KR20120055075A - Method and apparatus for repairing bus line of liquid crystal panel - Google Patents

Abstract

PURPOSE: A method for repairing a bus line of a liquid crystal panel and a device thereof are provided to precisely repair defects of a gate bus line or a data bus line on a non image area. CONSTITUTION: A laser processing unit(110) irradiates a laser beam wherein the laser beam has a feature which responds to a protective layer. The protective layer is formed on a damaged part of a bus line. The laser processing unit forms a recess area from which the protective layer is removed. A patterning unit(120) coats and hardens conductive ink in the recess area. The patterning unit generates a repair pattern.

Description

Method and apparatus for repairing bus line of liquid crystal panel {Method and Apparatus for repairing bus line of liquid crystal panel}

The present invention relates to a method and apparatus for repairing bus line damage occurring at an outer portion of a liquid crystal panel in which a bonding process is performed.

A liquid crystal panel is a device using optical anisotropy and polarization properties of a liquid crystal. A liquid crystal panel converts and transmits various electrical information into visual information by using liquid crystal transmittance which is changed by adjusting an arrangement direction of liquid crystal molecules according to an applied voltage. . Such liquid crystal panels are widely used in that their operating voltage is low and power consumption can be used in a portable manner.

The liquid crystal panel has a structure in which a thin film transistor (TFT) array substrate as a lower substrate and a color filter substrate as an upper substrate are bonded to face each other, and a liquid crystal layer having dielectric anisotropy is formed therebetween. .

The lower substrate includes a gate wiring and a data wiring defining a unit pixel region formed on the lower transparent substrate, a thin film transistor formed at an intersection of the gate wiring and the data wiring, and functions as a switching element, and is connected to the thin film transistor to form a liquid crystal layer. And pixel electrodes for applying a voltage for driving.

The upper substrate facing the lower substrate has a black matrix to prevent light leakage sequentially formed on the upper transparent substrate, color filter layers of R, G and B to realize red, green and blue, and planarize the surface of the color filter layer. It consists of an overcoat layer (Overcoat layer) and the like.

The upper substrate and / or the lower substrate may further include an alignment layer formed on an inner surface to determine an initial alignment of the liquid crystal layer, and a common electrode applying a reference voltage for driving the liquid crystal layer to face the pixel electrode.

When one gate wiring and one data wiring of the liquid crystal panel configured as described above are selected and voltage is applied, only the thin film transistor to which the voltage is applied is turned on, and the liquid crystal molecules in the pixel region corresponding to the turned on thin film transistor. The arrangement is changed.

In manufacturing such a liquid crystal panel, a substrate bonding process is performed. The upper substrate and the lower substrate are bonded to form a predetermined internal space, and the liquid crystal is injected into the internal space.

The liquid crystal display including the bonded liquid crystal panel includes a backlight disposed under the liquid crystal panel and used as a light source, and a driving unit positioned at an outer side of the liquid crystal panel to drive the liquid crystal panel. The driving unit further includes a driving IC (Integrated Circuit) in which a driving circuit for applying a signal to the gate wiring and the data wiring of the liquid crystal panel is integrated.

1 is a plan view of the liquid crystal panel in which the substrate bonding process is performed, and FIG. 2 is an outer sectional view of the liquid crystal panel in which the substrate bonding process is performed.

1 and 2, in the liquid crystal panel 1 in which the upper substrate 30 and the lower substrate 40 are bonded, the lower substrate 40 has a larger area than the upper substrate 30. There is a non-image area 20 out of the surface of 40 that is not covered by the upper substrate 30. In this non-image area 20 a bus line of a pad 24 for an IC bonding zone for electrical connection between a shorting bar 22 and a driving IC chip. 50 is formed.

Damage to opening patterns (such as thin film transistors, pixel electrodes, gates, or data wirings) formed on the lower substrate prior to the bonding process is opened in a vacuum environment such as a local chemical vapor deposition zone (CVD zone). There exists a technique of forming and repairing.

However, after the bonding process is performed, when the damage occurs to the bus line 50 formed in the non-imaging region 20, which is an outer portion of the lower substrate, and covered by the protective layer 60 (see FIG. 2B). Due to the presence of a step by bonding (see A in FIG. 2), it becomes impossible to implement a CVD zone, and thus a repair technique using the CVD zone as described above cannot be used.

In order to solve this problem, a technique of repairing using a laser has been developed and applied when a damage occurs in the bus line 50 formed in the non-image area 20 of the liquid crystal panel 1 after the bonding process is performed. .

3 is a cross-sectional view illustrating a process of repairing bus line damage using a laser. In particular, FIG. 3 illustrates a case in which the portion B of FIG. 2, that is, the bus line 50 of the non-image area 20 has an open defect.

The laser beam is irradiated to the open defective portion 52 of the bus line 50 to remove the portion 54 of the bus line around the open defective portion 52 and the protective layer 62 located thereon (Fig. 3). (a)). In this case, a part of the protective layer 64 remains on the open defect portion 52 that does not respond to the laser beam (see FIG. 3B).

The conductive material is then dispensed and cured inside the recess 66 removed by the laser beam and on top of the remaining protective layer 64 to create a new conductive path 70 (FIG. c), the bus line 50 is electrically connected through the conductive path 70 so that the open fault can be repaired. In order to protect the conductive path 70 from the external environment, the protective layer 75 is deposited (see (d) of FIG. 3) to complete the bus line repair operation.

In this case, the repaired portion has a size L1 larger than that of the open defect portion 52, and the repaired portion has a step height of a predetermined height (h) due to the remaining protective layer 62 when compared with the normal non-image area. By having a surface finish of the product is not good, there is a high possibility of damage due to external physical impact.

In addition, since the bus line 50 has a conductive path 70 extended by the remaining protective layer 62, the bus line 50 functions as an electrical path having a shape different from that of the basic design, thus causing unexpected problems in electrical signal transmission. have.

The above-described background technology is technical information that the inventor holds for the derivation of the present invention or acquired in the process of deriving the present invention, and can not necessarily be a known technology disclosed to the general public prior to the filing of the present invention.

The present invention provides a bus line repair method and apparatus capable of repairing precisely and with high quality an open type defect occurring in a bus line such as a gate bus line or a data bus line formed in a non-image area after a bonding process is performed. It is to.

In addition, the present invention can solve the problem that the protective layer of the open defect portion remaining to obtain a good surface finish and to reduce the possibility of damage due to external impact to increase the product completeness and faithful repair in the basic design of the bus line of the liquid crystal panel To provide a possible bus line repair method and apparatus.

Other objects of the present invention will be readily understood through the following description.

According to an aspect of the present invention, a device for repairing a bus line damage of a liquid crystal panel, the recess of which a protective layer is removed by irradiating a laser beam having a characteristic that a protective layer formed on the damaged portion of the bus line reacts. Disclosed is a bus line repair apparatus for a liquid crystal panel comprising a laser processing unit forming a region and a patterning unit applying and curing a conductive ink in the recess region to generate a repair pattern.

The laser beam may have a wavelength band of 100 to 410 nm. In addition, the wavelength of the laser beam may be one of 193 nm, 248 nm, 262 nm, 263 nm, 266 nm, 308 nm, 349 nm, 351 nm, 355 nm, and 405 nm.

The protective layer generating unit may further include a protective layer on the repair pattern in the recess region.

The protective layer deposited on the repair pattern may have a step difference between the protective layer around the damaged portion and a predetermined error range.

In the liquid crystal panel, a bonding process is performed, and a bus line may be formed in a non-image area of the liquid crystal panel.

Meanwhile, according to another aspect of the present invention, a method of repairing a bus line damage of a liquid crystal panel, wherein the protective layer is removed by irradiating a laser beam having a characteristic that a protective layer formed on the damaged portion of the bus line reacts. A bus line repairing method of a liquid crystal panel is provided, which includes forming a recess region and applying and curing a conductive ink in the recess region to generate a repair pattern.

The laser beam may have a wavelength band of 100 to 410 nm. In addition, the wavelength of the laser beam may be one of 193 nm, 248 nm, 262 nm, 263 nm, 266 nm, 308 nm, 349 nm, 351 nm, 355 nm, and 405 nm.

The method may further include depositing a protective layer on the repair pattern in the recess region.

The protective layer deposited on the repair pattern may have a step difference between the protective layer around the damaged portion and a predetermined error range.

In the liquid crystal panel, a bonding process is performed, and a bus line may be formed in a non-image area of the liquid crystal panel.

Other aspects, features, and advantages will become apparent from the following drawings, claims, and detailed description of the invention.

According to an exemplary embodiment of the present invention, after the bonding process is performed, defects of an open type occurring in a bus line such as a gate bus line or a data bus line formed in a non-image area may be repaired with high precision and high quality.

In addition, by solving the problem that the protective layer of the open defect portion remains, to obtain a good surface finish, and to reduce the possibility of damage due to external impact to increase the product completeness, there is a faithful effect in the basic design of the bus line of the liquid crystal panel.

1 is a plan view of a liquid crystal panel in which a substrate bonding process is performed;
2 is an outer sectional view of a liquid crystal panel in which a substrate bonding process is performed;
3 is a cross-sectional view showing a process of repairing bus line damage using a laser;
4 is a schematic structural diagram of a bus line repair apparatus according to an embodiment of the present invention;
5 is a flowchart of a bus line repair method according to an embodiment of the present invention;
6 is a plan view of a liquid crystal panel in which a process according to a bus line repairing method according to an embodiment of the present invention is performed;
FIG. 7 is a cross-sectional view of the CC line shown in FIG. 6, that is, a cross-sectional view of a liquid crystal panel in which a process according to the bus line repairing method according to an embodiment of the present invention is performed.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is a schematic structural diagram of a bus line repair apparatus according to an embodiment of the present invention. Referring to FIG. 4, the bus line repair apparatus 100, the laser processing unit 110, the laser oscillator 111, the optical modulator 112, the reflection mirror 113, the beam expander 114, the scanner 115, Objective lens unit 116, beam dump 117, support table 118, laser beam path 119, patterning unit 120, dispenser 122, curing unit 124, control unit 130, protection The layer generating unit 140 and the liquid crystal panel 1 are shown.

The bus line repaired by the bus line repair apparatus 100 according to the present exemplary embodiment will be described on the assumption that the bus lines are formed in the outer portion of the liquid crystal panel 1 where the bonding process is performed, that is, in the non-image area. However, when the protective layer is formed on the damaged pattern, the bus line repair apparatus 100 according to the present embodiment may be applied to repair the damage.

The bus line repair apparatus 100 according to the present embodiment uses a laser having a characteristic that a protective layer reacts to a bus line damage present in a non-image area of a liquid crystal panel 1 in which a bonding process is performed. The bus line is repaired by precisely removing the upper protective layer of the portion and then performing patterning using conductive ink on the damaged portion of the bus line.

The support table 118 is mounted with the liquid crystal panel 1 conveyed by the transfer device of the front end. The liquid crystal panel 1 mounted on the support table 118 is a liquid crystal panel in which a bonding process of an upper substrate and a lower substrate is performed, as illustrated in FIGS. 1 and 2, and the transfer device of the front end may be a conveyor or a robot arm. have.

In the liquid crystal panel 1 mounted on the support table 118, it is assumed that the damaged part position of the bus line formed in the non-image area is primarily detected. To this end, a damage detection unit may be provided at the front end of the bus line repair apparatus 100 or a damage detection unit may be further included in the bus line repair apparatus 100 according to an exemplary embodiment.

The damage detection unit determines the presence or absence of a bus line damage with respect to the liquid crystal panel 1, and acquires information regarding the location of the bus line damage in the case where there is a bus line damage. To this end, the damage detection unit may be configured to include an imaging camera and a position measuring unit.

The imaging camera photographs the liquid crystal panel including the bus line damage, and the position measuring unit calculates and outputs the position information of the bus line damage using the image signal received from the imaging camera. Bus line damage does not have a normal pattern and some of the patterns are open. Various methods for determining bus line damage and detecting its location may be applied in this embodiment.

The laser processing unit 110 irradiates a laser to a position corresponding to the damaged portion of the protective layer formed on the upper portion of the bus line to first remove the protective layer. If the bus line damage is open, the open part may be connected by irradiating a laser after applying and curing the conductive ink to perform patterning. To this end, the laser processing unit 110 or / and the liquid crystal panel 1 may be moved to be aligned by moving the supporting table 118.

The laser beam oscillated by the laser oscillator 111 is modulated by the optical modulator 112 and directed to the beam dump 117 or the reflection mirror 113. The laser beam traveling to the reflective mirror 113 is magnified through the beam expander 114, scanned by the scanner 115, and mounted on the support table 118 through the objective lens unit 116. The target machining position (in this embodiment, the protective layer corresponding to the bus line damage part) is irradiated. This will be described in detail for each component.

The laser oscillator 111 is composed of a laser medium, a pumping unit, a switching unit and the like to output a laser beam. The laser beam oscillated by the laser oscillator 111 may be a pulse type or a continuous wave type.

The laser beam output from the laser oscillator 111 may be ultraviolet (UV) light having a wavelength at which the protective layer may be removed by reaction, and the wavelength band is 100 to 410 nm.

As a representative wavelength in the ultraviolet wavelength band, for example, a laser beam having a wavelength of one of 193 nm, 248 nm, 262 nm, 263 nm, 266 nm, 308 nm, 349 nm, 351 nm, 355 nm, and 405 nm may be output from the laser oscillator 111. .

The optical modulator 112 separates the path of the laser beam to adjust the amount of the laser beam according to the irradiation conditions. The amount of laser beam to be controlled may be the number of pulses or irradiation time in the case of a pulse type laser beam, and the irradiation time in the case of a continuous wave type laser beam. This may vary depending on the irradiation conditions such as the shape, size, etc. of the damaged portion.

The number of pulses or irradiation time required for the repair of the bus line damage to the laser beam oscillated from the laser oscillation unit 111 is the path to the objective lens unit 116 for the remaining pulse or other time. The amount of laser beam can be adjusted by branching to another path, such as a path, to the beam dump 117 in this embodiment.

The optical modulator 112 calculates an amount of the laser beam required to process it according to the size of the damaged portion, and only the laser pulse corresponding to the calculated amount or the laser beam is directed to the objective lens unit 116 only for a corresponding irradiation time. A modulation control unit (not shown) may be added to control the operation of the optical modulator 112 to face. The modulation control unit may be integrated with the optical modulator 112 or may be connected to a separate device, or may be integrated with the control unit 130 that controls the laser processing unit 110.

Such an optical modulator 112 includes an Acoustic Optic Modulator (AOM), but may also include other optical shutters such as an Electro Optical Modulator (EOM), a liquid crystal modulator, a high speed optical switch.

The scanner 115 corresponds to a focus adjusting unit, and finely horizontally shifts the focus of the laser beam on the liquid crystal panel 1. The scanner 115 may be a galvano mirror installed so that two mirrors face each other and are positioned two-dimensionally with respect to the laser beam.

The first galvano mirror receives and reflects the laser beam and rotates about the first axis. The second galvano mirror receives and reflects a laser beam reflected from the first galvano mirror while rotating about a second axis different from the first axis. Therefore, the desired point of the liquid crystal panel on which the laser beam is mounted on the support table by adjusting the angle between the first and second axes, the degree of rotation of the first galvano mirror, and the degree of rotation of the second galvano mirror (this embodiment In this case, it is possible to irradiate the protective layer corresponding to the damaged part of the bus line.

When the scanner 115 positions the laser beam at a specific point on the horizontal, the objective lens unit 116 focuses the laser beam with finely adjusted focus so that the protective layer is irradiated. Here, the objective lens unit 116 may be composed of one objective lens, a plurality of lens groups such as a convex lens, a concave lens, or a combination of one or more lenses and other optical systems.

The support table 118 is a part for placing the liquid crystal panel 1, and the distance or / and the position with respect to the objective lens unit 116 may be adjusted so that the correct position and focus can be adjusted. In addition, the support table 118 may be adjusted to a distance or / and a position with respect to the dispenser 122, which will be described later, so that the dispensing of the conductive ink for the patterning operation can be precisely performed.

The support table 118 may be added with a mechanical component to enable movement and rotation in conjunction with the transfer device of the front end.

The path 119 of the laser beam can be changed as needed, and a reflective mirror 113 is used for this purpose.

In this embodiment, the driving of the laser oscillator 111, the optical modulator 112, the scanner 115, and the support table 118 may be generally controlled by the controller 130.

In the present embodiment, the laser oscillator 111, the optical modulator 112, the reflection mirror 113, the beam expander 114, the scanner 115, and the objective lens unit 116 are optically connected. Optical phenomena include various phenomena such as reflection, diffraction, and refraction of light. Here, 'optically connected' means that light emitted from one component is received by the other component by various optical phenomena. it means.

The patterning unit 120 is laser-processed by the laser processing unit 110 among the non-image areas of the liquid crystal panel 1 to apply and cure the conductive ink in a recess area where the protective layer is removed to form a repair pattern. This repairs the electrical connections of bus lines that had been damaged in the open form. The patterning unit 120 includes a dispenser 122 and a curing unit 124.

The dispenser 122 includes a distance adjusting part for adjusting a vertical distance from the support table 118, a body storing conductive ink therein, and a needle mounted at a lower end of the body to discharge conductive ink. do. Here, the support table 118 may be moved up and down instead of the distance adjuster to adjust the vertical distance between the dispenser 122 and the support table 118.

In the present embodiment, the dispenser 122 may include a dispensing unit or an inkjet unit, and discharges a predetermined amount of ink continuously or in predetermined units under the control of the controller 130 while storing the conductive ink therein. can do.

The body may be formed in a predetermined space therein and may contain conductive ink capable of performing a function of a bus line. The conductive ink may be, for example, a metal paste made of one or more metals of silver, gold, copper, etc., metal nanoparticle ink, and a soluable metal cluster & complex type. It may be one of the transparent electronic conductive ink (Transparent Electronic Conductive ink) of the structure. In particular, the transparent electronic conductive ink has a high density of cross section when it is reduced from a liquid to a metal, enables low-temperature firing of 130 ° C. or below, has a short firing time, enables thin films, and has a high conductivity to apply a fine pattern. There is this.

The hardening unit 124 may harden the conductive ink discharged by the dispenser 122 by applying heat or irradiating light. That is, the curing unit 124 includes a heater to apply heat to the conductive ink applied in the recessed region, or includes a lamp, so that light of a predetermined wavelength (for example, ultraviolet rays) is recessed. By releasing to the conductive ink applied therein, the conductive ink can be cured to a certain hardness by chemical reaction.

The curing unit 124 may further include a guide for directing a direction in which heat is applied or a direction in which light is emitted to a predetermined direction (eg, inside the recess area). The conductive ink can be cured more efficiently by applying heat or irradiating light accurately to the point where the conductive ink is discharged by the dispenser 122 by the guide.

The bus line repair apparatus 100 according to the present embodiment may further include a protective layer generating unit 140. The protective layer generating unit 140 deposits a new protective layer to protect the repaired bus line, that is, the repair pattern after the bus line repair is completed, and to supplement a portion of the protective layer removed by the laser processing unit 110.

In particular, a new protective layer is formed on the repair pattern in the recess area so that the surface and the step of the normal non-imaging area are substantially eliminated, thereby obtaining a good surface finish and lowering the possibility of damage due to external impact, thereby improving product completion. .

In the present exemplary embodiment, the position where the laser beam is irradiated by the scanner 115 is adjusted and the position where the conductive ink is dispensed by the dispenser 122 is adjusted, but the scope of the present invention is limited thereto. According to the embodiment, the support table 118 is three-dimensionally moved with respect to the irradiation of the laser beam having a fixed focus and / or the dispensing operation of the conductive ink, so that the irradiation position of the laser beam and / or The dispensing position may be adjusted. Alternatively, both the scanner 115 and / or the dispenser 122 and the support table 118 may be moved to adjust the irradiation position of the laser beam and / or the dispensing position of the conductive ink relatively.

Hereinafter, a bus line repair method and a process thereof will be described with reference to the drawings of FIG. 5.

5 is a flowchart of a bus line repair method according to an embodiment of the present invention, FIG. 6 is a plan view of a liquid crystal panel in which a process according to the bus line repair method is performed according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view of the CC line, that is, a cross-sectional view of the liquid crystal panel in which a process according to the bus line repairing method according to an embodiment of the present invention is performed.

Hereinafter, it will be described on the assumption that there is an open-type damage in the bus line formed in the non-image area with respect to the liquid crystal panel 1 in which the upper substrate and the lower substrate are opposed to each other.

First, in step S200, the liquid crystal panel 1 is mounted on the support table 118. Referring to FIGS. 6A and 7A, a liquid crystal panel mounted on a support table is illustrated. At this time, the damage portion of the bus line may have been previously detected by the damage detection unit in the position, shape, size, and the like.

In step S210, the laser processing unit 110 corresponds to a laser beam capable of reacting the protective layer 68 formed on the damaged portion 52 of the bus line with respect to the liquid crystal panel 1 mounted on the support table 118. The protective layer 68 is irradiated and removed to form a laser processed recess region 80 (see FIGS. 6B and 7B).

Here, the protective layer 68 removed by laser processing is sufficient to have a size L2 including the damaged portion 52, and the recessed region 80 formed also has a size corresponding to L2. L2 is smaller than L1 shown in FIG. 3, and according to the present exemplary embodiment, the laser processing area is smaller in size than the conventional method, thereby minimizing the influence on the peripheral circuit (for example, a normal bus line).

The recess region 80 has a shape in which the protective layer 68 corresponding to the damaged portion 52 does not remain and the upper surface of the lower transparent substrate corresponding to the damaged portion 52 is exposed to the outside.

The laser processing unit 110 drives each component so that the focal point of the laser beam is located in the protective layer 68 corresponding to the damaged portion 52, and oscillates the laser beam having the characteristic that the protective layer 68 reacts. The protective layer 68 in the region corresponding to the damaged portion 52 of the bus line is removed. Herein, the protective layer 68 may be removed in response to a laser beam in a wavelength band of 100 to 410 nm, and representative wavelengths of the laser beam for removing the protective layer 68 may be, for example, 193 nm, 248 nm, 262 nm, and 263 nm. , 266nm, 308nm, 349nm, 351nm, 355nm, 405nm.

In steps S220 and S230, the patterning unit 120 applies and cures the conductive ink in the recess region 80 to generate the repair pattern 85 (see FIGS. 6C and 7C). The repair pattern 85 is connected to the damaged both ends of the damaged bus line so that the electrical connection of the corresponding bus line is restored so that the repaired bus line functions as a passage through which an electrical signal is transmitted. Here, the bus line may be repaired according to the basic design of the liquid crystal panel, thereby preventing unexpected problems caused by physical changes such as extension of the path.

After the repair pattern generation is completed, the protective layer 90 is deposited on the repair pattern 85 inside the recess region 80 in step S240 (see (d) of FIG. 6 and (d) of FIG. 7). The liquid crystal panel 1 can be applied to subsequent work processes.

The repair pattern 85 generated inside the recess region 80 is exposed to the outside, and there is a step with the surface of the normal non-image region around the recess pattern 80. Therefore, the new repair layer 90 is deposited so that the repair pattern 85 is protected from the external environment. In addition, it is possible to obtain a good product surface finish by substantially eliminating the step with the surface of the normal non-image area of the surroundings, and to increase the product completeness by lowering the possibility of damage due to external impact that can occur by the conventional method.

In the bus line repair method according to the present embodiment, a test process may be additionally performed to check whether the repair of the bus line is performed properly.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the following claims And changes may be made without departing from the spirit and scope of the invention.

1: liquid crystal panel 10: image area
20: non-imaging area 30: upper substrate
40: lower substrate 50: bus line
60: protective layer 52: damaged portion
62: remaining protective layer 70: conductive path
75: protective layer 100: bus line repair device
110: laser processing unit 111: laser oscillation unit
112: optical modulator 113: reflective mirror
114: beam expander 115: scanner
116: objective lens unit 117: beam dump
118: support table 119: laser beam path
120: patterning unit 122: dispenser
124: curing unit 130: control unit
140; Protective layer generation unit 80: recessed area
85: repair pattern 90: protective layer

Claims (12)

As a device for repairing bus line damage of a liquid crystal panel,
A laser processing unit for irradiating a laser beam having a characteristic of reacting a protective layer formed on the damaged portion of a bus line to form a recessed region from which the protective layer is removed; And
And a patterning unit for applying a conductive ink in the recessed area and curing the conductive ink to generate a repair pattern.
The method of claim 1,
The laser beam is a bus line repair apparatus of the liquid crystal panel, characterized in that having a wavelength band of 100 to 410nm.
The method of claim 1,
The wavelength of the laser beam is 193nm, 248nm, 262nm, 263nm, 266nm, 308nm, 349nm, 351nm, 355nm, 405nm, bus line repair apparatus of the liquid crystal panel, characterized in that.
The method of claim 1,
And a protective layer generating unit for depositing a protective layer on the repair pattern in the recess region.
The method of claim 4, wherein
The protective layer deposited on the repair pattern is a bus line repair apparatus for a liquid crystal panel, characterized in that the step between the protective layer around the damaged portion is within a predetermined error range.
The method of claim 1,
The liquid crystal panel is a bonding process is performed,
And said bus line is formed in a non-image area of said liquid crystal panel.
As a method of repairing bus line damage of a liquid crystal panel,
Irradiating a laser beam having a characteristic that the protective layer formed on the damaged portion of the bus line reacts to form a recessed region from which the protective layer is removed; And
A method of repairing a bus line of a liquid crystal panel comprising applying and curing a conductive ink in the recess region to generate a repair pattern.
The method of claim 7, wherein
And the laser beam has a wavelength band of 100 to 410 nm.
The method of claim 7, wherein
The wavelength of the laser beam is 193nm, 248nm, 262nm, 263nm, 266nm, 308nm, 349nm, 351nm, 355nm, 405nm bus line repair method of the liquid crystal panel, characterized in that.
The method of claim 7, wherein
And depositing a protective layer on the repair pattern in the recess region.
The method of claim 10,
The protective layer deposited on the repair pattern is a bus line repair method for a liquid crystal panel, characterized in that the step between the protective layer around the damaged portion is within a predetermined error range.
The method of claim 7, wherein
The liquid crystal panel is a bonding process is performed,
And the bus line is formed in a non-image area of the liquid crystal panel.

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