KR102394874B1 - Laser Repair Apparatus for Repairing a Plurality of Defects with a Single Light Source - Google Patents

Abstract

Disclosed is a laser repair apparatus capable of repairing a plurality of defects with a single light source. One aspect of the present invention provides a laser repair apparatus that outputs a laser beam in order to repair defects occurring on a substrate. The laser repair apparatus comprises: one or more light sources irradiating a laser beam of a preset wavelength band; an upper optical system allowing the laser beam irradiated by the light sources to move ahead on any one path among a plurality of paths or to be divided and move ahead on the plurality of paths; a scanner processing the laser beam in a shape of a defect occurring on the substrate; a relay lens allowing the laser beam, passing through the scanner, to form an image; an objective lens focusing and irradiating the laser beam incident through the relay lens onto the substrate; and a control unit detecting whether the substrate is located at a position where the laser beam, irradiated through the objective lens, can be incident and controlling the operation of the light sources and the upper optical system.

Description

Laser Repair Apparatus for Repairing a Plurality of Defects with a Single Light Source

The present invention relates to a laser repair apparatus capable of repairing a plurality of defects with one light source.

The content described in this section merely provides background information for the present embodiment and does not constitute the prior art.

With the remarkable development of display device technology, technologies related to various types of image display apparatuses, such as liquid crystal displays and plasma displays, have been greatly advanced. In particular, in image display devices that realize large-scale and high-definition display, a high degree of technological innovation is progressing in order to reduce the manufacturing cost and improve image quality. High dimensional quality and high-precision surface properties are also required for glass substrates mounted on these various devices and used to display images. In the manufacture of glass for display device use, etc., although a glass substrate is shape|molded by using various manufacturing apparatuses, it is generally performed to shape|mold into a predetermined shape after heat-melting an inorganic glass raw material and homogenizing a molten glass. At this time, due to various causes, such as insufficient melting of glass raw material, unintentional mixing of foreign substances during manufacturing, aging of molding equipment, temporary molding conditions, and defects occurring in the process of cutting to a desired size after completion. In some cases, defects such as abnormality in surface quality may occur in the glass substrate.

What has been spotlighted as a technique for repairing such defects is a method of repairing disconnection by connecting a spare wiring in case of a defect by providing a spare wiring for repair. This is lowered, and there is a problem in that the operating characteristics of the liquid crystal panel are adversely affected.

Therefore, a repair wiring method using a laser has recently been in the spotlight. When a defect was found, after removing the found defect using a precise laser, the removed area was repaired by various methods such as CVD.

In general, the repair method using a laser outputs laser light, adjusts the direction of the laser to a position to be processed with a scanner, and then passes through various lenses to focus and irradiate the laser to a position to be processed.

In this case, in order to simultaneously repair defects occurring at various locations, a method of dividing an output laser beam into several paths and simultaneously irradiating each defect is used. However, since the length of each path inevitably varies, there has been a problem in that the quality of the laser beam irradiated to the defect in the substrate is ultimately changed. Accordingly, there has been a inconvenience in that it is difficult to accurately repair a defect with a conventional repair apparatus.

[Prior art literature number]

Prior art 1: 10-2021-0086233 (CPC: g02f1/1309, IPC: G02F 1/13)

An embodiment of the present invention has an object to provide a laser repair apparatus capable of uniformly repairing a plurality of defects even with a single light source.

According to one aspect of the present invention, in a laser repair apparatus for outputting a laser beam to repair a defect occurring on a substrate, one or more light sources irradiating a laser beam of a preset wavelength band and a plurality of laser beams irradiated from the light source An upper optical system that advances in any one of the paths or divides it into all of a plurality of paths, a scanner that processes a laser beam in the form of a defect generated on the substrate, and a relay lens that forms a laser beam that has passed through the scanner and an objective lens for focusing and irradiating the laser beam incident through the relay lens onto the substrate, and by detecting whether the substrate is positioned at a position where the laser beam irradiated through the objective lens can be received, the light source and the It provides a laser repair apparatus comprising a control unit for controlling the operation of the upper optical system.

According to one aspect of the present invention, the upper optical system receives the laser beam irradiated from the light source and receives a 1/4 wave plate to improve beam quality and an open/close mirror for adjusting the path of the laser beam passing through the 1/4 wave plate and a plurality of beam control optical systems that directly receive a laser beam passing through the 1/4 wave plate or receive a laser beam reflected from the outside, adjust the quality of the incident laser beam and output the laser beam reflected from the open/close mirror It is characterized in that it comprises a mirror for reflecting any one of the beam control optical system.

According to an aspect of the present invention, the opening/closing mirror is characterized in that it moves closer to or away from the mirror under the control of the controller.

According to an aspect of the present invention, when the open/closed mirror approaches the mirror, the laser beam passing through the 1/4 wave plate is reflected to the mirror.

According to an aspect of the present invention, when the open/close mirror moves away from the mirror, the laser beam passing through the 1/4 wave plate proceeds to any one beam control optical system.

According to one aspect of the present invention, the optical system is characterized in that the laser beam irradiated from the light source proceeds to any one of a plurality of paths.

According to an aspect of the present invention, the upper optical system includes a beam splitter for splitting the laser beam irradiated from the light source, an optical shutter arranged for each path branched by the beam splitter to adjust whether the laser beam moves, and the optical A plurality of beam control optical systems that receive the laser beam passing through the shutter, adjust the quality of the incident laser beam and output it, and a mirror that reflects any one of the laser beams branched from the beam splitter to any one beam control optical system characterized in that

According to one aspect of the present invention, the beam splitter is characterized in that any one beam is transmitted to the mirror and the other beam is transmitted to any one beam control optical system.

According to an aspect of the present invention, the upper optical system further comprises a 1/4 wave plate for improving the beam quality of the laser beam, behind the optical shutter on the traveling path of the laser beam.

According to one aspect of the present invention, the optical shutter is characterized in that when a voltage is applied from the outside, the polarization direction of the transmitted laser beam is changed.

As described above, according to one aspect of the present invention, there is an advantage that a plurality of defects can be uniformly repaired even with a single light source.

1 is a view showing a laser repair system according to an embodiment of the present invention.
2 is a diagram illustrating a configuration of a laser repair apparatus according to an embodiment of the present invention.
3 is a diagram showing the configuration of the upper optical system according to the first embodiment of the present invention.
4 is a view showing a control unit for controlling the operation of the upper optical system according to the first embodiment of the present invention.
5 is a diagram showing the configuration of an upper optical system according to a second embodiment of the present invention.
6 is a diagram illustrating an operation of an optical shutter according to an embodiment of the present invention.
7 is a diagram illustrating a control unit for controlling an operation of an upper optical system according to a second embodiment of the present invention.
8 is a diagram illustrating a configuration of a beam control optical system according to an embodiment of the present invention.

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing each figure, like reference numerals have been used for like elements.

Terms such as first, second, A, and B may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When an element is referred to as being “connected” or “connected” to another element, it is understood that it may be directly connected or connected to the other element, but other elements may exist in between. it should be On the other hand, when a certain element is referred to as being “directly connected” or “directly connected” to another element, it should be understood that no other element is present in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. It should be understood that terms such as “comprise” or “have” in the present application do not preclude in advance the possibility of the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification. .

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

In addition, each configuration, process, process or method included in each embodiment of the present invention may be shared within a range that does not technically contradict each other.

1 is a view showing a laser repair system according to an embodiment of the present invention.

Referring to FIG. 1 , a laser repair system 100 according to an embodiment of the present invention includes a defect detection apparatus 110 , a defect determination apparatus 120 , and a laser repair apparatus 130 .

The substrate includes a plurality of pixels. In general, a substrate is composed of a number of pixels, and each pixel is also composed of a plurality of layers. Pixels in the substrate are implemented with a plurality of layers such as an active layer, a gate layer, and a source and drain layer. Defects such as the introduction of fine particles or disconnection of fine particles may occur on the substrate during the production process of the substrate, and in particular, defects may occur on any layer of pixels in the substrate. The defect detection apparatus 110 detects a defect in which pixel of which layer included in the substrate.

The defect determination apparatus 120 determines the type and location of a defect in the substrate detected by the defect detection apparatus 110 . With respect to the defect detected by the defect detection apparatus 110 , the defect determination apparatus 120 determines what type of defect the defect occurred in the substrate, where on the substrate, and on which layer the defect occurred. The defect determination apparatus 120 determines the nature of the defect, so that the laser repair apparatus 130 can irradiate a laser beam suitable for repairing the generated defect.

The laser repair apparatus 130 generates a laser beam suitable for repairing the defect determined by the defect determination apparatus 120 and irradiates it to the substrate.

The laser repair apparatus 130 irradiates a defect by adjusting a beam profile to repair the defect, based on the determined property of the defect. The laser repair apparatus 130 may repair a plurality of defects at the same time by branching a laser beam output from one light source into two or more paths and irradiating each of the laser beams with different defects. At this time, the laser repair apparatus 130 uniformly adjusts the quality (width or divergence, etc.) of the laser beam irradiated to each path, so that all defects can be uniformly repaired.

2 is a diagram illustrating a configuration of a laser repair apparatus according to an embodiment of the present invention.

Referring to FIG. 2 , the laser repair apparatus 130 according to an embodiment of the present invention includes a light source 210 , a shutter 220 , an upper optical system 230 , a mirror 240 , a second mirror 250 , and a scanner. 260 , a relay lens 270 , a monitoring unit 280 , an objective lens 290 and a control unit (not shown).

The laser repair apparatus 130 includes one or more light sources to generate a laser beam of a desired wavelength band, and repairs a plurality of defects at the same time by branching and outputting the beam into two or more paths.

The light source 210 irradiates a laser beam of a preset wavelength band. A single light source 210 may be included in the laser repair apparatus 130, and a plurality of light sources 210a to 210c may be included as shown in FIG. 2 to irradiate a laser beam of a required wavelength band in some cases. can In this case, when the plurality of light sources 210a to 210c are included, each light source may emit light of different wavelength bands. For example, the light source 210a emits a laser beam of a 1030 nm wavelength band, and the light source 210b emits a laser beam of a 343 nm wavelength band. The light source 210c may each irradiate a laser beam of a wavelength band of 515 nm. The light source 210 oscillates a laser beam for repair and irradiates it to the upper optical system 230 .

The shutter 220 controls whether the laser beam oscillated from the light source 210 is irradiated to the upper optical system 230 .

The upper optical system 230 allows the laser beam irradiated from the light source 210 to proceed in an appropriate path or to be divided into all paths. When the defect to be repaired is located in the correct position, the upper optical system 230 adjusts the path so that the laser beam for repair reaches the corresponding substrate 205 under the control of the controller (not shown). Accordingly, the laser beam passing through the upper optical system 230 passes through the mirrors 240 and 250, the scanner 260, the relay lens 270 and the objective lens 290 and is irradiated to the substrate 205, mainly cut processing, It can be used to repair defects by drilling or block machining.

In some cases, the upper optical system 230 may repair any one defect by selectively operating the laser beam to proceed in any one of a plurality of paths, and may operate to branch the laser beam to all paths to repair a plurality of defects. can be repaired at the same time. At this time, the upper optical system 230 determines the quality of the laser beam due to the path difference that inevitably occurs as the path of the laser beam changes, more specifically, the difference in the optical path length from the light source 210 to the objective lens 290 . Can be adjusted. By adjusting the quality of the laser beam to be output, the quality of the laser beam to be output may be adjusted to be the same even if a path difference occurs in the diverged laser beam. A detailed structure and description of the upper optical system 230 will be described later with reference to FIGS. 3 to 8 .

The mirror 240 and the second mirror 250 reflect the laser beam passing through the upper optical system 230 to the scanner 260 .

The scanner 260 receives the laser beam passing through the mirror 240 and the second mirror 250 and processes the shape of the laser beam so as to remove defects generated in various patterns on the substrate 205 . The scanner 260 processes the laser beam to have a pattern shape of the defect, so that the laser beam to be output can completely repair the defect.

The relay lens 270 forms the laser beam passing through the scanner 260 .

The monitoring unit 280 may monitor the type of the disposed objective lens 290 or the state of the substrate 205 . The monitoring unit 280 irradiates the confirmation light irradiated to the substrate 205 through the beam splitter 245 and the objective lens 290, and monitors the reflected light reflected from the substrate 205, The type or state of the substrate 205 may be monitored.

The objective lens 290 focuses and irradiates the laser beam incident through the relay lens 270 to the substrate 205 . Various types of the objective lens 290 are arranged according to the degree to which the laser beam should be focused according to each wavelength of the laser beam and the type of defect. A control unit (not shown) controls so that an appropriate objective lens 290 is disposed according to the type of defect determined by the defect determination device 120 .

The control unit (not shown) detects whether the substrate 205 is positioned at a fixed position (a position where the laser beam is focused in the objective lens 290) that allows the defect to be repaired, and the light source 210 and the upper optical system ( 230) is controlled.

When a sensing value sensed that the substrate 205 having a defect is positioned in the correct position is received, the controller (not shown) controls the light source 210 to oscillate a laser beam for repairing the defect. At this time, if the upper optical system 230 selectively controls the laser beam to proceed in any one path, the controller (not shown) controls the upper optical system 230 so that the laser beam is irradiated to the path where the substrate 205 is located. can be controlled On the other hand, if the upper optical system 230 branches the laser beam to all paths, the controller (not shown) may control the upper optical system 230 so that the laser beam is branched to all paths.

In any case, the controller (not shown) may control the quality of the laser beam to be output to be uniform in any case of controlling the upper optical system 230 . The controller (not shown) may control the upper optical system 230 to finely adjust not only the path but also the quality of the laser beam to be output. Accordingly, the controller (not shown) may properly repair each of the plurality of defects.

3 is a diagram showing the configuration of the upper optical system according to the first embodiment of the present invention.

Referring to FIG. 3 , the upper optical system 230 according to the first embodiment of the present invention includes mirrors 310a to 310c, a quarter wave plate 320 , an open/close mirror 330 , and a beam control optical system 340 . include

The mirror 310a and the mirror 310b reflect the laser beam oscillated from the light source 210 to pass through the quarter wave plate 320 .

A quarter wave plate (320, Quarter Wave Plate) passes the laser beam and improves the quality of the laser beam.

The open/close mirror 330 moves according to the control of the controller (not shown), and adjusts the path of the laser beam passing through the 1/4 wave plate 320 . When the opening/closing mirror 330 moves away from the mirror 310c under the control of the controller (not shown), the laser beam passing through the 1/4 wave plate 320 is directly incident on the beam control optical system 340a. On the other hand, when the opening/closing mirror 330 moves closer to the mirror 310c under the control of the controller (not shown), the laser beam passing through the 1/4 wave plate 320 is transmitted by the opening/closing mirror 330 to the mirror 310c. ) is reflected. The laser beam reflected by the open/close mirror 330 is reflected back by the mirror 310c and is incident on the beam control optical system 340b.

The beam control optical system 340 adjusts and outputs the quality of the incident laser beam under the control of a controller (not shown). The beam control optical system 340 is irradiated to the substrate 205 through a mirror 240 and the like.

As described above, the upper optical system 230 according to the first embodiment of the present invention adjusts the path of the laser beam so that the laser beam is selectively irradiated to any one of the plurality of paths.

4 is a view showing a control unit for controlling the operation of the upper optical system according to the first embodiment of the present invention.

Referring to FIG. 4 , the sensor 410 is disposed on all of the plurality of paths to which the laser beam is irradiated, and senses whether the substrate 205 is disposed at the correct position (the position at which the laser beam is finally irradiated) on each path. do.

The control unit 420 operates the light source 210 by receiving the sensing value of the sensor 410 , and controls the operation of the open/close mirror 330 together with it. After determining which path the laser beam should be irradiated on based on the sensed value, the control unit 420 operates the light source 210 and the open/close mirror 330 .

The processing unit 430 receives a sensing value from each sensor 410 and transmits it to the control unit 420 , and upon receiving the sensing value, operates the trigger unit 440 that it controls.

The trigger unit 440 operates by receiving an operation signal from the processing unit 430 .

The trigger selector 450 detects which trigger unit 440 has operated, and transmits it to the control unit 420 , and transmits an operation signal to the light source 210 according to the operation of the trigger unit 440 .

According to this structure, when the sensed value is recognized, an operation signal is transmitted to the light source 210 and the light source 210 is operated, and the open/closed mirror 330 operates and output according to the control of the control unit 420. Adjust the path of the laser beam.

5 is a diagram showing the configuration of an upper optical system according to a second embodiment of the present invention.

5, the upper optical system 230 according to the second embodiment of the present invention includes mirrors 310a to 310c, a quarter wave plate 320, a beam control optical system 340, a beam splitter 510, and and an optical shutter 520 .

The mirrors 310a to 310c and the beam control optical system 340 perform the same operations as those in the upper optical system 230 according to the first embodiment.

Meanwhile, the beam splitter 510 is disposed at the position of the open/close mirror 330 in the upper optical system 230 according to the first embodiment. A beam splitter 510 is disposed, and splits an incident laser beam into all paths. The upper optical system according to the second embodiment splits the laser beam so that it can be irradiated in all paths.

An optical shutter 520 is disposed between the beam splitter 510 and the beam control optical system 230a or between the mirror 310c and the beam control optical system 340b. The optical shutter 520 is disposed at the above-described position, and adjusts whether the laser beam proceeds in each path. An operation manner of the optical shutter 520 is illustrated in FIG. 6 .

6 is a diagram illustrating an operation of an optical shutter according to an embodiment of the present invention.

Referring to FIG. 6 , the optical shutter 520 may be implemented as a polarizing plate that changes the polarization direction by 90° depending on whether a voltage is applied or not. Accordingly, whether a laser beam having a specific polarization state is passed or not can be adjusted depending on whether a voltage is applied to both ends of the polarizing plate. As illustrated in FIG. 6 , assuming that the optical shutter 520 is a polarizing plate having only light having polarization in the x-axis direction in a situation where no voltage is applied, a laser beam having polarization in the y-axis direction is applied to the optical shutter ( 520 , whether or not the laser beam passes through only whether a voltage is applied to both ends of the optical shutter 520 may be quickly determined. As the optical shutter 520 is implemented as a polarizing plate having the above-described characteristics, it has a fast reaction speed and can determine whether or not the laser beam passes.

Referring back to FIG. 5 , the laser beam passing through the optical shutter 520 passes through the beam control optical system 230 , and after passing through the beam control optical system 230 , passes through the 1/4 wave plate 320 . The quarter wave plate 320 also performs the same operation as that in the upper optical system according to the first embodiment, but is disposed behind the beam control optical system 230 on the optical path. This may cause the 1/4 wave plate 320 to adjust the polarization direction of the laser beam when adjusting the quality of the laser beam, thereby preventing the optical shutter 520 from fully operating. Accordingly, the quarter wave plate 320 is disposed at the corresponding position.

7 is a diagram illustrating a control unit for controlling an operation of an upper optical system according to a second embodiment of the present invention.

Referring to FIG. 7 , the controller 420 operates the light source 210 by receiving the sensing value of the sensor 410 , and controls the operation of the optical shutter 520 together with it. After determining whether the laser beam should be irradiated to any path or all paths based on the sensed value, the control unit 420 operates the light source 210 and the optical shutter 520 .

The processing unit 730 receives a sensed value from each sensor 410 and transmits it to the control unit 420 .

The trigger unit 440 operates by receiving an operation signal from the control unit 420 .

The optical shutter driver 720 controls whether the optical shutter 520 is driven according to whether the trigger unit 440 is operated.

According to this structure, when the sensing value is recognized, an operation signal is transmitted to the light source 210 and the light source 210 operates, and the optical shutter 520 operates together with it to adjust the path of the output laser beam.

The upper optical system 230 in the laser repair apparatus 130 may have a structure according to the first embodiment or a structure according to the second embodiment. Regardless of the structure, the laser beam may be selectively irradiated to any one of several paths. When the upper optical system 230 has the structure according to the first embodiment, the laser beam cannot be irradiated through a plurality of paths at the same time, but a laser beam having a relatively strong intensity can be irradiated. When the upper optical system 230 has the structure according to the second embodiment, a laser beam of relatively weak intensity is irradiated, but the laser beam may be irradiated through a plurality of paths at the same time.

Meanwhile, the controller 430 may control the beam control optical system 230 in the upper optical system 230 to appropriately adjust the quality of the output laser beam no matter what path the laser beam is output through. The structure of the beam control optical system 230 is shown in FIG.

8 is a diagram illustrating a configuration of a beam control optical system according to an embodiment of the present invention.

The width w of the laser beam to be output through the objective lens 290 is determined by the following equation.

Here, W ₀ is the beam width of the laser output from the light source 210 , L is the distance (optical path) from the light source 210 to the objective lens 290 , and θ is the width of the laser output from the light source 210 . means the angle of dispersion. Accordingly, since the L value is inevitably different for each path, the beam width of the laser outputted from the same light source 210 is different even if it is output with the same dispersion angle.

To solve this problem, the beam control optical system 340 is disposed on the optical path. The beam control optical system 340 includes a convex lens 810 and a collimator 820 .

The convex lens 810 is disposed at the front end of the collimator 820 on the optical path of the laser beam, focuses the laser beam at the front end of the collimator 820 and adjusts the width of the laser beam incident to the collimator 820 . The convex lens 810 adjusts the width of the laser beam incident to the collimator 820 , thereby adjusting the width of the laser beam (parallel light) incident to the objective lens 290 through the collimator 820 .

The collimator 820 collimates the incident laser beam into parallel light.

The controller 430 adjusts the width of the laser beam to be output through the objective lens 920 by adjusting the distance between the convex lens 810 and the collimator 820 . The distance between the convex lens 810 and the collimator 820 is adjusted, and the width w of the laser beam to be output is determined by the following equation.

The distance between the convex lens 810 and the collimator 820 is adjusted by the controller 430, and the width (W`) of the laser beam to be output can be adjusted by a constant (C) times. The width can be adjusted.

Through this process, the laser repair apparatus 130 may output a laser beam having a desired width to a desired path.

The above description is merely illustrative of the technical idea of this embodiment, and a person skilled in the art to which this embodiment belongs may make various modifications and variations without departing from the essential characteristics of the present embodiment. Accordingly, the present embodiments are intended to explain rather than limit the technical spirit of the present embodiment, and the scope of the technical spirit of the present embodiment is not limited by these embodiments. The protection scope of this embodiment should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present embodiment.

100: laser repair system
110: defect detection device
120: defect determination device
130: laser repair device
205: substrate
210: light source
220: shutter
230: upper optical system
240, 250, 310: Mirror
260: scanner
270: relay lens
280: monitoring unit
290: objective lens
370: substrate
320: 1/4 wave plate
330: retractable mirror
340: beam control optical system
410: sensor
420: control unit
430, 710: processing unit
440: trigger unit
450: trigger selection unit
510: beam splitter
520: optical shutter
720: optical shutter driver
810: convex lens
820: collimator

Claims (10)

A laser repair apparatus for outputting a laser beam to repair a defect occurring on a substrate, the laser repair apparatus comprising:
One or more light sources for irradiating a laser beam of a preset wavelength band;
an upper optical system for advancing the laser beam irradiated from the light source to any one of a plurality of paths, or dividing the laser beam into all of the plurality of paths;
a scanner for processing a laser beam in the form of a defect generated on the substrate;
a relay lens for imaging the laser beam passing through the scanner;
an objective lens for focusing and irradiating the laser beam incident through the relay lens onto the substrate; and
A control unit for controlling the operation of the light source and the upper optical system by sensing whether the substrate is positioned at a position where the laser beam irradiated through the objective lens can be incident,
The upper optical system is
a quarter wave plate receiving the laser beam irradiated from the light source to improve beam quality;
an open/close mirror for adjusting the path of the laser beam passing through the 1/4 wave plate;
a plurality of beam control optical systems that directly receive a laser beam passing through the 1/4 wave plate or receive a laser beam reflected from the outside, adjust the quality of the incident laser beam, and output; and
A mirror for reflecting the laser beam reflected from the open/close mirror to any one beam control optical system,
The opening/closing mirror moves closer to or away from the mirror under the control of the controller. When the opening/closing mirror moves away from the mirror, the laser beam passing through the 1/4 wave plate is directed to any one beam control optical system. Laser repair device, characterized in that in progress. delete delete According to claim 1,
The open/close mirror is
When approaching the mirror, the laser repair apparatus, characterized in that for reflecting the laser beam passing through the 1/4 wave plate to the mirror. delete According to claim 1,
the optical system
Laser repair apparatus characterized in that the laser beam irradiated from the light source proceeds to any one of a plurality of paths.

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