KR20120097413A - 패턴화된 기재를 제공하기 위해 마스크를 사용하는 방법 - Google Patents

패턴화된 기재를 제공하기 위해 마스크를 사용하는 방법 Download PDF

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Publication number
KR20120097413A
KR20120097413A KR1020127019723A KR20127019723A KR20120097413A KR 20120097413 A KR20120097413 A KR 20120097413A KR 1020127019723 A KR1020127019723 A KR 1020127019723A KR 20127019723 A KR20127019723 A KR 20127019723A KR 20120097413 A KR20120097413 A KR 20120097413A
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KR
South Korea
Prior art keywords
transfer layer
substrate
structured tool
layer
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127019723A
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English (en)
Korean (ko)
Inventor
맷튜 에스 스테이
미하일 엘 페쿠로브스키
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20120097413A publication Critical patent/KR20120097413A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020127019723A 2009-12-30 2010-12-20 패턴화된 기재를 제공하기 위해 마스크를 사용하는 방법 Withdrawn KR20120097413A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29105309P 2009-12-30 2009-12-30
US61/291,053 2009-12-30

Publications (1)

Publication Number Publication Date
KR20120097413A true KR20120097413A (ko) 2012-09-03

Family

ID=44307459

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127019723A Withdrawn KR20120097413A (ko) 2009-12-30 2010-12-20 패턴화된 기재를 제공하기 위해 마스크를 사용하는 방법

Country Status (8)

Country Link
US (1) US20130068723A1 (cg-RX-API-DMAC10.html)
EP (1) EP2519964A2 (cg-RX-API-DMAC10.html)
JP (1) JP2013516764A (cg-RX-API-DMAC10.html)
KR (1) KR20120097413A (cg-RX-API-DMAC10.html)
CN (1) CN102687241A (cg-RX-API-DMAC10.html)
BR (1) BR112012016099A2 (cg-RX-API-DMAC10.html)
SG (1) SG181954A1 (cg-RX-API-DMAC10.html)
WO (1) WO2011090641A2 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018236118A1 (ko) * 2017-06-20 2018-12-27 창원대학교 산학협력단 패턴의 제조방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2938495B1 (en) 2012-12-31 2017-04-19 3M Innovative Properties Company Re-inking roller for microcontact printing in a roll-to-roll process
BR112016010214A2 (pt) * 2013-11-06 2017-08-08 3M Innovative Properties Co ?estampas de impressão por microcontato com características funcionais?
JP2015159277A (ja) 2014-01-23 2015-09-03 パナソニック株式会社 電子デバイスの製造方法
WO2018063784A1 (en) * 2016-09-27 2018-04-05 Illumina, Inc. Imprinted substrates
KR102993524B1 (ko) * 2023-08-16 2026-07-21 한국전자통신연구원 접착 소재 디핑 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265535A (en) * 1991-12-28 1993-11-30 Kabushiki Kaisha Isowa Printing machine for corrugated board sheet
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6680214B1 (en) * 1998-06-08 2004-01-20 Borealis Technical Limited Artificial band gap
NO311797B1 (no) * 1999-05-12 2002-01-28 Thin Film Electronics Asa Fremgangsmåter til mönstring av polymerfilmer og anvendelse av fremgangsmåtene
US7122251B2 (en) * 2001-05-31 2006-10-17 Mitsubishi Rayon Co., Ltd. Resin composition for plating substrate and resin molding using the same, and metal plated parts
GB0323295D0 (en) * 2003-10-04 2003-11-05 Dow Corning Deposition of thin films
JP2006156735A (ja) * 2004-11-30 2006-06-15 Nippon Telegr & Teleph Corp <Ntt> パターン形成方法及びモールド
US7374968B2 (en) * 2005-01-28 2008-05-20 Hewlett-Packard Development Company, L.P. Method of utilizing a contact printing stamp
JP4622626B2 (ja) * 2005-03-30 2011-02-02 凸版印刷株式会社 導電性パターンの形成方法
EP1892076A4 (en) * 2005-06-16 2012-08-29 Dainippon Printing Co Ltd PATTERN COPYING DEVICE, PATTERN COPYING METHOD AND PEELING ROLLER
US8004742B2 (en) * 2006-07-12 2011-08-23 Konica Minolta Holdings, Inc. Electrochromic display device
ATE500973T1 (de) * 2006-11-15 2011-03-15 3M Innovative Properties Co Flexodruck mit härtung während der übertragung auf ein substrat
US8608972B2 (en) * 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
WO2008115530A2 (en) * 2007-03-20 2008-09-25 Nano Terra Inc. Polymer composition for preparing electronic devices by microcontact printing processes and products prepared by the processes
JP4448868B2 (ja) * 2007-06-29 2010-04-14 株式会社日立産機システム インプリント用スタンパとその製造方法
JP5065880B2 (ja) * 2007-12-27 2012-11-07 株式会社日立産機システム 微細構造転写装置および微細構造転写方法
EP2200413A4 (en) * 2008-09-30 2011-12-14 Ibiden Co Ltd MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD
CN101477304B (zh) * 2008-11-04 2011-08-17 南京大学 在复杂形状表面复制高分辨率纳米结构的压印方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018236118A1 (ko) * 2017-06-20 2018-12-27 창원대학교 산학협력단 패턴의 제조방법
US10800156B2 (en) 2017-06-20 2020-10-13 Changwon National University Industry Academy Cooperation Corps Fabricating method of a pattern including stretching a substrate

Also Published As

Publication number Publication date
EP2519964A2 (en) 2012-11-07
BR112012016099A2 (pt) 2016-05-31
WO2011090641A3 (en) 2011-09-22
WO2011090641A2 (en) 2011-07-28
SG181954A1 (en) 2012-07-30
US20130068723A1 (en) 2013-03-21
CN102687241A (zh) 2012-09-19
JP2013516764A (ja) 2013-05-13

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000