KR20120067036A - Flatness level inspection apparatus and method for inspecting measuring method using the same - Google Patents

Flatness level inspection apparatus and method for inspecting measuring method using the same Download PDF

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Publication number
KR20120067036A
KR20120067036A KR1020100128428A KR20100128428A KR20120067036A KR 20120067036 A KR20120067036 A KR 20120067036A KR 1020100128428 A KR1020100128428 A KR 1020100128428A KR 20100128428 A KR20100128428 A KR 20100128428A KR 20120067036 A KR20120067036 A KR 20120067036A
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KR
South Korea
Prior art keywords
nozzle
inspection object
chuck
voltage value
inspection
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KR1020100128428A
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Korean (ko)
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KR101215991B1 (en
Inventor
강원구
이진환
Original Assignee
에이피시스템 주식회사
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Priority to KR1020100128428A priority Critical patent/KR101215991B1/en
Priority to TW100146238A priority patent/TWI439663B/en
Priority to CN2011104173701A priority patent/CN102564359A/en
Publication of KR20120067036A publication Critical patent/KR20120067036A/en
Application granted granted Critical
Publication of KR101215991B1 publication Critical patent/KR101215991B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B13/00—Measuring arrangements characterised by the use of fluids
    • G01B13/22—Measuring arrangements characterised by the use of fluids for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means

Abstract

The flatness inspection apparatus according to the present invention includes a chuck for supporting and fixing an inspection object, a nozzle for injecting fluid onto the surface of the inspection object, and sprayed from the nozzle according to a separation distance between the nozzle and the inspection object. A movement that senses a change in the fluid injection pressure and converts it into a voltage value, a lifting module for raising and lowering the nozzle, and horizontally moving at least one of the chuck and the nozzle so that the chuck and the nozzle move horizontally relative to each other. The actual measured voltage value measured while scanning the surface of the inspection object is used as a reference value by using the voltage value according to the change in the separation distance between the nozzle and the specific surface of the inspection object measured by the unit and the measurement unit as a reference value. Calculated as the surface height value of the inspection object, and the ratio of the calculated height values of the surface of the inspection object relatively And it comprises a calculation unit for determining the flatness.
Therefore, according to embodiments of the present invention, the flatness of the inspection object can be inspected without contacting the inspection object, thereby preventing the inspection object from being damaged by scratches or contaminants. In addition, the inspection object can be inspected irrespective of the optical characteristics of the inspection object, and can be applied to various inspection objects.

Description

Flatness inspection apparatus and flatness inspection method using the same {FATNESS LEVEL INSPECTION APPARATUS AND METHOD FOR INSPECTING MEASURING METHOD USING THE SAME}

The present invention relates to a flatness inspection apparatus and a flatness inspection method using the same, which can easily inspect the flatness of the inspection object and can increase the inspection reliability.

In the case of semiconductor devices such as light emitting diodes (LEDs), LCDs, PDPs, etc., the surface flatness of a substrate such as a silicon wafer or a glass substrate is an important parameter for determining the characteristics of the device. Thus, the flatness of the substrate is inspected before fabricating the semiconductor device.

In general, there is a flatness inspection device using a probe as a device for checking the flatness of the substrate. The flatness inspection device inspects the flatness of the substrate by horizontally moving the probe in contact with the substrate surface. In this case, as the tip of the probe contacts the surface of the substrate, scratches and contaminants caused by the probe may damage the substrate. To solve this problem, light is irradiated onto the substrate surface to measure the flatness of the substrate in a non-contact manner. Substrate inspection using light does not damage the substrate, but inspection of a substrate having excellent light transmittance such as a sapphire wafer is not easy, and inspection reliability is low. This is because 95% of the light passes through the sapphire wafer, so the change in the intensity is small, and it is difficult to determine whether the change in the intensity is due to the surface of the sapphire wafer or an external factor. Therefore, the flatness of the substrate cannot be inspected accurately, resulting in a defect of the semiconductor device, which causes a decrease in yield.

One technical problem of the present invention is to provide a flatness inspection apparatus and a flatness inspection method using the same, which can easily inspect the flatness of the inspection object and can increase the inspection reliability.

Another technical problem of the present invention is to provide a flatness inspection apparatus capable of inspecting the flatness of the inspection object by a non-contact method by injecting a fluid toward the inspection object, and a flatness inspection method using the same.

The flatness inspection apparatus according to the present invention includes a chuck for supporting and fixing an inspection object, a nozzle for injecting fluid onto the surface of the inspection object, and sprayed from the nozzle according to a separation distance between the nozzle and the inspection object. A measurement unit for detecting a change in the fluid injection pressure and converting the same into a voltage value, a lifting module for lifting up and down the nozzle, and horizontally moving at least one of the chuck and the nozzle so that the chuck and the nozzle move horizontally relative to each other. Actual measurement measured while scanning the surface of the inspection object using a voltage value according to a change in the separation distance between any one of the nozzle and the inspection object surface measured by the mobile unit and the measurement unit as a reference value The voltage value is calculated as the surface height value of the inspection object, and the calculated height values of the surface of the inspection object are calculated. And a calculating unit that relatively compares and determines flatness.

The measuring unit comprises an air micrometer.

The moving unit includes a chuck driving module for rotating or horizontally moving the chuck and a horizontal moving module for horizontally moving a nozzle of the measuring unit.

The nozzle is provided in plurality.

In relative movement of the chuck and the nozzle of the measuring unit,

Rotate the chuck using the chuck driving module and horizontally move the nozzle in one direction using the horizontal moving module, or horizontally move the nozzle in one direction using a horizontal moving module with the chuck fixed. Alternatively, the chuck may be horizontally moved using the chuck driving module while the nozzle is fixed, or the chuck and the nozzle may be horizontally moved, but moved in different directions.

The calculation unit includes a calculation unit that calculates the actual measured voltage value as a height value of the surface of the inspection object by using the reference value, and a comparison determination unit that relatively compares the calculated height values of the surface of the inspection object to determine flatness. .

The flatness inspection method according to the present invention comprises the steps of preparing a test object, the nozzle disposed above the surface of the test object, by spraying a fluid to a specific point on the surface of the test object while changing the height of the nozzle, Calculating a reference value by detecting a fluid injection pressure according to a distance from the one specific point and converting the fluid injection pressure into a voltage value, while horizontally moving at least one of the nozzle and the test object, inspecting the test through the nozzle Injecting a fluid to scan the surface of the object, to detect the fluid injection pressure in accordance with the change of the separation distance between the surface of the inspection object and the nozzle, and converting it to a voltage value, to calculate the actual measured voltage value, the above calculation The actual measured voltage value as the height value of the surface of the test object by using the calculated reference value The step of shipping, and relatively comparing the height values of the surface of the inspection object, determining the flatness of the inspection object.

In dispensing fluid to a specific point on the surface of the test object while varying the height of the nozzle, the nozzle is disposed above a specific point of one of the test object surface areas, and the nozzle is raised or lowered so that the nozzle and the test The fluid is ejected from the nozzle while varying the separation distance from the specific point on the surface of the object.

Injecting a fluid to scan the surface of the inspection object through the nozzle while horizontally moving at least one of the nozzle and the inspection object,

The shape in which the fluid scans the surface of the object to be inspected is one of a spiral and a zigzag shape.

By rotating the inspection object and horizontally moving the nozzle in one direction, the shape in which the fluid scans the inspection object surface becomes spiral.

The nozzle moves horizontally so as to pass through the center portion above the surface of the inspection object.

The nozzles are horizontally moved alternately in the X direction and the Y direction while the inspection object is fixed, or the inspection objects are alternately horizontally moved in the X direction and the Y direction while the nozzle is fixed, or the inspection object and By alternately horizontally moving the nozzles in the X direction and the Y direction, the shape in which the fluid scans the inspection object surface becomes a zigzag shape.

In the step of calculating the actual measured voltage value as a surface height value using the calculated reference value, using the voltage value according to the distance between the nozzle and the one particular point is calculated as a voltage gradient, The actual measured voltage value is calculated as the surface height value using the voltage slope to calculate the surface height value.

In the step of calculating the actual measured voltage value as the surface height value using the calculated reference value, the actual measured voltage value is compared with the calculated reference value to the actual measured voltage value to the corresponding surface height value Calculate.

The inspection object uses a flat substrate applied to a semiconductor device and a display device.

As described above, the flatness inspection apparatus according to the embodiments of the present invention injects a fluid onto the surface of the inspection object, and detects the change in pressure depending on the separation distance between the inspection object and the nozzle to inspect the flatness of the inspection object. do. Accordingly, the flatness of the inspection object can be inspected without contacting the inspection object, thereby preventing the inspection object from being damaged by scratches or contaminants. In addition, the substrate inspection can be performed irrespective of the optical characteristics of the inspection object and can be applied to various inspection objects.

1 is a view showing a flatness inspection apparatus according to an embodiment of the present invention
2 shows schematically a measuring unit according to an embodiment of the invention
FIG. 3A depicts an illustration of air scanning the substrate surface spirally. FIG.
3B is a view for explaining the injection of air while moving the nozzle in the horizontal direction;
FIG. 4 is a diagram to explain that air scans a substrate surface in a zigzag shape. FIG.
5 is a view showing a modification of the flatness inspection apparatus according to the embodiment of the present invention
6 is a flowchart illustrating a method of sequentially checking a flatness of an inspection object using the flatness inspection device according to an embodiment of the present invention.
FIG. 7 is a view for explaining a method of calculating a voltage change according to a distance from the nozzle with respect to one specific point of an inspection object surface area by using the flatness inspection device according to the embodiment; FIG.
FIG. 8 is a graph showing a voltage value and a slope of a voltage change according to a distance from the nozzle with respect to a specific point of one surface area of a test object; FIG.
9 is a view for explaining a method of calculating the respective voltage value according to the change in the separation distance from the nozzle to the surface of the inspection object.
10 is a graph showing a change in voltage according to a change in the separation distance from the nozzle to the surface of the inspection object. 11 is an image of the flatness of the entire area of the substrate surface

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, provided that the embodiments of the present invention are completed to those skilled in the art, and the scope of the invention to those skilled in the art. It is provided for complete information.

1 is a view showing a flatness inspection apparatus according to an embodiment of the present invention. 2 is a view schematically showing a measuring unit according to an embodiment of the present invention. FIG. 3A is a diagram to illustrate that air scans the substrate surface in a spiral. FIG. 3B is a view for explaining the injection of air while moving the nozzle in the horizontal direction. FIG. 4 is a diagram for explaining that air scans a substrate surface in a zigzag shape. 5 is a view showing a modification of the flatness inspection apparatus according to the embodiment of the present invention.

1 and 2, the flatness inspection apparatus according to the embodiment of the present invention is disposed on the stage 100, the stage 100, and the chuck 200 supporting and fixing the inspection object S. And a nozzle 310 for injecting a gas to the inspection object S, and detecting a change in the injection pressure of the fluid according to a change in the separation distance between the nozzle 310 and the inspection object S, thereby detecting the voltage. At least one of the measurement unit 300 for converting the value, the elevating module 500 for elevating and elevating the nozzle 310, the chuck 200, and the nozzle 310 is horizontally moved to obtain the chuck 200 and the nozzle ( 310 includes a moving unit 800 to allow horizontal movement relative to each other. In addition, the signal value is connected to the measurement unit 300, and the voltage value according to the separation distance between any one of the nozzle 310 and the inspection target (S) surface measured by the measurement unit 300 The test object surface converted by the data converting unit 710 and the data converting unit 710 for calculating the actual measured voltage value measured as the surface height value of the test object by scanning the surface of the test object S using the reference value. Comparing determination unit 720 for determining the flatness by comparing the height values of the relatively, and the display unit 380 for displaying the inspection object (S) surface height values in a graph and a three-dimensional image.

In the embodiment, a circular wafer substrate is used as the inspection object S, and the chuck 200 is manufactured in a shape corresponding to the shape of the substrate S. FIG. Of course, the present invention is not limited thereto, and the chuck 200 may be manufactured in various shapes. The chuck 200 may be a vacuum chuck supporting and fixing the substrate S by using an electrostatic chuck or a vacuum suction force that supports and fixes the substrate S in an electrostatic half way. Of course, any means may be used as long as it is a means which can support and fix the board | substrate S without being limited to this.

The measurement unit 300 according to the embodiment detects a change in air injection pressure according to the separation distance between the nozzle 310 of the measurement unit and the surface of the substrate S when injecting air to the surface of the substrate S. By using the air micrometer (air micrometer) converting this to a voltage value. Embodiments use air as a fluid, but are not limited thereto, and various inert gases such as N 2 may be used. The air micrometer measurement unit 300 is connected to the fluid source 330, the fluid source 330 for providing a fluid, for example, air, as shown in FIGS. 1 and 2 to provide a constant amount of air. The regulator 340, the nozzle 310 for spraying the air supplied from the regulator 340 on the substrate (S), the nozzle 310 to support and secure the nozzle 310 is connected to the lifting module 500 An air-electric conveter 350 that is disposed between the support member 320, the nozzle 310, and the regulator 340, detects a pressure change of air injected from the nozzle 310, and converts the pressure into a voltage value. ), And a signal amplifier 360 for amplifying the voltage value changed by the converter 350 and transmitting it to the calculation unit 700. In addition, the first supply pipe 390a for connecting between the fluid source 330 and the regulator 340, the second supply pipe 390b for connecting between the regulator 340 and the converter 350, the converter 350 and And a third supply pipe 390c connecting between the nozzles 310. Here, the present invention is not limited to the air micrometer measuring unit 300 described above, and various air micrometers capable of injecting air onto the substrate S and detecting a change in pressure of the injection pressure can be converted into voltage values. have.

In the above, the measuring unit 300 having one nozzle 310 has been described. However, the present invention is not limited thereto, and a plurality of nozzles 310 may be provided as illustrated in FIG. 5. When the plurality of nozzles 310 are provided, the time for inspecting the substrate S can be shortened as compared with the case of using one nozzle 310.

The elevating module 500 is connected to the nozzle supporting member 320 for supporting the nozzle 310 to elevate the nozzle supporting member 320. The elevating module 500 includes a elevating member 510 having an elevating guide rail 520, one end of which is combined with an elevating guide rail 520, and the other end of which is coupled to the nozzle supporting member 320. The elevating block 530 which is slid along the lowering guide rail 520 and the elevating member 510 connected to the elevating guide rail 520 of the elevating member 510 is provided. An elevating power member 540 that provides elevating force to and an engaging member 550 that is coupled with the elevating member 510 and the other with which the horizontal moving member 610 of the horizontal moving module 600 is described later. It includes. Here, the elevating block 530 may be, for example, a combination of a linear motor for generating linear motion and a motor for rotating the ball screw and the ball screw. Of course, the present invention is not limited thereto, and the elevating block 530 may be applied in any manner that can slide on the elevating guide rail 520. In addition, the coupling member 550 is coupled to the horizontal moving member 610 of the horizontal moving module 600 as described above, so that the horizontal moving block slid in the X and Y directions on the horizontal moving member 610. Play a role. Thus, one side of the coupling member 550 coupled with the horizontal moving member 610 may be provided with a linear motor and a motor for rotating the ball screw and the ball screw linear movement similar to the lifting block 530. Of course, not limited to this, it is possible to modify a variety of structures and configurations that the coupling member 550 can move horizontally on the horizontal moving member 610. In addition, the elevating module 500 is not limited to the structure and configuration described in the embodiment, various modifications that can raise and lower the nozzle 310 is possible.

The moving unit 800 includes a chuck driving module 400 for rotating and horizontally moving the chuck 200 and a horizontal moving module 600 for horizontally moving the nozzle 310.

Here, the chuck driving module 400 is disposed below the chuck 200 to rotate the chuck 200 or to horizontally move in the X and Y directions. The chuck driving module 400 is disposed below the chuck 200 and connected to the chuck support member 410 and the chuck support member 410 to support the chuck 200 to rotate or rotate the chuck support member 410. And a chuck power member 420 for horizontal movement. At this time, it is preferable to rotate the chuck 200 at a constant speed using the chuck driving module 400. In the embodiment, a DD motor (Direct Drive Motor) is used as the chuck power member 420. Of course, any means may be used as long as it is a means which can rotate the chuck | zipper 200 provided in the board | substrate S support member, without being limited to this. As described above, the air is injected onto the substrate S while the chuck 200 is rotated or horizontally moved while the nozzle 310 is horizontally moved in one direction by using the horizontal moving module 600 described later.

The horizontal moving module 600 is coupled to the coupling member 550 of the elevating module 500 to horizontally move the elevating module 500 in the X and Y directions. At this time, since the nozzle support member 320 for supporting and fixing the nozzle 310 is combined with the elevating module 500, the nozzle 310 is horizontally moved by horizontally moving the elevating module 500. Move it. The horizontal moving module 600 includes a horizontal moving member 610 having a horizontal moving guide rail 620 and a horizontal moving power member 650 connected to the horizontal moving member 610. In this case, the coupling member 550 of the elevating module 500 is mounted on the horizontal moving guide rail 620 and slides along the horizontal moving guide rail 620 in the X and Y directions. Therefore, the nozzle 310 coupled with the elevating module 500 may be horizontally moved as shown in FIGS. 3A and 3B by the horizontal movement of the elevating module 500. In addition, while horizontally moving the nozzle 310 in one direction using the horizontal moving module 600, the air is injected through the nozzle 310, and the chuck 200 is rotated. At this time, the nozzle 310 is preferably horizontally moved to cross the central portion of the substrate (S) from the upper side of the substrate (S). As a result, the path through which the air scans the surface of the substrate S becomes spiral as shown in FIG. 3A.

In the above, the nozzle support member 320 to which the nozzle 310 is supported and fixed is installed in the elevating module 500, and the nozzle 310 and the elevating module 500 are horizontally moved together by the horizontal moving module 600. Explanation was made. However, the present invention is not limited thereto, and the horizontal moving module 600 may be combined with the nozzle support member 320 that directly supports and fixes the nozzle 310 without being coupled with the elevating module 500. Thus, only the nozzle support member 320 to which the nozzle 310 is supported and fixed may be horizontally moved using the horizontal moving module 600.

Also, in the above, the nozzle 310 is horizontally moved in one direction by using the horizontal moving module 600. However, the present invention is not limited thereto, and the nozzle 310 may be alternately moved in the X and Y directions using the horizontal moving module 600. For example, the nozzle 310 may be alternately moved in the X and Y directions so that a path through which air scans the surface of the substrate S is zigzag as shown in FIG. 4. As described above, when the surface of the substrate S is scanned in a zigzag using air, it is effective that the shape of the substrate S is rectangular. Of course, the present invention is not limited thereto, and in the case of inspecting a substrate S having various shapes, for example, a circular substrate S, the scanning may be performed by a zigzag method. In addition, in the above description, the nozzle 310 is moved in the X and Y directions, but the present invention is not limited thereto. The chuck 200 having the substrate S mounted thereon is moved in the X and Y directions using the chuck driving module 400. Alternatively, both the nozzle 310 and the chuck 200 may be moved in the X and Y directions.

Hereinafter, a method of measuring flatness of a substrate using a flatness inspection apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 10.

FIG. 6 is a flowchart for sequentially describing a method of inspecting flatness of an inspection object by using the flatness inspection apparatus according to an exemplary embodiment of the present invention. FIG. 7 is a view for explaining a method of calculating a voltage change according to a distance from the nozzle with respect to a specific point of one surface of an object to be inspected by using the flatness test apparatus according to the embodiment. 8 is a graph showing a voltage value and a slope of a voltage change according to a distance from the nozzle with respect to a specific point of one surface area of the inspection object. 9 is a view for explaining a method for calculating the respective voltage value according to the change in the separation distance from the nozzle to the surface of the inspection object. FIG. 10 is a graph illustrating a change in voltage according to a change in the separation distance from the nozzle with respect to the surface of the inspection object illustrated in FIG. 9.

Referring to FIG. 6, while controlling the heights of the nozzles 310 differently, the air is sprayed a plurality of times at one specific point on the surface of the substrate S to separate the distance between the nozzle 310 and the one specific point. The air injection pressure is detected and the reference value is calculated by converting it to a voltage value (S100). For example, first, the state where the end of the nozzle 310 is in contact with the upper surface of the substrate S is set to a zero position. Air is blown toward the substrate S while raising the nozzle 310 from the zero position, and is converted into a voltage value and calculated. At this time, the specific point where the air discharged from the nozzle 310 is continuously sprayed on the surface of the substrate (S) is set to zero by contacting the end of the nozzle 310 and the substrate (S) as in the previous and previous steps. It is desirable to have the spray in place. This is caused by various factors such as minute processing error of the nozzle 310, the bonding state of the nozzle 310, the surface state of the substrate S to be measured, that is, the roughness of the surface and the size of the pattern patterned on the substrate. This is because the injection pressure may be different.

Hereinafter, a method of calculating the reference value will be described in detail. First, an inspection object, for example, a sapphire wafer substrate S, to be measured is placed on the chuck 200 of the flatness inspection apparatus according to the embodiment. The nozzle 310 coupled to the elevating module 500 is positioned above the surface of the substrate S to be measured using the horizontal moving module 600 and the elevating module 500. At this time, it is preferable that the nozzle 310 is located at the center of the upper portion of the substrate S. Subsequently, as shown in FIG. 7, while spraying air while raising or lowering the nozzle 310 without moving in the X or Y direction, the air injection pressure according to the separation distance between the substrate S and the nozzle 310. Is detected and converted to a voltage value to produce a reference value. In this case, first, the end of the nozzle 310 is brought into contact with the upper surface of the substrate S to be measured, and it is set to a zero position. Then, the air is injected while moving the nozzle 310 in the upward direction to detect the air jet pressure according to the separation distance between the substrate (S) and the nozzle 310 and converts it into a voltage value to calculate a reference value. The voltage values V1 to V6 according to the separation distances h1 to h6 between the nozzle 310 and the substrate S calculated as described above are shown in a graph, for example, as shown in FIG. 8. Then, the separation distance and voltage value between the substrate S and the nozzle thus measured are used as reference values. In this embodiment, an air micrometer is used as the measuring unit 300.

Subsequently, while moving at least one of the nozzle 310 and the audited object S horizontally, air is blown to scan the surface of the substrate S through the nozzle 310, so that the surface of the substrate S and the nozzle 310 are moved. A change in the air injection pressure according to the change in the separation distance between the) and converts it to a voltage value to calculate the actual measured voltage value (S200). To this end, first, the nozzle 310 is moved to be positioned above the edge region of the surface of the substrate S by using the horizontal moving module 600. The nozzle 310 is raised or lowered by using the elevating module 500 to adjust the separation distance value between the nozzle S and the substrate S region where the first nozzle 310 is located. For example, the nozzle 310 is raised or lowered using the elevating module 500 so that the separation distance between the substrate S and the nozzle 310 is 20 to 30 μm. Thereafter, the chuck 200 on which the substrate S is placed is rotated using the chuck driving module 400. And as shown in Figure 9 while spraying the air toward the substrate (S), the nozzle 310 is horizontally moved in one direction without raising or lowering the substrate (S). Through this, the air discharged from the nozzle 310 scans the substrate S surface. At this time, the nozzle 310 is horizontally moved so that air crosses the central portion of the upper surface of the substrate S. Through this, the shape in which the air scans the surface of the substrate S becomes spiral as shown in FIG. 3A. When air is sprayed toward the surface of the substrate S by using the nozzle 310, even if only the horizontal movement is performed without raising or lowering the nozzle 310, the nozzle 310 and the nozzle 310 may be used according to the flatness of the substrate S. The separation distance between the substrates S varies. Thus, when the air is sprayed to scan the surface of the substrate S by using the nozzle 310, the injection pressure of the air injected from the nozzle 310 in accordance with the separation distance between the nozzle 310 and the surface of the substrate (S) This changes. The air micrometer measuring unit 300 senses the injection pressure of the air, and converts it to a voltage value. As such, the voltage value measured by jetting the fluid to scan the surface of the substrate S is called an actual measured voltage value.

For example, as shown in FIGS. 7 and 9, when a portion of the surface of the substrate S has a step portion positioned relatively higher than other regions, the entire surface of the substrate S and the nozzle 310 may be separated from each other. The separation distance is different. In the following description, in the substrate S shown in FIG. 7, a relatively low substrate S surface area is referred to as S1, and a relatively high substrate S surface area is referred to as S2. In this case, the separation distance between the substrate S surface area S2 and the nozzle 310 is smaller than the separation distance between the substrate S surface area S1 and the nozzle 310. The smaller the separation distance between the surface of the substrate S and the nozzle 310, the greater the injection pressure of air. As a result, the injection pressure injected from the nozzle 310 to the substrate S surface region S2 is larger than the injection pressure injected from the nozzle 310 to the substrate S surface region S1. The detected pressure value is converted into a voltage value, and the larger the pressure value, the larger the converted voltage value. And when the actual measured voltage values are shown as a graph, for example, as shown in FIG. Referring to FIG. 10, the voltage value S2 of the substrate S surface region S2 is larger than the voltage value V1 of the substrate S surface region S1.

In the above, the method of inspecting the surface of the stepped substrate S as illustrated in FIG. 9 has been described. However, the test of the inclined substrate S may also be performed as shown in FIG. 11. Hereinafter, a method of inspecting the surface flatness of the substrate S having an inclination will be described with reference to FIGS. 11 and 12. In this case, the content overlapping with the above description will be omitted or briefly described.

11 is a view for explaining a method of calculating the respective voltage value according to the change of the separation distance from the nozzle with respect to the surface of the other inspection object. FIG. 12 is a graph illustrating a change in voltage according to a change in the separation distance from the nozzle with respect to the surface of the inspection object illustrated in FIG. 10.

As shown in FIG. 11, the substrate S may include an inclined surface. Hereinafter, for the convenience of description, S1 to S5 will be referred to according to the inclination and the relative height of the substrate S. FIG. When air is injected while the nozzle 310 is horizontally moved with respect to the substrate S, the injection pressure is converted into a voltage value at this time. 12 shows the converted voltage value as a graph. Referring to FIG. 12, when the voltage values of S1 to S5 of the surface area of the substrate S are compared, S1 <S2 <S3 <S4 <S5. In the S2 and S4 regions, which are inclined surfaces, voltage values increase in one direction.

Thereafter, the pesticide measurement voltage value is calculated as the height value of the surface of the substrate S by using the reference value calculated by the data converter 710 of the calculation unit 700 (S300). That is, as shown in FIG. 8, the voltage change slope ΔV is calculated using the change in voltage value according to the separation distance between the nozzle 310 and the surface of the substrate S calculated in step S100. The actual measured voltage value is calculated as the height value of the surface of the substrate S by using the calculated voltage change slope ΔV (S300). For example, when the voltage change slope (ΔV) is 10 mV / micrometer and the difference between the voltage at the substrate S surface area S1 and the voltage at S2 (VS2-VS1) is 1V, the substrate S surface area It can be calculated through calculation that the height difference between the surfaces of S1 and S2 is 10 μm. As another example, the surface height value may be calculated by comparing the actual measured voltage value with the reference value calculated above and tracking the surface height value corresponding to the actual measured voltage value.

In the case where the flatness of another region is to be inspected on the same object, that is, the same substrate S, the reference value calculating step, that is, the step S100 is omitted, and the actual measured voltage value of the other surface region of the substrate S is omitted. Step S200 of calculating is performed (S500). Thereafter, the actual measured voltage value of the other surface area of the substrate S is calculated as the height value. By repeating this process a plurality of times, the surface height value of the entire area of the surface of the substrate S can be calculated.

Subsequently, when surface height values of the surface of the substrate S are calculated, the flatness of the substrate S may be determined by comparing the surface height values with the comparison determination unit 720 (S400). Thereafter, the operator may visually determine the flatness of the substrate S by imaging and displaying the image. In the case of the actual substrate (S) has a slope of about several hundred micrometers, such a degree of inclination and flatness of the substrate (S) can be measured by the method according to the embodiment. Moreover, the height or the level | step difference of the surface of the board | substrate S can also be measured.

In the above, the method of inspecting the flatness of the substrate S using the flatness inspection device according to the embodiment has been described. However, the present invention is not limited thereto, and the thickness of the substrate S, the amount of change in height at a specific position, and the like can also be measured. Of course, the present invention is not limited to the example described above, but may be applied to various fields for inspecting the substrate S surface state.

200: chuck 300: measuring unit
400: chuck drive module 500: lifting module
600: horizontal moving module

Claims (15)

A chuck supporting and fixing the inspection object;
A measuring unit having a nozzle for injecting a fluid on the surface of the test object, detecting a change in the fluid jet pressure sprayed from the nozzle according to a separation distance between the nozzle and the test object, and converting the fluid into a voltage value;
An elevating module for elevating the nozzle;
A moving unit which horizontally moves at least one of the chuck and the nozzle so that the chuck and the nozzle move horizontally relative to each other;
The actual measured voltage value measured while scanning the surface of the inspection object is inspected by using, as a reference value, a voltage value according to a change in the distance between the nozzle measured by the measuring unit and a specific point of the surface of the inspection object as a reference value. And a calculating unit that calculates a surface height value of an object and determines flatness by relatively comparing the calculated height values of the surface of the inspection object. The method according to claim 1,
And the measuring unit comprises an air micrometer. The method according to claim 1,
And the moving unit includes a chuck driving module for rotating or horizontally moving the chuck and a horizontal moving module for horizontally moving a nozzle of the measuring unit. The method according to claim 1,
Flatness inspection device provided with a plurality of nozzles. The method according to claim 1,
In relative movement of the chuck and the nozzle of the measuring unit,
Rotate the chuck using the chuck driving module and horizontally move the nozzle in one direction using the horizontal moving module, or horizontally move the nozzle in one direction using a horizontal moving module with the chuck fixed. Or, the flatness inspection device for horizontally moving the chuck using the chuck drive module in the state in which the nozzle is fixed, or horizontally move the chuck and the nozzle, respectively, in different directions. The method according to claim 1,
The calculation unit includes a calculation unit that calculates the actual measured voltage value as a height value of the surface of the inspection object by using the reference value, and a comparison determination unit that relatively compares the calculated height values of the surface of the inspection object to determine flatness. Flatness checking device. Preparing an object to be inspected and disposing a nozzle on an upper surface of the object to be inspected;
By varying the height of the nozzle to inject a fluid to a specific point on the surface of the inspection object, by detecting the fluid injection pressure according to the separation distance between the nozzle and the one particular point and converting it into a voltage value, a reference value is calculated Doing;
While moving at least one of the nozzle and the inspection object horizontally, the fluid is sprayed to scan the surface of the inspection object through the nozzle to detect the fluid injection pressure according to the change of the separation distance between the surface of the inspection object and the nozzle, Calculating the actual measured voltage value by converting it into a voltage value;
Calculating the actual measured voltage value as a height value of the surface of the inspection object using the calculated reference value;
And comparing the height values of the surface of the inspection object to determine the flatness of the inspection object. The method of claim 7,
In spraying the fluid to a specific point on the surface of the inspection object while changing the height of the nozzle,
The nozzle is placed above a specific point of one of the inspection object surface areas, and the nozzle is raised or lowered to flatten the fluid from the nozzle while changing the distance between the nozzle and the specific point of the inspection object surface. method of inspection. The method of claim 7,
Injecting a fluid to scan the surface of the inspection object through the nozzle while horizontally moving at least one of the nozzle and the inspection object,
And the shape in which the fluid scans the surface of the test object is one of a spiral and a zigzag shape. The method according to claim 9,
And rotating the test object and horizontally moving the nozzle in one direction so that the shape of the fluid scanning the test object surface becomes spiral. The method according to claim 8,
And the nozzle moves horizontally so as to pass through the center portion above the test object surface. The method according to claim 9,
The nozzles are horizontally moved alternately in the X direction and the Y direction while the inspection object is fixed, or the inspection objects are alternately horizontally moved in the X direction and the Y direction while the nozzle is fixed, or the inspection object and And horizontally moving the nozzles alternately in the X and Y directions so that the shape of the fluid scanning the surface of the inspection object becomes a zigzag shape. The method of claim 7,
In the step of calculating the actual measured voltage value as a surface height value using the calculated reference value,
A flatness that is calculated as a voltage gradient using a voltage value according to the distance between the nozzle and the one specific point, and calculates the actual measured voltage value as a surface height value using the voltage slope to calculate a surface height value Road inspection method. The method of claim 7,
In the step of calculating the actual measured voltage value as a surface height value using the calculated reference value,
And comparing the actual measured voltage value with the reference value calculated above to calculate the actual measured voltage value as a corresponding surface height value. The method of claim 7,
The inspection object is a flatness test method using a flat substrate applied to a semiconductor device and a display device.
KR1020100128428A 2010-12-15 2010-12-15 Flatness level inspection apparatus and method for inspecting measuring method using the same KR101215991B1 (en)

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TW100146238A TWI439663B (en) 2010-12-15 2011-12-14 Flatness level inspection apparatus and method for inspecting flatness level using the same
CN2011104173701A CN102564359A (en) 2010-12-15 2011-12-14 Flat level degree detection device and method using the device to detect flat level degree

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