KR20120049708A - Method for fabricating liquid crystal panel - Google Patents

Abstract

PURPOSE: A method for manufacturing a liquid crystal panel is provided to prevent damage of a pad unit during a process of cutting a liquid crystal display device. CONSTITUTION: A first substrate is bonded with a second substrate. A liquid crystal layer(150) is interposed between the first and second substrates. A seal pattern is formed by hardening a sealant. Laser is irradiated from an upper part of the second substrate to the outside of the seal pattern. The second substrate is cut. A protection metal layer(200) is eliminated.

Description

Manufacturing method of liquid crystal panel {Method for fabricating liquid crystal panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a liquid crystal display device having a narrow bezel that can reduce a non-display area where an image of a liquid crystal panel is not displayed.

Recently, liquid crystal displays have been spotlighted as advanced display devices with low power consumption, good portability, technology-intensive, and high added value.

The liquid crystal display device is formed by arranging two substrates having electrodes formed on one side thereof so that the electrodes face each other, injecting liquid crystal between the electrodes of the two substrates, and applying voltage to the electrodes formed on the substrates. By moving the liquid crystal molecules by the electric field, the image is expressed by the transmittance of light that varies depending on the position change of the liquid crystal.

1 is a schematic plan view of a general liquid crystal display.

As illustrated, the array substrate 11 having the thin film transistor T and the color filter substrate 12 having the color filter (not shown) face and face each other with the liquid crystal layer (not shown) therebetween. The array substrate 11 and the color filter substrate 12 are spaced apart from each other, and the edge portions thereof are encapsulated and sealed through a fail pattern 20.

In the array substrate, a display area AA and a non-display area NA for displaying an image are defined. A plurality of gates are formed on the inner surface of the display area AA of the array substrate 11, which is commonly called a lower substrate, under the premise of an active matrix method. The pixel GL is defined by the intersection of the wiring GL and the data wiring DL, and a thin film transistor T is provided at each crossing point to form a transparent pixel electrode formed in each pixel P. And one-to-one correspondence.

In this case, a gate and data pad electrode (not shown) connected to the gate and data lines GL and DL in the non-display area NA on one side of the array substrate 11 on which the gate and data lines GL and DL are disposed. The formed pad parts DPA and GPA are formed to connect the gate and the data lines GL and DL to an external driving circuit board (not shown).

In addition, an inner surface of the color filter substrate 12 called an upper substrate may correspond to each pixel P. For example, color filters of red (R), green (G), and blue (B) colors may be used. A black matrix (not shown) is provided at positions corresponding to the gate wiring GL, the data wiring DL, the thin film transistor T, and the like.

That is, the black matrix (not shown) is formed to separate the pixels P in the display area AA, and also captures the display area AA at the edge of the display area AA, which is the non-display area NA. It consists of a form.

The color filter substrate 12 is provided with a transparent common electrode (not shown) covering the color filter (not shown) and the black matrix (not shown).

Here, the bonding between the array substrate 11 and the color filter substrate 12 is crimped between the substrates 11 and 12 in a state in which a UV-curable or thermosetting sealant is applied to an edge of any one of the substrates 11 and 12. Then, the sealant is cured by irradiating the sealant with UV light or an appropriate temperature having an appropriate wavelength for a proper time to form a failure turn 20.

The failure turn 20 is formed in the non-display area NA that surrounds the edge of the display area AA, and serves as an encapsulant.

In the liquid crystal display, the first and second large area substrates (bare or mother glass), in which a plurality of cell regions are divided by positions, may be processed to reduce the process or improve the yield.

At this time, a failure turn 20 for bonding to each cell region of the first or second large area substrate is formed, and then the two substrates are bonded to each other with a liquid crystal layer (not shown) interposed therebetween. The liquid crystal panel 10 is obtained by cutting each region.

In particular, the cutting process of the cell process is a brake that cuts the substrate substantially by giving a shock using a break bar after the scribing process of scribing each cell region using a laser to form a linear scratch. It is through the process.

In this case, the linear scratches formed by the laser in the scribing process are formed to have a width of about 300 to 400 μm, and thus a cutting burr corresponding to the scratch width is formed on the cutting surface of the substrate.

Therefore, since the non-display area NA becomes wider due to the cutting burr, there is a problem that a liquid crystal display device having a narrow bezel, which is recently required, cannot be realized.

In addition, the cutting burr damages a cable (not shown) for applying a driving signal or the like to the liquid crystal display device, thereby causing a fatal problem such that the cable (not shown) is disconnected or the coating is peeled off and the wire is exposed to the outside.

As a result, a poor driving operation of the liquid crystal panel 10 may occur or damage to a circuit unit (not shown) may occur.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a liquid crystal display device having a narrow bezel.

In addition, the second object is to prevent the pad portion from being damaged during the cutting process of the liquid crystal display device, and prevents the occurrence of cutting burrs, thereby preventing damage to the cable, which is a signal transmission connection member connecting circuit boards. It is intended as a third purpose.

Therefore, a fourth object of the present invention is to prevent the driving operation failure of the liquid crystal panel from occurring or the damage of the circuit unit.

In order to achieve the object as described above, the present invention provides a method for manufacturing a display device comprising: providing first and second substrates on which a display area and a non-display area are defined; Forming a protective metal layer on the non-display area of the first substrate; Applying a sealant to the non-display area of one of the first substrate and the second substrate; Bonding the first and second substrates to each other and interposing a liquid crystal layer between the first and second substrates; Curing the sealant to form a failure turn; Irradiating a laser from the top of the second substrate to the outside of the failure turn to cut the second substrate; It provides a method of manufacturing a liquid crystal panel comprising the step of removing the protective metal layer.

In this case, a gate and a data pad electrode, a gate and a data link wiring, and a gate and a data pad electrode terminal are formed in the non-display area, and the protective metal layer has a reflectivity of 90% or more, chromium (Cr), aluminum (Al), and molybdenum. (Mo), silver (Ag) and gold (Au).

In addition, the protective metal layer is dipped in the etching solution or sprayed to remove the etching solution, the etching solution is made of a material that does not react with the gate and the data pad terminal electrode.

The first substrate may be an array substrate in which a thin film transistor is positioned at an intersection of the gate and data wirings and the gate and data wirings, and the second substrate is a color filter substrate having a color filter and a black matrix formed in the display area. In the cutting of the second substrate, the first substrate is cut by irradiating a laser from the lower portion of the first substrate to the outside of the non-display area.

The first and second substrates are each formed of a plurality of unit cells including the failing turns to form a liquid crystal panel.

As described above, according to the present invention, the protective metal layer is further formed in the non-display area in which the gate and the data pad terminal electrodes of the array substrate are formed, and the color filter substrate is completely cut by using a laser, whereby the color filter There is an effect to prevent the gate and the data pad terminal electrode of the array substrate from being damaged by the laser irradiated to the substrate.

In addition, it is possible to eliminate the brake process, there is an effect that can prevent the occurrence of cutting burrs (cutting burr) on the cutting surface of the substrate.

Therefore, the bezel area of the liquid crystal display device can be prevented from being widened, and the cable, which is a signal transmission connecting member for connecting circuit boards, can be prevented from being damaged by the cutting burr. Through this, there is an effect that it is possible to prevent the driving operation failure of the liquid crystal panel or damage to the circuit portion.

1 is a schematic plan view of a general liquid crystal display device.
2 is a flowchart illustrating a manufacturing process of a liquid crystal display according to an exemplary embodiment of the present invention step by step.
3 is a plan view schematically illustrating a part of the array substrate after the second step of FIG. 2 is performed;
4A through 4E are views of the liquid crystal cell taken along the cutting lines I-I 'and II-II' of FIG. 3 according to the process flow from the eighth to ninth steps of the TFT-LCD cell process of FIG. A schematic cross-sectional view of a portion.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

2 is a flowchart illustrating a manufacturing process of a liquid crystal display according to an exemplary embodiment of the present invention step by step.

The liquid crystal display first performs a TFT-LCD cell process St10, and forms a liquid crystal cell through the cell process St10.

In more detail, the TFT-LCD cell process (St10) is largely divided into a color filter substrate and an array substrate (St11), a protective metal layer (St12), an alignment layer (St13), a sealant coating and a spacer formation (St14), and a liquid crystal. It consists of dripping (St15), adhesion (St16), sealant hardening (St17), cutting (St18), removing a protective metal layer (St19), and an inspection process (St20).

Accordingly, in the first step St11 of the TFT-LCD cell process St10, after forming the upper substrate as the color filter substrate and the lower substrate as the array substrate, the foreign substances which may be present on the substrate are applied before the alignment layer is applied. This is the initial cleaning step to remove.

In this case, a plurality of gate wirings and data wirings intersect each other to define pixels on the inner surface of the display area of the array substrate, and thin film transistors are provided at each crossing point to connect one-to-one with the transparent pixel electrodes formed in each pixel. .

As an example corresponding to each pixel on the inner surface of the color filter substrate, a color filter of red (R), green (G), and blue (B) colors and each of them is disposed, and the gate wiring, the data wiring, and the thin film transistor are disposed. A first black matrix covering non-display elements, such as a light source, is provided, and a transparent common electrode covering them is provided.

In this case, the array substrate is formed to have a larger area than the color filter substrate, and a pad portion having gate and data pad electrodes connected to the gate and data wirings is formed in an area larger than the color filter substrate.

The gate and data pad electrodes are connected to each other through gate wiring, data wiring, and link wiring, respectively, and the gate and data pad electrodes minimize the influence of the external environment and prevent adhesion failure between the external signal wiring and each pad. Separate gate and data pad terminal electrodes are formed.

Next, in the second step St12, the liquid crystal display of the present invention forms a protective metal layer on the gate and data pad terminal electrodes and the link wirings formed in the non-display area of the array substrate, which are larger than the color filter substrate. It is.

The protective metal layer is preferably made of a metal material having a high reflectance (90% or more). For example, chromium (Cr), aluminum (Al), molybdenum (Mo), silver (Ag), and gold (Au) may be used. .

The protective metal layer is used as a role of preventing the gate and data pad terminal electrodes and the link wiring from being damaged by the laser in the process of cutting the color filter substrate.

We will discuss this in more detail later.

The third step St13 is a step of forming an alignment layer on the color filter substrate and the array substrate. In the fourth step St14, the sealant is coated so that the liquid crystal to be interposed between the color filter substrate and the array substrate is not leaked. In order to maintain a precise and uniform gap between the color filter substrate and the array substrate, a spacer of a certain size is scattered.

Here, the sealant is applied around the edge of one of the color filter substrate and the array substrate, and the sealant is formed in the non-display area surrounding the edge of the display area.

The fifth step (St15) of the TFT-LCD cell process (St10) is a step of dropping liquid crystal onto one of the selected substrates, and the sixth step (St16) is a bonding process step of the color filter substrate and the array substrate. Thereafter, a seventh step St17 of curing the sealant is performed.

Thus, the original liquid crystal cell is completed.

Next, after the sealant curing step St17 of the TFT-LCD cell step St10, an eighth step St18 of cutting the original liquid crystal cell into cell units is performed.

Here, the liquid crystal display device of the present invention is characterized in that the cutting process of the original liquid crystal cell using a laser.

In particular, the liquid crystal display of the present invention is characterized by cutting each array substrate and color filter substrate at a time using a laser without a separate break process.

Therefore, it is possible to prevent a cutting burr from being generated on the cutting surface of the substrate, thereby preventing the bezel area of the liquid crystal display device from being widened, and a signal transmission connection member connecting the circuit boards due to the cutting burrs. It is possible to prevent the printed cable from being damaged.

Through this, it is possible to prevent the driving operation failure of the liquid crystal panel or damage to the circuit unit.

Next, the ninth step St19 is a process of removing the protective metal layer on the gate and the data pad terminal electrode exposed to the outside of the failure turn.

At this time, the protective metal layer is removed by performing a dipping process by dipping a portion of the protective metal layer exposed to the bath containing the etching liquid reacting with the protective metal layer, or spraying the etching liquid on the exposed surface of the protective metal layer. Done.

In this case, it is preferable to use an etchant that does not react with the gate and the data pad terminal electrode formed under the protective metal layer.

Finally, the tenth step St20 of the TFT-LCD cell process St10 is an inspection process of the unit liquid crystal cell. Through the inspection process, high-quality unit liquid crystal cells are selected.

As a result, the TFT-LCD cell process St10 is completed, thereby completing the unit liquid crystal cell.

Next, a polarizing plate attaching process (St20) for attaching a polarizing plate to each of the array substrate and the color filter substrate of the completed unit liquid crystal cell is performed. The polarizing plate converts light sources into linear light on both sides of the unit liquid crystal cell. Play a role.

Next, the process of attaching the driving circuit (St30) is performed, and the driving circuit is a TAB method in which a driving circuit for connecting an electrical signal with an array substrate of a unit liquid crystal cell is directly mounted on a tape carrier package (TCP). To the unit liquid crystal cell.

This completes the actual driveable liquid crystal panel.

Such a driving circuit is divided into a gate driving circuit which scans and transmits an on / off signal of a thin film transistor to a gate wiring of a liquid crystal panel, and a data driving circuit which transmits image signals by frame to a data wiring. It can be located with two edges adjacent to each other.

In the liquid crystal panel having the above-described structure, when the thin film transistor selected for each gate wiring is turned on by the on / off signal of the gate driving circuit which is scanned and transmitted, the signal voltage of the data driving circuit is transferred through the data wiring. The arrangement direction of the liquid crystal molecules is changed by the electric field between the pixel electrode and the common electrode, which is transmitted to the pixel electrode, thereby indicating a difference in transmittance.

Next is a cell test process (St40), the cell test process is a complete liquid crystal panel attached to the driving circuit is completed to check whether it can be displayed by driving.

Through this inspection process, high-quality liquid crystal panels are selected.

Next, the backlight unit assembly and case assembly process (St50) is performed. The backlight unit assembly process includes a light source on the lower surface of the liquid crystal panel, a light source guide for guiding the light source, a light guide plate for moving light incident from the light source toward the liquid crystal panel, and a plurality of light guide plates. It includes an optical sheet of.

Alternatively, although the edge type method using the light guide plate has been described in the above description, a direct type in which a plurality of light sources are arranged side by side under the liquid crystal panel with the light guide plate omitted may be used.

In this case, a fluorescent lamp such as a cold cathode fluorescent lamp or an external electrode fluorescent lamp may be used as the light source. Alternatively, a light emitting diode lamp may be used as a light source in addition to the fluorescent lamp.

Assemble the case after the backlight unit assembly process. The case assembly is modularized through the top cover, the support main and the cover bottom. The top cover is a rectangular frame having a cross section bent in a shape to cover the top and side edges of the liquid crystal panel. It is configured to display an image implemented in the panel.

In addition, the cover bottom, which is the basis for assembling the entire structure of the liquid crystal display device module by mounting the liquid crystal panel and the backlight unit, is configured by vertically bending four edges thereof in a rectangular plate shape.

In addition, a support main mounted on the cover bottom and covering the edges of the liquid crystal panel and the backlight unit is assembled with the top cover and the cover bottom to complete the liquid crystal display module.

Meanwhile, the liquid crystal display of the present invention further includes a protective metal layer on the gate and data pad electrodes and the link wiring formed in the non-display area of the array substrate, which are formed with a larger area than the color filter substrate in the TFT-LCD cell process (St10). Forming (St12), in the process of cutting the color filter substrate, it is possible to cut the substrate at a time using a laser without a brake process, it is possible to prevent the occurrence of cutting burrs on the cutting surface of the color filter substrate. .

Therefore, it is possible to prevent the bezel area of the liquid crystal display from being widened, and to prevent damage to the cable, which is a signal transmission connection member connecting the circuit boards, due to the cutting burr.

Through this, it is possible to prevent the driving operation failure of the liquid crystal panel or damage to the circuit unit.

3 is a plan view schematically illustrating a part of the array substrate after the second step of FIG. 2 is performed.

As shown in the drawing, in the display area AA for displaying an image, a plurality of gate lines GL are formed extending in a first direction and intersecting the first direction. The data line DL is formed to extend and define the pixel P together with the gate line GL.

In each pixel P, a driving thin film transistor T, which is a switching element connected to the two wires, is formed at a portion where the gate line GL and the data line DL cross each other.

In the non-display area NA outside the display area AA, the gate pad part GPA of the plurality of gate pad electrodes 124 formed at one end of the plurality of gate wirings GL is formed. A plurality of data pad electrodes 125 connected to ends of the plurality of data lines DL are formed in the data pad part DPA, which is the other side of the substrate 101 which is not parallel to the pad part GPA.

The gate and data pad electrodes 124 and 125 are electrically connected to the gate wiring GL and the data wiring DL through the gate and the data link wirings 126 and 127, respectively.

In this case, the gate and the data pad electrodes 124 and 125 have separate gates in order to minimize the influence of the external environment and to prevent poor adhesion between the external signal wiring (not shown) and the pad electrodes 124 and 125. And data pad terminal electrodes 128 and 129 are formed.

In the non-display area NA, which surrounds the edge of the display area AA, a failure turn 120 for bonding to the color filter substrate (not shown) is formed.

In this case, the failure turn 120 may be formed on a color filter substrate (not shown), and in this case, when the bonding turn comes into contact with the array substrate 101 as shown in the drawing, the failure turn 120 may be formed on the array substrate 101. As shown in the drawings.

At this time, the outer side of the failure turn 120 of the array substrate 101 is formed larger than the color filter substrate (not shown), the gate and the data link wiring surrounding the outer edge of the failure turn 120 ( The protective metal layer 200 is formed on the upper portions 126 and 127 and the gate and data pad terminal electrodes 128 and 129.

The protective metal layer 200 damages the gate and data pad terminal electrodes 128 and 129 and the gate and data link wirings 126 and 127 by a laser during the cell cutting process St18 of the TFT-LCD cell process St10. It prevents it from becoming.

The protective metal layer 200 is removed after the cell cutting process.

4A through 4E are views of the liquid crystal cell taken along the cutting lines I-I 'and II-II' of FIG. 3 according to the process flow from the eighth to ninth steps of the TFT-LCD cell process of FIG. A cross-sectional view schematically showing a part.

Prior to the description, the liquid crystal cell is divided into a display area AA in which an image is displayed and a non-display area NA which surrounds the edge of the display area AA.

FIG. 4A is a part of the array substrate 101 and the color filter substrate 102 after the seventh step of FIG. 2 is performed, and as shown in the drawing, a gate wiring is formed on the inner surface of the display area AA on the array substrate 101. The pixel P is defined by the intersection of (not shown) and the data wiring (not shown), and the pixel electrode 123 is formed in each pixel P.

In addition, the gate electrode 111, the gate insulating film 113, the semiconductor layer 115, the source and drain electrodes 117 and 119, and the protective layer may be disposed at the intersections of the gate wirings (not shown) and the data wirings (not shown). A thin film transistor T, which is a switching element composed of 121, is provided.

In this case, the semiconductor layer 115 is composed of an active layer 115a of pure amorphous silicon and an ohmic contact layer 115b of amorphous silicon including an impurity. In this case, the thin film transistor T is amorphous of pure and impurity in the drawing. A bottom gate type consisting of the silicon silicon 115a and 115b is shown as an example, and may be formed as a top gate type including a polysilicon semiconductor layer as a modification thereof.

The non-display area NA of the array substrate 101 having a larger area than the color filter substrate 102 may include gate and data link wirings 126 and 127 connected to gate and data wirings (not shown). The gate and data pad parts GPA and DPA are provided with the gate and data pad electrodes 124 and 125 and the gate and data pad terminal electrodes 128 and 129.

At this time, the gate and data link wirings 126 and 127 and the gate and data electrode terminals 128 and 129 are completely formed in the gate and data pad portions GPA and DPA of the non-display area NA of the array substrate 101. The protective metal layer 200 is formed to wrap.

The inner surface of the color filter substrate 102 facing the array substrate 101 includes a thin film transistor T, a gate wiring (not shown), a data wiring (not shown), and a liquid crystal such as an edge of the pixel electrode 123. A grid-like black matrix 131 is formed around the pixel P to cover only the non-display area unrelated to driving and expose only the pixel electrode 123.

For example, R (red), G (green), and B (blue) color filters 133 and the black matrix 131 are sequentially arranged in a lattice of the black matrix 131 to correspond to each pixel P. And a common electrode 135 covering the color filter 133.

In this case, the liquid crystal layer 150, the pixel electrode 123, and the common electrode 135 are interposed with first and second alignment layers (not shown), each of which has a surface rubbing toward the liquid crystal in a predetermined direction, respectively. Evenly align the initial alignment of the molecules with the orientation.

The sealant is applied to the edges of the array substrate 101 and the color filter substrate 102 to prevent leakage of the liquid crystal layer 150. The sealant is a polymer mixture in which an epoxy resin and a curing accelerator are mixed. Cured by UV light irradiation to form a failure turn 120 of the adhesive role to maintain the bonding state of the two substrates (101, 102).

The failure turn 120 also serves as a gap agent that uniformly controls the cell gap between the substrates 101 and 102 defined by the thickness of the liquid crystal layer 150.

That is, the sealant is formed in the non-display area NA which covers the edge of the display area AA, and serves as an encapsulant of the liquid crystal cell.

Next, a process of cutting the substrates 101 and 102 of the eighth step of FIG. 2 in cell units is performed. In order to improve the yield in manufacturing a unit liquid crystal cell, a plurality of unit liquid crystal cells are formed on a large substrate. Forming at the same time is generally applied. Accordingly, a process of separating and processing a unit liquid crystal cell from a large area mother substrate by cutting and processing a mother substrate on which a plurality of liquid crystal cells are made is required.

The array substrate 101 includes gate and data pad electrodes connected to the gate and data wirings (not shown), respectively, in a non-display area NA on one side of the array substrate 101 where the gates and data wirings (not shown) are disposed. Since the gate and data pad portions GPA and DPA having the 124 and 125 formed thereon are formed to have a larger area than the color filter substrate 102, the cutting process is performed by the color filter substrate 102 and the array substrate 101. By cutting each using the laser LB, a disc liquid crystal cell is isolate | separated into a unit liquid crystal cell.

Here, as shown in Figure 4b, in the process of cutting the color filter substrate 102, the cutting line (A) is formed corresponding to the outer edge of the failure turn 120, the laser irradiated from the laser oscillator 160 LB cuts the color filter substrate 102 in correspondence with the outer edge of the failure turn 120.

The cutting line B of the array substrate 101 is irradiated with the laser LB corresponding to the outside of the non-display area NA of the array substrate 101 to cut the array substrate 101. As a result, the original liquid crystal cell is separated into a unit liquid crystal cell.

Here, the laser LB irradiated onto the color filter substrate 102 is irradiated at an intensity capable of completely cutting the color filter substrate 102.

In this case, the laser LB irradiated at an intensity capable of completely cutting the color filter substrate 102 may be irradiated to the non-display area NA of the array substrate 101 on which the gate and data pad terminal electrodes 128 and 129 are formed. Can be. However, at this time, the protective metal layer 200 is formed on the gate and the data pad terminal electrodes 128 and 129, and is irradiated to the non-display area NA of the array substrate 101 as shown in FIG. 4C. The laser LB is reflected by the protective metal layer 200 so that the gate and data pad terminal electrodes 128 and 129 and the gate and data link wirings 126 and 127 positioned below the damage are damaged by the laser LB. To prevent it.

Here, the laser oscillator 160 may use a CO2 laser, YAG laser, femtosecond laser and the like.

Therefore, in the liquid crystal display of the present invention, the color filter substrate 102 and the array substrate 101 are completely cut through the laser LB, so that a separate brake process does not need to be performed.

Through this, cutting burrs may be prevented from occurring on the cut surfaces of the substrates 101 and 102.

Therefore, it is possible to prevent the bezel area of the liquid crystal display from being widened, and to prevent the cable (not shown), which is a signal transmission connection member connecting the circuit boards, from being damaged by the cutting burr. Through this, it is possible to prevent the driving operation failure of the liquid crystal panel or damage to the circuit unit.

Next, FIG. 4D is a part of the unit liquid crystal cell in which the ninth step of FIG. 2 is performed, and as shown in FIG. 4D, the array substrate of the unit liquid crystal cell that has undergone the cutting process of the color filter substrate 102 and the array substrate 101. The protective metal layer 200 is exposed on the gate and data pad terminal electrodes 128 and 129 of the non-display area NA and the gate and data link wirings 126 and 127. The metal layer 200 is removed.

At this time, the protective metal layer 200 by performing an etching process such as spraying the etching solution (S) on the exposed surface of the protective metal layer 200, as shown in Figure 4e to remove the protective metal layer 200.

Alternatively, although not shown in the drawing, a dipping for dipping a portion of the substrate 101 on which the protective metal layer 200 exposed to the bath (not shown) containing the etching solution S reacting with the protective metal layer 200 is formed is provided. It can remove by performing.

In this case, the etching solution S may be an etching solution S that does not react with the gate and the data pad terminal electrodes 128 and 129 formed under the protective metal layer 200.

As described above, in the TFT-LCD cell process, the protective metal layer 200 is formed in the non-display area NA in which the gate and data pad terminal electrodes 128 and 129 of the array substrate 101 are formed. In addition, by completely cutting the color filter substrate 102 using the laser (160 in FIG. 4C), the brake process can be eliminated, thereby preventing the cutting burrs from being generated on the cut surfaces of the substrates 101 and 102. can do.

Therefore, it is possible to prevent the bezel area of the liquid crystal display from being widened, and to prevent the cable (not shown), which is a signal transmission connection member connecting the circuit boards, from being damaged by the cutting burr. Through this, it is possible to prevent the driving operation failure of the liquid crystal panel or damage to the circuit unit.

In addition, the gate and the data pad terminal electrodes 128 and 129 of the array substrate 101 formed larger than the color filter substrate 102 are damaged by the laser LB irradiated onto the color filter substrate 102. Can be prevented.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

101: array substrate, 102: color filter substrate
111: gate electrode, 113: gate insulating film
115: semiconductor layer 115a: active layer, 115b: ohmic contact layer
117: source electrode, 119: drain electrode, 120: failure turn
121: protective film, 123: pixel electrode, 124: gate pad electrode, 125: data pad electrode
126: gate link wiring, 127: data link wiring, 128: gate pad terminal electrode
129: data pad terminal electrode, 131: black matrix, 133: color filter, 135: common electrode
150: liquid crystal layer, 160: laser oscillator, 200: protective metal layer
T: driving thin film transistor, AA: display area, NA: non-display area
P: Pixel, GPA: Gate pad section, DPA: Data pad section

Claims (8)

Providing first and second substrates on which display areas and non-display areas are defined;
Forming a protective metal layer on the non-display area of the first substrate;
Applying a sealant to the non-display area of one of the first substrate and the second substrate;
Bonding the first and second substrates to each other and interposing a liquid crystal layer between the first and second substrates;
Curing the sealant to form a failure turn;
Irradiating a laser from the top of the second substrate to the outside of the failure turn to cut the second substrate;
Removing the protective metal layer
Method of manufacturing a liquid crystal panel comprising a.
The method of claim 1,
Gate and data pad electrodes, gate and data link wirings, and gate and data pad electrode terminals are formed in the non-display area, and the protective metal layer includes the gate and data pad electrodes, the gate and data link wirings, and the gate and data pads. A method of manufacturing a liquid crystal panel covering an electrode terminal.
The method of claim 1,
The protective metal layer has a reflectance of 90% or more, chromium (Cr), aluminum (Al), molybdenum (Mo), silver (Ag) and gold (Au) manufacturing method of a liquid crystal panel made of one.
The method of claim 2,
The protective metal layer is a method of manufacturing a liquid crystal panel by dipping in an etchant, or by spraying the etchant.
The method of claim 4, wherein
And the etching solution is formed of a material that does not react with the gate and the data pad terminal electrode.
The method of claim 2,
The first substrate is an array substrate in which a thin film transistor is positioned at the intersection of the gate and the data wiring and the gate and the data wiring, and the second substrate is a color filter substrate having a color filter and a black matrix formed in the display area. Manufacturing method.
The method of claim 1,
And cutting the first substrate by cutting the second substrate from a lower portion of the first substrate to the outside of the non-display area.
The method of claim 1,
And the first and second substrates are each formed of a plurality of unit cells including the fail turn to form a liquid crystal panel.

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