KR20120026640A - 양이온 경화성 조성물 - Google Patents

양이온 경화성 조성물 Download PDF

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Publication number
KR20120026640A
KR20120026640A KR1020127004986A KR20127004986A KR20120026640A KR 20120026640 A KR20120026640 A KR 20120026640A KR 1020127004986 A KR1020127004986 A KR 1020127004986A KR 20127004986 A KR20127004986 A KR 20127004986A KR 20120026640 A KR20120026640 A KR 20120026640A
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KR
South Korea
Prior art keywords
composition
polymer
base
species
mixtures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127004986A
Other languages
English (en)
Korean (ko)
Inventor
마이클 에이. 크로프
웨인 에스. 마호니
브리짓 케이. 웜카
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20120026640A publication Critical patent/KR20120026640A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Processing Of Solid Wastes (AREA)
KR1020127004986A 2003-11-26 2004-10-20 양이온 경화성 조성물 Ceased KR20120026640A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/723,827 US7192991B2 (en) 2003-11-26 2003-11-26 Cationically curable composition
US10/723,827 2003-11-26

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020067010230A Division KR101225220B1 (ko) 2003-11-26 2004-10-20 양이온 경화성 조성물

Publications (1)

Publication Number Publication Date
KR20120026640A true KR20120026640A (ko) 2012-03-19

Family

ID=34592400

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020127004986A Ceased KR20120026640A (ko) 2003-11-26 2004-10-20 양이온 경화성 조성물
KR1020067010230A Expired - Fee Related KR101225220B1 (ko) 2003-11-26 2004-10-20 양이온 경화성 조성물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020067010230A Expired - Fee Related KR101225220B1 (ko) 2003-11-26 2004-10-20 양이온 경화성 조성물

Country Status (8)

Country Link
US (1) US7192991B2 (enExample)
EP (1) EP1694791B1 (enExample)
JP (1) JP4991306B2 (enExample)
KR (2) KR20120026640A (enExample)
CN (1) CN100545226C (enExample)
AT (1) ATE368086T1 (enExample)
DE (1) DE602004007824T2 (enExample)
WO (1) WO2005056704A1 (enExample)

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JP2008260737A (ja) * 2007-04-13 2008-10-30 Fujifilm Corp トリアリールアミン誘導体
JP5121287B2 (ja) * 2007-04-13 2013-01-16 富士フイルム株式会社 トリアリールアミン誘導体
TWI370525B (en) 2008-04-25 2012-08-11 Ind Tech Res Inst Encapsulant composition and method for fabricating encapsulant material
JP5137673B2 (ja) * 2008-04-26 2013-02-06 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
CN101597475B (zh) * 2008-06-04 2013-07-10 财团法人工业技术研究院 封装材料组成物及封装材料的制造方法
JP5247396B2 (ja) * 2008-07-02 2013-07-24 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
DE102009001855A1 (de) * 2009-03-25 2010-09-30 Henkel Ag & Co. Kgaa Verfahren zur Herstellung eines faserhaltigen Verbundwerkstoffs
US8785524B2 (en) * 2010-06-24 2014-07-22 Funai Electric Co., Ltd. Spray coatable adhesive for bonding silicon dies to rigid substrates
JP5684275B2 (ja) * 2010-09-24 2015-03-11 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
US8394575B2 (en) * 2010-09-30 2013-03-12 Lexmark International, Inc. Formulations for environmentally friendly photoresist film layers
US9616460B2 (en) * 2011-12-02 2017-04-11 Toyota Motor Engineering & Manufacturing North America, Inc. Terminate-on-demand cationic polymerization method for forming a two-dimensional coating
JP6044261B2 (ja) * 2012-10-22 2016-12-14 日立化成株式会社 異方導電性接着剤組成物
US9006360B2 (en) * 2012-10-24 2015-04-14 Prc-Desoto International, Inc. Controlled-release amine-catalyzed, sulfur-containing polymer and epdxy compositions
WO2014199626A1 (ja) * 2013-06-10 2014-12-18 三井化学株式会社 熱硬化性組成物、有機ｅｌ素子用面封止剤およびその硬化物
CN103937303B (zh) * 2014-03-21 2017-06-06 中国科学院化学研究所 一种阳离子聚合亲水性涂层材料及其在印刷版材制备中的应用
US9951252B2 (en) 2015-08-10 2018-04-24 Prc-Desoto International, Inc. Moisture-curable fuel-resistant sealant systems
EP4341354A4 (en) * 2021-05-21 2025-02-19 Henkel AG & Co. KGaA HARDENABLE COMPOSITION AND ITS USE

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US4250311A (en) * 1974-05-02 1981-02-10 General Electric Company P, As, and Sb hexafluoride onium salts as photoinitiators
US4173476A (en) * 1978-02-08 1979-11-06 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4216288A (en) * 1978-09-08 1980-08-05 General Electric Company Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents
US4430445A (en) * 1979-07-19 1984-02-07 Asahi Kasei Kogyo Kabushiki Kaisha Novel basic imidazolylmethylstyrene compound, its polymer, a process for the preparation thereof and a use as ion exchange resin
US4420605A (en) * 1980-12-31 1983-12-13 Mobil Oil Corporation Coating compositions having dual curing mechanisms
US4358571A (en) * 1981-03-10 1982-11-09 Mobil Oil Corporation Chemically modified imidazole curing catalysts for epoxy resin and powder coatings containing them
US5089536A (en) * 1982-11-22 1992-02-18 Minnesota Mining And Manufacturing Company Energy polmerizable compositions containing organometallic initiators
US4503211A (en) * 1984-05-31 1985-03-05 Minnesota Mining And Manufacturing Co. Epoxy resin curing agent, process and composition
DE3666442D1 (en) * 1985-04-02 1989-11-23 Ciba Geigy Ag Curable compositions
US4742148A (en) * 1987-04-17 1988-05-03 Hexcel Corporation Modified imidazole latent epoxy resin catalysts and systems comprising them
US4830855A (en) * 1987-11-13 1989-05-16 Landec Labs, Inc. Temperature-controlled active agent dispenser
US4985340A (en) * 1988-06-01 1991-01-15 Minnesota Mining And Manufacturing Company Energy curable compositions: two component curing agents
US5254354A (en) * 1990-12-07 1993-10-19 Landec Corporation Food package comprised of polymer with thermally responsive permeability
US5124417A (en) * 1990-02-12 1992-06-23 Minnesota Mining And Manufacturing Company Initiators for cationic polymerization
US5084586A (en) * 1990-02-12 1992-01-28 Minnesota Mining And Manufacturing Company Novel initiators for cationic polymerization
EP0511405A4 (en) 1990-11-16 1993-04-14 Nippon Kayaku Kabushiki Kaisha Cationically polymerizable organic material composition and stabilization of said composition
US5129180A (en) * 1990-12-07 1992-07-14 Landec Labs, Inc. Temperature sensitive seed germination control
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US5554664A (en) * 1995-03-06 1996-09-10 Minnesota Mining And Manufacturing Company Energy-activatable salts with fluorocarbon anions
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TW418215B (en) * 1995-03-13 2001-01-11 Ciba Sc Holding Ag A process for the production of three-dimensional articles in a stereolithography bath comprising the step of sequentially irradiating a plurality of layers of a liquid radiation-curable composition
US6060540A (en) * 1998-02-13 2000-05-09 Landec Corporation Modeling pastes
DE19810549A1 (de) * 1998-03-11 1999-09-16 Delo Industrieklebstoffe Gmbh Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung
AU3666799A (en) * 1998-04-27 1999-11-16 Dow Chemical Company, The Encapsulated active materials
US6133335A (en) * 1998-12-31 2000-10-17 3M Innovative Properties Company Photo-polymerizable compositions and articles made therefrom
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US6358354B1 (en) * 2000-07-05 2002-03-19 Lexmark International, Inc. UV and thermally curable adhesive formulation
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JP2004099796A (ja) * 2002-09-11 2004-04-02 Konica Minolta Holdings Inc 活性光線硬化型インクジェット用インク組成物およびインクジェット記録方法

Also Published As

Publication number Publication date
CN1886475A (zh) 2006-12-27
JP2007512414A (ja) 2007-05-17
KR20060131757A (ko) 2006-12-20
WO2005056704A1 (en) 2005-06-23
KR101225220B1 (ko) 2013-01-22
CN100545226C (zh) 2009-09-30
DE602004007824T2 (de) 2008-04-17
JP4991306B2 (ja) 2012-08-01
US20050113474A1 (en) 2005-05-26
DE602004007824D1 (de) 2007-09-06
US7192991B2 (en) 2007-03-20
ATE368086T1 (de) 2007-08-15
EP1694791A1 (en) 2006-08-30
EP1694791B1 (en) 2007-07-25

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