KR20120069619A - Liquid crystal display and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A liquid crystal display device and a manufacturing method thereof are provided to increase the strength of a panel. CONSTITUTION: A thin film transistor is formed on a first substrate. A second substrate faces the first substrate. A color filter is formed on the second substrate. A round portion polishes at least one of edges of outer sides opposite to a side that the first and second substrates face. The radius curvature of the round portion is between 20 and 80 micrometers.

Description

Liquid crystal display device and its manufacturing method {LIQUID CRYSTAL DISPLAY AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a grinder and a polishing method using the same, and more particularly, to a grinder, a polishing method of a panel using the same, a method of manufacturing a display device using the polishing method, and a display device manufactured using the same.

Flat panel displays are flat, thin, thin display devices, and include liquid crystal displays, organic light emitting diode displays, and the like.

The flat panel display apparatus includes a display panel for displaying an image. In general, the display panel is formed by bonding an upper substrate and a lower substrate on which an element or the like for image display is formed to form a mother panel, and then a desired cell size. It is formed by cutting. At this time, the cutting process of the mother panel consists of a process of forming a cutting groove with a cutting wheel (cutting wheel) and a process of hitting the cutting groove using a breaker (breaker) or the like.

By such a cutting process, a display panel having a desired size can be separated, such that horizontal cracks or vertical cracks may occur in the corner region of the cut surface, and plastic deformation occurs in a portion where the cut groove is formed. Flaw may occur.

On the other hand, in order to remove such a defect, a method of cutting by making the cutting depth of the cutting wheel shallow has been devised, but there is a limit in healing the crack through this. In addition, in order to remove defects, a method of grinding the edges of the cut surface using abrasive stones having a roughness and a large hardness such as diamond is used. Although cracks due to cutting can be removed, the surface roughness is better than before grinding. Will increase. Since the increase in the surface roughness leads to a decrease in the strength of the panel, there is a problem that the strength of the desired panel can not be secured by this polishing method.

An object of the present invention is to provide a grinder that can heal cracks at the edges of a cut surface.

Another object of the present invention is to provide a method for polishing a display panel that can heal cracks at edges of a cut surface and improve panel strength.

Another object of the present invention is to provide a liquid crystal display device and an organic light emitting display device in which the edges of the cut surface of the panel are polished, and to manufacture a liquid crystal display device and an organic light emitting display device comprising a method of polishing the edges of the cut surface of the panel. To provide a way.

The grinder according to an embodiment of the present invention includes a polishing portion forming a polishing surface and a shaft connected to the polishing portion to rotate the polishing portion. In addition, the polishing portion includes a mixture of a curing agent and an abrasive and a polyurethane, and an angle α formed between the surface perpendicular to the axis of rotation of the shaft and the polishing surface satisfies 1 ° ≦ α ≦ 7 °.

The polishing unit may include 30 to 50 wt% of the mixture of the polyurethane and the balance of the total amount of the polishing unit, and the mixture includes 50 to 60 wt% of cerium oxide as the curing agent based on the total amount of the mixture. can do.

The abrasive may include at least one of zirconium oxide, silicon carbide, and aluminum oxide.

The polishing unit may include a plurality of pores.

According to an embodiment of the present invention, a polishing method includes rotating a grinder including a polishing part having a polishing surface and a shaft connected to the polishing part, and entering a panel in which a first substrate and a second substrate are bonded to the grinder. And polishing the edges by contacting the edges of the panel with the polishing surface of the grinder. In addition, the angle α formed by the surface perpendicular to the rotation axis of the shaft and the polishing surface, the surface perpendicular to the rotation axis of the shaft and the outer surface of the panel perpendicular to the cutting surface of the panel and opposite to the polishing surface of the grinder; The angle β to be achieved satisfies 1 ° ≦ α ≦ 7 ° and 10 ° ≦ β ≦ 60 °, respectively.

The rotation speed of the grinder may be in the range of 1,000rpm to 10,000rpm, the traveling speed of the panel may be in the range of 0.1m / min to 10m / min.

The polishing unit may include a mixture containing 30 to 50 wt% of the polyurethane as a binder and a balance of the remaining healing agent and the polishing agent, based on the total amount of the polishing unit, and the mixture may be 50 to the total amount of the mixture. To 60% by weight of cerium oxide may be included as a healing agent. In addition, the abrasive may include at least one of zirconium oxide, silicon carbide, aluminum oxide.

The polishing unit may include a plurality of pores.

The liquid crystal display according to the exemplary embodiment of the present invention includes a first substrate on which a thin film transistor is formed, and a second substrate on which the thin film transistor is bonded to face the first substrate. In addition, at least one of the edges of the outer surface located opposite the opposing surface of the first substrate and the second substrate has a polished round portion.

At this time, the radius of curvature of the round may be in the range of 1/20 to 1/5 of the thickness of the first substrate or the second substrate. In addition, the radius of curvature of the round may be in the range of 20 ㎛ to 80 ㎛.

In a method of manufacturing a liquid crystal display according to an exemplary embodiment of the present invention, a thin film transistor is formed on a first substrate, a color filter is formed on a second substrate, and the second substrate is bonded to the first substrate. (Iii) forming a panel, and injecting a liquid crystal between the first substrate and the second substrate. In addition, the panel is cut along the boundary of the cell of the mother panel to separate the panel, and the panel is entered into a rotating grinder including a polishing portion having a polishing surface and a shaft connected to the polishing portion, and an edge of the cutting surface of the panel. Polishing at least one of the edges by contacting the polishing surface of the grinder. At this time, the angle α formed between the surface perpendicular to the rotation axis of the shaft and the polishing surface, the surface perpendicular to the rotation axis of the shaft, and the outside of the panel perpendicular to the cutting surface of the panel and opposite to the polishing surface of the grinder. The angle β formed on the side surface satisfies 1 ° ≦ α ≦ 7 ° and 10 ° ≦ β ≦ 60 °, respectively.

The diameter of the abrasive portion of the grinder may be smaller than the length of the edge being polished.

The organic light emitting diode display according to the exemplary embodiment includes a thin film transistor, a first substrate on which the organic light emitting diode is formed, and a second substrate facing the first substrate and bonded to the first substrate. In addition, at least one of the edges of the outer surface of the first substrate located opposite the opposing surface of the first substrate and the second substrate has a polished round portion.

The radius of curvature of the round part may be in the range of 1/20 to 1/5 of the thickness of the first substrate. In addition, the radius of curvature of the round portion may be in the range of 20㎛ to 80㎛.

The second substrate may be formed of glass, wherein at least one of the edges of the outer surface of the second substrate, which is opposite to the opposite surface of the first substrate and the second substrate, may be polished. Can have

The second substrate may be formed as an encapsulation film in which a plurality of thin films are stacked.

In the method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention, a thin film transistor and an organic light emitting diode are sequentially formed on a first substrate, and a mother panel is formed by bonding a second substrate on the first substrate. Steps. In addition, the cutting surface of the first substrate while cutting along the boundary of the cell of the mother panel to separate the panel, the panel is entered into a rotating grinder including a polishing portion having a polishing surface and a shaft connected to the polishing portion. Polishing at least one of the edges of the edge of the panel by contacting the polishing surface of the grinder. At this time, the angle α formed between the surface perpendicular to the rotation axis of the shaft and the polishing surface, the surface perpendicular to the rotation axis of the shaft, and the outer surface of the panel perpendicular to the cutting surface of the panel and opposite to the polishing surface of the grinder. The angle β to be satisfied satisfies 1 ° ≦ α ≦ 7 ° and 10 ° ≦ β ≦ 60 °, respectively.

The diameter of the polishing portion of the grinder may be smaller than the length of the edge of the first substrate to be polished.

The second substrate may be formed of glass, and the first substrate and the second substrate may be bonded through a sealant applied on the first substrate or the second substrate. In this case, the method may further include polishing at least one of the edges of the cut surface of the second substrate by contacting the polished surface of the grinder. In addition, the diameter of the polishing portion of the grinder may be smaller than the length of the edge of the second substrate to be polished.

The second substrate may be formed of an encapsulation film in which a plurality of organic and inorganic films are stacked, and the first substrate and the second substrate may be bonded by curing the encapsulation film with ultraviolet rays.

According to one embodiment of the present invention, the panel may be polished uniformly and efficiently to remove defects such as cracks at edges of the cut surface generated after cutting the panel.

In addition, the surface roughness of the edge of the cut surface can be reduced to maintain the strength of the panel.

In addition, the yield of the product can be suppressed in the manufacturing process to improve the yield.

1 is a perspective view of a grinder according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the grinder cut along the line II-II of FIG. 1. FIG.
3 is a perspective view illustrating a process of polishing an edge of a panel according to an embodiment of the present invention.
4A and 4B are views viewed from the direction A and B of FIG. 3, respectively, and FIG. 4C is a cross-sectional view taken along the line IV-IV of FIG. 3.
5a to 5c are photographs comparing the edges of the panel after the polishing process according to an embodiment of the present invention with a comparative example.
6A to 6D are views sequentially illustrating a manufacturing process of a liquid crystal display according to an exemplary embodiment of the present invention.
7A to 7D are views sequentially illustrating a manufacturing process of an organic light emitting diode display according to an exemplary embodiment of the present invention.
8A to 8D are views sequentially illustrating a manufacturing process of an organic light emitting diode display according to another exemplary embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily practice the present invention.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification. In addition, the size and thickness of each configuration shown in the drawings are arbitrarily shown for convenience of description, so the present invention is not necessarily limited to the illustrated. That is, the thickness is exaggerated and exaggerated to clearly express various layers and regions in the drawings. On the other hand, when a part such as a layer, a film, etc. is said to be "on" or "on" another part, this includes not only the case where the other part is "directly on" but also another part in the middle.

FIG. 1 is a perspective view of a grinder according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1, with reference to them to explain a grinder according to the present embodiment.

The grinder 10 of this embodiment includes the grinding | polishing part 11 and the shaft 13. The polishing unit 11 includes a polishing surface 11a in direct contact with an object to be polished to substantially polish the object, and an inside thereof includes a cylindrical groove 11b. The shaft 13 transmits rotational force to the polishing unit 11 so that the polishing surface 11a rotates at a high speed to perform polishing. Specifically, the shaft 13 is connected to an electric motor (not shown) driven by an external power source and rotated. The rotational force is transmitted to the grinding | polishing part 11 by this.

Referring to FIG. 2, the polishing surface 11a of the present exemplary embodiment is formed to be inclined at an angle with respect to the plane VP perpendicular to the rotation axis AX rather than being a plane. That is, the upper part of the grinding | polishing part 11 of this embodiment has the truncated truncated conical shape of the grinding | polishing surface 11a. As a result, in the process of performing the polishing process, the object to be polished and the polishing surface 11a may be uniformly contacted, thereby improving the polishing efficiency and the product yield, which will be described in detail later.

Thus, in this embodiment, the inclined surface SP, which extends the polishing surface 11a, has a plane VP perpendicular to the rotation axis AX and a predetermined angle α, wherein the inclined surface SP and the rotating shaft ( The angle α formed by AX has a value in the range of 1 ° to 7 °. If the angle α is less than 1 °, the polishing surface 11a may have a shape close to a plane, and the inside of the polishing surface 11a may be worn out early, resulting in a problem such as a step. In the case where the angle α exceeds 7 °, the uniformity of polishing may decrease. Therefore, in the present embodiment, the angle α formed between the inclined surface SP and the rotation axis AX is set to a value between 1 ° and 7 °.

The polishing unit 11 is formed of a material obtained by mixing a mixture of a healing agent and an abrasive with a binder. In the present embodiment, the binder is a polyurethane (polyurethane), it is possible to form pores on the polishing surface (11a) by using the polyurethane as a binder, it is possible to obtain a softer polishing surface (11a) do. Accordingly, when the grinder is formed of diamond or the like, the problem of having a rough cross section after polishing due to high hardness can be solved.

On the other hand, the binder formed of polyurethane may contain 30 to 50% by weight. In this embodiment, the polishing portion 11 is formed of 30 to 50% by weight of polyurethane and the remainder of the curing agent and abrasive mixture.

Cerium oxide (Cerium oxide, CeO ₂ ) is used as a healing agent for curing a crack of the object to be polished. In addition, the abrasive mixed to enhance the polishing effect may include at least one of zirconium oxide (zrconium oxide, ZrO ₂ ), silicon carbide (SiC), aluminum oxide (Al ₂ O ₃ ). have. In this embodiment, the mixture of the healing agent and the abrasive contains 50 to 60% by weight of the healing agent, ie cerium oxide. In addition, zirconium oxide, silicon carbide, and aluminum oxide, which may be used as an abrasive, may be used by mixing at least 10% by weight, respectively.

In this way, by using a mixture of a curing agent containing cerium oxide and an abrasive containing zirconium oxide and the like together with a binder containing polyurethane, the pores can be healed and exhibit sufficient polishing effect. Including a polishing portion 11 having a soft characteristic can be formed.

3 is a perspective view showing a process of polishing the edges of the panel according to an embodiment of the present invention, Figures 4a and 4b is a side view seen in the direction A and B of Figure 3, Figure 4c is a IV- of FIG. A cross section taken along the line IV. Hereinafter, a polishing method according to an embodiment of the present invention will be described with reference to these.

Referring to FIG. 3, in the present exemplary embodiment, the mother panel, to which the upper substrate 21 and the lower substrate 23 are joined, is cut in cell units to form the panel 20, which is centered on the rotation axis AX. The grinding process proceeds toward the grinder 10 which rotates at a high speed. The grinder 10 according to the present embodiment has a shape and a material described with reference to FIGS. 1 and 2. That is, the polishing surface is formed to be inclined to form an angle α of 1 ° to 7 ° with the surface perpendicular to the axis of rotation AX, and the polishing unit includes polyurethane as a binder and a zirconium oxide healing agent including cerium oxide. It is formed by including an abrasive which may be included.

On the other hand, as described above, the grinding surface of the grinder 10 is formed to be inclined to form a predetermined angle (α) with the surface perpendicular to the rotation axis (AX), through which the grinding surface only on the basis of the center of the grinding surface And the edge of the panel 20 are in direct contact. 4A to 4C, the grinding surface of the grinder 10 forms an inclined surface SP having a predetermined angle α with respect to the surface VP perpendicular to the rotation axis AX. While moving, the edge of the panel 20 has a contact portion CP in contact with the polishing surface on only one side of the polishing portion. Since the grinder 10 rotates about the rotation axis AX to polish the edges of the panel 20 in contact with the rotary shaft AX, substantially all portions of the polishing surface at the contact portion CP are evenly aligned with the edges of the panel 20. Contact.

Unlike the present embodiment, when the polishing surface is formed in a plane (surface perpendicular to the rotation axis), as the panel moves, the edges of the panel enter the planar polishing surface, and thus both sides of the polishing surface are referred to. The contact portion is generated at the same time, the polishing proceeds simultaneously. In such a case, an excessive load may be applied to the inside of the polishing surface, whereby the inside of the polishing surface may be worn first, and a step may occur. As such, when a step occurs, an additional process for planarizing the polished surface is required. In addition, since polishing is simultaneously performed on both sides of which the rotation direction is different with respect to the center of the polishing surface, irregular grains may occur at the edges of the panel.

However, as in the present embodiment, as the polishing surface of the grinder 10 is formed with the inclined surface SP, polishing processing is uniformly performed on all portions of the polishing surface, and thus a step is generated in a specific portion of the polishing surface. The problem is solved. In addition, since the contact occurs only on one side of the polishing surface, the polishing process is performed in a constant direction, it is possible to suppress the problem that irregular grains occur in the edge of the panel. Thus, the life of the grinder can be extended, and the occurrence of defects can be reduced to improve the yield of the product.

In addition, a cylindrical groove is formed in the center of the polishing portion, whereby an excessive load can be prevented from being applied when the polishing process is performed. Meanwhile, in the present exemplary embodiment, the upper substrate 21 and the lower substrate 23 illustrate a structure in which the upper substrate 21 is bonded through the sealing member 25, but the present invention is not limited thereto, and the upper substrate 21 may be formed by various methods. And the lower substrate 23 may be bonded.

In the present embodiment, referring to FIG. 4B, the panel 20 has a predetermined angle with an upper surface of the panel 20 including an edge at which the surface VP perpendicular to the rotation axis AX of the grinder 10 is polished. move toward the grinder 10 to have β). At this time, when the angle β formed between the vertical surface VP of the rotation axis AX and the upper surface of the panel 20 is less than 10 °, the abrasive surface of the grinder 10 becomes large and the panel 20 Excessive pressure is applied to the upper surface of the), and defects may occur during the polishing process. In addition, when the angle β exceeds 60 °, polishing may be performed on unnecessary side surfaces other than the top edge of the panel 20 to be polished. Therefore, in the present embodiment, the angle β formed by the surface VP perpendicular to the rotation axis AX of the grinder 10 and the upper surface of the panel 20 may be set to a value between 10 ° and 60 °.

In this embodiment, the grinder 10 rotates at high speed while the panel 20 moves at low speed for sufficient polishing. However, in consideration of polishing efficiency, the rotational speed of the grinder 10 and the moving speed of the panel 20 may be limited within a predetermined range.

When the rotation speed of the grinder 10 is less than 1,000 rpm, sufficient grinding of the edge portion of the panel 20 may not be performed. On the other hand, when the rotational speed exceeds 10,000rpm, vibration may occur due to the high rotational speed, thereby causing a problem that it is difficult to achieve uniform polishing. Therefore, in this embodiment, the rotation speed of the grinder 10 is set to a value between 1,000 rpm and 10,000 rpm.

In this embodiment, the moving speed of the panel 20 is determined in the range of 0.1 m / min to 10 m / min. Generally, the smaller the moving speed of the panel 20, the more sufficient and uniform polishing can be achieved. However, when the moving speed is less than 0.1 m / min, it may be difficult to control the polishing process. Can be reduced. On the other hand, when the moving speed exceeds 10 m / min, sufficient polishing cannot be performed, thereby lowering the polishing efficiency and causing a defect.

In this manner, the rotational speed of the grinder 10 and the moving speed of the panel 20 can be determined appropriately within the above-described setting ranges in consideration of polishing efficiency, process speed, and the like.

5A to 5C are photographs comparing edges of a panel after a polishing process according to an embodiment of the present invention with a comparative example, and the effects of the grinder and the polishing method using the same according to the present embodiment will be described with reference to this. .

5A is a photograph showing an enlarged corner portion of one side of the cut surface and the cut surface of the panel cut by hitting the mother panel to the upper substrate and the lower substrate bonded through the cutting wheel to form a cutting wheel. Through this, it can be seen that the cutting grooves are formed and a large number of irregular defects such as cracks are formed at the corners where the hits are made.

FIG. 5B is an enlarged view of the cut surface and the corner portion thereof after polishing the edge of the cut surface of FIG. 5A using the abrasive stone formed of diamond. Unlike in FIG. 5A, a noticeable crack is reduced but the surface roughness is increased. Can be seen. Increasing the surface roughness causes a decrease in the strength of the substrate, which causes a problem that the strength of the substrate or the panel may be reduced through the polishing process.

On the other hand, Figure 5c is a photograph showing an enlarged cut surface and the corner portion after grinding the edge of the cutting surface of the panel with a grinder according to an embodiment of the present invention after cutting the mother panel. After grinding the edges of the panel with the grinder according to the present embodiment, irregular defects such as cracks are removed, and unlike the case of grinding with diamond-made abrasive stones, the surface roughness does not increase and maintains a smooth state. Through this, the grinder according to the present embodiment is formed in a structure having an inclined polishing surface, it can be confirmed that the above-described effect can be obtained by forming a polyurethane material with a soft material including cerium oxide and an abrasive.

Meanwhile, the process of cutting the panel is performed by forming a cutting groove in both substrates using a cutting wheel and then hitting the bar. The inner edge portion of the cutting surface not contacting the cutting wheel is substantially perpendicular to the upper and lower surfaces of the panel. Is formed. As a result, a defect problem such as a crack or the like does not occur at the inner edge of the cut surface, and thus a separate grinding process may not be required.

In addition, although not shown in the drawings, the smaller the thickness of the panel, the more susceptible to defects such as cracks due to cutting, so that a small panel having a relatively small thickness may have a relatively larger effect than a large panel.

Hereinafter, a description will be given of the above-described grinder, various flat panel display devices formed through the polishing method using the same and a manufacturing method thereof.

6 is a view sequentially illustrating a manufacturing process of a liquid crystal display according to an exemplary embodiment of the present invention, and a liquid crystal display and a manufacturing method thereof according to an exemplary embodiment of the present invention will be described with reference to the drawing.

The liquid crystal display panel of the liquid crystal display according to the present exemplary embodiment includes a TFT substrate 110 on which a thin film transistor (TFT) is formed and a CF substrate 120 on which a color filter (CF) is formed. 6A illustrates an enlarged view of a portion of the display area of the TFT substrate 110 and the CF substrate 120. Referring to this, the gate electrode 111 and the gate insulating layer 112 are formed on the TFT substrate 110. The semiconductor layer 113 and the ohmic contact layer 114 are sequentially formed. In addition, a source electrode 115 and a drain electrode 116 are formed on the ohmic contact layer 114, and a passivation layer 117 is formed thereon, and the pixel electrode 118 is a drain electrode 116 on the passivation layer 117. Is formed while connecting. In addition, a color filter (not shown) and a common electrode 121 for applying a voltage to the CF substrate 120 are formed on the CF substrate 120. The internal structure of the liquid crystal display panel is described as an example, and the present invention is not limited to the internal structure, and the present invention may be applied to a liquid crystal display panel having a structure that is variously modified.

After preparing the TFT substrate 110 and the CF substrate 120 as described above, a sealant is applied on the non-display area outside the display area of the CF substrate 120 and both substrates are bonded to form a mother panel. Thereafter, the sealant is cured by ultraviolet exposure or the like to form the sealing member 130, and the liquid crystal is injected between the TFT substrate 110 and the CF substrate 120.

Referring to FIG. 6B, the cutting wheel 30 forms a cutting groove along the boundary of the cell on the mother panel, and separates the panel by striking it. According to the process, the cut groove may be formed in at least one of the TFT substrate 110 and the CF substrate 120. Meanwhile, although the sealing member 130 is formed adjacent to the boundary of the cell in the present embodiment, it may be formed over both adjacent cells so as to overlap the boundary of the cell. In this case, the process of cutting the mother panel to separate the panel is made by cutting the upper portion of the sealing member to form a cutting groove and hit it.

Referring to FIG. 6C, after cutting the mother panel to separate the panel, the edge of the cut surface is polished using the grinder 10. At this time, a grinder having the same shape and material as the grinder described with reference to FIGS. 1 and 2 is used as the grinder 10. On the other hand, in the present embodiment, in order to easily control the polishing processing process, the grinder 10 of which the diameter of the grinding part of the grinder 10 is smaller than the length of one side of the panel is used, but the present invention is not limited thereto. The relative sizes of grinders and panels can vary depending on the size of the and other process conditions.

The inner edges of the edges of the cut surfaces where the TFT substrate 110 and the CF substrate 120 are adjacent to each other do not need to be polished because defects such as cracks are not a problem. The outer edges of the cut surfaces of the TFT substrate 110 and the CF substrate 120 require polishing to remove defects such as cracks and to improve strength. Therefore, in this embodiment, polishing is performed along the outer edges of the cut surfaces of the TFT substrate 110 and the CF substrate 120. In the present embodiment, the edges of the outer edges of the cut surfaces of the TFT substrate 110 and the CF substrate 120 may be selectively polished at the edges of which defects such as cracks are largely problematic, so that one to eight edges are polished. can do.

As described above, the polishing process is performed by using the grinder 10 to complete the manufacture of the liquid crystal display panel. Then, the liquid crystal display device according to the present embodiment is connected by combining a printed circuit board, a backlight assembly, and a mold frame containing the same. You get

The round part R is formed in the outer edge which performed the grinding process. In this embodiment, the radius of curvature of the round portion R is formed to a value of 1/20 to 1/5 of the thickness of the substrate on which the round portion R is formed. On the other hand, in the present specification, the round part is defined as including a shape having a polygonal outer line having a polygonal shape having three or more straight lines or a cross-sectional shape of a circle or an ellipse. That is, the forming of the round part includes a case where a flat surface is formed between two adjacent planes and connects them in addition to the case where a curved surface is formed between two adjacent planes. In addition, in the present specification, the radius of curvature of the round part means the radius of curvature of the ellipse when the cross-sectional shape is a circle or an ellipse, and the radius of curvature of the ellipse or circle that is simultaneously in contact with three or more faces when the cross-sectional shape is a polygon. do.

According to the manufacturing method of the liquid crystal display device as described above, by grinding the edge of the cut surface through the grinder 10, defects such as cracks at the edge portion caused by cutting can be removed, and the strength of the panel can be improved. have. In addition, the smaller the thickness of the panel, the more susceptible to defects such as cracks caused by cutting, and thus, when applied to a small and medium-sized liquid crystal display panel, a relatively large effect can be expected.

7 is a view sequentially illustrating a manufacturing process of an organic light emitting diode display according to an exemplary embodiment of the present invention. Hereinafter, an organic light emitting diode display and a manufacturing method thereof according to an exemplary embodiment of the present invention will be described. .

The organic light emitting display panel of the organic light emitting diode display according to the present exemplary embodiment includes a display substrate 210 on which the thin film transistor and the organic light emitting element 230 are formed, and an encapsulation substrate 240 opposite thereto. 7A illustrates an enlarged view of a portion of the display area of the display substrate 210. Referring to this, the buffer layer 211, the driving semiconductor layer 213, and the gate insulating layer 215 may be formed on the display substrate 210. The gate electrode 217 and the interlayer insulating film 219 are sequentially formed, and the source electrode 221 and the drain electrode 213 are respectively formed on the interlayer insulating film 219 and the source region and the drain region of the driving semiconductor layer 213. The thin film transistor is formed by being connected to the thin film transistor. The planarization layer 225 is formed on the interlayer insulating layer 219, the source electrode 221, and the drain electrode 223, and the pixel electrode 231 connected to the drain electrode 223 through the contact hole on the planarization layer 225. ), The organic light emitting layer 233, and the common electrode 235 are sequentially formed to form the organic light emitting device 230. The pixel electrode 231 may be an anode, the common electrode 235 may be a cathode, and vice versa, depending on a method of driving an OLED display. The internal structure of the organic light emitting display panel is described as an example, and the present invention is not limited to the internal structure, and the present invention may be applied to an organic light emitting display panel having a structure that is variously modified.

After preparing the display substrate 210 on which the thin film transistor and the organic light emitting element 230 are formed and the encapsulation substrate 240 formed of glass, a sealant is applied to at least one of the two substrates, and both substrates are bonded to each other. Form a panel. Thereafter, the sealant is cured through ultraviolet exposure or the like to form the sealing member 250.

After the display substrate 210 and the encapsulation substrate 240 are bonded to each other, the panel is separated and polished in a similar manner to the manufacturing process of the liquid crystal display.

Referring to FIG. 7B, after the display substrate 210 and the encapsulation substrate 240 are bonded to each other, the cutting wheel 30 forms a cutting groove along the boundary of the cell on the mother panel with the cutting wheel 30 and hits the panel. To separate. According to a process, the cut groove may be formed in at least one of the display substrate 210 and the encapsulation substrate 240. Meanwhile, in the present embodiment, the sealing member 250 is formed adjacent to the boundary of the cell. However, the sealing member 250 may be formed over both adjacent cells so as to overlap the boundary of the cell. In this case, the process of cutting the mother panel to separate the panel is made by cutting the upper portion of the sealing member to form a cutting groove and hit it.

Referring to FIG. 7C, after cutting the mother panel to separate the panel, the edge of the cut surface is polished using the grinder 10. At this time, a grinder having the same shape and material as the grinder described with reference to FIGS. 1 and 2 is used as the grinder 10. On the other hand, in the present embodiment, in order to easily control the polishing processing process, the grinder 10 of which the diameter of the grinding part of the grinder 10 is smaller than the length of one side of the panel is used, but the present invention is not limited thereto. The relative sizes of grinders and panels can vary depending on the size of the and other process conditions.

As described above, the inner edges of the cut surfaces where the display substrate 210 and the encapsulation substrate 240 are adjacent to each other do not need to be polished because defects such as cracks are not a problem. However, the display substrate 210 and the encapsulation substrate do not need to be polished. The outer edge of the cut surface of 240 requires polishing to remove defects such as cracks and to improve strength. Therefore, in the present exemplary embodiment, polishing is performed along the outer edges of the cut surfaces of the display substrate 210 and the encapsulation substrate 240. In the present exemplary embodiment, the edges of the outer edges of the cut surfaces of the display substrate 210 and the encapsulation substrate 240 that are seriously problematic such as cracks may be selectively polished, thereby polishing one to eight edges. It can be processed.

As described above, the polishing process is performed by using the grinder 10 to complete the manufacture of the organic light emitting display panel, and then the printed circuit board and the frame are combined to obtain the organic light emitting display device according to the present embodiment.

On the other hand, the rounded portion (R) is formed on the outer edge of the grinder 10 using the grinding process. In this embodiment, the radius of curvature of the round portion R is such that 1/20 to 1/5 of the thickness of the substrate on which the round portion R is formed.

According to the method of manufacturing the organic light emitting display device of the present embodiment, the edge of the cut surface is polished through the grinder 10, so that defects such as cracks at the edge portion caused by cutting can be removed, and the strength of the panel can be improved. have. In addition, the smaller the thickness of the panel, the more susceptible to defects such as cracks caused by cutting, and thus, when applied to a small and medium-sized organic light emitting display panel, a relatively large effect can be expected.

8 is a view sequentially illustrating a manufacturing process of an organic light emitting diode display according to another exemplary embodiment of the present invention. Hereinafter, an organic light emitting diode display and a manufacturing method thereof according to an exemplary embodiment of the present invention will be described. .

The organic light emitting display panel of the organic light emitting diode display according to the present exemplary embodiment has a structure similar to that of the organic light emitting display panel of FIG. 7. That is, as shown in FIG. 8A, the organic light emitting display panel according to the present exemplary embodiment includes a buffer layer 311, a driving semiconductor layer 313, a gate insulating layer 315, and a gate on the display substrate 310. The electrode 317 and the interlayer insulating film 319 are sequentially formed, and the source electrode 321 and the drain electrode 313 are respectively formed on the interlayer insulating film 319 by being connected to the driving semiconductor layer 313, thereby forming a thin film transistor. Configure In addition, the planarization layer 325 is formed on the interlayer insulating layer 319, the source electrode 321, and the drain electrode 323, and the pixel electrode connected to the drain electrode 323 through the contact hole on the planarization layer 325. The organic light emitting layer 333 and the common electrode 335 are sequentially formed to form the organic light emitting element 330. The internal structure of the organic light emitting display panel is described as an example, and the present invention is not limited to the internal structure, and the present invention may be applied to an organic light emitting display panel having a structure that is variously modified.

In the organic light emitting display panel according to the present exemplary embodiment, the encapsulation layer 340 including the organic layer 340a and the inorganic layer 340b is formed to seal the display substrate 310. Specifically, the organic layer 340a is formed of an ultraviolet curable material to stack the organic layer 340a and the inorganic layer 340b, and then the ultraviolet layer is irradiated to cure the organic layer 340a to form the encapsulation layer 340. do. In this case, an ultraviolet blocking film may be further formed between the organic light emitting device 330 and the encapsulation film 340 in order to block the characteristic change of the organic light emitting device due to ultraviolet irradiation. Meanwhile, in the present exemplary embodiment, the two-layer structure of the organic layer 340a and the inorganic layer 340b is illustrated, but the present invention is not limited thereto, and the organic layer 340a and the inorganic layer 340b may have a multilayer structure of two or more layers in which a plurality of organic layers and inorganic layers are stacked. .

After bonding the encapsulation layer 340 to the display substrate 310 as described above, the panel is separated and polished in a similar manner to the manufacturing process of the organic light emitting diode display of FIG. 7.

Referring to FIG. 8B, after bonding the encapsulation film 340 on the display substrate 310, the cutting wheel 30 forms a cutting groove along the boundary of the cell on the mother panel with the cutting wheel 30, and then hits the sealing film 340. Remove the panel. In this case, the cut groove is formed along the boundary of the cell on the display substrate 310.

Referring to FIG. 8C, after cutting the mother panel to separate the panel, the edge of the cut surface is polished using the grinder 10. At this time, a grinder having the same shape and material as the grinder described with reference to FIGS. 1 and 2 is used as the grinder 10. On the other hand, in the present embodiment, in order to easily control the polishing processing process, the grinder 10 of which the diameter of the grinding part of the grinder 10 is smaller than the length of one side of the panel is used, but the present invention is not limited thereto. The relative sizes of grinders and panels can vary depending on the size of the and other process conditions.

In the present embodiment, since the encapsulation film 340 is formed by stacking the organic film 340a and the inorganic film 340b, the edges on the encapsulation film 340 of the edges of the cut surfaces are free from defects such as cracks. There is no need to process. However, since the edge of the cut surface of the display substrate 310 needs to be polished to remove defects such as cracks and to improve strength, the edge of the cut surface of the display substrate 310 is polished along the edge of the cut surface of the display substrate 310. In the present embodiment, the edges of the edges of the cut surface of the display substrate 310 which are largely problematic such as cracks may be selectively polished, so that one to four edges may be polished.

As described above, the polishing process is performed by using the grinder 10 to complete the manufacture of the organic light emitting display panel, and then the printed circuit board and the frame are combined to obtain the organic light emitting display device according to the present embodiment.

On the other hand, a round portion R is formed at the corner of the display substrate 310 which has been polished using the grinder 10. In this embodiment, the radius of curvature of the round portion R is such that 1/20 to 1/5 of the thickness of the substrate on which the round portion R is formed.

According to the manufacturing method of the organic light emitting display device as described above, by grinding the edge of the cut surface of the display substrate 310 through the grinder 10, it is possible to remove defects such as cracks in the edge portion caused by the cutting, the panel Can improve the strength. In addition, the smaller the thickness of the panel, the more susceptible to defects such as cracks caused by cutting, and thus, when applied to a small and medium-sized organic light emitting display panel, a relatively large effect can be expected.

In the above, the present invention has been described through preferred embodiments, but the present invention is not limited to these embodiments. As described above, the scope of the present invention is determined by the description of the claims, and various modifications and variations are possible without departing from the concept and scope of the claims. Those will easily understand.

10: Grinder 11: Polishing Surface
13: axis of rotation 20: panel
30: cutting wheel 110: TFT substrate
120: CF substrate 130: sealing member
210 and 310: display substrates 230 and 330: organic light emitting element
240: sealing substrate 250: sealing member
340: sealing film

Claims (5)

A first substrate on which a thin film transistor is formed; And
A second substrate bonded to the first substrate and having a color filter;
Including,
Wherein at least one of the edges of the outer surface located opposite the opposing surface of the first substrate and the second substrate has a polished round portion. The method of claim 1,
The radius of curvature of the round part is in the range of 1/20 to 1/5 of the thickness of the first substrate or the second substrate. The method of claim 1,
The radius of curvature of the round portion is in the range of 20 ㎛ to 80 ㎛. Forming a thin film transistor on the first substrate,
Forming a color filter on the second substrate,
Joining the second substrate and the first substrate to form a mother panel;
Injecting a liquid crystal between the first substrate and the second substrate,
Cut along the boundary of the cell of the parent panel to separate the panel,
At least one of the edges of the cut surface of the panel is brought into contact with the polishing surface of the grinder while the panel is entered into a rotating grinder including a polishing portion having a polishing surface and a shaft connected to the polishing portion to polish the edges. Including the steps of:
An angle α formed between the surface perpendicular to the axis of rotation of the shaft and the polishing surface, the surface perpendicular to the axis of rotation of the shaft, and an outer surface of the panel perpendicular to the cutting surface of the panel and opposite to the polishing surface of the grinder. Angle β, respectively
1 ° ≤ α ≤ 7 °, 10 ° ≤ β ≤ 60 °
The manufacturing method of the liquid crystal display device which satisfy | fills. The method of claim 4, wherein
And a diameter of the polishing portion of the grinder is smaller than a length of the edge to be polished.

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