KR20120028750A - Printed circuit board and method of mounting electronic components - Google Patents

Abstract

PURPOSE: A printed circuit board and a method for mounting an electronic component are provided to minimize the thickness of the printed circuit board by inserting the electronic component into an insertion hole of a substrate. CONSTITUTION: An insertion hole(342) is formed on a substrate body(341) for inserting an electronic component(310). The remaining pattern is removed except a specific part corresponding to a terminal location of the electronic component. The electronic component is inserted into the insertion hole. A contact with the terminal is coated with conductive adhesive. The electronic component is adhered to the substrate body.

Description

Printed circuit board and electronic component mounting method {PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING ELECTRONIC COMPONENTS}

The present invention relates to a printed circuit board and an electronic component mounting method in which an electronic component is inserted into a long hole.

Recently, portable devices such as mobile phones and IT-related devices are becoming smaller. Accordingly, manufacturers are trying to reduce not only the overall size of portable devices, but also thickness and weight.

As part of this effort, manufacturers are investing heavily in the development of thinner electronic components. However, as the size of the electronic component is smaller, the precision of the electronic component must be higher, which results in a negative effect of increasing manufacturing costs.

However, according to the general method in which various electronic components are surface-mounted on the surface of a printed circuit board, there is no choice but to continuously develop electronic components with precision and thickness.

Therefore, there may be a need for a technique for mounting electronic components and the like on a printed circuit board in a simple and easy and safe manner. In particular, in the case of a mobile phone or various electronic cards, a thinner and more convenient product should be developed, and the thickness should be adjusted in accordance with a predetermined international standard. Therefore, reducing the size of an electronic component may have limitations in terms of cost. have. .

Accordingly, there is a need for a method of mounting an electronic component, which may have a uniform surface and a smaller overall thickness even after mounting the electronic component on a printed circuit board.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board and an electronic component mounting method for minimizing the thickness of the printed circuit board by inserting the electronic component into the insertion hole of the substrate body.

The present invention to achieve the above object is an electronic component for performing the function; And a substrate main body having an insertion hole into which the electronic component is inserted.

In order to achieve the above object, the present invention comprises the steps of forming an insertion hole for inserting the electronic component in the substrate body; Removing a pattern of the remaining portions except for a specific portion that matches the terminal position of the electronic component in the insertion hole; Inserting the electronic component into the insertion hole; Applying a conductive adhesive to a portion where the terminal portion of the insertion hole contacts the terminal of the electronic component; And melting or curing the conductive adhesive to adhere the electronic component to the substrate main body.

According to an embodiment of the present invention, the electronic component is inserted into the insertion hole of the printed circuit board, thereby minimizing the thickness of the printed circuit board.

In addition, according to an embodiment of the present invention, it is possible to reduce the overall thickness of the product to which the printed circuit board is inserted, such as a mobile phone, a portable device or a wall-mounted TV.

On the other hand, according to one embodiment of the present invention, as the thickness of the printed circuit board is minimized, it is possible to flexibly adjust the space occupied by other components existing in the relatively general IT product, the utilization value can be increased.

1 is a diagram showing the configuration of an RF card according to a first embodiment of the present invention.
2 is a view showing the configuration of an inlay sheet according to a first embodiment of the present invention.
3 is a view for explaining a light guide plate according to the first embodiment of the present invention.
4 is a diagram illustrating an antenna associated with a first embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing an inlay sheet according to a first embodiment of the present invention.
FIG. 6 is a diagram for explaining some steps of FIG. 5.
7 is a view for explaining the final thickness of the inlay sheet according to the first embodiment of the present invention.
8 is a view for explaining a printed circuit board according to a second embodiment of the present invention.
9 is a flowchart illustrating a method for mounting an electronic component in accordance with a second embodiment of the present invention.
10 is a flowchart illustrating a method of mounting an electronic component on a printed circuit board having a plurality of layers according to a second embodiment of the present invention.
11A and 11B are views for explaining a final thickness of a printed circuit board according to an embodiment of the present invention.

The terms used in this specification will be briefly described and the present invention will be described in detail.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. In addition, in certain cases, there is also a term arbitrarily selected by the applicant, in which case the meaning will be described in detail in the description of the invention. Therefore, the terms used in the present invention should be defined based on the meanings of the terms and the contents throughout the present invention, rather than the names of the simple terms.

Throughout the specification, the light emitting inlay sheet may be used for an IT product including a credit card, a mobile communication terminal, and the like. Hereinafter, the light emitting inlay sheet used in the RF card as the first embodiment of the present invention will be described as an example.

Throughout the specification, a radio frequency (RF) card refers to a contactless card using a radio frequency in which a radio frequency (RF) chip is embedded. The RF card can communicate data with a terminal (reader) using radio waves without touching the reader. Therefore, if you bring the RF card closer to the reader, the reader will automatically read the information on the card. RF card can be used as a means of transportation, security system, payment.

The RF card may be implemented in the form of a smart card or IC card. An IC card (smart card) means a card in which an integrated circuit (IC) is inserted. The IC card, which contains a microprocessor and IC memory, can have various intelligent functions such as arithmetic in addition to memory functions. The IC card has a larger storage capacity (8 to 32 kB) than the magnetic card and can have a single processing function.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Hereinafter, as a first embodiment of the present invention, a light emitting inlay sheet used in an RF card and a manufacturing method thereof will be described.

1 is a view showing the configuration of an RF card according to an embodiment of the present invention.

As shown in FIG. 1, according to an embodiment of the present invention, the RF card may include an upper and lower protective film 100, an upper and lower print layer 200, and a light emitting inlay sheet 300.

The upper and lower protective film 100 is to protect the RF card, and may be omitted according to an embodiment of the present invention.

The upper print layer 200 is a layer on which an upper image of the RF card is printed, and a card type, a card name, a card number, a card holder's name, an expiration date, and the like may be printed. The lower print layer 200 is a layer on which a back image of a card is printed, and a card brand name, a usage inquiry telephone number, and the like may be printed.

According to the exemplary embodiment of the present invention, the light emitting inlay sheet 300 refers to a sheet in which electronic components including light emitting devices are inlayed. In-Lay may mean that a specific element or a specific part is embedded or engraved in the sheet.

Hereinafter, a configuration of the light emitting inlay sheet 300 will be described in detail with reference to FIG. 2.

2 is a view showing the configuration of a light emitting inlay sheet according to an embodiment of the present invention.

According to an embodiment of the present invention, the light emitting inlay sheet 300 may include a base sheet, an electronic component 310 including a light emitting device, a support 320, a waveguide or a light guide plate 330, and a printed circuit board (PCB). Circuit Board 340, may include an antenna.

According to one embodiment of the present invention, the base sheet may mean that the laminated sheet is disposed on the upper and lower surfaces of the light guide plate or the waveguide 330.

The laminated sheet may be polyvinyl chloride (PVC), PET (polyethylene terephthalate: polyethylene terephthalate), PE (polyethylene: polyethylene), PC (polycarbonate), or the like. Hereinafter, PVC will be described as an example of the laminated sheet.

According to an embodiment of the present invention, a base hole may be formed in the base sheet. The base hole is for inserting the printed circuit board 340.

According to an embodiment of the present invention, the electronic component 310 may include a light emitting device. The light emitting device refers to a device for converting electricity into light. For example, there may be a light emitting diode (LED), a semiconductor laser, an organic electroluminescence (EL), an inorganic electroluminescence (EL), or the like.

According to an embodiment of the present invention, the electronic component 310 may include a diode, a capacitor, a resistor, an IC chip, an RF chip, etc. in addition to the light emitting device. The diode may convert an AC waveform coming through the antenna into a direct current. The capacitors may uniformly discharge current to stabilize the performance of the light emitting inlay sheet 300. The resistance may adjust the amount of current or the voltage according to the purpose of using the electronic component 310.

The IC chip may control the light emitting device, and the IC chip may store information for financial settlement. In addition, the RF chip allows RF card information to be read in a contactless manner in the terminal (reader).

According to an embodiment of the present invention, the support 320 is for protecting the electronic component 310 including the light emitting device from external pressure. Therefore, the height (thickness) of the support 320 should be equal to or greater than the height (thickness) of the electronic component 310. In addition, the support 320 may be located near the electronic component 310.

 On the other hand, the support 320 may be made of a high strength material. For example, the high-strength material may include brass, phosphor bronze, stainless steel (SUS, sus), nickel plated steel, and the like.

According to an embodiment of the present invention, when the support 320 is inserted into the printed circuit board 340, when the card is inserted into an apparatus for transferring the card while pressing the card with the upper and lower rollers, such as an ATM device, The direct force applied to the electronic component 310 is distributed to prevent breakage of the weak electronic component 310 from external physical shock.

According to one embodiment of the present invention, the waveguide or light guide plate (BLU) 330 is for dispersing light coming into the side to the outside.

The light guide plate 330 may make a small flaw on one surface of a transparent material such as polycarbonate acrylic, and may deflect and scatter the light of the light emitting device 310 coming from the side to the other surface. In addition, the waveguide 330 may print a fluorescent ink on one surface of the waveguide 330 to refract and scatter light from the light emitting device 310 to the other surface.

As an example of the waveguide or the light guide plate 330, an optical fiber exists. The optical fiber will be described later with reference to FIG. 3.

According to one embodiment of the present invention, PVC may be located on the upper side and the lower side of the light guide plate 330. In addition, the light guide plate 330 may be disposed on one side of the light emitting device. Therefore, the light guide plate 330 is not disposed vertically with the printed circuit board 340, but is disposed horizontally with the printed circuit board 340. Even if the thickness is thicker, the overall thickness of the light emitting inlay sheet 300 may not be increased.

For example, when the thickness of the printed circuit board 340 is a and the thickness of the light guide plate 330 is b, when the printed circuit board 340 and the light guide plate 330 are vertically arranged, the entire light emitting inlay sheet 300 is formed. ) Is a + b, but when arranged horizontally, a larger value of a or b may be the thickness of the entire light emitting inlay sheet 300, and thus, when arranged horizontally, the thickness of the light guide plate 330 Even if the thickness b is increased, the thickness of the entire light emitting inlay sheet 300 may be smaller than that of the vertically arranged (a + b).

As a result, according to the exemplary embodiment of the present invention, since the thickness of the light guide plate 330 may be thicker, the effect of dispersing light of the light emitting device may be greater. Therefore, according to an embodiment of the present invention, it is possible to maximize the light emitting effect of the light emitting inlay sheet 300.

According to an embodiment of the present invention, the printed circuit board (PCB) 340 may mean an electronic component 310 in which a circuit is formed. The printed circuit board 340 may be inserted into a base hole formed in the base sheet.

According to one embodiment of the present invention, a long hole may be formed in the printed circuit board 340. The electronic component 310 including the light emitting device may be inserted into the long hole. The shape of the long hole may vary in a circle, oval, rectangle, and the like. The long hole may be plural so that a plurality of electronic components 310 may be inserted.

The long hole may include a through hole or a via hole. The through hole means a hole in which a circuit is connected up and down and in which the electronic component 310 can enter. The via hole means a hole that only connects a circuit up and down.

According to an embodiment of the present invention, the antenna may include a first antenna for transmitting and receiving data to and from the outside and a second antenna for driving an electronic component. In this case, a problem of power shortage caused by simultaneously driving the electronic components 310 including the light emitting device using one antenna may be solved. Therefore, the distance that the light emitting inlay sheet 300 recognizes a card terminal (reader) or the like may increase. That is, even if the RF card contacts the card terminal at a greater distance, the electronic components 310 can be driven.

According to an embodiment of the present invention, the first antenna and the second antenna may be a loop antenna. The loop antenna is a wire wound several times in a circle. The structures of the first antenna and the second antenna will be described later with reference to FIG. 4.

According to an embodiment of the present invention, the light emitting inlay sheet 300 may finally include a cover lay sheet portion on an upper side and a lower side to protect the electronic component 310 and the light guide plate 330. have.

3 is a view for explaining a light guide plate according to an embodiment of the present invention.

According to one embodiment of the present invention, an optical fiber may be used as the light guide plate (waveguide) 330. Therefore, hereinafter, an optical fiber will be described as an example of the light guide plate 330.

The optical fiber has a structure in which a cladding having a low refractive index surrounds a core having a high refractive index of a transparent material. Therefore, the incident light does not escape outside due to the difference in refractive index between the two materials and continues to proceed along the optical fiber (light guide plate).

That is, according to an embodiment of the present invention, the light incident from the side surface from the light emitting device may go straight along the total reflection along the light guide plate (waveguide) 330. Total reflection means that all light with an angle of incidence above the critical angle is totally reflected at the media interface.

However, if there is a scratch on the surface of the light guide plate 330 or a printed material exists, total reflection may no longer occur. Therefore, the light in the light guide plate 330 is scattered and emitted out. According to an embodiment of the present invention, such a light emission pattern may be controlled so that a light emitting effect appears only on a specific portion of the RF card.

4 is a view for explaining an antenna associated with an embodiment of the present invention.

According to an embodiment of the present invention, the antenna 350 may be composed of a first antenna 351 for transmitting and receiving data with the outside and a second antenna 352 for driving electronic components. The first antenna 351 and the second antenna 352 may be loop antennas.

In the case of a loop antenna, when a plurality of antennas 350 exist, interference and resonance may occur. Therefore, as illustrated in FIG. 4B, when the first antenna 351 and the second antenna 352 are disposed to cross each other (hereinafter, referred to as a “cross winding method”), the second antenna 352 may be caused by interference. There is a limit to the generation of power through). In addition, this may result in deterioration of the performance of the first antenna 351 or inefficient performance due to insufficient power of the electronic components 320 connected to the second antenna 352.

However, in accordance with one embodiment of the present invention, as shown in Figure 4a, the first antenna 351 and the second antenna 352 is disposed around the outer periphery of the printed circuit board 340, alternately parallel In the case of winding side by side (hereinafter referred to as 'parallel winding method'), it is possible to minimize the occurrence of interference effects and resonance phenomenon. Accordingly, each of the first antenna 351 and the second antenna 352 may exhibit maximum efficiency.

In addition, according to the parallel winding method, an inner area of the first antenna 351 and the second antenna 352 may be the widest. Therefore, according to an embodiment of the present invention, the performance of the antenna 350 may be maximized.

On the other hand, in the case of the parallel winding method according to an embodiment of the present invention, even if the number of loops of the first antenna 351 and the second antenna 352 increases, the efficiency can be maximized. However, in the case of the cross-winding system, since the internal area of the antenna 350 is divided with each other as the number of loops increases, a limit arises.

According to Faraday's law of electromagnetic induction (induction electromotive force = number of coils wound × × magnetic flux change rate / time), the higher the electromotive force, the higher the electromotive force, where the magnetic flux is perpendicular to the direction of the magnetic field. This is because the coil winding area is proportional to the induced electromotive force because the number of magnetic force lines passing through the phosphorus unit area.

According to an embodiment of the present invention, the antenna 350 may be disposed around an outer circumference of the printed circuit board 340 inserted into the base hole formed in the base sheet. In this case, both ends of the antenna 350 may be welded on a pad provided on the printed circuit board 340.

 5 is a flowchart illustrating a method of manufacturing a light emitting inlay sheet according to an embodiment of the present invention.

After arranging the PVC sheet on the upper side and the lower side of the waveguide, the base sheet can be manufactured by laminating (S510). The lamination may mean that the PVC sheets are heat-compressed with a thermocompressor or the like to melt and adhere the PVC sheets. In the case of PVC located on the upper portion of the light guide plate 330 may be transparent.

According to one embodiment of the present invention, the light guide plate 330 may be present in the light emitting inlay sheet 300 as a whole. Therefore, the entire area of the RF card can emit light. It is also possible to adjust the design printed on the surface of the card so that only a specific part of the RF card emits light. That is, the light emitting position of the RF card is determined according to the design of the card surface.

If the light guide plate 330 is located only at a specific portion to emit light, the position or shape of the light guide plate 330 should be changed according to the position of the light emitting device or the design of the card. However, according to an embodiment of the present invention, since the entire area of the light emitting inlay sheet 300 may emit light, two contact points or light sources of the second antenna 352 for driving the electronic component 310 may be emitted. The inconvenience of having to change the position of the card according to the design of the card can be minimized.

According to an embodiment of the present invention, a base hole may be formed in the base sheet [S520] to insert the printed circuit board 340 [S530].

According to an embodiment of the present invention, the antenna is disposed around a printed circuit board, and both ends of the antenna may be welded onto a pad provided on the printed circuit board [S540].

According to one embodiment of the present invention, a long hole may be formed in the printed circuit board 340, and the electronic component 310 and the support 320 may be inserted therein (S550). When the electronic component 310 is inserted into the long hole, a conductive adhesive is applied to the terminal contact portion in the long hole [S560]. Details of steps S550 and S560 will be described later with reference to FIG. 6.

According to an embodiment of the present invention, the plastic coverlay may be placed on the upper side and the lower side of the light emitting inlay sheet 300 including the lead-coated printed circuit board 340 to be laminated [S570]. ]. The plastic coverlay may be PVC.

 That is, when the plastic coverlay is pressed with a thermocompressor, the plastic coverlays are melted together (laminated) and lead in the melt is also melted so that the electronic components 310 are attached to the printed circuit board 340.

 FIG. 6 is a diagram for describing some of operations S550 and S560 of FIG. 5.

According to an embodiment of the present invention, the electronic component 310 including the light emitting device is not disposed on the printed circuit board 340, but is disposed in the long hole formed in the printed circuit board 340.

Thus, long holes are formed in the printed circuit board 340 [S610]. There may be a plurality of long holes so that the electronic components 310 may be inserted. In this case, the inside of the long hole can be plated, and a terminal can be made on the side of the long hole.

According to an embodiment of the present invention, the pattern may be separated by removing a part of the long hole [S620]. This is because the terminals of the electronic component 310 may stick together when the entire interior of the long hole is plated. That is, the pattern of the long hole is left leaving only a portion corresponding to the terminal position of the electronic component 310, and the rest is removed. The pattern may mean a wiring circuit for electrically connecting the terminal (electrode) and the terminal of the electronic component.

According to an embodiment of the present invention, the electronic component 310 including the light emitting device may be inserted into the long hole [S630]. In this case, the support 320 may also be inserted into the long hole. Each electronic component 310 and the support 320 may be inserted into a different long hole. This is because the long hole may be formed differently according to the characteristics, size, terminal position, etc. of the electronic component 310.

According to one embodiment of the present invention, a conductive adhesive may be applied to the terminal contact portion in the long hole [S640]. The conductive adhesive may include a conductive or electrically conductive epoxy in a liquid or gel state. As an example, lead will be described.

According to one embodiment of the present invention, the lead may be melted by heating the printed circuit board 340 coated with lead [S650]. In this case, a heat press or the like may be used to melt the lead.

According to an embodiment of the present invention, when one side of the electronic component 310 is to be exposed, such as a side view LED, one side of the printed circuit board 340 may be cut and used [S660]. According to one embodiment of the present invention, a waveguide (light guide plate) 330 may be disposed on one side of the LED.

As a result, according to the exemplary embodiment of the present invention, the electronic component 310 including the light emitting device is inserted into the long hole without being disposed on the printed circuit board 340, thereby generally manufacturing the light emitting inlay sheet 300. There is a difference between how to do this. In general, lead is applied onto the printed circuit board 340, and then the electronic component 310 is placed thereon, so that the lead is melted. According to one embodiment of the present invention, the electronic component is formed in the hole. After inserting 310 first, lead is applied.

According to the method of applying lead first and inserting the electronic component 310, the lead is likely to be buried on the lower surface of the electronic component 310, the lead is in the form of a ball of about 25㎛ It may be a barrier to inserting the electronic component 310. In addition, when lead is buried on the lower surface of the electronic component 310, the phenomenon that the floating on the floor may occur.

Therefore, according to one embodiment of the present invention, by applying and melting lead only in the contact portion of the terminal in the long hole of the printed circuit board 340, the bead-shaped lead is to melt and flow down by gravity.

7 is a view for explaining the final thickness of the light emitting inlay sheet according to an embodiment of the present invention.

FIG. 7A illustrates a light emitting inlay sheet 300 manufactured by a conventional method, and FIG. 7B illustrates a light emitting inlay sheet 300 manufactured according to an embodiment of the present invention.

As shown in FIG. 7A, according to the conventional method, since the electronic component 310 including the light emitting device is disposed on the printed circuit board 340, the final thickness of the light emitting inlay sheet 300 is 'printed circuit'. Thickness of the substrate 340 + pattern (plating) thickness + adhesive (lead) thickness + thickness of the electronic component 310 '.

However, as shown in FIG. 7B, according to one embodiment of the present invention, since the electronic component 310 is located in the long hole of the printed circuit board 340, the final thickness of the light emitting inlay sheet 300 is provided. May be the thickness of the electronic component 310 or the thickness of the support 320. According to a preferred embodiment of the present invention, since the thickness of the support 320 should be greater than or equal to the thickness of the electronic component 310, the final thickness of the light emitting inlay sheet 300 may be the thickness of the support 320. have.

As a result, one embodiment of the present invention (final thickness = electronic component (final thickness = thickness of the printed circuit board 340 + thickness of the pattern (plating) + adhesive (lead) + thickness of the electronic component 310)). The thickness of the 310 or the thickness of the support 320), it is possible to reduce the final thickness of the light emitting inlay sheet 300.

Therefore, according to an embodiment of the present invention, as the thickness of the light emitting inlay sheet 300 decreases, the upper and second printed layers 200 and the upper and lower protective films 100 of the RF card may be further thickened. have. In addition, it can flexibly correspond to a predetermined thickness standard of the RF card.

On the other hand, according to an embodiment of the present invention, the thickness of the light guide plate 330 can also be adjusted to be thicker, so that the luminous efficiency of the light emitting RF card can be further increased.

In addition, as illustrated in FIG. 7B, the support 320 may be installed at an adjacent position of the electronic component 310. In this case, the support 320 prevents the electronic component 310 from being destroyed by dispersing the pressure received by the electronic component 310 including the light emitting device during the pressing process.

Hereinafter, as a second embodiment of the present invention, a printed circuit board used in a general electronic device and a method of mounting an electronic component on the printed circuit board will be described.

8 is a view for explaining an electronic component mounting method according to a second embodiment of the present invention.

As shown in FIG. 8, according to the second embodiment of the present invention, the printed circuit board 340 includes a substrate body 341, an insertion hole 342, an electronic component 310, and a support 320. can do. According to the second embodiment of the present invention, the printed circuit board 340 may be used not only for an electronic card but also for general IT products such as a mobile terminal and a computer.

According to an embodiment of the present invention, the substrate main body 341 may be formed with printed circuit wiring.

According to an embodiment of the present invention, the insertion hole 342 may include a long hole or a through hole. In the insertion hole 342, the pattern of the remaining parts except for a specific part coinciding with the position of the terminal of the electronic component 310 may be removed. The shape of the insertion hole 342 may vary from circular, elliptical, rectangular, etc. according to the shape of the electronic component 310 and the shape of the circuit connection terminal formed on the electronic component 342.

The electronic component 310 may include a light emitting device 311 and a connector. At least one side of the light emitting device 311 or the left and right sides of the connector may be open. This is to place the light guide plate 330 on the open side in the case of the light emitting device 311, and to place other electronic components 310 on the open side in the case of the connector. In addition, the electronic component 310 may include a diode, a resistor, an IC chip, a transistor, a coil, a support, and the like.

Hereinafter, a method of mounting the electronic component 310 on the printed circuit board 100 according to the second embodiment of the present invention will be described in detail with reference to FIG. 9.

According to an embodiment of the present invention, the electronic components 310 are not disposed on the substrate body 341 of the printed circuit board 340, but are formed on the substrate body 341 of the printed circuit board 340. It is disposed in the insertion hole 342.

Therefore, the insertion hole 342 is formed in the substrate main body 340. There may be a plurality of insertion holes 342 so that each of the electronic components 310 may be inserted. According to an embodiment of the present disclosure, the forming of the insertion hole 342 may include forming a through hole and / or a long hole in the substrate main body 341.

According to an embodiment of the present invention, a through hole or a long hole corresponding to the electrode terminal specification of the electronic component 310 is formed in the substrate main body 341 [Step 1]. In this case, the inside of the through-hole or the long hole formed in the substrate body 341 is plated, and the substrate body and the part of the through-pole are removed in accordance with the size of the electronic component 310 and the position of the terminal to remove the electronic component 310. ) A pad can be made to solder the terminal [Step 2].

That is, the pattern of the insertion hole 342 is removed leaving only the part corresponding to the terminal position of the electronic component 310, and the rest is removed. The pattern may mean a wiring circuit for electrically connecting the terminal (electrode) of the electronic component 310 to the terminal.

According to an embodiment of the present invention, the electronic component 310 including the light emitting element 311 or the connector may be inserted into the insertion hole 342 (step 3). In this case, at least one side of the light emitting device 311 (eg, side view LED) or the left and right sides of the connector may be opened. This can be made physically open by cutting one side.

In addition, according to an embodiment of the present invention, the support 320 may also be inserted into the insertion hole 342. Each electronic component 310 and the support 320 may be inserted into each other insertion hole 342. This is because the insertion hole 342 may be formed differently according to the characteristics and size of the electronic component 310, the terminal position, and the like.

According to one embodiment of the present invention, a conductive adhesive may be applied to the terminal contact portion in the insertion hole 342 [step 4]. The conductive adhesive may include a conductive or electrically conductive epoxy in a liquid or gel state. As an example, lead will be described.

According to one embodiment of the present invention, the lead is applied to the substrate body 341 may be heated to melt lead (step 5). In this case, a heat press or the like may be used to melt the lead.

As a result, according to an embodiment of the present invention, the electronic component 310 is inserted into the insertion hole 342 instead of being disposed on the substrate main body 341 of the printed circuit board 340, and thus, in general, the electronic component mounting method. There is a difference. In general, lead is applied onto the substrate body 341 of the printed circuit board 340, and then the electronic component 310 is placed thereon, so that the lead is melted. According to one embodiment of the present invention, The electronic component 310 is first inserted into the insertion hole 342, and then lead is applied.

According to the method of applying lead first and inserting the electronic component 310, the lead is likely to be buried on the lower surface of the electronic component 310, the lead is in the form of a ball of about 25㎛ It may be a barrier to inserting the electronic component 310. In addition, when lead is buried on the lower surface of the electronic component 310, the phenomenon that the floating on the floor may occur.

Therefore, according to one embodiment of the present invention, by applying and melting lead only in the contact portion of the terminal in the insertion hole 342 of the substrate main body 341, the beads in the form of beads to melt and flow down by gravity will be.

Meanwhile, according to an embodiment of the present invention, the printed circuit board 340 may form a multilayer structure as shown in FIG. 10. Therefore, when the printed circuit board 340 is formed of a plurality of layers, an insertion hole 342 for inserting the electronic component 310 may be formed in at least one layer of the substrate body 341 (S1). . In this case, by removing a portion of the interior of the insertion hole 342 with a drill or the like to separate the pattern, the insertion hole 342 is completed.

According to an embodiment of the present invention, the substrate main body 341 having the insertion hole 342 is bonded to the substrate main body 341 of another layer (S3). At this time, the electronic component is inserted into the insertion hole 342 of the printed circuit board 340 to which the plurality of layers are bonded (S4). Then, after the liquid lead is applied to the terminal contact portion of the electronic component 310 in the insertion hole 340 (S5), heating is applied to complete the mounting of the electronic component 310 (S6). ).

11A is a view for explaining the final thickness of a printed circuit board according to an embodiment of the present invention, Figure 10b is a view for explaining the final thickness of a printed circuit board manufactured by a general method.

As shown in FIG. 11B, according to the general electronic component mounting method, since the electronic components 310 are disposed on the printed circuit board 340, the final thickness of the printed circuit board 340 is' printed circuit board 340. ) Thickness + pattern (plating) thickness + adhesive (lead) thickness + electronic component 310 thickness'.

However, as shown in FIG. 11A, according to an embodiment of the present invention, since the electronic component 310 is located in the insertion hole 342 of the printed circuit board 340, the printed circuit board 340 is provided. The final thickness of may be 'thickness of the electronic component 310 or the thickness of the substrate body 341'.

As a result, one embodiment of the present invention (final thickness = electronic component (final thickness = thickness of the printed circuit board 340 + thickness of the pattern (plating) + adhesive (lead) + thickness of the electronic component 310)). Thickness of the substrate 310 or the thickness of the substrate body 341), the final thickness of the printed circuit board 340 can be reduced.

Therefore, the thickness of the mobile phone backlight unit, thin film TV, etc. using the printed circuit board 340 can be minimized. Therefore, when the printed circuit board 340 according to the second embodiment of the present invention is used in IT products, the thickness of other components can be flexibly adjusted, and thus the utilization value can be very high.

The embodiments of the present invention described above are not implemented only through systems and methods, but may be implemented through a program that realizes a function corresponding to the configuration of the embodiments of the present invention or a recording medium on which the program is recorded. Implementations can be readily implemented by those skilled in the art from the description of the above-described embodiments.

In addition, although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of the invention.

100: upper and lower protective film
200: upper and lower printing layer
300: inlay sheet
310: electronic components
311: light emitting element (LED)
320: support
330: light guide plate (waveguide)
340: printed circuit board
341: substrate body
342: insertion hole
350: antenna
351: first antenna
352: second antenna

Claims (9)

An electronic component for performing the function; And
And a substrate main body having an insertion hole into which the electronic component is inserted. The method of claim 1, wherein the printed circuit board
Have multiple layers,
At least one layer comprises a substrate body having the insertion hole formed therein. The method of claim 1, wherein the insertion hole
Printed circuit board, characterized in that the pattern of the remaining portion except for a specific portion matching the terminal position of the electronic component is removed. The method of claim 1, wherein the electronic component
Including a light emitting device,
At least one side of the left and right sides of the light emitting device is opened,
Printed circuit board, characterized in that the light guide plate is located on the open side. The method of claim 1,
And a support for protecting the electronic component from external pressure, wherein the support has a height greater than or equal to the electronic component. Forming an insertion hole for inserting an electronic component into the substrate body of the printed circuit board;
Removing a pattern of the remaining portions except for a specific portion that matches the terminal position of the electronic component in the insertion hole;
Inserting the electronic component into the insertion hole;
Applying a conductive adhesive to a portion where the terminal portion of the insertion hole contacts the terminal of the electronic component; And
Melting or curing the conductive adhesive to adhere the electronic component to the substrate body. The method of claim 6, wherein the printed circuit board
Have multiple layers,
The electronic component mounting method further comprises the step of bonding the substrate body of at least one layer having the insertion hole to the substrate body of the other layer. The method of claim 6, wherein the electronic component
Including a light emitting device,
And at least one side of the left and right sides of the light emitting device is opened. The method according to claim 6,
And inserting a support for protecting the electronic component from external pressure into another insertion hole of the printed circuit board.

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