KR20120009334A - plating rack assembly - Google Patents

Abstract

PURPOSE: A rack assembly for plating is provided to simply and rapidly fix a substrate to a rack body through the linear motion of transfer bars. CONSTITUTION: A rack assembly for plating comprises a rack body(2), transfer bars(4), guide units(6), and pressing units(8). The rack body has supports corresponding to the edge of a substrate. The transfer bars are arranged by corresponding to the supports of the rack body. The guide units linearly guide the transfer bars along the supports. The pressing units press the edge of the substrate to fix and unfix the substrate to/from the supports.

Description

Plating rack assembly

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rack assembly for plating used for plating work on substrates for manufacturing various thin film circuit boards (eg, printed circuit boards).

In general, during the manufacturing process of a thin-film circuit board such as a printed circuit board (Printed Circuit Board) there is a process of plating a part surface (exposed surface of the circuit pattern) of the circuit board manufacturing substrate.

The electroplating method of advancing the board | substrate for circuit board manufacture in the state which immersed the board | substrate for circuit board manufacture in the electrolyte solution of a plating bath is widely known, and a plating rack is used as an apparatus which mounts a board for circuit board manufacture in a fixed state and dips it in a plating bath.

The plating rack is formed to be mounted in a flat unfolded state by pressing at least two or more places among edges of a circuit board manufacturing substrate.

These plating racks may be of various types depending on the pressing method, but the plating rack of the rotational pressure fixing method, which is formed to press the fixed edge or release the fixed state by pressing the edge of the circuit board manufacturing substrate, is mainly used by the rotation of the rotational arm.

However, the plated rack of the rotational pressure fixing method has the following disadvantages when pressing or fixing the substrate for manufacturing the circuit board, or release the fixed state.

That is, a relatively large operation space (rotation radius) must be secured in advance for the rotational operation of the rotational arm, and thus it is difficult to expect satisfactory operation convenience because many restrictions may be applied to the operation space.

In particular, if the operation convenience is not good, the circuit board manufacturing substrates can not be fixed (loaded) or separated (unloaded) quickly on the plating rack side, which can be a factor that greatly reduces workability and productivity.

In addition, since a separate locking device must be additionally installed in order to fix the pivotal arm while pressing the edge of the circuit board manufacturing substrate, not only the structure is complicated, but also excessive manufacturing cost may be required.

The present invention has been proposed to solve the above problems,

It is an object of the present invention, in particular, to provide a rack assembly for plating that can easily and quickly fix or release the fixing state of the circuit board manufacturing substrate in a slide pressure fixing method by linear motion.

In order to achieve the object as described above,

A rack body having supports arranged to correspond to opposite edges of the circuit board manufacturing substrate;

Transfer bars disposed to correspond to the supports of the rack body;

A guide part formed to guide the transfer bars to a linear motion on a support side of the rack body;

Pressurizing means configured to pressurize an opposite edge of the substrate for manufacturing a circuit board by pressing power during linear movement of the transfer bars to press-fix or release the fixing state on the support side;

It provides a rack assembly for plating comprising a.

The present invention operates the transfer bars provided on the rack main body side in a linear motion direction to press and fix the opposite edges of the circuit board manufacturing substrate during linear motion (slide pressure fixing method) to the rack main body side. It can be fixed in the state which can be plated, or can be released.

In particular, the slide pressure fixing method of the present invention, for example, compared to the rotation pressure fixing method for holding the substrate by operating the rotational arm in the rotational direction as in the conventional plating racks, the substrate for circuit board manufacturing in a linear motion further It can be held quickly and easily, and because of the nature of the linear motion, it is not necessary to secure excessive operating space, thereby further increasing space utilization.

1 and 2 are views schematically showing the structure of the entire and main parts of the plating rack assembly according to an embodiment of the present invention.
3 to 7 are views for explaining the preferred operation of the plating rack assembly according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

The embodiments of the present invention will be described by those skilled in the art to which the present invention is applicable.

Therefore, since the embodiments of the present invention can be modified in various other forms, the claims of the present invention are not limited to the embodiments described below.

1 and 2 are views schematically showing the structure of the entire and main parts of the plating rack assembly according to an embodiment of the present invention, 2 denotes a rack body.

The rack body 2 is provided with two supports F, which are arranged to correspond with at least opposite edges of the edges of the circuit board manufacturing substrate G (hereinafter referred to as "substrate"). .

That is, the rack main body 2 has a rectangular frame provided with the support members F arranged in parallel with the left and right edges of the substrate G so as to correspond to the left and right edges. It may be made in the form.

The upper part of the rack body (2) is provided with a normal rinsing (2a, hanger). Although not shown in the drawing, this rinse 2a is hooked on the hook side of a conventional conveying apparatus installed in a plating workshop, that is, a hoist, so that the rack body 2 can be smoothly transported.

Plating rack assembly according to an embodiment of the present invention, the transfer bar (4) disposed to correspond to the support (F) of the rack body (2), and the transfer bar (4) to the support (F) It includes a guide portion (6) formed to guide in a linear motion to the side.

The transfer bars 4 have a length corresponding to that of the support F and are arranged in parallel with the supports F in front of the respective supports F when the reference is made to FIG. 1.

The transfer bars 4 are formed to have an outer surface that can suppress friction when the linear movement direction is guided by the guide part 6 to be described later.

The guide portion 6 is configured to guide the transfer bar 4 to the linear movement on the side of the support (F).

In particular, the guide portion 6 is formed to guide the linear movement while holding the outer surface of the transfer bar 4 on the support (F) side.

 Referring again to FIGS. 1 and 2, the guide part 6 may be configured as a guide block B having a guide hole B1.

The guide hole (B1) has a size to which the transfer bar (4) can be fitted, is provided in a state penetrating toward the other side from one side of the guide block (B).

The guide blocks (B) are, for example, so that the transfer bar (4) disposed on the rack body 2 side can be linearly moved along the longitudinal direction, for example, as shown in Figure 1 of the transfer bar (4) It is installed on the side of the support (F) to hold the upper and lower portions to the guide holes (H).

Although not shown in the drawings, the guide blocks B may be fixedly installed or detachably fixed to the side of the support F in such a manner as to fasten a fastening member such as a welding joint or a bolt.

The guide part 6 may guide the transfer bars 4 to be linearly moved along the length direction on the support F side by pushing or pulling one end or the other end of the transfer bars 4. have.

Although not shown in the drawings, a bush or an oilless bearing may be provided inside the guide hole B1, for example. Then, it is possible to reduce the friction or noise generated when the transfer bar 4 is moved in the state fitted in the guide hole (B1) side.

In addition, a handle K may be installed on the transfer bar 4 side as shown in FIG. 1. Then, the user can move the transfer bar 4 more easily while holding the handle (K) by hand.

On the other hand, the plating rack assembly according to an embodiment of the present invention, the pressing means (8) formed to press-fix or release the fixed state of the substrate (G) on the rack body (2) side.

In particular, the pressing means 8 is formed to receive a power during the linear movement of the transfer bar 4 to be a pressing operation.

Referring again to FIGS. 1 and 2, the pressing means 8 includes a pressing part 10 arranged to correspond to the edge of the substrate G on the side of the support body F of the rack body 2, and the transfer unit 10. It includes a power transmission portion 12 formed to generate and transmit the power for the pressing portion 10 pressing operation during the linear movement of the bar (4).

The pressing means 8 may be provided at at least one or more points on the side of the support body F of the rack body 2, and in this embodiment, the pressing means 8 is provided at two points of the respective supporters F. As an example.

The pressing portion 10 is composed of a first pressing hole (P1) and the second pressing hole (P2), the pressing holes (P1, P2) between the edge of the substrate (G) on the side of the support (F). Are placed in a state corresponding to each other.

That is, based on FIG. 2, the first pressing hole P1 is disposed on the support 2 side to correspond to the edge back surface of the substrate G, and the second pressing hole P2 is disposed on the substrate G. ) Is arranged to correspond to the front face of the edge.

The power transmission unit 12 is configured to pressurize or depressurize while moving any one of the pressurizing ports P1 and P2 with a contact force during the molding movement of the transfer bar 4.

In the present embodiment, the first pressing device (P1) is fixed to the support (F) side, the second fixing device (P2) by the power transmission unit 12 to move the structure to enable an example as an example Explain.

That is, the power transmission unit 12, the first contact hole (M1) provided on the side of the transfer bar 4 so as to move in a linear movement direction along the transfer bar (4), the first contact hole It may be composed of a second contact hole (M2) formed to move the second pressing hole (P2) by the contact force of (M1).

The first contact hole M1 is installed at a point corresponding to the second pressing hole P2 on the transfer bar 4 side, and the second contact hole M2 during the linear movement of the transfer bar 4. ) It is formed to press one side.

That is, the first contact hole M1 may have a pressing surface Q that is inclined in a substantially cone shape and may be installed to cover one side of the outer surface of the transfer bar 4.

The pressing surface Q is formed in an inclined state from one side to the other side along the linear movement direction of the transfer bar 4.

The second contact hole M2 is provided with the second pressing hole P2 at one side thereof, and is disposed to correspond to the first contact hole M1 at the support F side of the rack body 2. do.

That is, the second contact hole M2 is in contact with the inclined surface Q of the first contact hole M1 during the linear movement of the transfer bar 4 to be substantially perpendicular to the linear movement direction of the transfer bar 4. The second pressing port (P2) is set to be pressed to the first pressing port (P1) side while moving in the direction of forming a.

The second contact hole M2 is, for example, as shown in Figs. 1 and 2 is fitted on the side of a separate guide port (M3) on the support (F) to press or pressurized by the guide port (M3) Can be installed so that the release direction is guided.

Then, the second contact hole (M2) can be moved only in the pressurized or depressurized direction while the movement direction is guided by the guide (M3) on the support (F) side can increase the operating stability.

In the above description, the first pressing tool P1 is fixed to the side of the support F, and the second pressing tool P2 is fixed to the second contact hole M2 as an example. The second pressure port P2 is fixed to the side of the support F, and the first pressure port P1 is fixed to the side of the second contact hole M2 so that the first pressure port P1 can be pressed. It may be set to move.

In addition, the transfer bar 4 may be fitted in a direction penetrating the upper portion of the guide sphere M3, for example, as shown in FIG. 2.

Then, the second contact hole M2 may be prevented from being separated from the guide hole M3, thereby preventing the second contact hole M2 from being abnormally separated from the support base F.

Plating rack assembly according to an embodiment of the present invention, by fixing the opposite edge of the substrate (G) to the support (F) side of the rack body 2 can be mounted so that the plating operation.

In particular, the present invention can be more quickly and simply mount the substrate (G) on the rack body 2 side by the slide pressure fixing method by the linear movement of the transfer bar (4).

3 to 5 are views for explaining the preferred operation of the plating rack assembly according to an embodiment of the present invention, the preferred operation of the plating rack assembly with reference to the drawings as follows.

As shown in FIG. 3, the opposite edge of the substrate G is provided between the first pressing hole P1 and the second pressing hole P2 of the pressing part 10 provided on the side of the support body F of the rack body 2. Place it.

Then, as shown in FIG. 4, when the transfer bar 4 is pushed or pulled along one side in the longitudinal direction, the transfer bar 4 moves in a straight direction on the support F side.

During the linear movement of the transfer bar 4, the second contact hole M2 is pushed by the first contact hole M1 of the power transmission unit 12, and the second contact hole M2 is pressed.

Then, since the second pressing hole P2 provided at the side of the second contact hole M2 moves toward the first pressing hole P1 as shown in FIG. 5, both sides of the edge of the substrate G are formed. It is pressed by the 1st press opening P1 and the 2nd press opening P2, and it will be in the pressurized state.

Therefore, both sides of the opposite edges of the substrate G are pressed by the first pressing holes P1 and the second pressing holes P2 and fixed to the sides of the supports F, respectively. The substrate G may be mounted on the 2) side in a flat unfolded state.

In addition, although not shown in the drawing, when the transfer bar 4 is pulled or pushed in the opposite direction, the pressed state of the second pressing hole P2 is released, so that the substrate G may be separated from the rack main body 2. .

In particular, the slide pressure fixing method by the linear motion operation of the transfer bar 4 as described above, although not shown in the drawing, for example, compared with the so-called rotational pressure fixing method of pressing and fixing the substrate while moving by the rotational operation of the rotating arm. When the structure is simple, it is possible not only to quickly press and release the operation, but also to operate in a narrow space, thereby ensuring further improved operation convenience.

Plating rack assembly according to an embodiment of the present invention, may be made by further comprising a position adjusting portion 14 corresponding to the pressing portion 10.

The position adjusting unit 14 may be formed of a position adjusting bar S so as to appropriately adjust the position of the second pressing hole P2 in the pressing unit 10.

Referring back to Figures 1 and 2, the positioning bar (S) is formed in a substantially "??" shape so that both ends of the guide block (B) on both opposite sides of the rack body (2) One end of the second contact hole M2 inserted in the penetrating direction and provided with the second pressing hole P2 may be fixed as shown in the drawing.

Then, as shown in FIG. 7, the second contact hole M2 is guided to the guide hole M3 when the position adjusting bar S slides in the left and right directions on the rack body 2 side. Since it moves together, it is possible to appropriately adjust the pressing position of the second pressing port (P2) by pushing or pulling the position adjustment bar (S) in the slide direction.

According to such a structure, for example, when fixing (loading) or separating (unloading) the substrate G on the rack main body 2 side, a part of the edge of the substrate G is the second pressing hole P2. ) Or contact with the second contact hole M2 can be suppressed.

Therefore, if the position adjusting unit 14 is further provided, not only the loading or unloading operation of the substrate G is easy, but also a portion of the edge of the substrate G is broken by contact or the like during loading or unloading. The phenomenon of deformation can be prevented.

And, the position adjusting bar (S) may use a metal bar or synthetic resin bar having an elastic force. Then, the second pressure port (P2) is pressed by the contact force by the transfer of the transfer bar 4, or the position adjustment bar (S) is elastically curved when the pressing operation is released, the second pressure port The pressing operation or the pressing release operation of P2 may be performed smoothly.

2: rack body 4: transfer bar 6: guide part
8: pressurizing means 10: pressurizing portion 12: power transmission portion
14: position adjusting part G: substrate F: support

Claims (9)

A rack body having supports arranged to correspond to opposite edges of the circuit board manufacturing substrate;
Transfer bars disposed to correspond to the supports of the rack body;
A guide part formed to guide the transfer bars to a linear motion on a support side of the rack body;
Pressurizing means configured to pressurize an opposite edge of the substrate for manufacturing a circuit board by pressing power during linear movement of the transfer bars to press-fix or release the fixing state on the support side;
Rack assembly for plating comprising a. The method according to claim 1,
The rack body,
The rack assembly for the plating is provided spaced apart and parallel to each other spaced apart. The method according to claim 1,
The transfer bar,
Plating rack assembly disposed in parallel with the support on the support side of the rack body. The method according to claim 1,
The guide unit,
Guide block,
The guide block,
A guide hole fitted in a direction in which the transfer bar penetrates, and is installed at one or more points of the support, and is set to allow the transfer bar to be linearly moved from the support side along a longitudinal direction. assembly. The method according to claim 1,
The pressing means,
A pressing part including a first pressing hole and a second pressing hole which are arranged to correspond to one edge and the other surface of the circuit board manufacturing substrate at a support side of the rack body;
A power transmission unit configured to generate and transmit power for the pressing operation of the first or second pressing port during the linear movement of the transfer bar;
Rack assembly for plating comprising a. The method according to claim 5,
The power transmission unit,
A first contact hole provided on the side of the transfer bar so as to move in a linear movement direction along the transfer bar, and an agent formed to move the first pressing hole or the second pressing hole in the pressing direction by the contact force of the first contact hole. Plating rack assembly consisting of two contacts. The method of claim 6,
The first contact hole,
Plating rack assembly having an inclined surface inclined along the linear transfer direction of the transfer bar, and is set to push one side of the second contact hole to the inclined surface during the linear movement of the transfer bar. The method of claim 6,
The second contact hole,
Plating, characterized in that any one of the first pressure port and the second pressure port is installed on one side and is set so that the pressing operation toward the other pressure port while moving by the contact force of the first contact hole. Rack assembly. The method according to claim 1 or 5,
The plating rack assembly,
Further comprising a position adjusting portion corresponding to the pressing means,
The position adjusting unit,
It is composed of a position adjustment bar, the position adjustment bar is installed to enable the slide movement toward the inside or the outside of the rack body on the support to adjust the position in the push or pull the second pressure port during the slide movement Plating rack assembly, characterized in that set.

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