KR20120011201A - Method for transferring wafer using wafer transfer robot - Google Patents

Method for transferring wafer using wafer transfer robot Download PDF

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Publication number
KR20120011201A
KR20120011201A KR1020100072908A KR20100072908A KR20120011201A KR 20120011201 A KR20120011201 A KR 20120011201A KR 1020100072908 A KR1020100072908 A KR 1020100072908A KR 20100072908 A KR20100072908 A KR 20100072908A KR 20120011201 A KR20120011201 A KR 20120011201A
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KR
South Korea
Prior art keywords
wafer
transfer
conveying means
buffer
transferring
Prior art date
Application number
KR1020100072908A
Other languages
Korean (ko)
Inventor
이현호
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020100072908A priority Critical patent/KR20120011201A/en
Publication of KR20120011201A publication Critical patent/KR20120011201A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/025—Arms extensible telescopic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

In the wafer transfer method, the first transfer means including the first fixing portion to which the first wafer is fixed is transferred in the first direction. The body part is transferred in a direction perpendicular to the first direction, so that the first wafer is unloaded to the buffer part. The first conveying means is conveyed in a second direction opposite to the first direction, and at the same time, the second conveying means including a second fixing part on which the second wafer is fixed is conveyed in the first direction. The body portion is transferred in a direction perpendicular to the first direction so that the second wafer is unloaded from the buffer portion. The second conveying means is conveyed in the second direction. Thus, process efficiency can be increased during wafer transfer with the buffer portion.

Description

Wafer transfer method using wafer transfer robot {METHOD FOR TRANSFERRING WAFER USING WAFER TRANSFER ROBOT}

The present invention relates to a wafer transfer method using a wafer transfer robot, and more particularly to a wafer transfer method using a wafer transfer robot for transferring the wafer between the buffer portion in the semiconductor manufacturing process.

In the case of moving a wafer from one of the various processes of semiconductor manufacturing to another, or importing / exporting a wafer from the outside into the semiconductor manufacturing chamber, the processing time of each process In order to solve the problem of difference and improve the efficiency of the process, the wafer is temporarily moved to the buffer.

In general, wafers are loaded / exported into / outside the buffer unit while a plurality of wafers are loaded in the buffer unit, and wafers are loaded / exported into / outside the buffer unit to increase the efficiency of the semiconductor manufacturing process. It is necessary to minimize the time to do this.

Meanwhile, when the wafers of the buffer portions are loaded / exported by a wafer transfer robot having one transfer means, n unloading or loading processes are required to load or unload n wafers. A problem arises in that the import / export time of the is increased.

In order to solve this problem, a wafer transfer robot has been developed for loading and unloading two or more wafers through corresponding two or more transfer means, but in this case, after one wafer has been loaded or unloaded, Since loading or unloading is performed on another wafer, there is a problem in that work efficiency is lowered. Furthermore, in the semiconductor manufacturing process, when the distance between slots, such as a buffer, to which wafers are fixed and the distance between two or more transfer means, are different from each other, it is difficult to apply a separate control method. A problem occurs.

The technical problem of the present invention was conceived in this respect, and an object of the present invention is to provide a wafer transfer method using a wafer transfer robot with improved work efficiency.

In the wafer transfer method according to an embodiment for realizing the above object of the present invention, the first transfer means including a first fixing portion to which the first wafer is fixed is transferred in the first direction. The body part is transferred in a direction perpendicular to the first direction, so that the first wafer is unloaded to the buffer part. The first conveying means is conveyed in a second direction opposite to the first direction, and at the same time, the second conveying means including a second fixing part on which the second wafer is fixed is conveyed in the first direction. The body part is transferred in a direction perpendicular to the first direction so that the second wafer is unloaded from the buffer part. The second conveying means is conveyed in the second direction.

The wafer transfer method may include transferring the second transfer means in the first direction, transferring the main body in a direction perpendicular to the first direction, and fixing the second wafer to the buffer unit. Loading the second conveying means in the second direction and simultaneously conveying the first conveying means in the first direction, perpendicular to the first direction. Transferring the main body in an in-direction, loading the first wafer fixed to the buffer into the first fixing part, and transferring the first transfer means in the second direction. It may include.

According to the present invention, since two wafers can be loaded / unloaded between the buffer unit and the wafer through a wafer transfer robot having two transfer means, the efficiency of the semiconductor manufacturing process can be increased. In particular, when the first conveying means is conveyed in one direction, the second conveying means is also conveyed simultaneously in the direction opposite to the direction, thereby increasing the efficiency of the loading / unloading process of the wafer.

As such, when the wafer transfer time is reduced between the buffer unit, the speed of the transfer means can be relatively reduced to improve the durability of the wafer transfer robot, and the wafer transfer robot can be performed at a relatively low speed. The mechanical mechanism of can be implemented more stably.

In addition, when unloading the wafer into the slot of the buffer unit or loading the wafer from the slot of the buffer unit, the transfer robot is moved up and down in consideration of the gap between the slots of the buffer unit and the gap between the transfer means of the transfer robot. By adding a step, two transfer means can be simultaneously transferred irrespective of the spacing of the slots of the buffer portion.

1 is a perspective view illustrating a wafer transfer robot and a buffer unit for implementing a wafer transfer method according to an embodiment of the present invention.
2A through 2E are side views sequentially illustrating a wafer transfer method using the wafer transfer robot of FIG. 1.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings.

1 is a perspective view illustrating a wafer transfer robot and a buffer unit for implementing a wafer transfer method according to an embodiment of the present invention.

Referring to FIG. 1, the wafer transfer robot 100 for implementing the wafer transfer method according to the present embodiment includes a main body 10, a first transfer means 20, and a second transfer means 30. . On the other hand, the wafer transfer method in the present embodiment is preferably applied when loading and unloading the wafer between the buffer unit 40 in the semiconductor manufacturing process, for convenience of description in FIG. The buffer part 40 is shown.

The body part 10 includes first and second guide parts 11 and 12, and is spaced apart from the buffer part 40 by the transport distance of the first and second transport means 20 and 30. Is placed.

The first and second guide parts 11 and 12 guide the first and second transfer means 20 and 30, respectively. Specifically, each of the first and second transfer means 20 and 30 is guided by the first and second guide parts 11 and 12 to be transported on the main body part 10. In this case, the first and second guide parts 11 and 12 may be guide rails, and one ends of the first and second transfer means 20 and 30 are fixed and transferred on the guide rails. In FIG. 1, the first guide part 11 is formed at a position lower than the second guide part 12, but the predetermined position is such that the first and second guide parts 11 and 12 do not overlap each other. Enough distance apart.

Meanwhile, the first and second guide parts 11 and 12 are formed on the side surface of the main body part 10 to easily implement the transfer mechanism of the first and second transfer means 20 and 30. It is preferred, but not limited to.

On the other hand, a control unit (not shown) is provided inside the main body unit 10, the control unit controls the transfer of the first and second transfer means (20, 30). In particular, the controller may be configured in consideration of a gap between the slots 41 and 42 formed to fix the wafers to the buffer unit 40 and a gap between the first and second transfer means 20 and 30. By controlling the amount of moving the portion 10 up and down, the first and second transfer means (20, 30) enables a stable operation when loading and unloading the wafers.

As a result, in the wafer transfer method according to the present embodiment, the wafers can be stably loaded and unloaded by changing the amount of moving the main body 10 up and down even if the interval between the slots formed in the buffer unit 40 changes. have.

The first conveying means 20 includes a first fixing part 21 and a first frame part 22. The first wafer 24, which the first transfer means 20 transfers, is fixed to the first fixing part 21, and an end portion of the first wafer 24, such as a tong shape, is fixed to secure the first wafer 24. It is divided into dogs. Meanwhile, a first protrusion 23 may be further formed in the first transfer means 20 to stably transfer the first wafer 24. The first protrusion 23 protrudes to contact the outer circumferential surface of the first wafer 24 to fix the first wafer 24 so that the first wafer 24 is not separated during the transfer.

The first frame part 22 extends from the first fixing part 21 to be formed parallel to the upper surface of the main body part 10, and extends therefrom to be parallel to the side of the main body part 10. And a portion extending therefrom and fixed to the first guide portion 11 of the body portion 10. That is, the first frame part 22 extends from the first fixing part 21 and is fixed to the first guide part 11, and is preferably formed in a thin plate shape having high rigidity. In the present embodiment, since the first guide portion 11 is formed on the side surface of the main body portion 10, it is preferable that the first frame portion 22 is also formed in a shape as shown in the drawing. The first frame part 22 may be formed in various shapes according to the formation position of the first guide part 11.

The second conveying means 30 includes a second fixing part 31 and a second frame part 32. The second fixing part 31 is formed substantially the same as the first fixing part 21, and the second wafer 34 is fixed to the end portion of the tongs. Similarly, a second protrusion 33 for stably transferring the second wafer 34 may be further formed on the second transfer means 20, and the second protrusion 33 may also be formed on the second wafer ( 34) protrudes in contact with the outer peripheral surface.

The second frame portion 32 is also formed in a shape similar to the first frame portion 22. That is, the second frame portion 32 also extends from the second fixing portion 31 to be formed parallel to the upper surface of the main body portion 10, extending therefrom and parallel to the side of the main body portion 10. And a portion extending from the fixed portion to the second guide portion 21 of the main body portion 10. That is, the second frame part 32 also extends from the second fixing part 31 to be fixed to the second guide part 21 and is preferably formed in a thin plate shape having high rigidity.

However, since the first conveying means 20 and the second conveying means 30 must be conveyed without colliding with each other on the same trajectory, the first conveying means 20 is relatively as shown in FIG. 1. The second conveying means 30 is conveyed along the first guide portion 11 positioned below the second conveying means 30 in the space between the first conveying means 20 and the main body portion 10. It is preferred to be designed to be transported along 11). Therefore, the second fixing part 31 and the second frame part 32 are transferred in the space between the first fixing part 21 and the first frame part 22 and the main body part 10, respectively.

In addition, although not shown, in addition to the first and second conveying means, if additional conveying means are provided, the guide portions for conveying the additional conveying means are transported in order to be conveyed without colliding with each other on the same trajectory. It is preferably formed at a position lower than the first guide portion 11 of the) and the additional conveying means are conveyed from the upper portion of the first conveying means (20).

On the other hand, the buffer unit 40 is a configuration for explaining the transfer method of the first and second transfer means (20, 30), as shown in the slots 41, 42 to which the wafer can be fixed, respectively ). For example, a first wafer 24 conveyed by the first conveying means 20 may be fixed to the first slot 41, and the second conveying means may be fixed to the second slot 42. The second wafer 34 carried by 30 may be fixed. The intervals between the slots may be formed in various ways. As described above, the controller of the main body 10 may move up and down the main body 10 in consideration of information on the intervals between the slots in advance. To control the displacement.

2A through 2E are side views sequentially illustrating a wafer transfer method using the wafer transfer robot of FIG. 1. 2A to 2E, each step of the wafer transfer method according to the present embodiment will be described below. In the present embodiment, a transfer method for transferring two wafers by mounting two transfer means is illustrated. However, even when three or more transfer means are mounted to transfer three wafers, the transfer method according to the present embodiment, that is, A conveying method in which the conveying means cross each other and are conveyed in opposite directions can be applied.

Referring to FIG. 2A, the first wafer 24 is guided by the first guide part 11 and transferred in the first direction D1 to be fixed to the first fixing part 21. ) Is positioned above the first slot 41 of the buffer unit 40 (step ①).

Subsequently, referring to FIG. 2B, the controller considers the position of the first wafer 24 and the position of the first slot 41 of the buffer unit in step 1, so that the main body 10 is moved to the first portion. It moves to the lower direction perpendicular to the direction D1 (step ②). Thus, the first wafer 24 is unloaded into the first slot 41.

Thereafter, referring to FIG. 2C, the first transfer means 20 is guided by the first guide part 11 and is transferred in a second direction D2 opposite to the first direction D1. At the same time, the second conveying means 30 is guided by the second guide part 12 and is conveyed in the first direction D1. That is, the first and second transfer means 20 and 30 are simultaneously transferred in opposite directions. Thus, the second wafer 34 fixed to the second fixing part 31 is located above the second slot 42 of the buffer part 40 (step ③).

Subsequently, referring to FIG. 2D, the controller considers the position of the second wafer 34 and the position of the second slot 42 of the buffer unit in step 3 so that the main body 10 is removed. It moves to the lower direction perpendicular to the 1st direction D1 and the 2nd direction D2 (step ④). Thus, the second wafer 34 is unloaded into the second slot 42.

Thereafter, referring to FIG. 2E, the second conveying means 30 is guided by the second guide part 12 and is conveyed in the second direction D2. In this case, the first conveying means ( 20 maintains the stationary state so that the first and second transfer means 20, 30 are positioned at the same position and overlap each other (step ⑤).

Through the wafer transfer method according to the present embodiment, the first and second wafers 24 and 34 are respectively fixed to the first and second slots 41 and 42 of the buffer unit, respectively, to unload the wafers. The process ends.

Hereinafter, referring to FIGS. 2A to 2E again, the loading process of the first and second wafers in the wafer transfer method according to the present embodiment will be described. The loading process of the first and second wafers is the same as the reverse step of the unloading process described above, and is specifically as follows.

Referring again to FIG. 2E, of the first and second transfer means 20 and 30 overlapping each other, the second transfer means 30 is guided by the second guide part 12. It is transferred in the first direction D1 and is positioned below the second wafer 34.

Subsequently, referring again to FIG. 2D, the controller considers the position of the second wafer 34 and the position of the second slot 42 of the buffer unit, and moves the main body unit 10 in the first direction ( D1) and the upper direction perpendicular to the second direction D2. Thus, the second wafer 34 is loaded into the second fixing part 31.

After that, referring again to FIG. 2C, the second transfer means 30 loaded with the second wafer 34 is guided by the second guide part 12 and transferred in the second direction D2. At the same time, the first conveying means 20 is guided by the first guide part 11 and is conveyed in the first direction D1. That is, the first and second transfer means 20 and 30 are simultaneously transferred in opposite directions. Thus, the first transfer means 20 is located below the first wafer 24.

Subsequently, referring again to FIG. 2B, the controller considers the position of the first wafer 24 and the position of the first slot 41 of the buffer unit, and moves the main body 10 to the first direction D1. ) And an upper direction perpendicular to the second direction D2. Thus, the first wafer 24 is loaded into the first fixing part 21.

After that, referring again to FIG. 2A, the first conveying means 20 is guided by the first guide part 11 and is conveyed in the second direction D2. In this case, the second conveying means ( 30 maintains the stationary state so that the first and second transfer means 20 and 30 are overlapped and positioned at the same position with the first and second wafers 24 and 34 fixed, respectively. .

Through the wafer transfer method according to the present embodiment, the first and second wafers 24 and 34 are transferred from the first and second slots 41 and 42 of the buffer unit, respectively. The means 20 and 30 are fixed respectively to terminate the loading process of the wafers.

As such, according to the present invention, two wafers may be loaded / unloaded between the buffer unit and the wafer through a wafer transfer robot having two transfer means, thereby increasing the efficiency of the semiconductor manufacturing process. In particular, when the first conveying means is conveyed in one direction, the second conveying means is also conveyed simultaneously in the direction opposite to the direction, thereby increasing the efficiency of the loading / unloading process of the wafer.

As such, when the wafer transfer time is reduced between the buffer unit, the speed of the transfer means can be relatively reduced to improve the durability of the wafer transfer robot, and the wafer transfer robot can be performed at a relatively low speed. The mechanical mechanism of can be implemented more stably.

In addition, when unloading the wafer into the slot of the buffer unit or loading the wafer from the slot of the buffer unit, the transfer robot is moved up and down in consideration of the gap between the slots of the buffer unit and the gap between the transfer means of the transfer robot. By adding a step, two transfer means can be simultaneously transferred irrespective of the spacing of the slots of the buffer portion.

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

The present invention has industrial applicability that can be used for wafer transfer for semiconductor manufacturing processes.

100: wafer transfer robot 10: main body
20: first transfer means 30: second transfer means
40: buffer part

Claims (2)

Transferring a first conveying means in a first direction, the first conveying means including a first fixing part on which a first wafer is fixed;
Transferring the main body in a direction perpendicular to the first direction to unload the first wafer into a buffer;
Conveying the first conveying means in a second direction opposite to the first direction and simultaneously conveying the second conveying means in the first direction, the second conveying means including a second fixing part on which the second wafer is fixed;
Transferring the body part in a direction perpendicular to the first direction to unload the second wafer to the buffer part; And
And transferring the second transfer means in the second direction. The method of claim 1, further comprising: conveying the second conveying means in the first direction;
Transferring the main body in a direction perpendicular to the first direction to load the second wafer fixed to the buffer into the second fixing part;
Conveying the second conveying means in the second direction and simultaneously conveying the first conveying means in the first direction;
Transferring the main body in a direction perpendicular to the first direction to load the first wafer fixed to the buffer into the first fixing part; And
Wafer transfer method further comprising the step of transferring the first transfer means in the second direction.
KR1020100072908A 2010-07-28 2010-07-28 Method for transferring wafer using wafer transfer robot KR20120011201A (en)

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KR1020100072908A KR20120011201A (en) 2010-07-28 2010-07-28 Method for transferring wafer using wafer transfer robot

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Application Number Priority Date Filing Date Title
KR1020100072908A KR20120011201A (en) 2010-07-28 2010-07-28 Method for transferring wafer using wafer transfer robot

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KR20120011201A true KR20120011201A (en) 2012-02-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101942310B1 (en) * 2018-09-11 2019-01-25 (주)포톤 Buffer device for semiconductor equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101942310B1 (en) * 2018-09-11 2019-01-25 (주)포톤 Buffer device for semiconductor equipment

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