KR20120063612A - Apparatus for full breaking of a glass panel by a laser - Google Patents

Abstract

PURPOSE: An apparatus for full breaking of a glass panel using a laser is provided to cut a glass panel through a single process by aligning a scribing beam, cooling fluid, and a breaking beam to be projected to the glass panel at a time. CONSTITUTION: An apparatus for full breaking of a glass panel using a laser comprises first and second laser sources(110,120), a scribing beam projecting unit(130), first and second cylindrical lenses(140,150), and a cooling unit(160). The second laser source has greater output than the first laser source. The scribing beam projecting unit comprises two or more beam splitters(131,132,133,134) for dividing the laser beam of the first laser source into a plurality of aligned beams and a mirror(135). The first and second cylindrical lenses standardize the beam projected to a glass panel into an elliptical shape. The cooling unit sprays cooling fluid between a scribing beam and a breaking beam, where the scribing beam is projected to the glass panel(10) through the first cylindrical lens and the breaking beam is projected to the glass panel through the second cylindrical lens. The scribing beam, the cooling fluid, and the breaking beam are successively aligned and simultaneously projected to the glass panel.

Description

Apparatus for full breaking of a glass panel by a laser}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for completely cutting a glass substrate using a laser. The present invention relates to an apparatus for completely cutting a glass substrate using a laser for cutting a glass substrate by one process by simultaneously performing scribing and breaking. It is about.

In general, a method of cutting a glass substrate is performed by forming a scribing line in the vertical direction on the surface of the glass substrate, and then applying a physical or thermal impact along the scribing line to break the glass substrate. Is done.

A scriber is for forming a scribing line on a glass substrate. The scriber is cracked in a direction perpendicular to the surface of the glass substrate to be segmented by using a physical method using a wheel or the like or a thermal method using a laser or the like. to cause cracks.

The breaker breaks the glass substrate by applying an impact on the surface to the glass substrate on which the scribing line is formed.

Generally, the process of cutting a glass substrate is performed by forming a scribing line on the surface of the glass substrate in the scriber and then transferring the scribing line to the cutting device to separate the glass substrate by using a physical impact or thermal method along the scribing line. It requires two working steps. Therefore, the work space required for each process requires a large work space as a whole, and after the scribing process, the process of transferring the product to the cutting process, which is the next process, results in a decrease in work efficiency due to product transfer. There is a limit to increase in production cost and productivity.

In the present invention, when cutting a glass substrate using a laser on the glass substrate, the glass substrate can be cut by a single process by irradiating the scribing beam and the breaking beam to the glass substrate together, thereby enabling the work efficiency. To provide a complete glass substrate cutting device using a laser that can increase the productivity.

In addition, the glass substrate complete cutting device using the laser of the present invention is to provide a glass substrate complete cutting device using a laser that can improve the accuracy of the cutting surface by using a beam shape that is shaped in a specific form when the scribing beam is irradiated It is.

Glass substrate complete cutting device using a laser of the present invention comprises a first laser light source; A second laser light source having a larger output than the first laser light source; A scribing beam irradiation unit comprising at least two beam splitters and mirrors for splitting the beam emitted from the first laser light source into a plurality of aligned beams; A first cylindrical lens installed on an optical path between the scribing beam irradiator and the glass substrate to shape the beam irradiated onto the glass substrate into an elliptical shape; A second cylindrical lens installed on an optical path between the second laser light source and the glass substrate to form an oval shape of a beam irradiated onto the glass substrate; And a cooling unit for injecting a cooling fluid to the glass substrate between the scribing beam passing through the first cylindrical lens and irradiated onto the glass substrate and the braking beam passing through the second cylindrical lens and irradiating onto the glass substrate. The scribing beam, the cooling fluid sprayed from the cooling unit, and the braking beam may be arranged in order and irradiated onto the glass substrate at the same time.

In the laser cutting of the glass substrate using the laser of the present invention, the scribing beam, the cooling fluid, and the braking beam, in which a plurality of beams are shaped into a specific shape, are aligned and irradiated to the glass substrate continuously at once. By doing so, the glass substrate can be cut in only one process, thereby reducing the cutting process time, and the invention can effectively use the working space and reduce the manufacturing cost.

In addition, the glass substrate complete cutting device using the laser of the present invention has a specific shape having an initial strong light intensity so that the scribing beam irradiated to preheat the glass substrate to form a scribing line is effective for preheating the glass substrate. By having it, the depth uniformity of a scribing line is improved and it is an invention which has the effect which can raise the precision of a cut surface.

1 is a view showing the entire glass substrate cutting device according to the invention,
2 is a view showing briefly only the main components of the glass substrate complete cutting device according to the present invention,
3 is a view for showing the scribing beam, cooling fluid, and breaking beam form irradiated to the glass substrate in the complete glass substrate cutting device according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Glass substrate complete cutting device using a laser of the present invention comprises a first laser light source (110); A second laser light source (120) having a larger output than the first laser light source (110); A scribing beam irradiation unit 130 comprising at least two beam splitters 131, 132, 133, 134 and a mirror 135 to branch the beam emitted from the first laser light source into a plurality of aligned beams. )Wow; A first cylindrical lens 140 installed on an optical path between the scribing beam irradiator 130 and the glass substrate 10 to shape the beam irradiated onto the glass substrate into an elliptical shape; A second cylindrical lens 150 installed on an optical path between the second laser light source and the glass substrate to shape the beam irradiated onto the glass substrate into an elliptical shape; The scribing beam S irradiated to the glass substrate 10 through the first cylindrical lens 140 and the breaking beam B irradiated to the glass substrate 10 through the second cylindrical lens 150. Including cooling unit 160 for injecting a cooling fluid to the glass substrate 10 between the scribing beam (S), the cooling fluid (C) injected from the cooling unit 160, and The breaking beams B are arranged in order and are irradiated to the glass substrate 10 at the same time.

As shown in FIG. 1, the apparatus for completely cutting a glass substrate of the present invention includes a first laser light source 110 used as a scribing beam light source for forming a scribing line on a glass substrate. And a second laser light source 120 which is used as a breaking beam light source for breaking the glass substrate along the scribing line.

The second laser light source 210 used as the breaking beam light source has a larger output than the first laser light source 110.

In particular, in the present invention, the first laser light source 110 and the second laser light source 120 are CO 2 lasers having a wavelength range of 9.4 to 10.6 μm, and their output is 100 to 300 W and 300 to 500 W, respectively.

The laser light source of the present invention includes a power meter for detecting laser output, a collimator for turning the beam into parallel light, a power stabilizer for maintaining the beam output stable, and a beam size. Known optical elements such as a beam expander for adjusting, or a mirror for changing the light path of the beam can be used.

The scribing beam irradiator 130 is for splitting a beam emitted from the first laser light source 110 into a plurality of aligned beams and may be provided by a plurality of beam splitters and mirrors.

As illustrated in FIG. 2, the scribing beam irradiator 130 may include four beam splitters 131, 132, 133, and 134 and one mirror 135.

The beam emitted from the first laser light source 110 is partially reflected by the first beam splitter 131 and irradiated onto the glass substrate 10, and the beam passing through the first beam splitter 131 is a second beam splitter ( Branched again at 132, the glass substrate 10 is irradiated. The beam passing through the second beam splitter 132 is branched from the third beam splitter 133 and irradiated onto the glass substrate 10, and the beam passing through the third beam splitter 133 is the fourth beam splitter 134. Branched from the glass substrate 10 and irradiated to the glass substrate 10, the beam passing through the fourth beam splitter 134 is totally reflected by the mirror 135 positioned at the end and irradiated onto the glass substrate 10.

The beams irradiated onto the glass substrate 10 through the plurality of beam splitters 131, 132, 133, 134 and the mirror 135 are shaped into an elliptical shape while being passed through the first cylinder lens. .

In particular, in the present invention, the beam splitters have different optical characteristics, and the beam splitters in each beam splitter have different intensities. More preferably, the beam splitters branch in each beam splitter and The beam irradiated onto the glass substrate passing through the one-cylinder lens is characterized in that the light intensity is arranged sequentially.

For example, the technical characteristic of the present invention is that the first beam splitter 131 has the highest light transmittance, and the second beam splitter 132 and the third beam splitter 133 sequentially decrease the light transmittance of the fourth beam. It may be achieved by arranging the beam splitter and the mirror so as to have the lowest light transmittance in the splitter 134 and to have total reflection at the mirror 135 disposed last.

3 is a view showing the scribing beam (S), the cooling fluid (C), and the breaking beam (B) form irradiated to the glass substrate in the complete glass substrate cutting device according to the present invention.

As illustrated in FIG. 3, the glass substrate is irradiated with the aligned scribing beam S, the cooling fluid C, and the breaking beam B in order.

The scribing beam S is for preheating the glass substrate along the cutting line. The scribing beam S is composed of a plurality of beams 131a, 132a, 133a, 134a, and 135a that are formed into two or more elliptical shapes. It is preferable to have a water droplet form in which the light intensity is gradually decreased while having a strong light intensity. For reference, the beam 135a having the strongest light intensity is the beam irradiated by the mirror 135, and the beams 134a, 133a, 132a, and 131a are sequentially arranged in the fourth beam splitter 134. And a beam irradiated by the third beam splitter 133, the second beam splitter 132, and the first beam splitter 131.

Cooling fluid (C) is generated in the cooling unit 160 is injected to the glass substrate, by spraying the cooling fluid to the glass substrate portion preheated by the scribing beam (S) to form a crack by sharply lowering the temperature To form a scribing line.

The cooling fluid injected from the cooling unit can adjust the air pressure and the flow rate to enable fine control.

The braking beam B is irradiated with a laser beam along the scribing line so that the cutting is performed along the scribing line due to the difference in thermal expansion of the glass substrate due to locally generated high temperature heat.

The breaking beam B preferably has a long elliptical beam along the scribing line, so that the second laser light source used as the breaking beam is irradiated through the second cylindrical lens 150 before being directly irradiated onto the glass substrate. , The braking beam B irradiated onto the glass substrate 10 preferably has a beam shaped in an elliptical shape.

The spots of the beams are oval in the shape of approximately 1 to 4 mm in width and 3 to 6 mm in length. The total length of the entire beam is about 10-40 mm.

Referring to Figures 1 to 3, look at the operation of the glass substrate complete cutting device of the present invention configured as described above are as follows. For reference, arrows A in FIGS. 1 and 2 indicate the traveling direction of the glass substrate.

The beam emitted from the first laser light source S1 is branched into a plurality of beams by the plurality of beam splitters 131, 132, 133, 134 and the mirror 135 and then the first cylindrical lens 140. As it passes through, it is shaped into an elliptical shape and irradiated onto the glass substrate (scribing beam). At this time, the scribing beam irradiated onto the glass substrate preheats the glass substrate while having a droplet shape having a strong light intensity initially.

At this time, the processing speed of the glass substrate is approximately 100 to 900 mm / sec.

The cooling unit 160 injects a cooling fluid onto the preheated glass substrate from the glass substrate preheated by the scribing beam, and at this time, the temperature of the preheated glass substrate decreases rapidly and the crack line (scribing line). This happens.

Next, a beam, which is emitted from the second laser light source S2 along the glass substrate on which the scribing line is formed, and passes through the second cylindrical lens 150 and is shaped into an elliptical shape, is irradiated with high temperature along the scribing line. Due to the difference in thermal expansion due to heat, the glass substrate is cut along the scribing line.

As described above, in the glass substrate cutting device of the present invention, the scribing beam, the cooling fluid and the braking beam are aligned on the glass substrate, and the glass substrate is continuously irradiated onto the glass substrate to cut the glass substrate in one step.

The above embodiment is an example for explaining the technical idea of the present invention in detail, and the scope of the present invention is not limited to the above drawings and embodiments.

10: glass substrate 11: cutting line
110: first laser light source 120: second laser light source
130: scribing beam irradiation unit
131, 132, 133, 134: beam splitter
135 mirror 140 first cylindrical lens
150: second cylindrical lens 160: cooling unit

Claims (5)

A first laser light source;
A second laser light source having a larger output than the first laser light source;
A scribing beam irradiation unit comprising at least two beam splitters and mirrors for splitting the beam emitted from the first laser light source into a plurality of aligned beams;
A first cylindrical lens installed on an optical path between the scribing beam irradiator and the glass substrate to shape the beam irradiated onto the glass substrate into an elliptical shape;
A second cylindrical lens installed on an optical path between the second laser light source and the glass substrate to form an oval shape of a beam irradiated onto the glass substrate;
And a cooling unit for injecting a cooling fluid to the glass substrate between the scribing beam that passes through the first cylindrical lens and irradiated onto the glass substrate, and the braking beam that passes through the second cylindrical lens and irradiates onto the glass substrate.
And the scribing beam, the cooling fluid sprayed from the cooling unit, and the breaking beam are arranged in order and irradiated onto a glass substrate at the same time. The laser beam of claim 1, wherein the beam splitters have different optical characteristics, and the beams branched from each beam splitter have different intensities and are irradiated onto a glass substrate by being aligned through the first cylindrical lens. Complete cutting device for glass substrate. 3. The glass substrate of claim 2, wherein the beam splitters are arranged so that light beams branched from each beam splitter and passed through the first cylindrical lens and irradiated onto the glass substrate are sequentially reduced in light intensity. Fully cutting device. 4. The apparatus of claim 3, wherein the beam splitters are four. The glass substrate as claimed in claim 1, wherein the first laser light source and the second laser light source are CO 2 lasers having a wavelength range of 9.4 to 10.6 μm, and output power thereof is 100 to 300 W and 300 to 500 W, respectively. Cutting device.

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