature, for example, a material having a weight average molecular weight (Mw) of less than 5 million It is considered desirable.

Moreover, the adhesive composition of this invention contains at least 1 sort (s) of a hydroxyl group containing (meth) acrylate monomer (monomer B).

In one preferable embodiment of the raw material composition for pressure-sensitive adhesive of the present invention, an acrylic polymer and a hydroxyl group-containing (meth) acrylate monomer obtained by polymerizing a monomer of an alkyl (meth) acrylate not containing a hydroxyl group and an acrylic acid. Is present in a mixed state dispersed separately without copolymerization. Moreover, in another preferable embodiment, the polymer A and hydroxyl group containing (meth) acrylate monomer obtained by superposing | polymerizing the monomer containing a hydrophilic monomer are contained in the raw material composition for adhesives.

It is preferable that content (the total amount of monomer B is two or more types of monomer B) is 5-20 weight part with respect to 100 weight part of main polymers (polymer A), and is in the environment of temperature 85 degreeC x humidity 85% RH. When high durability is needed, such as to test, it is more preferable that it is 5-15 weight part.

Moreover, in the adhesive composition which consists of an acryl-type polymer containing a well-known hydroxyl group, it may contain a little (meth) acrylate monomer containing a hydroxyl group as an unreacted monomer. However, the content rate is remarkably low compared with the content rate of the hydroxyl group-containing (meth) acrylate in the raw material composition for pressure-sensitive adhesive of the present invention.

The manufacturing method of the adhesive composition (polymer C) which concerns on this invention is demonstrated below. The raw material composition for pressure-sensitive adhesives formed by mixing at least one type (monomer B) of a hydroxyl group-containing (meth) acrylate monomer and a photopolymerization initiator with a pressure-sensitive adhesive composition (polymer A) made of acrylic resin is adjusted. Then, the adhesive composition (polymer C) can be obtained by making the polymerization reaction by light irradiation using the said raw material composition for adhesives.

Pressure sensitive pressure-sensitive adhesive composition (polymer A) made of acrylic resin, (meth) acrylate monomer (monomer B) containing hydroxyl group and acrylic syrup (photopolymerization initiator) state containing photopolymerization initiator, or coating and hydroxyl group-containing In order to uniformly disperse the monomer (monomer B), the acrylic syrup is prepared as a resin solution dissolved in an organic solvent.

In the step of dissolving the hydroxyl group-containing (meth) acrylate monomer (monomer B) in the pressure-sensitive adhesive composition (polymer A) made of the above acrylic resin to obtain an acrylic syrup, before dissolving the monomer B in the polymer A, if necessary, It is preferable to wash with an organic solvent or the like. Thereby, an unreacted acryl-type monomer can be removed from the polymer A. Moreover, the weight of the polymer A can be more accurately quantified, and the acrylic syrup whose content of the monomer B and a photoinitiator used by the next process were adjusted more appropriately can be produced. In the case of producing an acrylic syrup, after dissolving the monomer B in the polymer A, washing with the organic solvent or the like may be performed.

Moreover, after adding a photoinitiator to an acrylic syrup, if ultraviolet light contained in room light or sunlight acts on an acrylic syrup, there exists a possibility that a polymerization reaction may advance. For this reason, since management of an acrylic syrup becomes difficult, it is preferable to add a photoinitiator as soon as possible before the application | coating process which is a subsequent process. The same applies to the resin solution in which acrylic syrup is dissolved in an organic solvent. It should be noted that the photoinitiator is prevented from initiating the reaction before application and film formation due to external factors.

In order to provide the fluidity | liquidity suitable for base material application | coating, the adhesive composition (polymer C) of this invention is preferably made into the adhesive coating liquid which mix | blended the appropriate amount of organic solvent. As an organic solvent used in an adhesive coating liquid, Specifically, For example, aromatic hydrocarbons, such as toluene and xylene, aliphatic esters, such as ethyl acetate and butyl acetate, alicyclic hydrocarbons, such as cyclohexane, or hexane Although aliphatic hydrocarbons, such as pentane, etc. are mentioned, It will not specifically limit, if the objective of the said application | coating and dispersion can be achieved.

When manufacturing an adhesive coating liquid, what is necessary is just to obtain the organic solvent liquid which three types of polymer A, the monomer B, and a photoinitiator melt | dissolve in the organic solvent in a suitable mix ratio with each other, The order to dissolve is not specifically limited. For example, the monomer B and a photoinitiator may be directly injected into the acrylic syrup which melt | dissolved the polymer A, and the liquid which melt | dissolved the monomer B and the photoinitiator in the appropriate amount of organic solvent in the polymer A may be injected.

The hydroxyl group-containing (meth) acrylate monomer used as the monomer B in the present invention is 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) Acrylate, 4-hydroxybutyl (meth) acrylate, 5-hydroxypentyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 7-hydroxyheptyl (meth) acrylate, 8-hydroxy Hydroxyoctyl (meth) acrylate, 7-methyl-8-hydroxyoctyl (meth) acrylate, 2-methyl-8-hydroxyoctyl (meth) acrylate, 9-hydroxynonyl (meth) acrylate, 10 -Hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, etc. are mentioned. 1 type may be used for these and they may use 2 or more types together. In particular, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate or 4-hydroxybutyl (meth) acrylate is preferably used.

As the hydroxyl group-containing (meth) acrylate, hydroxyalkyl (meth) acrylate is preferably used. This can be obtained by esterifying one hydroxyl group of two hydroxyl groups of a dihydric alcohol (diol compound) with acrylic acid or methacrylic acid, and each having one hydroxyl group and one vinyl group.

The kind of monomer B used by this invention changes with adhesive force and storage elastic modulus of the adhesive tape required. In the case of using an adhesive tape having a rework property, the adhesive composition having high storage elastic modulus and a hard adhesive composition (polymer C) may be used, so that Tg is preferably room temperature or more as a guide for selecting the monomer B. In the case where a strong adhesive force is required or when the storage elastic modulus is to be lowered, on the contrary, a monomer B in which Tg is lower than room temperature and preferably Tg becomes negative temperature is required.

(Photoinitiator)

Although it does not specifically limit as a photoinitiator (polymerization catalyst) used for this invention, For example, an acetophenone system photoinitiator, a benzoin system photoinitiator, a benzophenone system photoinitiator, a thioxanthone system photoinitiator, etc. are mentioned.

Examples of the acetophenone-based photopolymerization initiator include acetophenone, p- (tert-butyl) 1 ′, 1 ′, 1′-trichloroacetophenone, chloroacetophenone, 2 ′, 2′-diethoxyacetophenone and hydroxyaceto Phenone, 2, 2-dimethoxy-2'-phenylacetophenone, 2-aminoacetophenone, dialkylaminoacetophenone, etc. are mentioned.

As a benzoin type photoinitiator, benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 1-hydroxy cyclohexylphenyl ketone, 2-hydroxy 2-methyl -1-phenyl-2-methyl propane-1-one, 1- (4-isopropylphenyl) -2-hydroxy 2-methyl propane-1-one, benzyl dimethyl ketal, and the like.

As a benzophenone type photoinitiator, benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, methyl-o- benzoyl benzoate, 4-phenylbenzo phenone, hydroxy benzophenone, hydroxypropyl benzophenone, acryl benzophenone, or 4, 4'-bis (dimethylamino) benzophenone etc. are mentioned.

As a thioxanthone type photoinitiator, thioxanthone, 2-chloro thioxanthone, 2-methyl thioxanthone or diethyl thioxanthone, dimethyl thioxanthone, etc. are mentioned.

As another photoinitiator, (alpha)-acyl oxime ester, benzyl- (o-ethoxycarbonyl)-(alpha)-monooxime, acyl phosphine oxide, glyoxy ester, 3-ketocoumarin, 2-ethyl Anthraquinone, camphor quinone, tetramethylthiuram sulfide, azobisisobutyronitrile, benzoyl peroxide, dialkyl peroxide or tert-butyl peroxy fibrate and the like.

These photoinitiators may use only one type or may use two or more types together. It is preferable that content of a photoinitiator is 0.005-5 mass% in the weight percentage which makes 100 mass% whole quantity of a polymeric compound (in the case of this invention, hydroxyl group containing (meth) acrylate), Especially 0.01-2 It is preferable that it is mass%. If content of a photoinitiator is 0.005 mass% or more, a polymeric compound can be polymerized in a short time, and if it is 5 mass% or less, the residue of a photoinitiator is hard to remain in hardened | cured material.

In addition, as mentioned above, it is preferable that hydroxyl-group-containing (meth) acrylate monomer B (total amount when using two or more types) is 3-20 weight part with respect to 100 weight part of polymer A, for example, temperature When high durability is required under high temperature, high humidity, such as testing in an environment of 85 ° C. × 85% RH, the content of the photopolymerization initiator based on 100 parts by weight of polymer A is 0.01. 0.5 weight part is preferable.

In this invention, it is preferable to polymerize in the adhesive composition after photopolymerization in 40-80 weight% of monomers, Preferably it is 50-75 weight%. That is, it is preferable to leave unreacted monomer in the range of 60-20 weight%, Preferably it is 50-25 weight%. If the polymerization rate is less than 40% by weight, sufficient adhesion is not imparted to the obtained polymer, and at a polymerization rate of more than 80% by weight, the cohesive force is lowered. It is also raised.

The material of the base material used when apply | coating a raw material composition for adhesives to a base material, and forming an adhesive tape has transparency and heat resistance, and has a small scattering and absorption in the ultraviolet region near 350 nm-400 nm which inhibits hardening of an ultraviolet curable resin composition. desirable. For example, polyester, such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polysulfone, polyether sulfone, polystyrene, polyacrylate, polyether ether ketone, polycarbonate, polyolefin, such as polyethylene and polypropylene Polyamide, nylon, polyimide, triacetyl cellulose (cellulose triacetate), cellulose diacetate, poly (meth) acrylic acid alkyl ester, poly (meth) acrylic acid ester copolymer, polymethyl methacrylate, polytetrafluoroethylene Fluorine resins such as polytrifluoroethylene, polyvinyl chloride, polyvinylidene chloride copolymers, vinyl chloride-vinyl acetate copolymers, polyvinyl alcohol, cellophane or cellulose films, and the like. These materials may be used individually by 1 type, or may use 2 or more types together.

In particular, it is preferable to use polyethylene terephthalate in the above-mentioned substrates in terms of heat resistance, UV transmittance and price.

Moreover, it is preferable that it is 16 micrometers-200 micrometers, and, as for the thickness of a base material, it is more preferable that it is 50 micrometers-188 micrometers. If the thickness of the base material is too thin, the handling property is bad, and if the thickness of the base material is too thick, it is disadvantageous in terms of high manufacturing cost and also in disadvantage in that the handling property is lowered.

(Transparent resin film)

As the base material 1 used for the adhesive tape of this invention, a transparent resin film is preferable. This transparent resin film is at least 150 degreeC, considering that it can also heat-process at about 150 degreeC high temperature in the process of processing with an optical element or an optical apparatus using the transparent conductive laminated body which the adhesive tape adhered and protected. It is necessary to have heat resistance to withstand.

It is preferable that it is any 1 type selected from the resin film group which consists of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and cyclic polyolefin (COP) which are heat resistant resin as a material of such a heat resistant resin film. All of these heat resistant resins have a heat resistance temperature of 200 ° C. or higher, and can be used without problems at 150 ° C. which is a normal heat treatment temperature of the transparent conductive laminate.

Moreover, it is preferable that the transparent resin film used for the base material of the adhesive tape of this invention can be wound in roll shape from the workability of the manufacturing process of a transparent conductive laminated body. For this purpose, the transparent resin film needs to have flexibility. In order to have flexibility, it is preferable that the thickness of a transparent resin film is 500 micrometers or less, and more preferable thickness is 10-150 micrometers. If the thickness is 10 μm or less, the flexibility is too strong and handling is difficult, and if the thickness exceeds 500 μm, the rigidity is too strong and cannot be wound into a roll shape, which is not preferable.

In addition, the transparent resin film used for the base material of the adhesive tape of this invention has the thermal contraction rate at 30 degreeC hold | maintained for 30 minutes in all the MD direction (flow direction at the time of film shaping | molding) and TD direction (width direction at the time of film shaping). It is preferable that it is 0.5% or less in the direction.

As described above, the transparent resin film used for the base material of the adhesive tape of the present invention has a heat shrinkage of 0.5% or less in all directions in the MD direction and the TD direction, thereby reducing curl due to heat deformation generated in the heat treatment process or the like. Can be.

For this purpose, it is preferable that the transparent resin film used for the base material of the adhesive tape of this invention performs an annealing process for reducing a heat shrink rate. By carrying out an annealing treatment, the heat shrinkage can be 1% or less, preferably 0.5% or less of polyester resin.

The conventionally well-known method can be performed for the annealing process performed with respect to the transparent resin film used for the base material of the adhesive tape of this invention.

It is preferable that the transparent resin film used for the base material of the adhesive tape of this invention is biaxially oriented of a polyethylene terephthalate (PET) film, for example from an excellent mechanical strength. A biaxially orientated PET film generally refers to a film in which a non-stretched PET film is stretched by about 2 to 6 times in the longitudinal direction and the width direction, respectively, and then subjected to heat treatment and crystallized alignment. In addition, when using a biaxially-oriented PET film, the annealing treatment is performed such that the heat shrinkage ratio of the PET film dimension after heating the PET film at 150 ° C. for 30 minutes is less than 0.5% in both the longitudinal direction of the PET film and the direction perpendicular thereto. It is more preferable to adjust by the etc. Such a PET film is easy to manufacture a high precision panel because there is little deformation of a PET film substrate in the process heat-processed at high temperature.

In addition, the transparent resin film used for the base material of the adhesive tape of this invention is further annealed using the unstretched transparent PET film filmed by the melt-extrusion film forming method, the solution casting film forming method, etc., and thermal contraction rate is 0.5. It can be made into% or less.

Moreover, when it manufactures according to the solution casting film forming method, since the residual stress applied to MD direction and TD direction of a film can be made small, it is preferable.

Moreover, a cyclic polyolefin can also be used for the transparent resin film used for the base material of the adhesive tape of this invention. The cyclic polyolefin is a polyolefin having an alicyclic structure in the main chain. Examples of the alicyclic structure of the main chain include a cycloalkane structure and a cycloalkene structure. Specific examples of the cyclic polyolefin include norbornene polymers, monocyclic cyclic olefin polymers, cyclic conjugated diene polymers and their hydrogenated substances, vinyl alicyclic hydrocarbon polymers and their hydrogenated substances, and cyclic olefin monomers and ethylene addition polymers. Preferred examples can be given. As cyclic polyolefin type resin marketed, the brand name Genoa 1060R by the Japan Xeon Co., Ltd. is mentioned, for example.

(Peel film)

In the adhesive tape of this invention, the peeling process release film 3 is laminated | stacked on one side (for example, upper surface of FIG. 1) of a transparent resin film with the adhesive layer 2 interposed. As a base material of the peeling film used by this invention, paper, such as a good quality paper, glassine paper, a coated paper, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyphenylene sulfide (PPS) ), Synthetic resins such as polyolefin resins such as polyethylene and polypropylene, polyvinyl chloride resins, polyurethane resins, acrylic resins, and fluorine resins, and the like, but synthetic resins are preferably used in view of ease of handling.

The thickness of a release film base material is not specifically limited, A foamed base material can also be used, The thing which laminated | stacked several sheet-like base material into the multilayered structure can also be used. In addition, a sheet-like base material may be colored, and the coating layer may be laminated | stacked for the provision of functionality.

Peeling process is given to the single side | surface of the peeling film base material used by this invention. As a method of peeling treatment, a well-known method, such as apply | coating a silicone compound, a fluorine type compound, a long chain alkyl type compound, etc. to one side of a sheet-like base material can be used.

(Transparent conductive laminate)

The adhesive tape of this invention is used by bonding to the transparent conductive film of the transparent conductive laminated body in which the transparent conductive film layer is formed in one side of a transparent base material, and the hard coating layer was formed in the other surface of the transparent base material preferably. Or it bonds to the transparent conductive film of the transparent conductive laminated body in which the transparent conductive film layer was formed on both surfaces of a transparent base material, and is used. It is preferable that it is 1 type or transparent glass plate chosen from the heat resistant resin group which consists of a polyethylene terephthalate (PET) resin, a polyethylene naphthalate (PEN) resin, and a cyclic polyolefin (COP) type resin as a transparent base material used for a transparent conductive laminated body. .

10-250 micrometers is preferable and, as for the thickness of the transparent base material used for a transparent conductive laminated body, 30-200 micrometers is more preferable. When the thickness of a transparent resin base material is thinner than 10 micrometers, since handling becomes difficult, it is unpreferable. When the thickness of a transparent resin base material is thicker than 250 micrometers, since transparency falls, manufacturing cost also becomes high and the processing speed in the manufacturing process of a transparent conductive laminated body falls, it is unpreferable. From the above point, 10-250 micrometers is preferable and, as for the thickness of a transparent resin base material, 30-200 micrometers is more preferable. Moreover, in order to improve the adhesiveness of a transparent resin base material and a transparent conductive film, a suitable easily adhesive resin layer is laminated | stacked on the surface of a transparent resin base material, a flame treatment, a corona treatment, a plasma treatment, etc. The surface treatment of may be performed. Moreover, you may provide a base layer between a transparent resin base material and a transparent conductive film.

The hard coat layer formed on the transparent base material of a transparent conductive laminated body should just be hard-coating enough to be used for the surface material of a touchscreen, and there is no problem in practicality if the measured value in a pencil hardness test is 2H or more normally. There is no restriction | limiting in particular in resin used for a hard-coat layer, A thermosetting hard-coating resin, such as silicone type and a melamine type, or ultraviolet curable hard coating resin, such as silicone type, an acryl type, etc. can be used.

Moreover, 1-10 micrometers is preferable and, as for the thickness of a hard coat layer, 2-8 micrometers is more preferable. When the thickness of the hard coating layer is thinner than 1 μm, hard coating properties are not obtained, and scratch resistance is lowered, and curing failure is more likely to occur when an ultraviolet curable hard coating resin is used.

In addition, when the thickness of the hard coating layer is thicker than 10 μm, cracks tend to occur in the hard coating layer, and curling tends to occur on the hard coating film itself.

Moreover, you may add the additive for providing various functions, such as an antistatic agent and a ultraviolet absorber, to a hard coating layer as needed. As a method for forming the hard coating layer on the surface of the transparent substrate, a known method such as a reverse coating method, a die coating method or a gravure coating method can be used.

In addition, the transparent conductive film layer is formed on one surface of the transparent base material of the transparent conductive laminate according to the present invention by any method selected from the group of transparent conductive film formation methods consisting of sputtering, vacuum evaporation, and ion plating.

It is preferable to include the process of forming the wiring pattern which consists of the said transparent conductive film in the formation process of this transparent conductive film or after the formation process of the said transparent conductive film. A well-known method can be used for the method of forming the wiring pattern of a transparent electrode. Representative methods include patterning by photolithography. Moreover, what provided the transparent conductive film layer in the glass substrate can also be used as a transparent conductive substrate.

The coating apparatus which applies the raw material composition for pressure-sensitive adhesive to a base material may be any apparatus as long as it is provided with a means for supplying and apply | coating uniformly the raw material composition for pressure-sensitive adhesive on a base material. As the coating device, a device having a configuration consisting of a tank, a liquid pump, a pipe, a foreign matter removing filter, and a coater head for storing the pressure-sensitive adhesive raw material composition can be continuously applied and applied onto a substrate. (Not shown). As for a coater head, a die coater etc. are preferable, for example.

The thin film layer (coating film) of the raw material composition for pressure-sensitive adhesive is formed on one side of the substrate by the coating device.

The raw material composition for pressure-sensitive adhesive immediately after coating with the coating device is uncured and liquid, and has fluidity suitable for coating.

When the raw material composition for an adhesive is a syrup type, it is preferable that the thickness of a coating film exists between 0.05-3 mm, More preferably, it is 0.1-2 mm. The thickness of a coating film is substantially the same as the thickness of the adhesive layer obtained by photopolymerization. Therefore, it is preferable that the thickness of the adhesive layer in the adhesive tape of this invention also exists between 0.05-3 mm, More preferably, it is 0.1-2 mm.

When the raw material composition for an adhesive is a solution type, the thickness of the coating film before drying becomes thicker than the syrup type, and becomes the number which divided the thickness of the coating film by the density | concentration. The thickness of the coating film after drying is the same as that of the syrup type.

When the coating film is too thin, the thickness of the pressure-sensitive adhesive layer also becomes thin, so that the shock absorbing performance deteriorates. Moreover, when a coating film is too thick, it is disadvantageous in that manufacturing cost rises.

An example of the manufacturing method of the adhesive tape of this invention is shown typically in FIG. In the apparatus shown in FIG. 2, the pressure-sensitive adhesive raw material composition is supplied from the die coater 21 onto the substrate 11 to form a coating film 12. Reference numeral 22 is a backup roll 22 disposed opposite the die coater 21 and supporting the substrate 11. The base material 11 in which the coating film 12 was formed is conveyed along the longitudinal direction, and is dried so that the solvent in the coating film 12 may be removed in the drying chamber 23. On the coating film 12 after drying, the separator 13 is supplied onto the coating film 12 by the separator supply means 24, and is bonded by the nip roll 25. As shown in FIG.

The temperature in the drying chamber 23 may be a temperature at which the solvent in the coating film 12 is sufficiently volatilized, and is preferably maintained at a temperature at which the polymerizable compound is not thermally polymerized.

The separator supply means 24 is comprised from the roll body by which the separator 13 was wound, the shaft which hold | maintains the roll body, etc.

The nip roll 25 consists of a pair of roll which pinches | interposes the base material 11 in which the coating film 12 was formed, and the separator 13, and is an apparatus which bonds both. It is preferable to provide the pressurizing means for joining, and it is preferable that at least one roll is rubber | gum so that it is easy to apply uniform pressure with respect to a film.

As a separator, for example, a polycarbonate film, a polyarylate film, a polyether sulfone film, a polysulfone film, a polyester film, a polyamide film, a polyimide film, a polystyrene film, a polyolefin film, a norbornene-based film, phenoxy A peeling film having a peeling treatment with a silicone-based peeling agent or the like on a single layer or a multilayer plastic film made of an ether polymer film or an organic air permeable film, and having at least one surface peelable; Release paper having a peeling treatment with a silicone release agent or the like on the paper and at least one side having peelability; Films in which the film itself, such as a fluorine resin film and a predetermined polyolefin film, has peelability; The film etc. which added the peeling agent inside and formed into a film are mentioned. Although there is no limitation in the thickness of a separator, Usually, it is 5 to 500 micrometers, Preferably it is 10-100 micrometers in many cases. The separator shall be selected in accordance with the adhesive to be used and the intended use (peel strength).

The ultraviolet irradiation device 26 includes a light source unit for generating ultraviolet rays and a cooling device for removing heat generated from the light source. The light source unit can be freely selected, such as a lamp light source such as a high pressure mercury lamp or a metal halide lamp, or a light emitting diode having an emission peak in the ultraviolet region, so long as it can obtain an ultraviolet irradiation amount for sufficiently curing the polymerizable compound in the coating film 12.

The coating film 12 polymerizes the polymeric compound in the coating film 12 by appropriate light irradiation, and raises cohesion force and expresses adhesiveness.

In addition, when manufacturing the double-sided adhesive tape which does not have a support body like a transfer tape as an adhesive tape of this invention, a separator is supplied not only to the separator 13 but also as the base material 11 for conveyance, and an adhesive layer is formed on a separator.

Moreover, when manufacturing the double-sided adhesive tape which has an adhesive layer on both surfaces of a support body as the adhesive tape of this invention, application | coating and drying of a coating liquid, and photopolymerization of a coating film can be performed simultaneously or sequentially in each surface.

After light irradiation for the photopolymerization reaction, curing for the crosslinking reaction is performed. Although the curing method is not specifically limited, For example, the adhesive tape wound on the roll is left to stand by predetermined temperature and time conditions. Although curing temperature depends also on the kind of crosslinking agent, etc., it is preferable to heat (for example, 40-80 degreeC) as needed.

After the adhesive layer was bonded to the adherend, the resultant adhesive layer was left to stand at 23 ° C. and 50% RH for 1 hour, and then the adhesive force to glass and acrylic resin when peeled at a peel rate of 300 mm / min was 10 N / 25 mm. It is preferable that it is above. In order to obtain such a high adhesive force, it is preferable that the storage elastic modulus (G ') at 23 degrees C and 1 Hz of the adhesive which comprises an adhesive layer is 1x10 <^4> Pa or more and less than 1x10 <^6> Pa, and is in 85 degreeC and 85% RH environment. When high durability is required, such as by performing a test, it is more preferable that it is 5 * 10 <^4> Pa or more and 5 * 10 <^5> Pa or less. When the storage elastic modulus is low, the pressure-sensitive adhesive layer tends to be softly deformed, so it is easy to join. If the storage elastic modulus is in the above range, the bonding property at the time of joining two members (for example, a hard plate such as a glass plate or an acrylic plate), durability after bonding, furthermore, adhesive strength and the like are combined.

The adhesive tape of this invention can be used suitably for the use of bonding a member to the ITO surface of the transparent conductive laminated body used for a touchscreen etc.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated concretely based on an Example.

The adhesive tape of Examples 1-3 and Comparative Examples 1-6 was produced with the following manufacturing method using the raw material composition for adhesives shown in following Table 1.

Polymer A
(Acid value)

Hardener, additive
Monomer B
Photopolymerization
Initiator Kinds Weight portion Kinds Weight portion
Example 1

2094
(33)
E-AX
0.27
4HBA
10
Irg184
Example 2

2147
(0)
TD-75
A-50
0.06
0.04
4HBA
5
Irg184
Example 3

2147
(0)
TD-75
A-50
0.06
0.04
4HBA
10
Irg184
Comparative Example 1

Blank
-
-
-
Comparative Example 2

2094
(33)
E-AX
0.27
-
-
-
Comparative Example 3

2147
(0)
TD-75
A-50
0.06
0.04
-
-
-
Comparative Example 4

2147
(0)
TD-75
A-50
0.06
0.04
4HBA
15
Irg184
Comparative Example 5

AA / 2EHA = 13/87
(101)
EX-830
0.8
4HBA
6
Irg651
Comparative Example 6

AA / 2EHA = 5/95
(38)
EX-830
0.6
4HBA
4
Irg651

In Table 1, 2094 and 2147 represent SK Dyne® 2094 and SK Dyne® 2147, respectively, "AA / 2EHA" represents a copolymer of acrylic acid and 2 ethylhexyl acrylate, and "4HBA". Represents 4-hydroxybutyl acrylate, and Irg184 and Irg651 represent Irgacure® 184 and Irgacure® 651, respectively. In addition, the photoinitiator of the product name Irgacure (trademark) 184 has 1-hydroxy cyclohexyl phenyl- ketone as an active ingredient. The photopolymerization initiator of the product name Irgacure (registered trademark) 651 contains benzyl dimethyl ketal as an active ingredient.

(Example 1)

As a material of the pressure-sensitive adhesive composition (polymer A), a solution prepared by blending SK Dyne 2094 (manufactured by Soken Chemical Co., Ltd., acid value: 33) and E-AX (Soken Chemical Co., Ltd.) as a curing agent at 1000 g: 2.7 g, respectively Using this, a pressure-sensitive adhesive composition (polymer A) made of an acrylic resin polymer was obtained.

100.0 g of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Materials Industry Co., Ltd .; 4HBA) as a (meth) acrylate monomer (monomer B) further containing a hydroxyl group in the obtained pressure-sensitive adhesive composition (polymer A), 0.10 g of an alkyl phenone system photoinitiator (made by Chiba Japan Co., Ltd .; product name: Irgacure 184) was added, and the raw material composition for adhesives was produced.

The raw material composition for pressure-sensitive adhesive was applied to an upper surface of a base film made of polyethylene terephthalate (manufactured by Mitsubishi Resin Co., Ltd .; product name: T100, thickness of 38 μm) using an applicator to apply a thickness of the pressure-sensitive adhesive layer to 200 μm after drying. Then, it dried and the laminated body which laminated | stacked the adhesive layer was produced.

Next, a separator (manufactured by Mitsubishi Resin Co., Ltd .; product name; MRF, thickness of 38 µm) was bonded to the surface of the pressure-sensitive adhesive layer of the obtained laminate, to prepare a laminated film in which the pressure-sensitive adhesive was laminated.

Thereafter, while conveying the obtained laminated film, the UV irradiation light was adjusted using a continuous UV irradiation device using a high pressure mercury lamp to adjust the conveyance speed, UV irradiation light amount and the like of the pressure-sensitive adhesive laminated film to be about 200 mJ (wavelength 300 nm to 400 nm). Irradiation was carried out, and a polymerization reaction was carried out using a photopolymerization initiator to finally obtain an adhesive tape of Example 1 in which an adhesive composition (polymer C) was laminated.

(Example 2)

SK Dyne 2147 (manufactured by Soken Chemical Co., Ltd., acid value: 0) as a material of the pressure-sensitive adhesive composition (polymer A), TD-75 (manufactured by Soken Chemical Co., Ltd.) as an curing agent, and A-50 (manufactured by Soken Chemical Co., Ltd.) as an additive The pressure-sensitive adhesive composition (polymer A) made of an acrylic resin polymer was obtained using a solution prepared by mixing 1000 g: 0.4 g: 0.6 g, respectively. In addition to the obtained pressure-sensitive adhesive composition (polymer A), 50.0 g of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Material Industry Co., Ltd .; 4HBA) as an hydroxyl group-containing (meth) acrylate monomer (monomer B), and alkylene The adhesive tape of Example 2 was obtained like Example 1 except having added 0.10 g of field-type photoinitiators (The Chiba Japan Co., Ltd. product; product name: Irgacure 184), and manufactured the adhesive raw material composition.

(Example 3)

SK Dyne 2147 (manufactured by Soken Chemical Co., Ltd., acid value: 0) as a material of the pressure-sensitive adhesive composition (polymer A), TD-75 (manufactured by Soken Chemical Co., Ltd.) as an curing agent, and A-50 (manufactured by Soken Chemical Co., Ltd.) as an additive The pressure-sensitive adhesive composition (polymer A) made of an acrylic resin polymer was obtained using a solution prepared by mixing 1000 g: 0.4 g: 0.6 g, respectively. In addition to the obtained pressure-sensitive adhesive composition (polymer A), as a hydroxyl group-containing (meth) acrylate monomer (monomer B), 100.0 g of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Materials Industry Co., Ltd .; 4HBA), and alkylene The adhesive tape of Example 3 was obtained like Example 1 except having added 0.10 g of field-type photoinitiators (The Chiba Japan Co., Ltd. product; product name: Irgacure 184), and manufactured the adhesive raw material composition.

(Comparative Example 1)

As a reference (blank) for comparison with the change of the surface resistivity of the ITO surface when the adhesive tape of the present invention is bonded to the ITO surface, an ITO film (Nakai Kogyo Co., Ltd .: Metaforce 125R2 × A, surface resistivity 250 mW / m ²⁾ ), The ITO film was thrown into the oven as it was without bonding the adhesive tape of this invention.

(Comparative Example 2)

As a material of the raw material composition for polymer (polymer C), SK Dyne 2094 (manufactured by Soken Chemical Co., Ltd., acid value: 33) and E-AX (manufactured by Soken Chemical Co., Ltd.) were respectively blended at 1000 g: 2.7 g as a curing agent. Except having manufactured (Polymer C), it carried out similarly to Example 1, and obtained the adhesive tape of the comparative example 2.

(Comparative Example 3)

SK Dyne 2147 (manufactured by Soken Chemical Co., Ltd., acid value: 0) as a material of the raw material composition for polymer (polymer C), TD-75 (manufactured by Soken Chemical Co., Ltd.) as an curing agent, and A-50 (manufactured by Soken Chemical Co., Ltd.) as an additive The adhesive tape of the comparative example 3 was obtained like Example 1 except having mix | blended in 1000g: 0.4g: 0.6g, respectively, and manufactured the adhesive composition (polymer C).

(Comparative Example 4)

SK Dyne 2147 (manufactured by Soken Chemical Co., Ltd., acid value: 0) as a material of the pressure-sensitive adhesive composition (polymer A), TD-75 (manufactured by Soken Chemical Co., Ltd.) as an curing agent, and A-50 (manufactured by Soken Chemical Co., Ltd.) as an additive The pressure-sensitive adhesive composition (polymer A) made of an acrylic resin polymer was obtained using a solution prepared by mixing 1000 g: 0.4 g: 0.6 g, respectively. In addition to the obtained pressure-sensitive adhesive composition (polymer A), 150.0 g of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Materials Industry Co., Ltd .; 4HBA) as an hydroxyl group-containing (meth) acrylate monomer (monomer B), and alkylene The adhesive tape of Comparative Example 4 was obtained in the same manner as in Example 1 except that 0.10 g of a non-based photopolymerization initiator (manufactured by Chiba Japan Co., Ltd .; product name: Irgacure 184) was added to produce a pressure-sensitive adhesive raw material composition (polymer C).

(Comparative Example 5)

As a material of the pressure-sensitive adhesive composition (Polymer A), a polymer obtained by concentration of 40% of acrylic acid / acrylic acid 2 ethylhexyl = 87:13 (acid value: 101.25) with ethyl acetate and a curing agent EX-830 (manufactured by Nagase Chemtex Co., Ltd.) The pressure-sensitive adhesive composition (polymer A) made of acrylic resin polymer was obtained using the solution prepared by mix | blending 1000g: 8.0g, respectively. In addition to the obtained pressure-sensitive adhesive composition (polymer A), 60.0 g of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Materials Industry Co., Ltd .; 4HBA) as an hydroxyl group-containing (meth) acrylate monomer (monomer B), and alkylene The adhesive tape of Comparative Example 5 was obtained in the same manner as in Example 1 except that 0.40 g of a non-based photopolymerization initiator (manufactured by Chiba Japan Co., Ltd .; product name: Irgacure 651) was added to produce a pressure-sensitive adhesive raw material composition (polymer C).

(Comparative Example 6)

As a material of the pressure-sensitive adhesive composition (Polymer A), a polymer obtained by concentration of 34% of acrylic acid / acrylic acid 2 ethylhexyl = 95: 5 (acid value: 38.2) with ethyl acetate and EX-830 (manufactured by Nagase Chemtex Co., Ltd.) as a curing agent. The pressure-sensitive adhesive composition (polymer A) made of acrylic resin polymer was obtained using the solution prepared by mix | blending 1000 g: 6.0 g, respectively. In addition to the obtained pressure-sensitive adhesive composition (polymer A), 40.0 g of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Materials Industry Co., Ltd .; 4HBA) as an hydroxyl group-containing (meth) acrylate monomer (monomer B), and alkylene The adhesive tape of Comparative Example 6 was obtained in the same manner as in Example 1 except that 0.60 g of a non-based photopolymerization initiator (manufactured by Chiba Japan Co., Ltd .; product name: Irgacure 651) was added to produce a pressure-sensitive adhesive raw material composition (polymer C).

<Test method of adhesive tape>

Using the adhesive tapes of Examples 1 to 3 and Comparative Examples 2, 3, 5, and 6, a test sample piece in which an adhesive tape was bonded to an ITO film was prepared, and the change ratio of the resistance value of the ITO film was measured and white turbidity was measured. A test was conducted to confirm the occurrence. In addition, in Comparative Example 1 as a blank, the ITO film was put into the oven as it is without bonding the adhesive tape to the ITO film, and the change ratio of the resistance value of the ITO film was measured.

(Measuring method of change magnification of transparent conductive film resistance value)

An ITO film (manufactured by Nakai Kogyo Co., Ltd., product name: Metaforce 125R2 × A, surface resistivity 250 mW / m ² ) was prepared, and it was cut into a rectangle having a width of 25 mm and a length of 120 mm. A test sample in which a 25 mm wide x 100 mm long adhesive tape is bonded to an ITO surface of a cut rectangular ITO film piece with a pressure sensitive adhesive layer interposed therebetween, and the adhesive tape laminated on the ITO film. A piece was produced. In order to improve the adhesive strength of the adhesive tape bonded to the ITO surface of a test sample piece, the test sample piece was put into an oatclave and the heating operation was performed for 15 minutes at the pressure of 0.5 MPa x temperature 40 degreeC.

Silver paste (Fujikura Chemical Co., Ltd. make, product name: Dohite, product number: FA-301CA) was apply | coated to the point where the adhesive tape of the both ends of the ITO film of a test sample piece is not bonded, and a measurement terminal is formed and temperature 80 After carrying out thermosetting of (degreeC) * 1 hour, the tester was made to contact the measuring terminals of both ends of a test sample piece, the resistance value between the both ends of an ITO film was measured, and it was set as the initial resistance value of a transparent conductive film.

Thereafter, the test sample piece was put into an oven having a temperature of 85 ° C. and a humidity of 85% RH, and after 500 hours had elapsed, the test sample piece was taken out, and the tester was brought into contact with the measuring terminals at both ends of the ITO film to measure the resistance value between the both ends of the ITO film. It was set as the resistance value after a high humidity environment test.

The change ratio of the resistance value of the ITO film | membrane of a test sample piece was computed by the following formula.

(Change ratio of resistance value of transparent conductive film) = (resistance value after high temperature, high humidity environment test) / (initial resistance value)

(Test confirming outbreak of turbidity)

The test sample piece produced by the change magnification measurement of the resistance value of the said transparent conductive film was thrown in the high temperature, high humidity environment of 85 degreeC x 85% RH of temperature, and it took out after 12 hours. Then, it left to stand in the environment of the temperature of 23 degreeC x 50% RH of humidity, and visually confirmed the appearance change of a test sample piece. It was evaluated by ((circle)) that (x) and what was not able to confirm generation | occurrence | production of turbidity occurred.

<Test result>

The test results are shown in Table 2.

Magnification change of resistance value

Appearance of the pressure-sensitive adhesive layer
Turbidity rating
Example 1

1.61
Transparency
No turbidity
Example 2

1.40
Transparency
No turbidity
Example 3

1.38
Transparency
No turbidity
Comparative Example 1

1.45
-
-
Comparative Example 2

1.99
Transparency
White cloud
Comparative Example 3

1.46
Transparency
White cloud
Comparative Example 4

-
White cloud
-
Comparative Example 5

140
Transparency
No turbidity
Comparative Example 6

More than 1000
Transparency
No turbidity

(Measurement Result of Resistance Value Change Magnification of Transparent Conductive Film)

The test results shown in Table 2 show that the commercially available acid values are 0 to 33 in comparison with Comparative Examples 2 and 3 using only pressure-sensitive adhesive compositions (polymers A) made of acrylic resin having commercially available acid values of 0 to 33. Example which is the adhesive composition (polymer C) produced by adding and photopolymerizing the pressure-sensitive adhesive composition (polymer A) which consists of phosphorus acrylic resin to at least 1 sort (s) of a hydroxyl group containing (meth) acrylate monomer (monomer B), and a photoinitiator. In 1 to 3, the rate of change of the resistance value of the ITO film is suppressed low.

At least one of the hydroxyl group-containing (meth) acrylate monomers (monomer B) does not increase the rate of change of the resistance value of the ITO membrane, and at least one of the hydroxyl group-containing acrylic resins having an acid value of 0 to 33 When it adds to a type | mold adhesive composition (polymer A), it is thought that the polymer A dilutes with the monomer B, and the hydroxyl group in resin increases and it has an effect which suppresses the change ratio of the resistance value of an ITO membrane lower. In Comparative Examples 5 and 6 in which the acid value was larger than those in Examples 1 to 3, although the monomer B and the photopolymerization initiator were introduced, the rate of change in the resistance value of the ITO film increased significantly. From this point of view, the effect of suppressing the change ratio of the resistance value of the ITO film lower was confirmed that the acid value of the pressure-sensitive adhesive composition (polymer A) as well as the presence of the polymerized product of the monomer B was important.

(Test result confirming the occurrence of turbidity of the adhesive tape)

In Examples 1-3 and Comparative Examples 5 and 6, the occurrence of cloudiness could not be confirmed. In Comparative Examples 2 and 3, the occurrence of turbidity was confirmed. In Comparative Examples 2 and 3, since the monomer B and the photopolymerization initiator are not introduced, the monomer B does not polymerize even when irradiated with UV. In the comparative example 2, since it was not made into the adhesive which has the improvement effect which prevents generation | occurrence | production of cloudiness, it was confirmed that polymerizing monomer B is effective in the improvement which prevents generation | occurrence | production of cloudiness. In Comparative Example 4, since the monomer B and the photopolymerization initiator exist, the photoinitiator reacts by performing UV irradiation. However, in Comparative Example 4, since the content of the monomer B was large in comparison with Example 3, turbidity occurred in Comparative Example 4. From this point of view, it was confirmed that clouding does not occur under normal conditions, and the effect of preventing cloudiness when taken out under high temperature and high humidity is important not only for the presence of the polymerized product of monomer B but also for the composition ratio.

In addition, the graph which shows the change of the haze value after taking out from the test oven of the high temperature, high humidity environment of FIG. 3 showed that the cloudiness does not arise after the test in a high temperature, high humidity environment as an effect of this invention. In Example 1 of the adhesive tape of the present invention, the haze value does not change at all even after being taken out of the test oven in a high temperature and high humidity environment and 60 minutes after being taken out of the oven, and thus it is understood that the adhesive tape has excellent performance in preventing the occurrence of clouding. .

On the other hand, in the comparative example 2, after a haze value rose to about 11% which is the maximum value only in few minutes immediately after taking out from the test oven of a high temperature, high humidity environment, haze value shows the tendency for a gradual fall with lapse of leaving time. However, it can be seen that the state in which turbidity has occurred lasts for more than 120 minutes.

This evaluation is a change which occurs when resin films, such as a separator or polyethylene terephthalate (PET), are performed. However, although the timing of the occurrence of cloudiness is the same at samples such as glass having poor gas permeability, or of acrylic plates and glass, the situation in which the occurrence of cloudiness disappears may take several days. In addition, all the turbidity generated in the test in a high temperature, high humidity environment was left to stand at room temperature for several hours, so that the turbidity disappeared and became transparent.

In the above result, at least 1 type of the pressure-sensitive adhesive polymer (polymer A) which consists of acrylic resin whose acid value is 0-33 which is a main component of the adhesive composition of this invention, and a hydroxyl-group-containing (meth) acrylate monomer (monomer B) ) And a pressure-sensitive adhesive raw material composition obtained by mixing a photopolymerization initiator to obtain a pressure-sensitive adhesive composition (polymer C) by irradiating with light to obtain a pressure-sensitive adhesive composition (polymer C). After the test in a high-temperature, high-humidity environment, there can be provided a method for producing a pressure-sensitive adhesive composition, pressure-sensitive adhesive composition, and pressure-sensitive adhesive tape using the pressure-sensitive adhesive tape that does not cause cloudiness in the pressure-sensitive adhesive layer.

One… Substrate, 2... Pressure-sensitive adhesive layer; Separator, 5... Single-sided adhesive tape, 6.. Transfer tape, 11... ... Substrate or separator to be conveyed; Coating film; Separator, 21... Die coater, 22... Backup roll, 23... Drying chamber, 24... Separator supply means, 25... Nip roll, 26... Ultraviolet irradiation device

Claims (7)

As a manufacturing method of the adhesive composition for adhesive tapes joined to the said ITO surface of the transparent conductive film which consists of ITO, The adhesive composition (polymer C) which has physical property (K) by going through the process of at least following (1)-(2) Method for producing a pressure-sensitive adhesive composition to obtain;
(1) A raw material for pressure-sensitive adhesive formed by mixing at least one (monomer B) of a hydroxyl group-containing (meth) acrylate monomer and a photopolymerization initiator with a pressure-sensitive adhesive composition (polymer A) made of acrylic resin having an acid value of 0 to 33. Adjusting the composition;
(2) Process of performing the polymerization reaction by light irradiation using the said raw material composition for adhesives, and obtaining the adhesive composition (polymer C) which has physical property (K);
Here, the physical property (K) is obtained by applying the pressure-sensitive adhesive composition (polymer C) on the surface of the ITO to form a thin film having a thickness of 200 μm after drying, and then performing 500 hours under an environment of a temperature of 85 ° C. and a humidity of 85% RH for 500 hours. After taking out from the test oven, the change ratio of the ITO membrane resistance value is 1.7 times or less compared with the initial value, and it is defined that the turbidity does not generate | occur | produce in an adhesive composition (polymer C) layer immediately after taking out from the said oven. A pressure-sensitive adhesive composition (polymer C) having a physical property (K) as a method for producing a pressure-sensitive adhesive composition for pressure-sensitive adhesive tapes bonded to the ITO surface of a transparent conductive film made of ITO, by undergoing at least the following steps (1) to (3). Method for producing a pressure-sensitive adhesive composition to obtain;
(1) A raw material for pressure-sensitive adhesive formed by mixing at least one (monomer B) of a hydroxyl group-containing (meth) acrylate monomer and a photopolymerization initiator with a pressure-sensitive adhesive composition (polymer A) made of acrylic resin having an acid value of 0 to 33. Adjusting the composition;
(2) Process of apply | coating the said raw material composition for adhesives to the base film which consists of elongate thermoplastic resin so that thickness after drying may be 20-500 micrometers, and drying, and obtaining a long coating film;
(3) performing a polymerization reaction by light irradiation using the long coating film to obtain an adhesive composition (polymer C) having physical properties (K) on the base film;
Here, the physical property (K) is obtained by applying the pressure-sensitive adhesive composition (polymer C) on the surface of the ITO to form a thin film having a thickness of 200 μm after drying, and then performing 500 hours under an environment of a temperature of 85 ° C. and a humidity of 85% RH for 500 hours. After taking out from the test oven, the change ratio of the ITO membrane resistance value is 1.7 times or less compared with the initial value, and it is defined that the turbidity does not generate | occur | produce in an adhesive composition (polymer C) layer immediately after taking out from the said oven. Pressure sensitive adhesive composition (polymer A) which consists of acrylic resin whose acid value is 0-33: 100 weight part of solid content, at least 1 type (monomer B) of hydroxyl group containing (meth) acrylate monomer: 5-15 weight part, and Photoinitiator: It consists of 0.01-0.5 weight part and consists of adhesive composition (polymer C) which has physical property (K);
Here, the physical property (K) is obtained by applying the pressure-sensitive adhesive composition (polymer C) on the surface of the ITO to form a thin film having a thickness of 200 μm after drying, and then performing 500 hours under an environment of a temperature of 85 ° C. and a humidity of 85% RH for 500 hours. After taking out from the test oven, the change ratio of the ITO membrane resistance value is 1.7 times or less compared with the initial value, and it is defined that the turbidity does not generate | occur | produce in an adhesive composition (polymer C) layer immediately after taking out from the said oven. The adhesive tape in which the adhesive composition (polymer C) manufactured by the method of Claim 1 or 2 is laminated | stacked on the base film. The adhesive tape in which the adhesive composition (polymer C) of Claim 3 is laminated | stacked on the base film. The method of claim 4, wherein
Adhesive tape for bonding a member to a display. The method of claim 5, wherein
Adhesive tape for bonding a member to a display.

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