KR20120043867A - Semiconductor package and method of manufacturing the same - Google Patents

Abstract

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce wire manufacturing or purchasing costs by electrically connecting a semiconductor chip and a lead using lead fingers without using a wire. CONSTITUTION: A lead frame(130) comprises a die paddle(120) and leads(110). A semiconductor chip(140) is mounted on the die paddle. Lead fingers(150) is extended from the lead frame. The lead fingers electrically connect the semiconductor chip and the leads. A molding part(170) molds the semiconductor chip and the lead fingers.

Description

Semiconductor package and manufacturing method therefor {SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a semiconductor package and a method for manufacturing the same, and more particularly, to a semiconductor package and a method for manufacturing the same that can be implemented without a wire to connect the semiconductor chip and the lead.

Recently, with the growth of mobile electronic devices such as mobile phones and tablet PCs, the demand for semiconductor packages having small size and high performance is increasing. Accordingly, the development direction of the semiconductor package is from the conventional dual in line package (DIP) type insert-mount type to surface mount type quad flat non-lead (QFN), thin small out-line package (TSOP), and thin quad (TQFP). Flat Package) and BGA (Ball Grid Array) are being converted.

In particular, the semiconductor package having a QFN shape has an advantage that the lead for electrically connecting with the outside does not protrude from the bottom of the mold to the outside, thereby reducing the size and weight. In general, a semiconductor package having a QFN shape includes a die paddle for mounting a semiconductor die, a lead spaced apart from the die paddle and electrically connected to the outside, and a semiconductor chip mounted on the die paddle and electrically connected to the lead. And electrically connected between the semiconductor chip and the lead by a conductive wire.

The conductive wire may use any one of gold (Au), aluminum (Al), and copper (Cu) or an alloy thereof, and is preferably formed of gold (Au). This is because gold has higher ductility and electrical conductivity than other metals, so that a thin wire can be formed.

However, the conventional semiconductor package having a conductive wire, there is a problem to prepare or purchase a wire made of expensive materials in advance before the packaging process, as described above, the connection of the wire in the wire connection process and subsequent steps Since defects may occur, there is a problem of lowering the yield of the semiconductor package.

Accordingly, the technical problem of the present invention was conceived in this respect, and an object of the present invention is to provide a semiconductor package capable of realizing a semiconductor package without using wires to connect a semiconductor chip and a lead.

Another object of the present invention is to provide a method of manufacturing the semiconductor package.

A semiconductor package according to an embodiment for realizing the above object of the present invention includes a lead frame, a semiconductor chip, lead fingers and a molding part. The lead frame includes a die paddle and leads, one end of which is spaced apart from the die paddle and exposed to the outside. The semiconductor chip is mounted on the die paddle. The lead fingers extend the lead frame to electrically connect the semiconductor chip and the leads. The molding part molds the semiconductor chip and the lead fingers.

In one embodiment of the present invention, the semiconductor chip may further include a conductive material positioned between the lead fingers.

In one embodiment of the present invention, the lead fingers may have a structure bent to contact the conductive material bonded on the semiconductor chip.

In a method of manufacturing a semiconductor package according to another exemplary embodiment for realizing the object of the present invention, a die paddle and a lead frame including lead pads spaced apart from the die paddle and exposed to the outside are formed. The semiconductor chip is mounted on the die paddle. The lead frame extends to form lead fingers that electrically connect the semiconductor chip and the leads. The semiconductor chip and the lead fingers are molded.

In an embodiment of the present invention, a conductive material may be bonded onto the semiconductor chip.

In example embodiments, the forming of the lead fingers may be performed to bend the lead fingers to contact the conductive material bonded on the semiconductor chip.

According to such a semiconductor package and a method of manufacturing the same, since leadfingers having an extended lead frame are used to electrically connect the semiconductor chip and the lead, it is possible to reduce the cost of wire fabrication or purchase.

In addition, since defects caused by wires are eliminated, productivity of the semiconductor package can be increased.

1 is a cross-sectional view illustrating a semiconductor package according to an embodiment of the present invention.
2A, 2B, 2C, 2D, 2E, and 2F are cross-sectional views illustrating a method of manufacturing the semiconductor package shown in FIG. 1.

As the inventive concept allows for various changes and numerous modifications, the embodiments will be described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprise" or "consist of" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the existence or the possibility of addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, with reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention.

1 is a cross-sectional view illustrating a semiconductor package according to an embodiment of the present invention.

Referring to FIG. 1, a semiconductor package 100 according to an embodiment of the present invention includes a lead frame 130, a semiconductor chip 140, lead fingers 150, and a molding unit 170. The semiconductor package 100 illustrated in FIG. 1 illustrates a quad flat non-lead (QFN) type semiconductor package in which a lead is formed under a mold, but is not limited thereto.

The lead frame 130 includes a die paddle 120 and leads 110 that are spaced apart from the die paddle 120 and have one end exposed to the outside. The lead frame 130 has a die paddle 120 and leads 110 spaced apart from the die paddle 120 in a first direction D1 and exposed at one end thereof. Although not shown, they are spaced apart from each other in the third direction D3. The lead frame 130 constitutes a semiconductor package together with the semiconductor chip 140. The lead frame 130 supports the semiconductor chip 140 and electrically connects the semiconductor chip 140 and an external circuit (eg, a PCB). Function to connect. The lead frame 130 may be formed of a common copper or nickel alloy.

The semiconductor chip 140 is mounted on the die paddle 120 of the lead frame 130. Specifically, the semiconductor chip 140 has an activation surface on which a circuit pattern is formed and an inactivation surface opposite to the activation surface, and the inactivation surface faces the die paddle 120 and is mounted on the die paddle 120. do. For example, the semiconductor chip 140 may be attached to the die paddle 120 through an adhesive member (not shown), and the adhesive member may include an epoxy material having an electrically insulating property. It may be an adhesive tape or an adhesive tape including a polyimide material.

The lead fingers 150 extend the lead frame 130 to electrically connect the semiconductor chip 140 and the leads 110. The lead fingers 150 are formed by extending a portion of the lead frame 130 to correspond to the leads 110 arranged side by side along the outer circumference of the semiconductor chip 140. Located between 110 and the semiconductor chip 140 to provide wiring of the electrical signal.

Preferably, the lead fingers 150 may have a structure bent to contact the conductive material 160 bonded on the semiconductor chip 140. In addition, a conductive material 160 may be positioned between the semiconductor chip 140 and the lead fingers 150. In detail, the conductive material 160 is disposed on the upper surface of the semiconductor chip 140 and extends in the second direction D2 from the leads 110 of the lead frame 130. 150 is bent in the first direction D1 and bonded to the conductive material 160 disposed on the upper surface of the semiconductor chip 140.

In the related art, a wire formed of gold (Au) material or the like electrically connects the semiconductor chip 140 and the leads 110, but the semiconductor package 100 of the present invention does not use the wire and the lead frame. Since the 130 uses the lead fingers 150 extended, it is possible to reduce the cost of manufacturing or purchasing the wire. In addition, since the defect caused by the wire is eliminated, it is possible to increase the productivity of the semiconductor package.

The molding part 170 molds the semiconductor chip 140 and the lead fingers 150 to prevent internal damage from an external environment. For example, the molding unit 170 may include a molding resin. For example, the molding resin may be an epoxy molding compound (EMC).

2A, 2B, 2C, 2D, 2E, and 2F are cross-sectional views illustrating a method of manufacturing the semiconductor package 100 shown in FIG. 1.

Referring to FIG. 2A, the lead frame 130 including the die paddle 120 and the leads 110 spaced apart from the die paddle 120 is exposed to the outside. First, an selective exposure process and development process are performed on a substrate for forming the lead frame 130 to form an etch mask pattern (not shown) having a predetermined pattern. Next, the die paddle 120 and the leads 110 are formed by etching the substrate using the etch mask pattern as an etch stop layer. The formation of the lead frame 130 may be formed by pressing, stamping or etching as known to those skilled in the art.

Referring to FIG. 2B, the semiconductor chip 140 is mounted on the die paddle 120. Specifically, the semiconductor chip 140 is mounted on the die paddle 120 such that the lower surface of the semiconductor chip 140 and the upper surface of the die paddle 120 face each other. For example, the semiconductor chip 140 may be attached to the die paddle 120 through an epoxy adhesive tape or a polyimide adhesive tape.

Referring to FIG. 2C, a conductive material 160 may be bonded onto the semiconductor chip 140. In this case, the conductive material 160 may be bonded to the edge of the semiconductor chip 140 in consideration of the bonding position of the lead fingers 150.

Referring to FIG. 2D, the lead frame 130 extends to form lead fingers 150 that electrically connect the semiconductor chip 140 and the leads 110. Specifically, the lead fingers 150 are formed by extending a portion of the lead frame 130 corresponding to the leads 110 arranged side by side along the outer periphery of the semiconductor chip 140, Located between the leads 110 and the semiconductor chip 140 to provide an electrical signal wiring.

Referring to FIG. 2E, forming the lead fingers 150 may bend the lead fingers 150 to be in contact with the conductive material 160 bonded on the semiconductor chip 140. In detail, the conductive material 160 is disposed on the upper surface of the semiconductor chip 140 and extends in the second direction D2 from the leads 110 of the lead frame 130. 150 is bent in the first direction D1 and bonded to the conductive material 160 disposed on the upper surface of the semiconductor chip 140.

Referring to FIG. 2F, the semiconductor package 100 is formed by molding the side and top portions of the semiconductor chip 140 and the lead fingers 150. Side portions of the leads 110 may also be molded in the molding process.

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

Since the semiconductor package and the method of manufacturing the same according to the present invention use leadfingers having extended lead frames instead of wires to electrically connect the semiconductor chip and the lead, it is possible to reduce the cost of wire fabrication or purchase.

In addition, since defects caused by wires are eliminated, productivity of the semiconductor package can be increased.

100: semiconductor package 110: leads
120: die paddle 130: lead frame
140: semiconductor chip 150: lead fingers
160: conductive material 170: molding part

Claims (6)

A lead frame comprising a die paddle and leads spaced apart from the die paddle and exposed at one end to the outside
A semiconductor chip mounted on the die paddle
Lead fingers extending from the lead frame to electrically connect the semiconductor chip and the leads;
And a molding part molding the semiconductor chip and the lead fingers. The semiconductor package of claim 1, further comprising a conductive material positioned between the semiconductor chip and the lead fingers. The semiconductor package of claim 2, wherein the lead fingers are bent to contact the conductive material bonded on the semiconductor chip. Forming a lead frame including a die paddle and leads spaced apart from the die paddle, the ends being exposed to the outside
Mounting a semiconductor chip on the die paddle
Extending the lead frame to form lead fingers electrically connecting the semiconductor chip and the leads;
Molding the semiconductor chip and the lead fingers. The method of claim 4, further comprising bonding a conductive material onto the semiconductor chip. The method of claim 5, wherein forming the lead fingers,
Bending the lead fingers into contact with the conductive material bonded on the semiconductor chip.

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