KR20120095333A - Retainer ring for polishing wafer and method of manufacturing the same - Google Patents

Abstract

PURPOSE: A retainer ring for polishing a wafer and a manufacturing method thereof are provided to manufacture the retainer ring with low costs. CONSTITUTION: A frame ring(10) made of metal is mounted on a carrier. A plurality of retaining members(30) are insert-molded to form an arc which equally divides the circumference of a circle corresponding to the frame ring. An intermediate member(20) is formed between the frame ring and the retaining members to combine the frame ring with the retaining members with an insert-molding method. A female screw is formed in a nut member and a male screw is formed in the outside of the nut member. The nut member is screwed with a plurality of net holes formed in the frame ring.

Description

Retainer Ring for Polishing Wafer and Method of Manufacturing the Same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer polishing retainer ring and a method of manufacturing the same. More particularly, the present invention relates to a wafer polishing retainer that retains an outer circumferential surface of a wafer in a process of polishing the wafer by a chemical mechanical polishing (CMP) method. A method of making a ring and its retainer ring is provided.

In the manufacturing process of a semiconductor element, the grinding | polishing process for planarizing the surface of a semiconductor wafer is essential.

Mainly used in such polishing process is a chemical mechanical polishing process. The CMP process is a process of polishing a surface of a wafer coated with tungsten, an oxide, or the like by mechanical friction and a chemical polishing agent. In the CMP process, the wafer fixed to the carrier is rotated while being pressed against the polishing pad, thereby polishing the wafer surface by friction between the polishing pad and the wafer surface. In addition, the surface of the wafer is chemically polished by a slurry as a chemical abrasive supplied between the polishing pad and the wafer.

1 is a schematic view for explaining a step of polishing a wafer by a CMP method. The polishing pad 2 is provided on the turntable 1 and the wafer W is placed thereon. The wafer W is adsorbed to the lower surface of the carrier 3 serving to receive the wafer W, and then the wafer W is released out of the carrier 3 operated by the driving unit 4 during polishing. It is supported by the retainer ring 9 so as not to. The slurry 6 (Slurry), which is an abrasive, is supplied between the wafer W and the polishing pad 2 through the nozzle 5 while pressing the wafer W accommodated in the carrier 3 at a predetermined pressure with respect to the polishing pad 2. As a result, the wafer W is simultaneously polished chemically and mechanically by the rotational movement of the polishing pad 2.

The conventional wafer polishing retainer ring 9 is composed of a frame ring 7 and a polishing ring 8. The frame ring 7 is made of metal, and the polishing ring 8 is made of synthetic resin. The frame ring 7 and the polishing ring 8 are joined to each other by an adhesive. Referring to FIG. 1, the polishing ring is rotated while pressed against the polishing pad 2, and the polishing ring 8 wears together with the wafer W by the friction force and the rotational force. That is, since the polishing ring 8 wears out over a long period of time and the height gradually decreases, the polishing ring 8 is a consumable part of the CMP process. In this manner, when the life of the polishing ring expires, the polishing ring 8 is scraped off from the frame ring 7 using a cutting tool, and a new polishing ring 8 is attached to the frame ring 7 to be used.

By the way, since the frame ring 7 and the polishing ring 8 are bonded to each other by an adhesive, the polishing ring 7 made of synthetic resin in the process of cutting the polishing ring 8 from the frame ring 7 with a cutting tool. Not only is it cut, but part of the frame ring 8 is also cut together. Therefore, when the polishing ring is replaced several times for the same frame ring, the size and shape of the frame ring are also changed, and there is a problem that the frame ring can no longer be used. This shortens the replacement cycle of the frame ring and increases the process cost of the CMP process.

In addition, the adhesive force of the adhesive is weakened in the CMP process may cause the frame ring 7 and the polishing ring 8 to be separated from each other, which causes a problem that damages the wafer and causes a large loss in the CMP process.

In addition, the polishing ring is produced using a resin such as polyether ether ketone (PEEK), polyethylene (POM), polyphenylene sulfide (PPS), polyamideimide (PAI), polyetherimide (PEI), and the like. The same resin is very expensive because it is a highly functional resin with abrasive resistance. Since only a part of the polishing ring is worn out, the retainer ring is replaced, thereby unnecessarily consuming expensive polishing ring resins, thereby increasing the overall manufacturing cost.

Disclosure of Invention The present invention has been made to solve the above problems, and an object thereof is to provide a retainer ring for polishing a wafer which can produce a retainer ring at a relatively low price while maintaining the function of the retainer ring.

In addition, an object of the present invention is to provide a method of manufacturing a retainer ring for wafer polishing, which can produce the retainer ring at low cost while maintaining the quality of the retainer ring.

In order to solve the problems described above, the present invention is a method for manufacturing a retainer ring for holding a wafer is provided in a carrier that adheres the wafer to the upper surface of the polishing pad, (a) formed in the form of a circular ring (ring) Providing a frame ring of metal material mounted on the carrier; (b) injection molding a plurality of retaining members so as to have an arc shape for dividing the circumference of the circle corresponding to the frame ring; (c) the frame ring and the frame ring by an insert injection method for injecting molten resin between the frame ring and the retaining member while the frame ring and the plurality of retaining members are disposed to face each other in an injection mold; Forming an intermediate member coupling the retaining members to each other; And (d) after completing step (a), screwing nut members having a female screw portion at an inner side and a male screw portion at an outer side to a plurality of nut holes formed at regular intervals along the circumferential direction of the frame ring, respectively. It includes; wherein step (c) is characterized in that the insert injection is performed in a state in which the frame ring in which the step (d) is completed is disposed in the injection mold.

In addition, the present invention is a wafer polishing retainer ring provided on a carrier for holding the wafer to the upper surface of the polishing pad to hold the wafer, is formed in the form of a circular ring, the frame ring of a metal material mounted on the carrier ; A plurality of retaining members formed to have an arc shape for dividing the circumference of the circle corresponding to the frame ring and disposed at equal intervals along the circumferential direction while being disposed to face the frame ring; An intermediate member which is filled between the frame ring and the retaining member by insert injection in a state where the frame ring and the retaining member are placed in an injection mold to couple the frame ring and the retaining member to each other; And a plurality of nut members respectively formed at an inner side of the female thread part and formed at an outer side of the male thread part at a predetermined interval along the circumferential direction of the frame ring.

The present invention has the effect of providing a wafer polishing retainer ring manufacturing method capable of producing a wafer polishing retainer ring at a low price, and a wafer polishing retainer ring produced by the method.

1 is a schematic view for explaining a step of polishing a wafer by a CMP method.
2 is a perspective view of a retainer ring for polishing a wafer according to a first embodiment of the present invention.
3 is a cross-sectional view taken along line III-III of the retainer ring for polishing a wafer shown in FIG.
4 is a cross-sectional view taken along the line IV-IV of the wafer polishing retainer ring shown in FIG. 2.
5 is an exploded perspective view of the retainer ring for wafer polishing shown in FIG. 2.
FIG. 6 is a cross-sectional view taken along line IV-IV for explaining a process of recycling the retainer ring for wafer polishing shown in FIG. 2.
7 is a cross-sectional view of the retainer ring for polishing a wafer according to the second embodiment of the present invention so as to correspond to FIG. 3 of the first embodiment.
FIG. 8 is a perspective view of the retaining member of the retainer ring for wafer polishing shown in FIG. 7.
9 is a perspective view of a retainer ring for polishing a wafer according to a third embodiment of the present invention.
10 is a cross-sectional view taken along the line AA of the retainer ring for wafer polishing shown in FIG. 9.
FIG. 11 is a cross-sectional view taken along line BB of the wafer polishing retainer ring shown in FIG. 9.
FIG. 12 is a cross-sectional view taken along line CC of the retainer ring for wafer polishing shown in FIG. 9. FIG.

Hereinafter, with reference to the accompanying drawings, it will be described in detail a wafer polishing retainer ring manufacturing method and a wafer polishing retainer ring manufactured by the method according to an embodiment of the present invention.

2 is a perspective view of a wafer polishing retainer ring according to a first embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line III-III of the wafer polishing retainer ring shown in FIG. 2, and FIG. 4 is shown in FIG. A IV-IV cross-sectional view of the retainer ring for wafer polishing. 5 is an exploded perspective view of the retainer ring for wafer polishing shown in FIG. 2.

2 to 5, the wafer polishing retainer ring according to the first embodiment of the present invention includes a frame ring 10, a plurality of retaining members 30, and an intermediate member 20.

First, referring to FIGS. 1 and 5, a frame ring 10 formed in a circular ring shape and made of a metal material is performed (step (a)). A plurality of bolt coupling holes 11 are formed on the upper surface of the frame ring 10. The frame ring 10 is coupled to the carrier of the CMP apparatus and the frame ring 10 by bolts, and the bolts are tightened to the bolt coupling holes 11 of the frame ring 10. Coupling grooves 12 are formed in the lower surface of the frame ring 10 along the circumferential direction. Referring to Figure 3, the coupling groove 12 of the frame ring 10 is formed in a trapezoidal cross-section thereof. That is, the width of the coupling groove 12 toward the upper side is formed.

Next, an injection molding of the plurality of retaining members 30 is performed to have an arc shape for dividing the circumference of the circle corresponding to the frame ring 10 (step (b)).

In this embodiment, the retaining member 30 is divided into six equal parts in the circumferential direction. A slurry groove 31 is formed on the bottom surface of the retaining member 30 so that the slurry generated during wafer polishing can be discharged to the outside.

Coupling protrusions 32 are formed on the upper surface of the retaining member 30. As shown in FIGS. 3 and 4, the coupling protrusion 32 is formed such that a portion thereof may be accommodated in the coupling groove 12 of the frame ring 10. The engaging projection 32 is formed in a trapezoidal cross section so as to correspond to the engaging groove 12 of the retaining member 30. That is, the coupling protrusion 32 is formed to be wider as it approaches the frame ring 10. When the six retaining members 30 are arranged to face the frame ring 10, the retaining members may be formed so that the retaining members contact each other, and the retaining member 30 is shown in FIG. 2. The retaining member 30 may be formed to be spaced apart from each other.

In this embodiment, the interval between the retaining members 30 performs the same function as the slurry groove 31.

The retaining member 30 described above may be formed of a resin such as polyether ether ketone (PEEK), polyethylene (POM), polyphenylene sulfide (PPS), polyamideimide (PAI), polyetherimide (PEI), or the like. use. Since the synthetic resin as described above should have a very good wear resistance, very high quality resin is used. Therefore, the price is very high compared to other general synthetic resin materials. However, when the abrasive ring 8 is injection molded into a circular ring shape as described with reference to FIG. 1 using such an expensive material, the manufacturing cost thereof is high. In order to injection molding the large circular polishing ring 8, a large injection mold has to be provided, thereby increasing the manufacturing cost. In addition, in order to injection molding such a large-size abrasive ring 8, a plurality of runners and sprues must be provided in the entire mold to form a mold so that molten resin flows smoothly. In this case, the resin parts of the runner and the sprue part are discarded. However, due to the large size of the mold, the amount of discarded resin in the runner and sprue is very high, and the overall manufacturing cost is high.

When the polishing ring 8 is manufactured as the retaining member 30 divided into six parts as in the present embodiment, the size of the injection mold is inevitably small because the retaining member 30 is small in size. In addition, the amount of resin discarded in the runner and the sprue in the process of injection molding is also greatly reduced. As described above, since the raw material resin of the retaining member 30 is very expensive, the manufacturing cost can be drastically lowered by reducing the amount of resin used as in the present embodiment. In addition, in the case of the polishing ring 8 described with reference to FIG. 1, when a defect occurs in the injection molding process, both the relatively large polishing ring 8 and its material correspond to process loss. The size 30 is smaller than that of the polishing ring 8, so that even if a defect occurs in the injection molding process, the loss of material can be reduced. In addition, in the case of forming a plurality of retaining members 30 by one mold, even if a defect occurs, the retaining member 30 which does not have some defects can be selected and used to reduce the loss of manufacturing cost. Do. When the frame ring 10 and the retaining member 30 are provided as described above, the frame ring 10 and the six retaining members 30 are disposed in the injection mold so as to face each other. A step of forming the intermediate member 20 by insert injection method of injecting molten resin between the retaining members 30 is performed (step (c)). As the molten resin is cooled, the frame ring 10 and the retaining members 30 are coupled to each other.

As the material of the intermediate member 20, it is preferable to use a resin such as PBT, PC, PPS, or ABS, which is relatively inexpensive than the material of the retaining member 30.

In order to prevent residual stress from occurring as the molten intermediate member 20 shrinks while cooling, the frame ring 10 is heated in advance to a temperature similar to that of the molten intermediate member 20, and then (c) It is good to follow the steps.

4 and 5, a spacer protrusion 33 is formed on an upper surface of the coupling protrusion 32. In the step (c), when the frame ring 10 and the retaining member 30 are placed in the injection mold, the spacer protrusion 33 contacts the lower surface of the frame ring 10, whereby the frame ring 10 is formed in the injection mold. There is an advantage that it is very easy to keep the gap between the retaining member 30 and the constant constant.

In addition, referring to Figure 5, the engaging projection 32 is formed with a filling groove 34 extending in the radial direction of the frame ring 10. Due to the filling groove 34, the molten resin flows smoothly between the frame ring 10 and the retaining member 30 in step (c) to effectively form the intermediate member 20 and the intermediate member 20. ) Has the advantage of reducing the residual stress inside.

On the other hand, when providing the frame ring 10 and the retaining member 30 in step (a) and (b), respectively, the structure between the coupling groove 12 and the coupling protrusion 32 is configured as follows: Good to do. That is, when forming the intermediate member 20 in the step (c), as shown in Figure 3, the gap d1 between the upper surface of the coupling projection 32 facing the lower surface of the coupling groove 12, the coupling The gap d2 between the inner surface of the groove 12 and the outer surface of the engaging projection 32 and the gap d3 between the lower surface of the frame ring 10 and the upper surface of the retaining member 30 are coupled to be equal to each other. It is preferable to determine the dimensions of the groove 12 and the engaging projection 32. That is, by maintaining the thickness d1, d2, d3 of the intermediate member 20 between the coupling groove 12 and the coupling protrusion 32, the quality of the intermediate member 20 can be improved. During the process of forming the intermediate member 20 by cooling the molten resin, the thickness between the coupling groove 12 and the coupling protrusion 32 is uniform, so that shrinkage occurs uniformly, causing the internal member 20 to be damaged due to internal stress. There is an advantage to minimize deformation.

The completed wafer polishing retainer ring is installed in the carrier and used in the CMP process. If the retaining ring for wafer polishing is used for a predetermined period, the lower side of the retaining member 30 wears out and the end of life is reached. As such, the retaining ring for wafer polishing, which has reached the end of its service life, may be regenerated and used through the following process.

The intermediate member 20 attached to the frame ring 10 after cutting the intermediate member 20 and a part of the retaining member 30 with the machine tool by using a machine tool while the frame ring 10 is fixed. And removing the remaining part of the retaining member 30 (step (e)).

Unlike the frame ring 10 made of metal, since the intermediate member 20 and the retaining member 30 are made of synthetic resin, the intermediate member 20 and the retaining member 30 can be easily removed by cutting the intermediate member 20 and the retaining member 30. have. At this time, it is not necessary to cut both the intermediate member 20 and the retaining member 30 with a machine tool, and if only a thickness of about 0.3 mm is left as shown in FIG. 6, the remaining parts can be easily removed by hand. have. Since the intermediate member 20 and the retaining member 30 are not bonded to the frame ring 10 by an adhesive, but are coupled to each other by a coupling structure such as the coupling groove 12 and the coupling protrusion 32, the coupling protrusion (32) Cutting around allows easy separation from each other. In addition, according to such a method, since the intermediate member 20 and the retaining member 30 may be removed without damaging the frame ring 10, the frame ring 10 may be easily recycled. .

At this time, in the above-described step (c), the intermediate member 20 does not wrap up to the upper and side surfaces of the frame ring 10, and only the lower surface of the frame ring 10 contacts the intermediate member 20. ) In the step (c), there is an advantage that the step of removing the intermediate member 20 and the retaining member 30 in the step (e) can be more easily performed.

As such, the frame ring 10 may be recycled by performing steps (b) and (c) again on the frame ring 10 from which the intermediate member 20 and the retaining member 30 are removed.

As such, since the structure of the wafer ring retainer ring can be easily manufactured by recycling the frame ring 10 without damaging the frame ring 10, the overall manufacturing cost of manufacturing the retainer ring for wafer polishing can be greatly reduced. .

The retaining ring for wafer polishing should be manufactured to a predetermined height in accordance with the specification. However, when the use is completed according to the actual service life, the wear height of the retaining member 30 is a part of the entire retaining member 30. Therefore, by forming the intermediate member 20 of a material cheaper than the material of the retaining member 30 as in this embodiment, the manufacturing cost can be significantly reduced. By forming the intermediate member 20 by filling the space between the frame ring 10 and the retaining member 30 with resin at a price lower than that of the retaining member 30, the overall height of the retainer ring for wafer polishing can be reduced. The cost of manufacturing can be kept low while maintaining the same.

Hereinafter, a second embodiment of a wafer polishing retainer ring and a wafer polishing retainer ring manufacturing method according to the present invention will be described with reference to FIGS. 7 and 8.

7 and 8, in the wafer polishing retainer ring of the second embodiment, unlike the wafer polishing retainer ring of the first embodiment, the engaging projections 62 of the retaining member 60 are formed in two rows along the circumferential direction. There is a difference in points. As shown in FIG. 8, the intermediate member 50 is formed by placing six retaining members 60 having two coupling protrusions 62 in an injection mold and insert-inserting the frame ring 40 together. By configuring in this way, there is an advantage of increasing the contact area between the intermediate member 50 and the frame ring 40 and improving the bonding force.

The frame ring 40 and the bolt coupling holes 41 of the frame ring 40 are the same as the frame ring 10 and the bolt coupling holes 11 of the first embodiment.

In addition, the slurry grooves 61 of the intermediate member 50 and the retaining member 60 are also similar or identical to the corresponding configurations of the first embodiment.

Next, a third embodiment of the wafer polishing retainer ring and the wafer polishing retainer ring manufacturing method according to the present invention will be described with reference to FIGS.

9 is a perspective view of the wafer polishing retainer ring according to the third embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along line A-A of the wafer polishing retainer ring shown in FIG. FIG. 11 is a cross-sectional view taken along the line B-B of the wafer polishing retainer ring shown in FIG. 9, and FIG. 12 is a cross-sectional view taken along the line C-C of the wafer polishing retainer ring shown in FIG.

9 to 12, the wafer polishing retainer ring according to the third embodiment of the present invention includes a frame ring 110, a plurality of retaining members 130, and an intermediate member 120.

First, the step of providing a frame ring 110 formed in the shape of a circular ring (ring) (step (a)). The frame ring 110 is formed of a metal material or die casting. A plurality of nut holes 111 are formed in the frame ring 110. The nut hole 111 is formed to penetrate the frame ring 110 up and down, and an internal thread is formed on an inner circumferential surface thereof. The nut holes 111 are formed in the frame ring 110 at regular intervals along the circumferential direction.

As shown in FIG. 10, the nut member 140 is coupled to the frame ring 110 formed as described above (d). A female screw portion 142 is formed inside the nut member 140 and a male screw portion 141 is formed outside. The male screw portion 141 of the nut member 140 is formed to screw with the female screw formed in the nut groove of the frame ring 110. In this embodiment, 18 nut holes 111 are formed in the frame ring 110.

The female screw part 142 formed inside the nut member 140 is screwed with a separate bolt to couple the carrier of the CMP apparatus and the retainer ring for wafer polishing of this embodiment to each other.

Next, an injection molding of the plurality of retaining members 130 is performed to form an arc shape for dividing the circumference of the circle corresponding to the frame ring 110 (step (b)). Coupling protrusions 132 are formed on the upper surface of the retaining member 130.

When the frame ring 110 and the retaining member 130 are provided as described above, the frame ring 110 and the six retaining members 130 are disposed in the injection mold so as to face each other. A step of forming the intermediate member 120 is performed by an insert injection method for injecting molten resin between the retaining members 130 (step (c)). As the molten resin is cooled, the frame ring 110 and the retaining members 130 are coupled to each other.

At this time, the hollow member 150 as shown in FIG. 12 is placed in the frame ring 110 at regular intervals to be placed in the injection mold and insert injection is performed. The hollow member 150 is formed in a pipe shape so that the slurry generated during wafer polishing can be discharged to the outside, and a through hole 151 extending in the longitudinal direction is formed. The hollow member 150 and the retaining member 130 are placed in the injection mold together with the frame ring 110 in which grooves in which the hollow member 150 is located are formed at predetermined intervals to perform insert injection. do. When the hollow member 150 is disposed in the groove formed in the frame ring 110, protrusions 152 are formed on both sides of the hollow member 150 so that the hollow member 150 can be easily positioned in the frame ring 110. have. As the hollow member 150 is fitted to the frame ring 110 by the protrusion 152 of the hollow member 150, the hollow member 150 does not move in the injection mold during the insert injection process. Maintaining the fixed state 110 has the advantage that the intermediate member 120 is formed in an accurate shape. As a result of the injection molding, a plurality of hollow members 150 are disposed between the frame ring 110 and the intermediate member 120.

On the other hand, when the nut member 140 is placed in the injection mold in the state coupled to the frame ring 110, one end of the nut member 140 is in close contact with the inner wall of the injection mold and the other end is in close contact with the retaining member 130. It is good to be formed to. By the shape of the nut member 140, the frame ring 110 and the retaining member 130, etc. in the injection mold can be fixed at a predetermined position inside the injection mold without shaking or moving. For example, after arranging the frame ring 110 and the retaining member 130 between the injection molds composed of the first mold (upper mold) and the second mold (lower mold), the first mold is compared with the second mold. In close contact, the nut member presses the retaining member 130 to fix the retaining member 130 in the mold. Due to the structure of the nut member 140, even though the injection mold is filled with molten synthetic resin at a high pressure, the retaining member 130 is disposed without shaking in the correct position, so that a retainer ring for wafer polishing having a precise and accurate dimension can be manufactured. There is an advantage.

In addition, the height of the upper surface of the nut member 140 may be formed to be lower than the height of the upper surface of the intermediate member 120. When the fabrication of the wafer polishing retainer ring of the present embodiment is completed by the insert injection method, a surface treatment is performed by cutting the outer surface of the intermediate member 120 to a very thin thickness by using a cutting machine prior to use. . At this time, as described above, the height of the upper surface of the nut member 140 is lower than the height of the upper surface of the intermediate member 120, so that the cutting tool cuts the upper surface of the intermediate member 120 to the nut member 140. It has the advantage of not getting caught. If the cutting tool is caught by the nut member 140 in the process of cutting the upper surface of the intermediate member 120, the surface of the intermediate member 120 may not be smoothly processed, the nut member 140 is the intermediate member ( 120) By being disposed below the upper surface has the effect of preventing the occurrence of the above problems.

The completed wafer polishing retainer ring is installed in the carrier and used in the CMP process. If the retaining ring for wafer polishing is used for a predetermined period of time, the lower side of the retaining member 130 wears out, and the end of life is reached. As such, the retaining ring for wafer polishing, which has reached the end of its service life, may be regenerated and used through the following process.

The intermediate member 120 attached to the frame ring 110 after cutting the intermediate member 120 and a portion of the retaining member 130 with a machine tool using a machine tool in a state where the frame ring 110 is fixed. And removing the remaining portion of the retaining member 130 (step (e)).

Unlike the frame ring 110 made of metal, since the intermediate member 120 and the retaining member 130 are made of synthetic resin, the intermediate member 120 and the retaining member 130 can be easily removed by cutting the intermediate member 120 and the retaining member 130. have. When the hollow member 150 is made of a synthetic resin material, the hollow member 150 may also be easily removed by cutting of the machine tool.

As such, the frame ring 110 may be recycled by performing the steps (b) and (c) again on the frame ring 110 from which the intermediate member 120 and the retaining member 130 are removed.

As such, the structure of the wafer polishing retainer ring can be easily manufactured by recycling the frame ring 110 without damaging the frame ring 110, thereby greatly reducing the overall manufacturing cost of manufacturing the wafer polishing retainer ring. .

While the present invention has been described with reference to preferred embodiments, the scope of the present invention is not limited to the forms described and illustrated above.

For example, the retaining member 30 has been described as being composed of six pieces, but may be configured to divide the circumference into various sizes as necessary. Accordingly, the number of nut members 14 used in the first embodiment may also be variously changed.

In addition, in the first embodiment, the shape of the engaging projection 32 of the retaining member 30 may also be variously configured in addition to the above-described and illustrated form. Filling groove 34 formed in the engaging projection 32 may not be configured as necessary. In some cases, it is also possible to configure a coupling protrusion without the spacer protrusion 33.

Further, the wafer polishing retainer ring of the third embodiment has been described as having a hollow member, but it is also possible to construct a wafer polishing retainer ring without a hollow member.

In addition, the detailed features of the first to third embodiments of the present invention described above may be appropriately modified as necessary to be applied to other embodiments.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention, and the protection scope of the present invention is limited only by the matters described in the claims. Those skilled in the art can improve or change the technical spirit of the present invention in various forms, and such improvements and modifications will fall within the protection scope of the present invention.

10, 40, 110: Frame ring 11, 41: Bolted hole
12, 42: coupling groove 20, 50, 120: intermediate member
30, 60, 130: retaining member 31, 61: slurry groove
32, 62, 132: engaging projection 33: spacer projection
34: Filling groove

Claims (8)

In the method of manufacturing a retainer ring for holding a wafer provided on a carrier that adheres the wafer to the upper surface of the polishing pad,
(a) forming a frame ring formed of a circular ring and mounted on the carrier;
(b) injection molding a plurality of retaining members so as to have an arc shape for dividing the circumference of the circle corresponding to the frame ring;
(c) the frame ring and the frame ring by an insert injection method for injecting molten resin between the frame ring and the retaining member while the frame ring and the plurality of retaining members are disposed to face each other in an injection mold; Forming an intermediate member coupling the retaining members to each other; And
(d) after completing step (a), screwing nut members having a female thread on the inner side and a male thread on the outer side to a plurality of nut holes formed at regular intervals along the circumferential direction of the frame ring; Including;
Step (c) is a wafer polishing retainer ring manufacturing method characterized in that the insert injection is performed in a state in which the frame ring is completed (d) is placed in the injection mold. The method of claim 1,
The nut member is a wafer polishing retainer ring manufacturing method, characterized in that both ends are in close contact with the injection mold inner wall and the retaining member when performing step (c). The method according to claim 1 or 2,
In the step (c), a wafer polishing retainer ring is manufactured by inserting a hollow member having a through hole formed in the frame ring at a predetermined interval so that slurry generated during wafer polishing can be discharged to the outside. Way. The method of claim 3,
(e) after using the retainer ring completed in step (c), cutting a portion of the intermediate member and the retaining member with a machine tool, and then removing the intermediate member and the retaining member attached to the frame ring. After removing the remaining portion;
And (b) and (c) again to recycle the frame ring. In the wafer polishing retainer ring provided on a carrier for holding the wafer in close contact with the upper surface of the polishing pad,
A frame ring formed in a circular ring shape and mounted to the carrier;
A plurality of retaining members formed to have an arc shape for dividing the circumference of the circle corresponding to the frame ring and disposed at equal intervals along the circumferential direction while being disposed to face the frame ring;
An intermediate member which is filled between the frame ring and the retaining member by insert injection in a state where the frame ring and the retaining member are placed in an injection mold to couple the frame ring and the retaining member to each other; And
And a plurality of nut members respectively formed at an inner side of the female thread part and formed at an outer side of the male thread part to be coupled to the plurality of nut holes formed at regular intervals along the circumferential direction of the frame ring. The method of claim 5,
And the nut member is formed such that both ends thereof closely adhere to the injection mold inner wall and the retaining member when the intermediate member is formed by insert injection. The method of claim 5,
The height of the upper surface of the nut member is lower than the height of the upper surface of the intermediate member retainer ring for polishing. 8. The method according to any one of claims 5 to 7,
And a plurality of hollow members disposed in the form of a pipe having through holes formed therein so that slurry generated during wafer polishing can be discharged to the outside, and disposed between the frame ring and the intermediate member in the circumferential direction of the frame ring. A wafer polishing retainer ring.

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