JP5710395B2 - IC card - Google Patents

Description

  Embodiments described herein relate generally to an IC card including a display.

  Generally, what is called an IC card includes a contact IC card defined by ISO / IEC 7816, a contactless card (wireless card) defined by ISO / IEC 14443, and a dual interface card having both functions. is there. Dual interface cards are classified into a combination card that provides contact communication and wireless communication functions with a single IC, and a hybrid card that provides each function with an individual IC.

  For example, a contact IC card is generally formed by embedding an IC module having an IC inside in a card substrate such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or paper. The IC module has 6 or 8 terminals for communication with the outside, the IC arranged on the back side of the contact terminal and each terminal are electrically connected by a gold wire or the like, and the IC and the gold wire are thermoset. Sealed with resin or the like. The function of each terminal is defined in ISO / IEC 7816. In general, an IC module is embedded in a card by placing an IC module with an adhesive tape attached in a counterbore hole provided at a predetermined position on a card base and thermocompression bonding. Adhesion with the card substrate is performed.

  An IC card equipped with a display such as a liquid crystal has been proposed. However, IC cards with a display have not yet been popular due to problems such as manufacturing cost, durability against bending and the need for a power source. In recent years, displays that are flexible and can be driven with low power consumption, as typified by electronic paper, have been developed, and the problems that have been solved so far can be solved. .

JP 2010-108387 A

  When an IC card with a display is realized, it is necessary to consider how communication is performed by three devices: an IC card function IC, an external terminal, and a display control IC.

  When the external terminal communicates with each of the IC card function IC and the display control IC, it is necessary to newly provide an interface for communication between the external terminal and the display control IC. When the IC card function IC communicates with each of the external terminal and the display control IC, the IC card function IC needs to newly provide an interface for communicating with the display control IC. This increases the manufacturing cost of the IC card.

  The present invention has been made in view of the above circumstances, and the problem is that the card control element, the external device, and the display control element can communicate with each other and can suppress an increase in manufacturing cost. To provide an IC card.

  According to the embodiment, the IC card includes a card base, a display provided on the card base, a communication input / output unit connectable to an external device, and a card connected to the input / output unit. A control element, and a display control element that is connected to a communication transmission path between the input / output unit and an external device and controls the display.

FIG. 1 is a plan view showing an IC card according to the first embodiment. FIG. 2 is a cross-sectional view of the IC card taken along line AA in FIG. FIG. 3 is a plan view showing an IC module of the IC card. FIG. 4 is a plan view showing a back side of the IC module. FIG. 5 is an exploded plan view showing the IC module of the IC card and a card substrate. FIG. 6 is an exploded cross-sectional view showing the IC module of the IC card and the card substrate. FIG. 7 is a diagram schematically showing a communication frame used as transmission data of the IC card. FIG. 8 is a plan view schematically showing a communication state between the IC card and an external terminal. FIG. 9 is a plan view schematically showing the mutual communication state of the card control IC, display control IC, and external terminal of the IC card. FIG. 10 is a plan view showing an IC card according to a second embodiment. FIG. 11 is a cross-sectional view of the IC card taken along line BB in FIG. FIG. 12 is a plan view showing an IC module of the IC card. FIG. 13 is a plan view showing the back side of the IC module. FIG. 14 is an exploded plan view showing the IC module of the IC card and the card substrate. FIG. 15 is an exploded cross-sectional view of the IC module of the IC card and a card substrate. FIG. 16 is a plan view showing an IC card according to a third embodiment. 17 is a cross-sectional view of the IC card taken along line CC in FIG. FIG. 18 is a plan view showing an IC module of the IC card. FIG. 19 is a plan view showing the back side of the IC module.

  Hereinafter, various embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
1 to 4 show a contact type IC card according to the first embodiment. The IC card 10 includes a rectangular plate-shaped card base 12, a display 14 provided on the card base 12, and an IC module 16 embedded in the card base 12.

  As shown in FIGS. 1, 2, and 5, the card substrate 12 is a thin plastic made of a material such as polyethylene terephthalate (PET), PET-G, polyvinyl chloride (PVC), polycarbonate (PC), or the like. A plurality of sheets are stacked and bonded by hot pressing to form a sheet having a thickness (0.76 ± 0.08 mm) specified in ISO / IEC7810, and then the sheet is punched into a card shape of a predetermined size. . In addition, the card | curd base material 12 may be injection-molded with a synthetic resin using a card-shaped metal mold | die.

  The card base 12 is formed with a first recess 18 in which the display 14 is mounted, and a stepped second recess 20 in which the IC module 16 is mounted, each opening on the surface of the card base 12. Yes. A wiring 22 for connecting a display is embedded in the card substrate 12, and the wiring 22 extends from the first recess 18 to the second recess 20. One end of the wiring 22 is exposed in the first recess 18, and the other end is exposed in the second recess 20. Further, a display control IC 34 is embedded in the card substrate 12 in the vicinity of the recess 18.

  The first recess 18 is formed in, for example, an elongated rectangular shape corresponding to the display size. The display 14 is mounted in the first recess 18, is fixed to the card base 12, and is electrically connected to the wiring 22 exposed in the first recess 18. The display control IC (display control element) 34 is electrically connected to the wiring 22 and further connected to a plurality of wirings on the substrate 25 of the display 14. The display control IC 34 controls the display 14 and displays arbitrary information such as time, station name, card number, card balance and the like on the display 14.

  In manufacturing, a hole corresponding to the display size is formed in a plastic sheet, and the display 14 is set between the plastic sheets. A transparent overcoat layer may be further laminated on the outermost surface of the card substrate 12.

  The display 14 is preferably flexible and has low power consumption. For example, the display 14 uses electrophoretic electronic paper in which microcapsules containing black and white pigment particles are arranged and the particles are moved by an electric field to perform black and white display. Alternatively, a thin liquid crystal panel or organic EL may be used. The power of the contact IC module 16 may be used to supply power necessary for display and rewriting on the display 14, but a thin battery may be built in the card base 12 or as a non-contact IC card. An antenna may be provided inside the card substrate to supply power by an electromagnetic induction method.

  The second recess 20 for embedding the IC module 16 includes a rectangular large-diameter recess 20a and a rectangular small-diameter recess formed deeper than the large-diameter recess 20a at the center of the large-diameter recess. 20b, and is formed in a rectangular two-step recess. The second recess 20 may be provided in advance in a state in which a hole is made in a plastic sheet at the time of lamination and the wiring 22 from the display 14 is exposed, or a card formed in a plate shape before the IC module is bonded. The second recess may be formed by cutting the substrate, and the wiring 22 may be exposed.

  As shown in FIGS. 2 to 5, the IC module 16 includes a rectangular substrate 30 formed of an insulating material and a contact communication contact formed on the upper surface of the substrate 30 and defined by ISO / IEC7816. Terminals C1 to C8 and a card control IC (card control element) 32 mounted on the back surface of the substrate 30 are provided. For example, the contact terminal C1 functions as a power source, the contact terminal C2 functions as a reset, the contact terminal C3 functions as a clock, the contact terminal C5 functions as ground, and the contact terminal C7 functions as transmission (input / output (I / O)).

  The card control IC 32 has a contact communication interface, and the pads of the IC 32 are electrically connected to the external terminals C1, C2, C3, C5, and C7 through a gold bonding wire 37 or the like. A connection terminal 36 for display connection is formed on the back surface of the substrate 30. The connection terminal 36 is formed in an elongated strip shape, and extends from one side edge of the substrate to the center side along the width direction of the substrate 30. The connection terminal 36 is provided in the vicinity of the contact terminal C7. The connection terminal 36 is electrically connected to the contact terminal C7 through a through hole of the substrate 30 by wiring, for example, a bonding wire 35.

  The card control IC 32 mounted on the back surface of the substrate 30, the bonding wires 35 and 37, and the central end of the connection terminal 36 are sealed with a sealing material 42 such as thermosetting resin or mold resin. Yes. The outer end of the connection terminal 36 is exposed to the back side of the substrate 30 without being covered with the sealing material 42.

  As shown in FIGS. 2 and 5, the IC module 16 configured as described above is embedded in the second recess 20 of the card base 12 and is heat-pressed to the card base 12 with an adhesive 44. The large diameter recess 20a of the second recess 20 is formed in a size and shape corresponding to the substrate 30, and the substrate 30 and the contact terminal of the IC module 16 are accommodated in the large diameter recess 20a. The substrate 30 is bonded to the bottom of the large-diameter recess 20 a by the adhesive 44 at the periphery of the back surface. The contact terminals C1 to C8 of the IC module 16 are disposed substantially flush with the surface of the card base 12 and are exposed to the outside. The small diameter recess 20b is formed in a size and depth corresponding to the sealing portion of the IC module 16, and the sealing portion is accommodated in the small diameter recess 20b.

By cutting the shallow large-diameter recess 20a out of the two second recesses 20, the wiring 22 from the display 14 is exposed at the bottom of the large-diameter recess 20a. The connection terminal 36 provided on the back side of the substrate of the IC module 16 is physically bonded to the wiring 22 by a conductive adhesive 46 or the like and is electrically connected thereto. Accordingly, the display control IC 34 is electrically connected to the communication contact terminal C7 via the wiring 22, the connection terminal 36, and the bonding wire 35. In other words, the display control IC 34 for controlling the display 14 is connected to the communication transmission path between the input / output unit (contact terminal C7) and the external device, and is further electrically connected to the card control IC 32 via the input / output unit. It is connected.
Thus, the contact type IC card 10 is formed.

  Communication between the IC card 10 configured as described above and the external terminal 50 is performed by a block frame as shown in FIG. 7 in the case of the T = 1 protocol. Address of transmission destination DAD (external terminal 50, card control IC 32, display control IC 34) and transmission source SAD (external terminal 50, card control IC 32, display control IC 34) by NAD (Node Address) at the head of the frame Is specified. Normally, the external terminal 50 and the IC card 10 communicate one-on-one, and thus are unused (“00”). In addition, the block frame has a prologue area including NAD, PCB, and LEN, an information area, and an epilogue area. LEN indicates the length of the frame.

  As shown in FIGS. 7 to 9, a node address is assigned to each of the external terminal 50, the card control IC 32, and the display control IC 34, and the destination address is determined by the NAD (Node Address) at the head of the block frame of T = 1 protocol. By designating the address, each of the external terminal, the card control IC, and the display control IC can communicate with each other.

  If the node address is Node # 0 for the external terminal 50, the card control IC is Node # 1, and the display control IC is Node # 7, NAD is used for communication from the external terminal 50 to the card control IC 32. = 10, NAD = 1 for communication from the card control IC 32 to the external terminal 50, and NAD = 70 for communication from the external terminal 50 to the display control IC.

  As described above, the transmission destination identification information DAD and the transmission source identification information SAD specified by the NAD are used as fixed information for the external terminal 50, the card control IC 32, and the display control IC 34.

  Note that the transmission destination identification information DAD and the transmission source identification information SAD may be variable information that can be changed in accordance with changes in the applied external terminal. DAD and SAD are set when information is first transmitted from the terminal side. If the values are used for subsequent communication, the address is specified by the external terminal even if the external terminal is changed. It becomes possible. However, it is necessary to distinguish whether information transmitted first from the terminal side is transmitted to the card control IC or to the display control IC. For example, information transmitted first from the terminal side is required. It is desirable to predetermine a rule that the card control IC responds.

  Each of the card control IC 32 and the display control IC 34 has a determination unit that determines whether or not the communication frame is to be processed according to the communication frame transmission destination identification information. Further, the card control IC 32 and the display control IC 34 are provided with memories 32a and 34a in which transmission destination identification information and transmission source identification information are stored in advance.

  According to the IC card 10 configured as described above, the communication between the card control IC and the display control IC and the external terminal 50 using the common input / output unit (input / output terminal), and the card Communication between the control IC and the display control IC can be performed. As described above, the card control IC, the external terminal, and the display control IC can communicate with each other, and the card control IC and the external terminal do not need to be provided with a new interface. An IC card with a display can be realized.

  Further, by attaching the IC module 16 to the card substrate 12, the connection terminal of the IC module 16 and the display control IC 34 can be connected. This makes it possible to divert the IC module 16 and connect the IC module 16 and the display 14 by diverting the conventional manufacturing method, thereby reducing the investment cost of the manufacturing equipment and highly reliable IC. You can get a card. From the above, it is possible to obtain an IC card with a display that can be manufactured at a low cost and has improved reliability as a card.

(Second Embodiment)
Next, an IC card according to the second embodiment will be described. 10 to 13 show a contact type IC card 10 according to the second embodiment. The IC card 10 includes a rectangular plate-shaped card base 12, a display 14 provided on the card base 12, and an IC module 16 embedded in the card base 12.

  According to the second embodiment, the display control IC 34 is provided in the IC module 16. In other words, the IC module 16 is mounted on a rectangular substrate 30, contact terminals C1 to C8 for contact communication formed on the upper surface of the substrate 30 and defined by ISO / IEC7816, and the back surface of the substrate 30. A card control IC (card control element) 32 and a display control IC 34 mounted on the back surface of the substrate 30 are provided. For example, the contact terminal C1 functions as a power source, the contact terminal C2 functions as a reset, the contact terminal C3 functions as a clock, the contact terminal C5 functions as ground, and the contact terminal C7 functions as transmission (input / output (I / O)).

  The card control IC 32 has a contact communication interface, and the pads of the IC 32 are electrically connected to the external terminals C1, C2, C3, C5, and C7 through a gold bonding wire 37 or the like.

  The display control IC 34 is provided on the same plane as the card control IC 32. That is, the display control IC 34 is mounted on the back surface of the substrate 30 and is located side by side with the card control IC 32. In addition, a plurality of connection terminals 36 for connecting the display are formed on the back surface of the substrate 30. Each of the connection terminals 36 is formed in an elongated strip shape, and extends from one side edge of the substrate toward the center portion along the longitudinal direction of the substrate 30. The plurality of connection terminals 36 are arranged with a slight gap therebetween.

  The plurality of pads of the display control IC 34 are electrically connected to one end of the connection terminal 36 by bonding wires 38 or the like. Further, the display control IC 34 is electrically connected to the contact terminal C <b> 7 through a through hole of the substrate 30 by wiring, for example, a bonding wire 40.

  The card control IC 32, the display control IC 34, the bonding wires 37, 38, and 40 mounted on the back surface of the substrate 30 and the end on the center side of the connection terminal 36 are sealed with a thermosetting resin or a mold resin. It is sealed with a material 42. The outer end of the connection terminal 36 is exposed to the back side of the substrate 30 without being covered with the sealing material 42. Thereby, the IC module 16 on which the card control IC and the display control IC are mounted is formed.

  As shown in FIGS. 10, 11, 14, and 15, a plurality of wirings 22 for connecting a display are embedded in the card substrate 12, and these wirings 22 are connected from the first recess 18 to the second recess. It extends to place 20. One end of each wiring 22 is exposed in the first recess 18, and the other end is exposed in the second recess 20.

  The first recess 18 is formed in, for example, an elongated rectangular shape corresponding to the display size. The display 14 is mounted in the first recess 18, is fixed to the card base 12, and is electrically connected to the wiring 22 exposed in the first recess 18.

  The IC module 16 is embedded in the second recess 20 of the card base 12 and is heat-pressed to the card base 12 with an adhesive 44. The large-diameter recess 20a of the second recess 20 is formed in a size and shape corresponding to the substrate 30, and the substrate 30 and external terminals of the IC module 16 are accommodated in the large-diameter recess 20a. The substrate 30 is bonded to the bottom of the large-diameter recess 20 a by the adhesive 44 at the periphery of the back surface. The external terminals C1 to C8 of the IC module 16 are disposed substantially flush with the surface of the card base 12 and are exposed to the outside.

  By cutting the shallow large-diameter recess 20a out of the two second recesses 20, the wiring 22 from the display 14 is exposed at the bottom of the large-diameter recess 20a. The plurality of connection terminals 36 provided on the back surface of the substrate of the IC module 16 are physically bonded to the wiring 22 by a conductive adhesive 46 or the like and are electrically connected thereto. Accordingly, the display control IC 34 is electrically connected to the display 14 via the connection terminal 36 and the wiring 22.

When a plurality of wirings 22 are exposed on the same surface, an anisotropic conductive adhesive that energizes only in the thickness direction may be used as the conductive adhesive 46 so that adjacent wirings are not short-circuited. desirable. In this case, even if the wiring 22 of the large-diameter recess 20a is not exposed, electrical connection can be performed using a common anisotropic conductive adhesive. When connecting the wiring 22 and the connection terminal 36 by providing a small recess for each wiring 22 and filling the inside of this recess with a conductive adhesive, the distance for energization is long, so isotropic It is desirable to use a conductive conductive adhesive.
The other configuration of the IC card 10 is the same as that of the first embodiment described above, and the same portions are denoted by the same reference numerals and detailed description thereof is omitted.

  According to the second embodiment, the card control IC, the external terminal, and the display control IC can communicate with each other, and the card control IC and the external terminal need to be provided with a new interface. Therefore, an IC card with a display can be realized at low cost. Further, the IC module 16 can be provided with a card control IC 32 and a display control IC 34, and these ICs can be connected to input / output terminals inside the module. This makes it possible to manufacture a contact IC card with a display at low cost. Further, the IC module 16 and the display 14 can be connected by mounting the IC module 16 on the card base 12. Thereby, it is possible to divert the IC module 16 and connect the IC module 16 and the display 14 by diverting the conventional method of manufacturing a combination card, thereby reducing the investment cost of manufacturing equipment and reliability. High IC card. From the above, it is possible to obtain an IC card with a display that can be manufactured at a low cost and has improved reliability as a card.

  In the second embodiment described above, the two control ICs of the IC module are configured to be directly connected by wire bonding. However, the present invention is not limited to this, and wiring is formed on the substrate, and the two ICs are respectively wired. Two ICs may be electrically connected to the input / output unit by connecting to the same wiring by bonding.

  In the second embodiment described above, the card control IC and the display control IC are provided on the same plane of the substrate. However, the present invention is not limited to this, and the other IC is stacked on one IC. It is good also as a stack structure to mount.

(Third embodiment)
Next, an IC card according to the third embodiment will be described. 16 to 19 show an IC card 10 according to the third embodiment. The IC card 10 is configured as a combination card having both a non-contact type and a contact type. The IC card 10 includes a rectangular plate-shaped card base 12, a display 14 provided on the card base 12, and an IC module 16 embedded in the card base 12. An antenna 52 for wireless communication is embedded in the card substrate 12.

  As the antenna 52, a copper wire that has been treated with an insulating coating or a plastic film that is formed by etching copper or aluminum on a plastic film is used. The antenna 52 is wound in a substantially rectangular shape along the outer periphery of the card base 12, and its input end and output end are drawn out in the vicinity of the second recess 20 of the card base 12.

  The IC module 16 includes a rectangular substrate 30 formed of an insulating material, contact terminals C1 to C8 for contact communication formed on the upper surface of the substrate 30 and defined by ISO / IEC7816, and the back surface of the substrate 30. A card control IC 32 and a display control IC 34 mounted on the card. A plurality of connection terminals 36 for connecting the display are formed on the back surface of the substrate 30. A pair of wireless communication connection terminals 52 are formed on the back surface of the substrate 30.

  The card control IC 32 has a contact communication interface, and the contact communication pads of the IC are electrically connected to the contact terminals C1, C2, C3, C5, and C7 through gold bonding wires 37 and the like. Similarly, the wireless communication pad of the card control IC 32 is electrically connected to the connection terminal 52 by a gold bonding wire 35 or the like.

  The display control IC 34 is provided on the same plane as the card control IC 32. That is, the display control IC 34 is mounted on the back surface of the substrate 30 and is located side by side with the card control IC 32. In addition, a plurality of connection terminals 36 for connecting the display are formed on the back surface of the substrate 30. Each of the connection terminals 36 is formed in an elongated strip shape, and extends from one side edge of the substrate toward the center portion along the longitudinal direction of the substrate 30. The plurality of connection terminals 36 are arranged with a slight gap therebetween.

  The plurality of pads of the display control IC 34 are electrically connected to one end of the connection terminal 36 by bonding wires 38 or the like. Furthermore, the display control IC 34 is electrically connected to the communication contact terminal C7 through a through hole of the substrate 30 by wiring, for example, a bonding wire 40.

  The card control IC 32, the display control IC 34, the bonding wires 35, 37, 38, and 40 mounted on the back surface of the substrate 30 and the end portions on the center side of the connection terminals 36 are made of a thermosetting resin, a mold resin, or the like. It is sealed with a sealing material 42. The outer end of the connection terminal 36 and most of the connection terminal 52 are not covered with the sealing material 42 and are exposed on the back side of the substrate 30. Thereby, the IC module 16 on which the card control IC and the display control IC are mounted is formed.

As shown in FIGS. 16 and 17, the IC module 16 is embedded in the second recess 20 of the card base 12 and is heat-pressed to the card base 12 with an adhesive 44. The adhesive 44 is provided on the back surface of the substrate 30 except for the sealing material 42 and the connection terminals 36 and 52. The display connection terminal 36 is physically and electrically connected to the wiring 22 by, for example, an anisotropic conductive adhesive 46. The connection terminal 52 for wireless communication is physically and electrically connected to the input end and the output end of the antenna 52 by a conductive adhesive 56 or the like. In this way, the IC module 16 is electrically connected to the display 14 and the antenna 52 at the same time by adhesively fixing the IC module 16 to the card substrate 12. Further, the external terminals C1 to C8 of the IC module 16 are arranged substantially flush with the surface of the card base 12 and are exposed to the outside.
The other configuration of the IC card 10 is the same as that of the above-described second embodiment, and the same reference numerals are given to the same portions, and detailed description thereof is omitted.

  According to the third embodiment, the card control IC, the external terminal, and the display control IC can communicate with each other, and the card control IC and the external terminal need to be provided with a new interface. Therefore, an IC card with a display can be realized at low cost. Further, by providing the antenna, a combination card capable of wireless communication can be obtained. As in the first embodiment, it is possible to manufacture an IC card with a display at a low cost. By mounting the IC module 16 on the card substrate 12, the connection between the IC module 16 and the display 14 and the connection between the IC module and the antenna can be performed. Thereby, an IC card with a display which can be manufactured at low cost and has improved reliability as a card can be obtained.

The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.
For example, in the embodiment described above, the card control IC and the display control IC of the IC module are two independent ICs. However, the present invention is not limited to this, and a single IC may be used. Further, the number of ICs mounted on the IC module is not limited to two, and a third IC that controls communication between the card function IC and the display control IC may be provided. Alternatively, an IC having a different function may be mounted on the IC module. The present invention is not limited to an IC card, and may be applied to other forms of portable electronic devices.
Hereinafter, the invention described in the scope of claims at the beginning of the application of the present application will be added.
[1]
A card substrate;
A display provided on the card substrate;
An input / output unit for communication that can be connected to an external device;
A card control element connected to the input / output unit;
An IC card comprising: a display control element that is connected to a communication transmission path between the input / output unit and an external device and controls the display.
[2]
A plurality of contact terminals provided to be exposed on the card substrate and connectable to an external device, and these contact terminals include input / output terminals constituting the input / output unit. IC card.
[3]
The data transmitted to the communication transmission path includes a communication frame including transmission destination identification information whose transmission destination is the external device, the card control element, and the display control element, and the card control element and display control The IC card according to [1] or [2], wherein the element includes a determination unit that determines whether the communication frame is to be processed according to transmission destination identification information of the communication frame.
[4]
The IC card according to [3], wherein the communication frame includes transmission source identification information for identifying a transmission source.
[5]
The IC card according to [4], wherein the transmission destination identification information and the transmission source identification information are fixed information for each of the external device, the card control element, and the display control element.
[6]
The IC card according to [4] or [5], further including a memory in which the transmission destination identification information and the transmission source identification information are stored in advance.
[7]
The IC card according to [4], wherein the transmission destination identification information and the transmission source identification information are variable information.
[8]
An IC module embedded in the card substrate;
The IC module includes a substrate, a communication contact terminal formed on an upper surface of the substrate, the card control element mounted on the back surface of the substrate and connected to the contact terminal, and the substrate. And a connection terminal connected to the contact terminal,
The IC card according to any one of [1] to [7], wherein the display control element is provided in the card substrate and connected to the connection terminal via a wiring.
[9]
An IC module embedded in the card substrate;
The IC module includes a substrate, a communication contact terminal formed on the upper surface of the substrate, the card control element mounted on the back surface of the substrate and connected to the contact terminal, and the back surface of the substrate. And the display control element connected to the contact terminal, and a display connection terminal provided on the back surface of the substrate and connected to the display control element,
The IC card according to any one of [1] to [7], wherein the display connection terminal is electrically connected to the display through a wiring.

10 ... IC card, 12 ... card substrate, 14 ... display, 16 ... IC module,
18 ... first recess, 20 ... second recess, 22 ... wiring, 32 ... card control IC,
34 ... Display control IC, 36 ... Connection terminal, 35, 37, 38 ... Wiring,
52 ... Antenna, C1 to C7 ... Contact terminals.

Claims (8)

A card substrate;
A display provided on the card substrate;
A substrate, a communication input / output unit formed on the upper surface of the substrate and connectable to an external device, a card control element mounted on the back surface of the substrate and connected to the input / output unit, and the substrate A connection terminal connected to the input / output unit, and an IC module embedded in the card substrate;
Provided in the card within the substrate, is connected to the connecting terminal through the wire, the said output unit connected to the communications channel with an external device, and a display control device for controlling the display, the IC card provided.   2. The device according to claim 1, further comprising a plurality of contact terminals that are exposed on the card base and connectable to an external device, and the contact terminals include input / output terminals that constitute the input / output unit. IC card.   The data transmitted to the communication transmission path includes a communication frame including transmission destination identification information whose transmission destination is the external device, the card control element, and the display control element, and the card control element and the display control element. The IC card according to claim 1, wherein the element includes a determination unit that determines whether the communication frame is to be processed according to transmission destination identification information of the communication frame.   The IC card according to claim 3, wherein the communication frame includes transmission source identification information for identifying a transmission source.   The IC card according to claim 4, wherein the transmission destination identification information and the transmission source identification information are fixed information for each of the external device, the card control element, and the display control element.   6. The IC card according to claim 4, further comprising a memory in which the transmission destination identification information and the transmission source identification information are stored in advance.   The IC card according to claim 4, wherein the transmission destination identification information and the transmission source identification information are variable information.   A card substrate;
  A display provided on the card substrate;
  A board, a communication input / output unit formed on the upper surface of the board and connectable to an external device via a communication transmission path, and a card control mounted on the back surface of the board and connected to the input / output unit An element for display, a display control element for controlling the display mounted on the back surface of the substrate and connected to the input / output unit, and a display connection provided on the back surface of the substrate and connected to the display control element And an IC module embedded in the card substrate,
  An IC card comprising: the display connection terminal and a wiring electrically connecting the display.

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