KR20120078870A - Epoxy resin composition having polymer-treated nanopore particle and semiconductor device sealed with the same - Google Patents

Abstract

PURPOSE: An epoxy resin composition is provided to effectively restrain the movement of metal ions like copper, etc between devices, while maintaining excellent adhesion even in high temperature, thereby giving excellent reliability to semiconductor device sealed by an epoxy resin composition even in high temperature. CONSTITUTION: An epoxy resin composition comprises 5-60 parts by weight of an epoxy resin, 10-60 parts by weight of butadiene acrylonitrile, 2-20 parts by weight of a curing agent, 0.2-5 parts by weight of a curing accelerator, 1-20 parts by weight of a polymer-modified nano-porous ion trapper, 0.5-5 parts by weight of additives, and 10-50 parts by weight of organic solvent. The polymer with anion functional group is modified to one or more kinds selected from polymers like polyethyleneimine based, carboxyl containing polyethyleneimine based, carboxyl containing polyacrylic based, and polyaminesulfonic based polymers. The nano-porous ion trapper as a mesoporous material is porous silicate, porous aluminosilicate, or zeolite.

Description

Epoxy resin composition having polymer-treated nanopore particles and semiconductor device sealed with the same

The present invention relates to an epoxy resin composition containing polymer-modified nanoporous particles and a semiconductor device sealed thereby, and more particularly, to a nanoporous particle-containing epoxy resin composition capable of preventing ion migration while maintaining adhesion, and thereby A sealed semiconductor device.

In recent years, as the speed of semiconductor devices increases, the wiring has also changed from aluminum to copper. Under these circumstances, copper is less susceptible to oxidation and corrosion than aluminum and requires careful attention in use. In particular, when copper is used as a wire, wiring, or lead frame, migration of copper ions occurs due to acid ions such as phosphoric acid, nitric acid, or sulfuric acid. Problems arise. In order to prevent the movement of such metal ions, application of an inorganic ion adsorbent is known to the adhesive film for multilayer wiring boards. Examples of the inorganic ion adsorbent include activated carbon, zeolite, silica gel, activated alumina, activated clay, hydrated antimony pentoxide, and zirconium phosphate. , And hydrotalcite are exemplified (Japanese Patent Application Laid-Open No. Hei 10-33096), and an anion exchanger or a cation exchanger is exemplified by an adhesive containing an ion trapping agent in an epoxy resin composition (Japanese Patent Laid-Open Application No. Hei 10-13011). ). Moreover, what mix | blended inorganic ion exchangers, such as a cation exchanger, an anion exchanger, and zwitterion exchanger, with the epoxy resin used for a printed wiring board is known (Japanese Patent Laid-Open No. 05-140419). However, a technology that can effectively prevent the movement of metal ions without deteriorating the performance of the adhesive has not yet been disclosed.

Accordingly, a problem to be solved by the present invention is to provide an epoxy resin composition capable of suppressing the movement of metal ions such as copper while maintaining the sealing force and adhesion between semiconductor elements.

Another object of the present invention is to provide a semiconductor device sealed by the epoxy resin composition.

In order to solve the above problems, the present invention is an epoxy resin composition, the composition is 5 to 60 parts by weight of the epoxy resin; 10 to 60 parts by weight of butadiene acrylonitrile; 2 to 20 parts by weight of the curing agent; 0.2 to 5 parts by weight of a curing accelerator; 1 to 20 parts by weight of the polymer-modified nanoporous ion trapping agent; 0.5 to 5 parts by weight of the additive; And it provides an epoxy resin composition comprising 10 to 50 parts by weight of an organic solvent.

In one embodiment of the present invention, the polymer-modified nanoporous ion trapping agent is loaded with a polymer having an anionic functional group in the nanopore, and the polymer having an anionic functional group is polyethyleneimine-based, carboxyl-containing polyethyleneimine-based, carboxyl-containing polyacrylic acid-based And polyacrylamide-based, polyacrylate-based, and polyamine sulfonic acid-based polymers.

In one embodiment of the present invention, the polymer having an anion functional group is a polymer having a molecular weight of 200 to 1,000,000, and the nanoporous ion trapping agent is a porous silicate or porous aluminosilicate or zeolite as a mesoporous material.

In addition, the mesoporous material porous silicate has a particle size of 0.01 to 4 ㎛, a pore size of 1 to 10 nm, pore volume of 0.7 to 1.2 cc / g, ratio The surface area is 600 to 900 m ² / g, and the epoxy resin is bisphenol A, bisphenol F, phenol novolac, cresol novolac, including epoxy modified with polysulfide resin, epoxy modified with urethane, rubber, etc. It is 1 or more types chosen from a system, a biphenyl system, a naphthalene system, a phenoxy clock, a silicone system, and a polyfunctional epoxy resin.

In one embodiment of the present invention, the epoxy resin is an epoxy mixed equivalent of 150 ~ 400g / eq.

The present invention also provides a semiconductor device using the epoxy resin composition described above, and provides a semiconductor device characterized in that it is made of a film using the epoxy resin composition described above and used as a semiconductor sealing material.

The epoxy resin composition according to the present invention can effectively suppress the inter-element transfer of metal ions such as copper while maintaining excellent adhesion, especially at high temperatures. Therefore, the semiconductor device sealed by the epoxy resin composition according to the present invention shows excellent reliability even at high temperatures.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of one aspect of the BGA system semiconductor device using the adhesive composition of this invention.
Figure 2 is an XRD analysis of the nanoporous ion trapping agent used in the adhesive composition of the present invention.
3 is a pore distribution diagram of the nanoporous ion trapping agent used in the adhesive composition of the present invention.
4 is an evaluation of migration characteristics of the adhesive composition of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention to those skilled in the art will fully convey. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

As migration of metal ions such as copper (migration) occurs in an adhesive composition used for sealing a semiconductor device, a reduced metal species grows to induce disconnection or change in electrical resistance. There is a problem of lowering.

Accordingly, the present invention is to provide an epoxy based adhesive composition for effectively preventing or inhibiting metal ion migration such as copper. That is, the adhesive composition according to an embodiment of the present invention is an ion trapping agent having a nano-sized porous structure (Nano-pore) surface modified with a polymer (especially an anion functional group-containing polymer) in the curable epoxy resin composition for adhesion By adding it to an epoxy resin composition, it is providing the epoxy resin composition which can effectively prevent the problem of the prior art which copper ion moves through an adhesive bond layer.

The nanoporous ion trapping agent according to the present invention is a nanoporous material having nano-sized pores, the pores having a size of 50 nm or less uniformly formed. In general, the uniformly arranged pores of 2 nm or less are called micro-porous materials, and the meso-porous materials having pores of uniform size of 2 nm to 50 nm are called meso-porous materials. And, having pores of 50 nm or more in size is called a macro-porous material, which is referred to collectively as a nanoporous material, and the nanoporous ion trapping agent used in the present invention has a large surface area and pore volume. In addition, anion charges are formed in the pores, and the cation adsorption effect is further increased by polymer modification. That is, the adsorption of copper ions, which are cations, is caused by the electrostatic attraction of the charges formed in the pores of the nanoporous ion trapping agent. In particular, the copper ions adsorbed in the pores are not discharged to the outside again by the electrostatic attraction with the porous surface.

The nanoporous ion trapping agent surface-modified with the polymer was modified in such a manner as to carry a polymer having an anion functional group. In other words, by modifying the porous material by pre-supporting a polymer having an anionic functional group such as carboxylate (COO ⁻ ) in the porous structure, the effect of inhibiting dispersion by the polymer in the adhesive having mostly hydrophobic aromatic groups is prevented.

In the present invention, the polymer of the nanoporous ion trapping agent surface-modified with the polymer is preferably a polymer having an anionic functional group, the polymer having an anionic functional group is a polyethyleneimine-based, such as the general formula (1), carboxyl as the formula (2) Polymers, such as a polyethylenimine type | system | group which has a late group, the polyacrylic acid type, polyacrylamide type, polyacrylate type, and polyamine sulfonic acid type which have a carboxylate group like Formula (3), are preferable.

The molecular weight of the polymer has a value between 200 and 1,000,000.

In the above formula, M represents a hydrogen atom, an ammonium group or an organic amine group, and the molecular weight of the polymer has a value between 200 and 1,000,000.

In the above formula, M represents a hydrogen atom, an ammonium group or an organic amine group, and the molecular weight of the polymer has a value between 200 and 1,000,000.

The skeleton of the polymer having an anionic functional group may be either branched or linear, but is more preferably a linear skeleton in which surface modification is advantageous for the nanoporous ion trapping agent. Moreover, although a homopolymer or a copolymer may be sufficient, it is preferable at the point which can form a stable polymer layer on a nanoporous structure as long as the molecular weight corresponding to a polymer backbone part is 200-1,000,000.

The important characteristics of the polymer having an anion functional group are those that are basic and those having extremely high polarity. Accordingly, polymers having anionic functional groups include many electron acceptor substrates such as metal substrates, glass substrates, inorganic metal oxide substrates, plastic substrates having polar surfaces, cellulose substrates, Lewis acidic substrates, acidic substrates, polar substrates, and hydrogen bonds. It has a strong interaction force with various surfaces such as sex base materials. Since the nanoporous ion complexes modified with polymers having such anionic functional groups have a strong coordination ability with respect to metal ions, metal ions coordinate with units such as ethyleneimine in the backbone to form metal ion complexes. Unlike an ionic bond, this can form a complex by coordination to units, such as ethyleneimine, whether the metal ion is a cation or an anion.

In the present invention, the nanoporous ion trapping agent may be mesoporous silica (Periodic mesoporous organosilicas), aluminum silicate or silicate substituted with a transition metal, zeolite, and the like, and particularly preferably silicate having a mesoporous structure. That is, the copper ion-preventing effect of the adhesive according to the present invention is maximized by silicates having a porous structure even if it does not contain aluminum or other transition metals. It can be described as the suppression of the ion release effect by the miracle attraction, the following experimental example describes the excellent ion migration prevention effect of the adhesive composition according to the present invention.

In order to improve the thixotropy of the adhesive composition and the reliability of the semiconductor package, the nanoporous ion trapping agent preferably has a particle size of 5 μm or less in the form of particles. It is preferable to use 4 micrometers nanoporous silica, and it is more preferable if it is surface-treated to have hydrophobicity in order to improve dispersibility in an adhesive composition. Moreover, the average particle diameter of the said nanoporous ion trapping agent is 0.05? It is more preferable that it is 3 micrometers, and is 0.1? It is most preferable that it is 2 micrometers. If the size is exceeded, the thickness of the adhesive composition is not uniform, which may cause problems in the semiconductor packaging process and affect the adhesion.

The pore size of the nanoporous ion trapping agent is about 1 to 10 nm, and it is preferable to use an ion trapping agent having a porous structure having a size of 6 to 8 nm. The pore volume of the ion trapping agent is 0.7 to 1.2 cc / g, and a nanoporous silica-based ion trapping agent having a specific surface area of 600 to 900 m ² / g is preferable. do.

In view of the viscosity, mechanical strength, workability, and package reliability of the adhesive composition, the nanoporous ion trapping agent is preferably used in an amount of 1 to 20 parts by weight, more preferably 1 to 10 parts by weight, based on the total epoxy resin composition. It is most preferable to use 5-10 weight part. If less than the above range, it is difficult to adsorb sufficient copper ions, on the contrary, if more than the above range, excessive nanoporous material dispersion may cause a problem in terms of workability and package reliability of the epoxy adhesive.

The epoxy resin of the present invention has excellent adhesion and is stable to heat, and thus is suitable for use in semiconductor packaging processes. The epoxy resin may be a liquid or solid general purpose epoxy resin, it is preferable to use a mixture of liquid and solid epoxy resin.

The epoxy resin is not particularly limited as long as it is an epoxy resin used for semiconductor die bonding, and is preferably an epoxy compound containing two or more epoxy groups in a molecule. Examples of the epoxy resin include bisphenol A-based, bisphenol-F-based, phenol novolac-based, cresol novolac-based, biphenyl, including epoxy modified with polysulfide resin illustrated in Chemical Formula 4 below, epoxy modified with urethane, rubber, etc. It is preferable to use at least 1 type selected from the group consisting of a system, a naphthalene system, a phenoxy clock, a silicone system, and a polyfunctional epoxy. The epoxy resin is preferably 5 to 60 parts by weight, more preferably 10 to 40 parts by weight, and most preferably 10 to 30 parts by weight of the total composition in terms of curing rate, workability, and package reliability of the adhesive composition. If the epoxy resin is less than the above range, sufficient adhesive effect cannot be expected. On the contrary, if the epoxy resin exceeds the above range, it is difficult to effectively prevent the movement of metal ions such as copper.

(Wherein x is 3 to 14)

Butadiene acrylonitrile rubber in the adhesive composition according to an embodiment of the present invention to reduce the elastic modulus and glass transition temperature of the resin composition, to ensure the process margin of the B-stage process, to improve the reliability of the semiconductor package Can be used. The butadiene acrylonitrile rubber has a butadiene content ratio of 55 to 75 parts by weight based on the total rubber and an acrylonitrile content of 25 to 45 parts by weight in total in terms of adhesion, electrical insulation and compatibility with the resin composition. It is preferable to use one. Butadiene acrylonitrile rubber of the following formula (5) is preferably used in an amount of 10 to 60 parts by weight based on the total adhesive composition in terms of curing rate, curing temperature, workability margin of the adhesive composition and reliability of the package, 10 More preferably, it is used in an amount of from 30 to 30 parts by weight, most preferably from 15 to 25 parts by weight.

(In the formula, x1, x2 and y are each 0.6-0.8, 0.1-0.2, 0-0.3, and M is 50-80)

The curing agent of the adhesive composition according to the present invention is not particularly limited as long as it can react with an epoxy resin to form a cured product, but it is preferable to use a novolak resin represented by the following Chemical Formulas 6 and 7, The phenolic hydroxyl group equivalent is preferably 100 to 110, and it is preferable to use a high purity product having a hydroxyl equivalent of 160 to 180 in the xylene novolac resin represented by the following formula (7).

The curing agent is preferably used in an amount of 2 to 20 parts by weight, more preferably 3 to 10 parts by weight, and more preferably 5 to 10 parts by weight, based on the curing rate of the adhesive composition and the reliability of the semiconductor device. Most preferred.

(Wherein the average value of n is 0.1 to 3)

(Wherein the average value of n is 0.1 to 3)

In the present invention, in addition to the curing agent, a curing accelerator capable of promoting a curing reaction with an epoxy resin may be further used. In addition, it is also possible to use a curing accelerator or a curing accelerator modified with a curing agent encapsulated in a thermoplastic resin to increase the room temperature stability as needed. At this time, the curing accelerator is preferably 0.2 to 5 parts by weight of the total composition.

The organic solvent is for viscosity control and dilution of the adhesive composition, it is preferable to use a non-reactive compound having a high boiling point of 200 to 250 ℃, most preferably to use a carbitol-based compound. The organic solvent has respect to the total adhesive composition in terms of viscosity, mechanical strength, workability, and package reliability of the adhesive composition.

It is preferable to use 10-50 weight part, It is more preferable to use 20-40 weight part, It is most preferable to use 25-35 weight part.

In the present invention, in addition to the above components, an antifoaming agent for facilitating removal of bubbles, a dispersing agent for improving dispersibility, a silane coupling agent for increasing mechanical properties or adhesion, etc. may be further used as an additive. In this case, the total weight of the additive is preferably 0.5 to 5 parts by weight of the total composition.

The epoxy resin composition according to the present invention can be used in a semiconductor device as an adhesive composition.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of one aspect of the BGA system semiconductor device using the adhesive composition of this invention. In FIG. 1, reference numeral 1 denotes a semiconductor chip component (IC), reference numeral 2 denotes an adhesive which is a composition according to the present invention, reference numeral 3 denotes a circuit board (PCB), and reference numeral 4 denotes a solder ball. And 5 is an epoxy molding compound (EMC).

Hereinafter, the present invention will be described in more detail with reference to preferred examples, examples and experimental examples.

Manufacturing example

Polymer Modified Porous Nanoparticles Fabrication

Manufacturing example  1-1

The nanoporous ion trapping agent particles were immersed in the polyethyleneimine solution of Formula 1, stirred for 24 hours under conditions of pH 3 or 5, and the nanoporous particles were loaded with a polymer to modify the nanoporous ion trapping agent. Polyethyleneimine (PEI) manufactured by the following Chemical Formula (BAI) was used as the molecular weight of 7.5x10 ⁵ .

Manufacturing example  1-2

After immersing the nanoporous ion trapping particles in a solution containing a carboxyl group of Formula 2 (Carboxymethylated polyethyleneimine, CMPEI, BASF, M _av = ca. 5.0x10 ⁴ ) solution, the mixture was stirred for 24 hours at a pH of 3 or 5 The nanoporous ion trapping agent was modified by carrying a carboxylate group-containing polyethyleneimine polymer on the nanoporous ion trapping agent particles.

Manufacturing example  1-3

The nanoporous ion trapping agent particles were immersed in a polyacrylic acid (Polyacrylic acid, PAAA, Aldrich, M _av = ca. 1.0x10 ⁵ ) solution containing a carboxyl group of Formula 3, and then stirred for 24 hours at a pH 3 or 5 condition. The nanoporous ion trapping agent was modified to carry a carboxylate group-containing polyacrylic acid polymer on the nanoporous ion trapping agent particles.

Example  1 to Example  3 lessons Comparative example

Epoxy Resin Composition Preparation

After blending the raw materials in the blending ratio shown in Table 1, by using a mixing machine and a three-axis roll mill, stirring, dispersion, and mixing to prepare an adhesive composition. Since the solid epoxy and the curing agent were directly added and difficult to mix, the composition was prepared by dissolving in an organic solvent before mixing the raw materials and sufficiently stirring and dispersing using a triaxial roll mill. Evaluation was performed by the evaluation method described below using the adhesive composition prepared above.

1. Epoxy Resin

1) o-cresol novolac type epoxy resin: EOCN-1020 (Nippon Kayaku Co., equivalent 200g / eq)

2) Bisphenol A epoxy resin: KDS-8128 (Kukdo Chemical, equivalent 180g / eq)

3) Polysulfide epoxy resin: FLEP-60 (Toray Fine Chemicals, equivalent to 275 g / eq)

2. Butadiene acrylonitrile rubber: CTBN 1300X13 (Emeralds, Acid 33)

3. Curing agent

1) Phenolic resin represented by the following chemical formula: HF-1M (Meiwa Plastic Industries, hydroxyl equivalent 107)

(average value of n is 0.1 to 3)

2) Phenol aralkyl resin represented by the following formula: MEH-78004s (Meiwa Plastic Industries, hydroxyl group equivalent 173)

(average value of n is 0.1 to 3)

4. Curing accelerator

 1) Modified polyamine type: LC-500 (Shin-A T & C, amine value 105mg KOH / g)

 2) imidazole series: HXA-3932HP (Asahi Kasei)

5. Mineral filler: R-972 (DEGUSSA-HULTS, specific surface area 100 m ² / g)

6. Ion Capture Agent

 1) IXE-600 (Doagosei Co., Ltd.), a metal oxide-based non-porous structure for comparison.

 2) Polymer modified nanoporous mesoporous system (mesoporous silica): S 15-20-30 modified by Preparation Example 1-1, S15-20-32.5 modified by Preparation Example 1-2, Preparation Example 1- 3 modified S15-20-40, S15-40-27.5.

XRD analysis results of the nanoporous ion trapping agent are shown in FIG. 2, and the results of pore size distribution are shown in FIG. 3. Moreover, the result regarding these physical properties is shown in Table 2.

7. Other

1) Organic solvent: Carbitol (Samjeon Chemical)

 2) Defoamer: BYK-A501 (BYK company)

3) Dispersant: BYK-110 (BYK company)

Table 1 is a component table of the adhesive composition (Examples 1 to 3) and the comparative composition (comparative example) according to the present invention.

Example 1 Example 2 Example 3 Comparative example EOCN 7.5 7.5 7.5 10.0 KDS-8128 15.0 20.0 25.0 5.0 Flep-60 15.0 CTBN 1300X13 10.0 15.0 20.0 35.0 HF-1M 5.0 2.5 4.7 MEH-78004s 5.0 2.5 0.5 LC-500 0.4 0.6 0.3 0.7 HXA-3932HP 0.3 R-972 5.0 5.0 5.0 5.0 S15-20-30 3.0 1.0 S15-20-32.5 2.0 1.0 S15-20-40 1.0 2.0 S15-40-27.5 2.0 IXE-600 1.0 Carbitol 30.0 30.0 30.0 25.0 BYK-A501 0.4 0.4 0.4 0.4 BYK-110 0.5 0.5 0.5 0.4

Nanoporosity
Ion trap S15-20-30 S15-20-32.5 S15-20-40 S15-40-27.5 S _BET
(m ² / g) 658 851 703 694 V _T
(cc / g) 0.77 1.03 1.12 0.78 Mean pore
Size (nm) 6 6.5 9 5.5 Particle
Size (㎛) 2 to 4 1-4 1-3 3 to 6 Particle
shape

Property evaluation methods and results of Examples and Comparative Examples are shown in Table 3 below, and the evaluation methods are as follows.

Tensile modulus

Tensile modulus specimens were manufactured according to ISO 527-2, and after curing at 125 degrees 30 minutes and 175 degrees 1 hour, the cross-head speed was 50 mm / min using UTM (Zwick, Z050). Tensile test was performed to measure the tensile modulus.

2. Water absorption

The epoxy resin composition was left at 120 to 30 minutes at 175 for 1 hour to prepare a cured test piece having a thickness of 2 mm, a width of 50 mm, and a length of 50 mm, and the moisture absorption rate was measured after standing at 121 ° C. and 100% RH for 24 hours. The moisture absorption was calculated by the following formula.

Hygroscopicity (%) = (W _{1 -} W ₂ / W ₂ ) X 100

W ₁ is the weight of the sample after water absorption and W ₂ is the weight of the sample before water absorption.

3. Screen printability

The screen printing equipment was used to print the adhesive compositions of Examples and Comparative Examples on a substrate to check the condition. The print job was smooth and the printed condition was good, and the print job was not smooth or the print status was bad.

4. B-stage Margin

The adhesive composition printed on the substrate was placed in a convection oven to check the curing state of the B-stage at a temperature of 10 ° C. and a temperature of 10 ° C. lower than the work temperature and the work temperature. In the process for adhering the chip after the B-stage curing, it is indicated as good if chip adhesion is possible and bad if not.

5. Metal ion migration

Specimens for evaluating metal ion migration were fabricated as follows. A comb-shaped conductor pattern having a conductor width of 80 μm and a distance between conductors of 80 μm was formed on a printed circuit board, and an epoxy resin composition was applied thereon to a thickness of 100 μm and dried at 120 degrees 30 minutes and 175 degrees 60 minutes to prepare a specimen. It was. This was applied to a voltage of 100V in a constant temperature and humidity chamber of 130 ℃, 85% RH and left for 24 hours to confirm the occurrence of migration. If there was no migration phenomenon, it was marked as good, and if it occurred, it was marked as bad.

6. Reliability

 1) MRT (Moisture Resistance test): A chip made by attaching a chip on a printed substrate with adhesive composition and epoxy molding is left at 85 ° C and 85% RH. The chip is then chipped using C-SAM (Scanning Acoustical Microscopy). The number of peeling occurrences between the substrate and the substrate was evaluated.

 2) PCT (Pressure Cooker Test): C-SAM (Scanning Acoustical Microscopy) was used by leaving a component made by attaching a chip on a printed substrate with adhesive composition and epoxy molding at 120 ℃, 100% RH and 0.2 MPa pressure. The number of peeling occurrences between the chip and the substrate was evaluated.

Example 1 Example 2 Example 3 Comparative example Tensile Modulus 5.39 5.13 4.62 1.5 Moisture absorption 0.4 0.5 0.6 0.7 Screen printability Good Good Good Good Temperature margin Good Good Good Good Migration Good Good Good Bad MRT 0/24 0/24 0/24 3/24 PCT 0/24 0/24 0/24 7/24

Referring to Table 3, Examples 1 to 3 containing a nanoporous ion trapping agent modified with a polymer having an anion functional group can be seen that has excellent migration properties, compared to the general metal oxide ion trapping agent does not have a porosity. Furthermore, it can be seen that the tensile modulus is also excellent.

4 is a photograph illustrating a migration phenomenon that occurs when the adhesive composition according to the present invention and the adhesive composition according to the comparative example are used.

Referring to FIG. 4, when the adhesive composition according to the present invention is used, migration does not occur (upper figure), but when the adhesive composition according to the comparative example is used, migration can be seen (lower figure).

The epoxy resin composition according to the present invention is used in a semiconductor device, in particular can be used as a sealing material of the semiconductor device. To this end, the epoxy resin composition may be bonded between the substrate in the form of a film.

The present invention has been described above with reference to preferred embodiments thereof. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the disclosed embodiments are to be regarded in an illustrative rather than a restrictive sense, and all differences within the equivalent scope should be construed as being included in the present invention.

1: Semiconductor Chip Component (IC)
2: adhesive
3: Circuit Connection Board (PCB)
4: Solder Ball
5: epoxy molding compound (EMC)

Claims (10)

An epoxy resin composition, wherein the composition
5 to 60 parts by weight of an epoxy resin;
10 to 60 parts by weight of butadiene acrylonitrile;
2 to 20 parts by weight of the curing agent;
0.2 to 5 parts by weight of a curing accelerator;
1 to 20 parts by weight of the polymer-modified nanoporous ion trapping agent;
0.5 to 5 parts by weight of the additive; And
Epoxy resin composition comprising 10 to 50 parts by weight of an organic solvent. The method of claim 1,
The polymer-modified nanoporous ion trapping agent is an ion trapping agent and an epoxy resin composition using the same, characterized in that a polymer having an anionic functional group is carried in the nanopore. The method of claim 2,
The polymer having an anionic functional group is modified with at least one selected from polymers such as polyethyleneimine, carboxyl group-containing polyethyleneimine, carboxyl group-containing polyacrylic acid, polyacrylamide, polyacrylate, and polyamine sulfonic acid. An ion trapping agent and an epoxy resin composition using the same. The method of claim 2,
An ion trapping agent and an epoxy resin composition using the same, characterized in that a polymer having a molecular weight of 200 to 1,000,000 is carried thereon. The method of claim 2,
The nanoporous ion trapping agent is a mesoporous material epoxy silicate composition, characterized in that the porous silicate or porous aluminosilicate, zeolite. 6. The method of claim 5,
The mesoporous material porous silicate has a particle size of 0.01 to 4 μm, a pore size of 1 to 10 nm, a pore volume of 0.7 to 1.2 cc / g, and a specific surface area. Epoxy resin composition, characterized in that 600 to 900 m ² / g. The method of claim 1,
The epoxy resin is bisphenol A-based, bisphenol-F, phenol novolak-based, cresol novolak-based, biphenyl-based, naphthalene-based, phenoxy clock including epoxy modified with polysulfide resin, epoxy modified with urethane-based, rubber-based, etc. , At least one selected from silicone-based and polyfunctional epoxy resins. The method of claim 1,
The epoxy resin is an epoxy resin composition, characterized in that the epoxy mixing equivalent of 150 ~ 400g / eq. The semiconductor device containing the epoxy resin composition of any one of Claims 1-8. The semiconductor device which manufactures the epoxy resin composition of any one of Claims 1-8 in film form, and uses it as a semiconductor sealing material.

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