KR20120045307A - Temperature detecting system and temperature control method for single crystal growing - Google Patents

Abstract

PURPOSE: A single crystal growth temperature measurement system and a single crystal growth temperature control method are provided to improve accuracy of melt temperature control by precisely determining a melt state. CONSTITUTION: A first temperature measurement apparatus(210) measures temperature of a melt inside of a single crystal growth chamber by being arranged on the upper side of the single crystal growth chamber. A second temperature measurement apparatus(220) measures the temperature of the melt by being arranged on a side surface of the single crystal growth chamber. The first temperature measurement apparatus and the second temperature measurement apparatus comprise an infrared radiation thermometer.

Description

TEMPERATURE DETECTING SYSTEM AND TEMPERATURE CONTROL METHOD FOR SINGLE CRYSTAL GROWTH

The embodiment relates to a single crystal growth temperature measuring system and a single crystal growth temperature control method.

In order to manufacture a semiconductor, a wafer must be manufactured, and in order to manufacture a wafer, single crystal silicon must be grown in the form of an ingot, and for this, the Czochralski (CZ) method may be applied.

Silicon single crystal growth for semiconductor devices proceeds to grow silicon single crystal under the seed by slowly dipping the seed into the silicon melt and slowly pulling the seed above the melt while forming a necking. .

According to the prior art, when dipping the seed into the silicon melt, a good dip process state is formed in order to minimize thermal shock of the seed to contact the silicon melt interface and to form stable thermal conditions in the necking process.

Good Dip is the temperature of the melt that is appropriate for the necking process. If the temperature of the melt is high or low, it is more likely to cause loss in the subsequent process. It is important. As such, the melt temperature is an important factor that determines the quality of the ingot and requires precise and precise control.

According to the prior art, the silicon melt temperature is measured using a two color pyrometer. The two-color pyrometer is located at the top of the chamber of the single crystal growth apparatus and measures only the temperature for one point. These measured values are transmitted to the controller as analogue values and control the melt temperature.

In addition, the temperature measurement value is used as a criterion for determining whether the operator is a good dip manually.

By the way, according to the prior art, the temperature distribution of the melt surface appears very different depending on the position. However, a two-color pyrometer measuring only one point measures different melt points at the top of the chamber. As a result, there is a problem that the melt surface measurement temperature is inaccurate and inter-device errors occur.

In addition, according to the related art, the operator controls the melt temperature by manually determining whether or not it is a good dip based on a value measured by a two-color pyrometer. This is a problem of poor process efficiency and repeatability due to differences in experience and skill among workers. Accordingly, according to the prior art, there is a possibility that a difference between workers may occur, and because the worker cannot observe in real time, there is a problem that the work efficiency may also decrease.

Embodiments provide a single crystal growth temperature measurement system and a single crystal growth temperature control method capable of improving the accuracy of melt temperature control.

In addition, the embodiment is to provide a single crystal growth temperature measurement system and a single crystal growth temperature control method that can be carried out in the automatic process to control the temperature manually (Manual) in determining the Good Dip (Good Dip) .

A single crystal growth temperature measuring system according to an embodiment includes a first temperature measuring device provided above the single crystal growth chamber to measure a temperature of a melt in the single crystal growth chamber; And a second temperature measuring device provided at a side of the single crystal growth chamber to measure a temperature of the melt.

In addition, the single crystal growth temperature control method according to the embodiment includes a first temperature measuring device provided above the single crystal growth chamber, and a second temperature measuring device provided on the side of the single crystal growth chamber, wherein the first and second temperatures The temperature of the melt in the single crystal growth chamber may be measured by a measuring device to control the temperature of the single crystal growth chamber.

According to the single crystal growth temperature measuring system and the single crystal growth temperature control method according to the embodiment, a two-color pyrometer is additionally installed to accurately determine the melt state through the Q value using the ratio of the two measured values. By judging, the accuracy of melt temperature control can be improved.

In addition, according to the embodiment, the operator can control the temperature so that the good dip automatically becomes a good dip by using an automatic temperature measuring system to adjust the temperature to be in a good dip state manually. Accordingly, it is possible to avoid manual process progress depending on the experience of each worker, and to establish an automatic system through equipment to clarify the criterion of the single crystal growth process and to expect a certain level of working time.

1 is an exemplary single crystal growth apparatus to which a single crystal growth temperature measuring system according to an embodiment is applied.
2 is an exemplary configuration diagram of a single crystal growth temperature measuring system according to an embodiment.
3 is an exemplary flowchart of a single crystal growth temperature control method according to an embodiment.

In the description of the embodiments, each wafer, apparatus, chuck, member, sub-region, or surface is referred to as being "on" or "under" Quot ;, " on "and" under "include both being formed" directly "or" indirectly " In addition, the criteria for “up” or “down” of each component will be described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

(Example)

1 is an exemplary single crystal growth apparatus to which a single crystal growth temperature measuring system according to an embodiment is applied.

The silicon single crystal growth apparatus 100 according to the embodiment may include a chamber 110, a crucible 120, a heater 130, a pulling means 150, and the like.

For example, the single crystal growth apparatus 100 according to the embodiment is provided in the chamber 110, the inside of the chamber 110, the crucible 120 containing the silicon melt, and the inside of the chamber 110. It is provided in, and may include a pulling means 150 coupled to the heater 130 and the seed crystal 152 to heat the crucible 120.

The chamber 110 provides a space in which predetermined processes are performed to grow a single crystal ingot for a silicon wafer used as an electronic component material such as a semiconductor.

The radiant heat insulator 140 may be installed on the inner wall of the chamber 110 to prevent heat of the heater 130 from being discharged to the side wall of the chamber 110.

A side surface of the chamber 110 may be provided with a view port 115.

The embodiment may adjust various factors such as pressure conditions inside the rotation of the quartz crucible 120 to control the oxygen concentration during silicon single crystal growth. For example, in order to control the oxygen concentration, an argon gas or the like may be injected into the chamber 110 of the silicon single crystal growth apparatus and discharged downward.

The crucible 120 is provided inside the chamber 110 to contain the silicon melt SM and may be made of quartz. A crucible support 125 made of graphite may be provided outside the crucible 120 to support the crucible 120. The crucible support 125 is fixedly installed on the rotation shaft 127, which is rotated by a driving means (not shown) so that the solid-liquid interface has the same height while rotating and elevating the crucible 120. It can be maintained.

The heater 130 may be provided inside the chamber 110 to heat the crucible 120. For example, the heater 130 may have a cylindrical shape surrounding the crucible support 125. The heater 130 melts a high-purity polycrystalline silicon mass loaded in the crucible 120 into a silicon melt SM.

Embodiments provide a single crystal growth temperature measurement system and a single crystal growth temperature control method capable of improving the accuracy of melt temperature control.

In addition, the embodiment is to provide a single crystal growth temperature measurement system and a single crystal growth temperature control method that can be carried out in the automatic process to control the temperature manually (Manual) in determining the Good Dip (Good Dip) .

2 is an exemplary configuration of a single crystal growth temperature measuring system according to an embodiment.

The single crystal growth temperature measuring system 200 according to the embodiment is provided above the single crystal growth chamber 110 to measure the temperature of the melt (SM) in the single crystal growth chamber 110 and 210 A second temperature measuring device 220 may be provided at the side of the single crystal growth chamber 110 to measure the temperature of the melt SM.

The first and second temperature measuring devices 210 and 220 may include an infrared radiation thermometer, but are not limited thereto.

The second temperature measuring device 220 may measure the surface temperature of the melt through the view port 115 of the chamber 110.

In addition, the second temperature measuring device 220 may adjust the temperature measurement position so that the melt surface temperature measurement position becomes a point right next to the meniscus.

According to the exemplary embodiment, two pieces of temperature data are received from the first temperature measuring device 210 and the second temperature measuring device 220. Subsequently, two data are substituted into Equation 1 below to obtain a specific value Q.

S1 is a temperature measurement value of the first temperature measuring device 210, S2 is a temperature measurement value of the second temperature measuring device 220, A and B are constants determined when measuring the temperature. A is the temperature of the melt (melt) in the ADC (automatic diameter controller) is about 2000 ℃ ± 200 ℃, B value is the temperature value of the heater (heater) measured in the ATC (automatic temperature controller).

In an embodiment, Equation 1 may determine a current melt state and determine whether a good dip is performed using a ratio of values measured by the first and second temperature measuring devices 210 and 220. have.

Since the silicon melt is convection, the surface temperature is continuously changed and the temperature is very different from location to location. However, if the value is obtained from the ratio of the measured values at the two points of the melt, it is less volatile due to the change of the melt than the measured value of one, and the state of the melt can be more accurately understood.

In the embodiment, when the melt (Melt) changes, the two measured values S1 and S2 are also changed in a similar ratio, so that the Q value is always maintained at a specific value according to the melt state.

Therefore, it is possible to find the Q value when the melt state is stable and maintain the good dip state, and necking is performed at each value in each run.

According to the embodiment, when the Q value of the test and data collection is about 1,300 to about 2,000, a good dip state is formed, and when the necking process is started, a single crystal is formed into a full structure when the necking process is started. Grew. Meanwhile, the Q value may vary depending on the hot zone, the product, and the equipment.

According to the single crystal growth temperature measuring system and the single crystal growth temperature control method according to the embodiment, a two-color pyrometer is additionally installed to accurately determine the melt state through the Q value using the ratio of the two measured values. By judging, the accuracy of melt temperature control can be improved.

In addition, according to the embodiment, the operator can control the temperature so that the good dip automatically becomes a good dip by using an automatic temperature measuring system to adjust the temperature to be in a good dip state manually. Accordingly, it is possible to avoid manual process progress depending on the experience of each worker, and to establish an automatic system through equipment to clarify the criterion of the single crystal growth process and to expect a certain level of working time.

3 is a flowchart illustrating a method of controlling single crystal growth temperature according to an embodiment.

A single crystal growth temperature control method according to an embodiment will be described with reference to FIG. 3.

First, a dipping step of contacting the seed 152 to the melt (SM) interface is performed.

Then, the temperature of the melt (SM) (SM) that is dipping from the first and second temperature measuring devices (210, 220) is measured to control the temperature of the single crystal growth chamber in the controller 230 (S110) Proceed.

Thereafter, the temperature of the melt in the single crystal growth chamber is measured from the first and second temperature measuring apparatuses 210 and 220, and the Q value is measured by Equation 1 (S120).

Next, it is determined whether the Q value is in the range of 1300 to 2000 (S130), and if there is a Q value in the corresponding range, it is determined whether the Q value is maintained in the range of 1300 to 2000 for 10 minutes or more (S140). If the condition of time is satisfied, the necking process is started (S160). The condition of the holding time is that the final good dip state can be determined only when the stabilization state of the melt is maintained at least 10 or more.

On the other hand, if the condition of the Q value or the holding time is not satisfied (if not Good Dip), the heater system is controlled (S150) to raise or lower the temperature of the melt while the first and second temperature measuring devices 210, The temperature data is collected from 220 to determine whether the condition is satisfied.

According to the single crystal growth temperature measuring system and the single crystal growth temperature control method according to the embodiment, a two-color pyrometer is additionally installed to accurately determine the melt state through the Q value using the ratio of the two measured values. By judging, the accuracy of melt temperature control can be improved.

In addition, according to the embodiment, the operator can control the temperature so that the good dip automatically becomes a good dip by using an automatic temperature measuring system to adjust the temperature to be in a good dip state manually. Accordingly, it is possible to avoid manual process progress depending on the experience of each worker, and to establish an automatic system through equipment to clarify the criterion of the single crystal growth process and to expect a certain level of working time.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiment can be modified. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (8)

A first temperature measuring device provided above the single crystal growth chamber to measure a temperature of a melt in the single crystal growth chamber; And
And a second temperature measuring device provided at a side of the single crystal growth chamber to measure the temperature of the melt. The method according to claim 1,
The first and second temperature measuring devices include a single crystal growth temperature measuring system including an infrared radiation thermometer. The method according to claim 1,
Controlling the temperature of the single crystal growth chamber by measuring the temperature of the melt in the single crystal growth chamber from the first and second temperature measuring devices;
Single crystal growth temperature measuring system for measuring the Q value by the equation (1).
Equation 1: Q = B / [A + ln (S1-S2)-ln (S1 / S2)], wherein S1 is a temperature measurement value of the first temperature measuring device, and S2 is a value of the second temperature measuring device. Temperature readings, A and B: Constants determined when measuring temperature The method of claim 3,
And wherein the Q value is in the range of 1300 to 2000, controlling to start the necking process. A first temperature measuring device provided above the single crystal growth chamber and a second temperature measuring device provided on the side of the single crystal growth chamber,
The single crystal growth temperature control method for controlling the temperature of the single crystal growth chamber by measuring the temperature of the melt in the single crystal growth chamber from the first and second temperature measuring devices. The method of claim 5,
Controlling the temperature of the single crystal growth chamber by measuring the temperature of the melt in the single crystal growth chamber from the first and second temperature measuring apparatus, the single crystal growth temperature control method comprising the step of measuring the Q value by Equation 1 .
Equation 1: Q = B / [A + ln (S1-S2)-ln (S1 / S2)], wherein S1 is a temperature measurement value of the first temperature measuring device, and S2 is a value of the second temperature measuring device. Temperature readings, A and B: Constants determined when measuring temperature The method of claim 6,
And the necking process is started when the Q value is in the range of 1300 to 2000. The method of claim 7, wherein
And the necking process is started when the Q value is maintained in the range of 1300 to 2000 for at least 10 minutes.

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