KR20120050139A

KR20120050139A - The heat pipe type heat sink

Info

Publication number: KR20120050139A
Application number: KR1020100111502A
Authority: KR
Inventors: 전선욱
Original assignee: 에니웰(주)
Priority date: 2010-11-10
Filing date: 2010-11-10
Publication date: 2012-05-18

Abstract

Electronic products, rectifiers, communication repeaters, and LEDs are becoming smaller due to improved performance, but heat sinks, which are essential for preventing performance degradation due to heat generation and extending their life, must be miniaturized and radiated as much as possible in a narrow space. The present invention is a heat pipe structure heat sink in which the heat absorbing device is in contact with the heat generating device and absorbs heat into a planar structure having good heat absorption, and a wick is formed on the inner surface of the heat generating device, and the heat generated from the heat generating device does not pass through the insulator having low thermal conductivity. It is delivered directly to this good heatpipe structure heatsink and discharged, providing a highly efficient heatsink with improved performance and reduced size.

Description

Heat Pipe Type Heat Sink

Electronic products, rectifiers, communication repeaters, LEDs, etc. are required to heat dissipate as much as possible in a small space and miniaturize essential heat sinks in order to prevent performance deterioration and extend the life. It relates to a technology for absorbing heat and radiating the heat absorbed by contacting the primary heat generating device by a method of radiating and cooling heat generated by various heat generating devices.

Electronic products, rectifiers, communication repeaters, and LEDs should release heat to prevent performance deterioration due to heat generation and to extend their lifespan.How to release heat from heat generators is to connect heat sinks to heat generators. Heat generated from the generator is transferred to the heatsink to be discharged. Heat sinks use a natural convection method that attaches heat radiation fins to dissipate heat, forcibly blows heat using a fan to increase heat dissipation efficiency, and industrial power units and power plant rectifiers use heat to cool heat. Since the heat sink is directly proportional to the volume of the heat sink, the installation of the heat sink in a narrow place is limited due to the size of the heat sink. Phosphorous noise is generated. In addition, the method using coolant requires additional facilities such as sprinkler to cool the heated coolant.

The present invention relates to a heat sink that prevents performance degradation and lifespan by discharging and cooling heat generated by various electrical and electronic products and heating devices. There are many types of heat sinks, but there are also many ways of dissipating heat. In the natural convection method of dissipating heat from a heat generating device by attaching a heat sink or heat sink fin to the heat generating device, since heat dissipation is directly proportional to the volume of the heat sink or heat sink, the size of the heat sink is inevitably increased so that installation is impossible in a place where space is not secured. In addition, the Heat Sink + Fan type for discharging heat by forcibly blowing heat to the heat sink fins by using a fan requires a separate power for operating the fan and generates noise. In addition, the cooling method using the cooling water also requires additional facilities such as a sprinkler, which is essential for absorbing heat of the heating device to cool down the cooling water having a high temperature. The heat conduction is spread by heat transfer to the heat pipe type heat sink having good thermal conductivity, thereby providing a high efficiency heat sink with smaller heat sink size and improved performance.

Heat transfer performance of heat pipe is 40 times better than copper (80) and 80 times better than aluminum. For example, 1/4 inch and 6 inch long metals are 0.25w copper and 0.50w copper. Heat transfer is fast at 20w. The present invention is a heat pipe type heat sink that applies the principle and structure of the heat pipe as described above, directly contacting the heat generator 6, absorbing heat from the heat generator 6, and not directly passing through the insulator that is transferred to the heat sink. The heat pipe heat sink is a heat pipe type heat sink, which is an invention of the present invention. If the structure is described in more detail, the part which cools the heat generator 6 by absorbing heat of the heat generator 6 in contact with the heat generator 6 takes a planar structure with better heat absorption than the circular shape. The heat pipe structure with the wick 3 formed on the inner surface of the flat plate structure allows the heat pipe type heat sink to directly absorb and discharge the heat of the heat generator 6 without passing through the conductor, so that the heat dissipation efficiency uses a general metal insulator. This is much higher than the heat sink attached to the heat generator. In addition, the heat dissipation performance is improved while lowering the manufacturing cost by not forming a wick on the inner surface of the half-moon-shaped portion of the present invention, which is the same container as the heat dissipation unit. In addition, the wick 3 is formed on the inner surface of the heat pipe 1 having a planar structure in contact with the heat generator 6 so that the capillary tube of the wick 3 is irrespective of the installation direction and the inclination of the heat generator 6. Due to the phenomenon, the entire surface in contact with the heat generating device 6 becomes an endothermic area, and the heat of the heat generating device 6 is rapidly absorbed and cooled more rapidly. The heat radiation fins 2 attached to the heat radiation diffuse immediately without heat transportation. Due to the function and characteristics of the heat pipe 1, the heat absorbing portion which contacts the heat generating device 6 has a good wick structure 3, and the heat dissipating portion that dissipates heat transmitted by heat absorbing from the heat absorbing portion has no wick and thus does not generate heat resistance. Amosipone tube is a good use of the characteristics of the better heat pipe.

The heat pipe type heat sink which deforms the surface absorbing heat by contacting the heat generating device, which is a characteristic of the present invention, into a flat structure and has a wick formed on the inner surface of the flat structure. By adopting a thermosyphon structure without a wick, the heat generating device can endothermic heat dissipated more quickly, providing a high efficiency heat sink that can improve performance and reduce volume. There is no need to increase the volume of the heat sink, which is necessary to increase the heat dissipation rate for absorbing heat of the heat generator and cooling it. It also provides the advantage of eliminating the need for complex plants, such as sprinkler installations for heat dissipation systems that use the cooling water used to cool the rectifiers in power plants.

The present invention will be described with reference to the accompanying drawings.

1 is a perspective view of the present invention will be the bottom structure of the present invention that the surface in contact with the heat generating device is deformed into a plane and the wick (3) is formed on the inner surface of the plane, the heat dissipation fins in the outer diameter of the half-moon structure of the same container but also the heat dissipation unit (2) is formed. Plane structure Joining the present invention to a heat generating device using a flat iron joint structure (5) formed horizontally with the bottom surface of the planar structure on the left and right side, the part directly connected to the heat generating device is a joining structure (5) Since there is no flat iron, the heat pipe type heat sink which directly becomes the present invention without the insulator heat dissipates heat.

FIG. 2 is a front sectional view of the present invention, in which a wick 3 is formed on the bottom surface of the heat pipe 1, and the working fluid 4 is absorbed in the wick 3. As shown in FIG.

3 is a side view of the present invention, the surface in contact with the heat generating device 6 is deformed into a plane and the wick 3 is formed on the inner surface, the working fluid 4 absorbed by the wick 3 generates heat When the heat generated by the device 6 is absorbed more quickly, the working fluid 4 is evaporated. As the working fluid 4 is evaporated, the heat of the heat generating device 6 is absorbed and the heat generating device 6 is absorbed. To cool. In the endothermic evaporation unit of the present invention, the wick 3 is formed without the wick 3, so that the working fluid 4 in a liquid state has a very high density, so that the endothermic evaporation rate is slow, but the wick 3 forms a working fluid. When (4) is absorbed in the wick (3), the density of the working fluid (4) is very low, the lower the density of the working fluid (4) of the heat pipe (1) the faster the evaporation. The faster the evaporation of the working fluid 4, the more rapidly the heat of the heat generating device 6 is absorbed and evaporated. The heat radiation is caused by the heat radiation fins (2) formed in the. The automatic fluid 4 in the gas state is condensed when it is dissipated, and the condensed automatic fluid 4 is absorbed by the wick 3 again due to its own gravity and absorbs heat of the heat generator 6. The endothermic working fluid 4 is evaporated while changing into a gas, and the evaporated working fluid 4 repeats a cycle of dissipating and condensing again. The present invention and the heat generating device 6 may be joined using the flat iron joint structure 5 formed on the left and right sides of the planar structure. Since the portion that is in contact with the heat generating device 6 does not have a junction structure (5) flat iron, the heat generated from the heat generating device (6) is directly transferred to the heat pipe type heat sink of the present invention without passing through the non-conductor to radiate heat. . Since the joining method of the heat generating device 6 and the present invention is various and easy, it will be omitted here.

4 is a horizontal deformation of the heat dissipation part that is part of the present invention can be easily installed if the heat dissipation part transversely even when the upper portion of the heat generating device 6 is narrow or there is an obstacle.

FIG. 5 is the same as that of FIG.-4 to deform the heat dissipation part which is a part of the present invention by deforming to both sides, which is another method.

Figure 6 (a) is a cross-sectional view when the present invention is attached (installed) vertically, (b) is a cross-sectional view is expected when installed (installed) vertically when the thermosyphon tube is inserted. Referring to (a), which is a cross-sectional view of the present invention, a wick 3 is formed on the entire inner surface of the heat generating apparatus 6, and the working fluid 4 is absorbed by the wick 3, so that the heat generating apparatus ( 6) the total surface contacting with 6) is endothermic area, so that the endothermic area of working fluid (4) up to the working fluid level (7) is only 3 times different from the endothermic area. have. In addition, the density of the automatic fluid 4 is also high in the liquid state, but very low if absorbed in the wick (3). As mentioned above, the lower the density of the working fluid (4), the faster the time for absorbing heat is obtained. As a result of the experiment, the working fluid (4) absorbed in the wick (3) rather than the working fluid (4) that is standing in the liquid phase. The evaporation was 30% faster. As a result, the present invention shows that the endothermic area is increased three times and the working fluid 4 is absorbed with low density in the wick 3 so that the heat generated from the heat generator 6 does not pass through the non-conductor. Heat transfer to the heat dissipation by the heat dissipation fin (2) is attached to the outer surface of the half-moon-type heat dissipation surface of the present invention.

1 is a perspective view of the present invention,

2 is a front cross-sectional view of the present invention.

3 is a side view of the present invention,

4 is a cross-sectional view of a heat dissipation part which is a part of the present invention deformed to one side;

5 is a cross-sectional view of the heat dissipation part that is a part of the present invention deformed to both sides.

6 is a cross-sectional view when the present invention is installed vertically

"I" is the expected section when the thermosyphon tube type is installed vertically.

Claims

The contact surface that absorbs heat by contacting the heat generator 6 is deformed into a plane, and the wick 3 is formed on the inner surface of the plane, and the heat dissipation fins 2 are formed on the outer diameter of the half-moon structure, which is the same inner surface but is a heat dissipation part. Heatpipe Structure Heatsink.

The method of claim 1

A heat pipe structure heat sink in which a heat dissipation portion having heat dissipation fins is formed in a lateral direction, an upper side, or both left and right directions.