KR100628438B1 - Manufacturing method of liquid crystal display panel - Google Patents

Abstract

The present invention discloses a method of manufacturing a liquid crystal display panel which can prevent the adhesion of the polarizing plate and the generation of static electricity generated during the cutting and polishing of the cut surface. In the method for manufacturing a liquid crystal display panel of the present invention, the bonded substrate is cut by a laser, and the cut surface of the cut substrate is curved using a laser.

Description

Manufacturing method of liquid crystal display panel

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the use of lasers for cutting and polishing substrates, and more particularly to a method for manufacturing a liquid crystal display panel using a laser for cutting and polishing a bonded liquid crystal display panel.

Recently, the liquid crystal display (LCD) module, which has been spotlighted as a substitute for a cathode ray tube due to its small size, light weight, and low power consumption, has been injected into the LCD panel. A flat panel display using liquid crystal having an optical shutter property of passing and blocking light by an electrical signal.

Among the active liquid crystal display devices, a thin film transistor (hereinafter, referred to as TFT), which is most widely used, is mainly composed of a color filter substrate attached to face a TFT substrate and a TFT substrate, and a liquid crystal. In the FTF substrate and the color filter substrate, for example, each component is formed on two large glass mother substrates on which about six LCD units can be simultaneously formed.

A glass substrate for a TFT substrate includes a plurality of gate lines, a plurality of data lines formed to perpendicularly intersect the gate lines, thin film transistor elements and pixel electrodes formed at each intersection of the gate lines and the data lines. do.

In addition, the color filter substrate, which is the other glass base substrate, is provided with a color filter layer of red, green, and blue, a black matrix, and a counter electrode. The black matrix serves to prevent the mixing of light between the color filter layers and to prevent the thin film transistor of the TFT substrate from operating in the off state.

After the TFT substrate and the color filter substrate on which such components are formed, the substrate is cut along one cutting line and the other substrate facing along the cutting line after alignment and bonding of the TFT substrate and the color filter substrate before the liquid crystal is injected between the color filter substrate and the TFT substrate. By cutting sequentially into individual LCD unit glass.

1 and 2 are diagrams illustrating a process of cutting a bonded substrate using a diamond scriber and attaching a polarizing plate.

First, referring to FIG. 1, the bonded substrate includes a cutting process (ST2) of cutting a bonded mother substrate using a diamond scriber, a liquid crystal filling process (ST3) of filling a liquid crystal between the bonded substrates, and a liquid crystal. It is fab-outed by completion of the end sealing process (ST4) which seals an injection hole, the process (ST5) of attaching a polarizing plate to the outer surface of the joined both board | substrates, and the grinding | polishing process (ST6) which grinds a cutting surface using a grinder. .

In addition, referring to FIG. 2, the bonded substrate includes a cutting process (ST12) of cutting a bonded mother substrate using a diamond scriber, a liquid crystal filling process (ST13) of filling a liquid crystal between the bonded substrates, Fab out by completing the end sealing step (ST14) for sealing the liquid crystal injection hole, the polishing step (ST15) for polishing the cut surface using the polishing machine, and the step (ST16) for attaching the polarizing plates to the outer surfaces of the bonded substrates. do.

In the above two methods, the polishing steps ST6 and ST15 remove the glass chips remaining at the edges of the cut substrate after the cutting steps ST2 and ST12 and suppress the damage of the printed circuit board attached to the pad. In addition, the remaining cracks are generated to prevent wire breakage and breakage of the panel.

However, according to the method shown in FIG. 1, since the glass chips generated during the cutting process remain at the edges of the panel after the cutting process, defects by the glass chips may occur in the polarizing plate attaching process. Such a polarizing plate adhesion failure involves the implementation of a reworking operation for reattaching the polarizing plate, resulting in an increase in manufacturing cost and a reduction in productivity.

In addition, according to the method of FIG. 2 in which the grinding process is performed prior to the attachment of the polarizing plate, the polarization plate adhesion failure due to the glass chips generated during the cutting process is significantly reduced, but the short bar is removed during the cutting process, so that the friction bar during polishing The static electricity may be caused to cause a defect of the device formed on the panel.

Accordingly, the present invention has been made in view of the above problems, and has one object to prevent the generation of glass chips during cutting of the bonded substrate for liquid crystal display panel using a diamond scriber.

Another object of the present invention is to prevent the generation of static electricity generated while polishing the cut surface of the bonded substrate using a polishing machine.

In order to achieve the above object, in the method of manufacturing a liquid crystal display panel according to an aspect of the present invention, a plurality of wirings parallel to each other are arranged on the inner surface of at least one insulating substrate of the two transmissive insulating substrates, The bonded substrate is cut by irradiating a laser along the cutting line of the panel joined so that the inner surfaces of the two insulating substrates face each other. When the two translucent substrates are glass substrates, the generation of glass chips is significantly reduced by the use of a laser during the cutting process. Next, a liquid crystal is injected into the space between the two transmissive insulating substrates, and the injection hole is sealed. Next, a polarizing plate is attached to at least one outer surface of the outer surfaces of the two transparent insulating substrates. Then, the cut surfaces of the two transparent insulating substrates are polished using a laser. Since the cut surface is polished by the laser, no static electricity is generated during the polishing process.

According to another aspect of the present invention, a method of manufacturing a liquid crystal display panel includes a first transparent insulating substrate having a thin film transistor, wires connected to the thin film transistor, and elements including pixel electrodes formed on an inner surface thereof, and the first transparent insulating substrate. A panel having an inner surface opposite to and having the elements including the color filter layer and the counter electrode bonded together so that the inner surfaces of the second translucent insulating substrate formed on the inner surface of the second translucent insulating substrate face each other is cut using a laser along a cutting line. Next, a liquid crystal is injected into the space between the two transmissive insulating substrates, and the injection hole is sealed. Next, the cut surfaces of the two transparent insulating substrates are polished using a laser. Then, attaching the polarizing plate to the outer surface of the two light-transmissive insulating substrates.

The first light-transmissive insulating substrate used in the above method is connected to the ground terminal, and includes a short bar connecting the wires to each other, and a cutting line parallel to the short bar is formed on both sides of the short bar and a predetermined distance.

Other objects, features and advantages of the present invention will become apparent from the following detailed description with reference to the accompanying drawings.

5 and 6 are flowcharts illustrating a method of manufacturing a liquid crystal display panel according to an exemplary embodiment of the present invention.

First, referring to FIG. 5, a bonded substrate is prepared (ST51). The bonded substrate is composed of a glass mother substrate for a TFT substrate and a glass mother substrate for a color filter having an area corresponding to at least one unit panel area.

A glass substrate for a TFT substrate includes a plurality of gate lines, a plurality of data lines formed to perpendicularly intersect the gate lines, thin film transistor elements and pixel electrodes formed at each intersection of the gate lines and the data lines. do.

One side edge portion of the wiring such as the gate line and the data line is perpendicular to the wiring 12 to prevent generation of static electricity during the cutting process, as shown in FIGS. 3 and 4, and a short connecting the wirings 12 to each other. Bar 14 is provided. Here, the cutting line G1 is positioned in parallel with the short bar 14 at a position spaced apart from the short bar 14 by a predetermined interval.

In addition, the color filter substrate, which is the other glass base substrate, is provided with a color filter layer of red, green, and blue, a black matrix, and a counter electrode. The black matrix serves to prevent the mixing of light between the color filter layers and to prevent the thin film transistor of the TFT substrate from operating in the off state.

Next, the bonded substrate is cut along a cutting line using a laser (ST52). In the cutting process using a laser, cutting of the remaining remaining substrate is performed after cutting of one substrate in the bonded state. Cutting of the selected one side substrate is cut along the inner surface from the outer surface of the substrate.

The cut surface cut by the laser is smooth unlike the cut surface cut using the diamond blade, and there is almost no generation of chip glass after polishing. Therefore, adhesion failure due to the chip glass is minimized during the subsequent process of attaching the polarizing plate to the outer surface of the substrate. In addition, in the case of the TFT substrate, since chip glass hardly occurs at the edge of the cut surface of the inner surface even after cutting, the chip glass pressurizes the wiring during the TCP bonding process, so that a defect such as disconnection of the wiring can be prevented. The starting edge of the outer surface where the cutting starts is the part where stress is concentrated and can be easily broken even by a slight impact. Since the stress concentration is removed by applying the laser cutting method, the impact resistance is improved, and the edge is broken. Is prevented.

Liquid crystal is filled between the cut TFT substrate and the color filter substrate (ST53). Thereafter, the liquid crystal injection hole is sealed by the end seal step ST54.

Then, a polarizing plate is attached to the outer surfaces of the TFT substrate and the color substrate (ST55).

After attachment of the polarizing plate, the cut surface edges of the outer surface of the substrate are polished with a laser (ST56). Here, the generation of static electricity during the polishing process by polishing with a laser is prevented, and as a result, the thin film transistor element formed on the inner surface of the TFT substrate is prevented from becoming defective by static electricity.

The laser polished panel is fab-outed for subsequent assembly process.

In the above embodiment, the polarizing plate attaching process is performed on both outer surfaces of the bonded substrate in the projection type liquid crystal display, but is formed only on one side in the reflective type.

On the other hand, in the above embodiment, the laser polishing step ST56 was performed after the advancing of the polarizing plate attaching step ST55, but the order of these steps may be changed.

That is, as shown in Fig. 6, the laser cutting process (ST62) for cutting the bonded substrate along the cutting line, the liquid crystal filling process (ST63) for filling the liquid crystal between the bonded substrates, and the end seal for sealing the liquid crystal injection hole The process ST64, the laser polishing process ST65 for polishing the edges of the cut surface with a laser, and the process of attaching the polarizing plates to the outer surfaces of both polished substrates may be performed.

FIG. 7 is a cross-sectional view showing the cut surface 72 and the polishing surface 74 of the substrate 70 cut according to the method of the present invention, showing that the polishing surface 74 is rounded.

On the other hand, in the above two embodiments, both the cutting process using a laser and the polishing process using a laser are shown and described. However, during the cutting process using a laser, the focusing beam contacting the cutting surface has a long axis parallel to the cutting line. It is also possible to omit the grinding | polishing process by making elliptical structure which a short axis orthogonally crosses a cutting line. That is, the use of an elliptical focusing beam rounds the outer edge of the cutting surface from which the cutting is started, thus eliminating the need for a separate polishing process for rounding the outer edge.

As described above, the present invention substantially prevents the generation of glass chips at the cut surface by performing the cutting process of the bonded substrate for manufacturing the liquid crystal display panel using a laser. As a result, the adhesion failure of the polarizing plate on the outer surface of the substrate due to the chip glass remaining after the cutting process and the disconnection failure of the wiring during the tape carrier package bonding on the inner surface of the substrate are prevented. In addition, by polishing the edges of the cut surface with a laser, generation of static electricity during the polishing process is prevented, thereby preventing defects of the thin film transistor due to static electricity.

Although specific embodiments of the present invention have been described and illustrated, modifications and variations will be apparent to those of ordinary skill in the art. Accordingly, the following claims are intended to embrace all such alterations and modifications without departing from the spirit and scope of the invention.

1 and 2 is a process chart showing a manufacturing process of the liquid crystal display panel according to the prior art.

3 is a partial plan view of a mother glass substrate for a thin film transistor substrate.

4 is a detail view of portion “A” of FIG. 3.

5 is a process chart showing a manufacturing process of the liquid crystal display panel according to an embodiment of the present invention.

6 is a process chart showing a manufacturing process of the liquid crystal display panel according to another embodiment of the present invention.

7 is a partial cross-sectional view of a substrate cut and polished according to the method of the present invention.

Claims (1)

Elements including a first light-transmitting insulating substrate having a thin film transistor, elements including a wiring connected to the thin film transistor and a pixel electrode, and a short bar connecting the wirings to each other, and a color filter layer and an opposite electrode are formed on the inner surface. Cutting the panels joined together so that the formed second light-transmissive insulating substrates face each other using a laser along cut lines positioned parallel to each other at a predetermined distance from the short bar; Injecting liquid crystal into a space between the first and second translucent insulating substrates and sealing an injection hole; Rounding edges of the cut surfaces of the first and second translucent insulating substrates using a laser; And And attaching polarizing plates to outer surfaces of the first and second transmissive insulating substrates.