KR20120005357A

KR20120005357A - Multi-cooling apparatus for computer's part

Info

Publication number: KR20120005357A
Application number: KR1020100067302A
Authority: KR
Inventors: 이광로
Original assignee: 이광로
Priority date: 2010-07-08
Filing date: 2010-07-13
Publication date: 2012-01-16

Abstract

PURPOSE: A computer component complex cooling apparatus is provided to improve the lifetime of a computer component by providing air-cooling effects and liquid-cooling effects. CONSTITUTION: The main body of a housing unit(10) includes a space unit in the inside of the housing unit. The space unit includes radiant heat pins in the inside of a radiant heat panel(13) and a connection unit(17) in the bottom of the radiant heat panel. A water supply unit(21) and a water discharging unit(22) supply cooling water the upper side of the radiant heat panel selectively. An inhalation unit(30) and an exhaust unit(31) are installed the both sides of the housing unit and supply external air to the inside of the space unit.

Description

MULTI-COOLING APPARATUS FOR COMPUTER'S PART}

The present invention relates to a complex cooling device for computer parts, and more specifically, by providing a cooling effect using evaporative heat in addition to the air-cooled cooling and water cooling cooling effect, for example, CPI (CPU; central processing unit), ground oil The present invention relates to a composite cooling device for computer parts, in which heat generated from computer parts such as a GPU, a north bridge, and a south bridge is effectively cooled to significantly improve the life of the computer part.

In general, the computer body generally includes sipe oil for controlling all operations of the computer, including data processing, sipe oil for graphic processing, and integrated circuit on the sipeil socket side of the computer main board. Northbridge, which refers to a system controller, and an integrated circuit on a peripheral component interconnect (PCI) slot side of a computer mainboard, are components such as a southbridge that manages power management or a USB interface.

These computer parts emit a relatively large amount of heat according to the operation of the computer. If such heat is not properly cooled or dissipated, a fatal failure occurs. Usually, the computer body is forced to introduce external air to the computer. The cooling fan for cooling the parts is integrally provided, or the heat sink and the cooling fan are integrally provided in the computer component itself such as Sipeu.

However, since cooling or heat dissipation of computer parts cannot be effectively performed by only a cooling fan, a structure for cooling computer parts by supplying cooling water separately has been developed. However, even in the case of the water-cooled cooling device for computer parts, cooling or heat dissipation of computer parts is required. There was a limiting issue in this.

Therefore, an object of the present invention is to provide a cooling effect using the heat of vaporization in addition to the air-cooling and water-cooled cooling effect, the heat generated from the computer component is effectively cooled to significantly improve the life of the computer component composite It is to provide a cooling device.

An object of the present invention described above is provided in the computer body to cool the computer component, the cooling device for a computer component, the space is formed inside the heat dissipation panel with a plurality of radiating fins protruding in the space is arranged to have a gradient. A housing main body having a contact portion in contact with the computer component arranged horizontally on a lower surface thereof, supply / drainage means for selectively supplying cooling water onto the heat dissipation panel, and installed on both sides of the housing main body, and the housing main body. Provided on both sides of the upper surface of the and is achieved by providing a composite cooling device for a computer component comprising a suction / exhaust means for selectively supplying external air in the space.

According to a preferred feature of the present invention, the above-described water supply / drainage means is provided on one side of the outside of the computer main body, and a cooling / draining device is provided to store and recollect the cooling water therein, and one end of one side of the water supply / drainage device. The other end is connected to a higher position of the housing body to supply the cooling water to the soundproof panel, and one end is connected to the other side of the water supply / drainage device and the other end is connected to a lower position of the housing body. It is to include a drain pipe for draining the cooling water flowing down the soundproof panel to the side of the water supply / drainage device.

According to a further preferred feature of the present invention, the aforementioned intake / exhaust means is installed at a higher position among the housing bodies and is installed at a lower position among the housing bodies and an intake fan for supplying external air to the soundproof panel side in the space. And an exhaust fan for forcibly releasing external air supplied to the soundproof panel side, and one end of which is connected to the exhaust fan side and the other end of which is connected to the outside of the computer main body, the external air containing moisture by the cooling water. Comprising exhaust pipes that exhaust the outside of the body

According to a more preferable feature of the present invention, the above-described heat dissipation fins are arranged side by side on the heat dissipation panel, the fins protruding long in the flow direction of air.

According to a further preferred feature of the present invention, a temperature sensor for determining whether the supply / drain means and the intake / exhaust means is provided on the contact portion of the housing body described above.

According to the complex cooling device for computer parts according to the present invention, the air flow is provided by the air circulation by the intake fan and the exhaust fan to the heat sink fins soaked with the coolant by the coolant supply unit and the water supply basin, so that the conventional air-cooling and water-cooling cooling effects In addition, since a cooling effect using vaporization heat as the cooling water supplied to the radiating fin is provided in combination, heat generated from the computer parts is effectively cooled, so that the life of the computer parts can be greatly improved.

1 is a side cross-sectional view of a composite cooling device for a computer component according to the present invention.
Figure 2 is a plan sectional view of a composite cooling device for computer parts according to the present invention.
Figure 3 is a state of use of the composite cooling device for computer parts according to the present invention.

Figure 1 is a side cross-sectional view of a composite cooling device for a computer component according to the present invention, Figure 2 is a cross-sectional plan view of a composite cooling device for a computer component according to the present invention, Figure 3 for the computer component according to the present invention A state diagram of the combined cooling system is shown.

The complex cooling device 1 for a computer component according to the present invention is provided in the computer main body and cools the computer component, wherein the space 11 is formed inside the space 11. The housing body 10 having a plurality of heat radiation fins 15 protruding from the heat dissipation panel 13 is disposed to have a gradient, the lower surface is provided with a contact portion 17 in contact with the computer component 50 arranged horizontally And supply / drainage means for selectively supplying cooling water on the heat dissipation panel 13 and installed on both sides of the housing main body 10, and installed on both sides of the upper surface of the housing main body 10. 11) intake / exhaust means for selectively supplying external air. Here, the contact portion 17 may be installed by changing the position of the contact portion appropriately to the position of the corresponding computer component 50 through screwing into the contact portion connection screw hole 19.

The housing body 10 is located on top of computer components, such as CPU (CPU; central processing unit), GPU, north bridge, south bridge, which will be described later. It is to serve to cool the computer component 50 by the components.

The housing body 10 has a space 11 formed therein, but a heat radiation panel 13 having a plurality of heat radiation fins 15 protruding therein is disposed in the space 11 so as to have a gradient, and horizontally on a lower surface thereof. A contact portion 17 is provided which is interviewed with the arranged computer part 50.

The housing main body 10 as described above is arranged horizontally in the same manner as the computer parts, and the above-mentioned space 11 has a coolant and external air, which will be described later, other than the drain pipe 21 or the exhaust fan 31. It is to be formed tightly so as not to leak to the outside through the position.

In addition, the above-described contact portion 17 is disposed on the upper side of the heated computer component and primarily conducts and radiates heat generated therefrom, so as to directly interview the upper portion of the computer component 50 to increase conduction efficiency. It is supposed to be formed of a metal member having high conductivity.

And the temperature sensor 40 is provided on the above-described contact portion 17, the temperature sensor 40 detects the heat conducting from the computer parts to operate the supply / drainage means and intake / exhaust means will be described later It is the role to decide.

That is, when the temperature sensor 40 detects a temperature higher than the predetermined temperature, the signal is sent to the supply / drain means by a wired / wireless method to supply the cooling water, and at the same time, to introduce external air from the intake / exhaust means. do. On the contrary, if the heat conducted from computer parts falls below a certain temperature due to the inflow of coolant and external air, it detects this and sends the corresponding signal to the supply / drain means and the intake / exhaust means by wired / wireless means to supply the supplied coolant and external air. Stop the inflow of

Such a temperature sensor 40 is the same as the temperature sensor 40 according to the prior art, further detailed description will be omitted for simplicity of the specification.

In addition, the above-described heat dissipation panel 13 is disposed inside the space 11 described above, and is disposed in a shape having a gradient so that cooling water to be described later can flow down by its own weight. That is, one side of the heat dissipation panel 13 is tightly connected to the inner wall of the space part 11 of the housing main body 10 so that the other side is disposed high and the other side is low, so that the coolant flowing on the heat dissipation panel 13 does not leak out. It shall be.

In addition, the heat dissipation fins 15 described above are arranged on the heat dissipation panel 13 at a height equal to that of the space, and are arranged in parallel with the heat dissipation fins in parallel in the same direction as the flow direction. This is to increase the cooling efficiency by maximizing the area. In this case, the above-described heat dissipation fins 15 may be provided in various thicknesses and shapes, and the arrangement may also be variously combined to achieve the best cooling effect.

In addition, the narrower the distance from the heat dissipation panel 13 to the upper surface of the housing main body 10 is, the faster the intake / exhaust speed of the external air is, thereby increasing the heat dissipation effect. It is preferable to set the position of the heat dissipation panel 13 in consideration of this because it may be leaked to the outside by the).

On the other hand, both sides of the housing main body 10 described above is provided with water supply / drainage means, the supply / drainage means being primarily supplied through the contact portion 17 by selectively supplying the cooling water on the heat dissipation panel 13 described above. It conducts the water-cooled heat radiation of the conducted heat radiation secondarily.

As described above, the water supply / drainage means includes a water supply / drainage device (not shown) which is provided on one side of the outside of the computer main body and stores the coolant therein so as to be supplied and recovered, and one end thereof is connected to one side of the water supply / drainage device. And the other end is connected to a high position of the housing body 10 to supply cooling water to the soundproof panel, and one end is connected to the other side of the water supply / drainage device, and the other end is to a lower position of the housing body 10. It comprises a drain pipe 21 is connected to drain the cooling water flowing down the soundproof panel to recover to the supply / drainage device side.

Here, although not shown, the water supply / drainage device is provided with a reservoir (not shown) for storing the coolant, and a pump (not shown) is provided to enable the supply / drainage of the coolant. In addition, the other end of the water supply pipe 20 described above is connected to a higher position of the housing body 10, but is connected to a position higher than the heat dissipation panel 13 so that the coolant can be supplied to the heat dissipation panel 13, and conversely, the drain pipe 21 is supposed to be connected to a position lower than the heat dissipation panel 13 so that the heat dissipation panel 13 flows down and then drains.

According to a more preferred feature of the invention the above-described water supply pipe 20 is connected to the water supply basin 22 provided on the upper end of the housing to supply the cooling water, the water supply basin 22 through the drain hole therein the cooling water in the housing 10 The cooling water flows down the inside of the heat dissipation fins 15 to serve to uniformly transmit the heat dissipation fins 15.

On the other hand, inlet / exhaust means is provided on both sides of the upper surface of the housing body 10 described above, the inlet / exhaust means selectively supply the external air into the space portion 11 provided with the heat dissipation panel 13 described above. By doing so, the third air-cooled heat of the second water-cooled heat through the supply / drainage means, and at the same time the fourth through the heat of vaporization generated by the opportunity of some of the cooling water on the heat dissipation panel 13 by the external air. It is to act as a heat radiation to vaporize.

As described above, the intake / exhaust means is provided at a high position in the housing main body 10, and an intake fan 30 that supplies external air to the soundproof panel side in the space 11, and a lower position in the housing main body 10. And an exhaust fan 31 for forced exhaust of external air supplied to the soundproof panel side, and one end of which is connected to the exhaust fan 31 side, and the other end of which is connected to the outside of the computer body, and retains moisture by cooling water. It includes a exhaust pipe 33 for exhausting the outside of the computer main body.

At this time, two intake fans 30 are respectively installed at a high position of the housing main body 10, and two exhaust fans 31 are respectively installed at a lower position of the housing main body 10. The exhaust pipe 33 described above is It is tightly connected to the outer edge of the exhaust fan 31 to prevent external air containing moisture from leaking into the computer body, thereby preventing the computer from malfunctioning due to moisture.

Hereinafter, the overall method of using the composite cooling device 1 for a computer component according to an exemplary embodiment of the present invention will be described as follows.

When the temperature of the computer component rises above the temperature set in the temperature sensor 40, the contact portion 17 conducts heat radiation primarily, and at the same time, the temperature sensor 40 sends a signal to the supply / drain means so that the water supply pipe 20 Cooling water is supplied through the fan), a signal is sent to the intake / exhaust means, and forced air is sucked and supplied through the intake fan (30).

At this time, the cooling water flows down from the high position to the low position along the heat dissipation panel 13 to the water of the heat dissipation panel 13 and the heat dissipation fin 15 in a secondary manner, and the forced air is radiated from the heat dissipation panel 13. The heat is passed through the 3rd side to the third rack heat dissipation.

At the same time, while the external air vaporizes the cooling water on the heat dissipation panel 13 and the heat dissipation fins 15, vaporization heat is generated to vaporize and heat the fourth air.

The coolant passing through the heat dissipation panel 13 side is drained to the water supply / drainage device (not shown) through the drain pipe 21, and similarly, the outside air passing through the heat dissipation panel 13 side is exhaust fan 31 and the exhaust pipe. Through 33 is safely vented to the outside of the computer body.

When the coolant and the external air are continuously supplied and the temperature of the computer component falls below the temperature set by the temperature sensor 40, the temperature sensor 40 sends a corresponding signal to the supply / drain means and the intake / exhaust means, and the coolant and Stop supply of external air.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It is not limited.

1: compound cooling device for computer parts 10: housing body
11: space part 13: heat dissipation panel
15: heat radiation fin 17: contact portion
19: screw connection hole 20: water supply pipe
21: drain pipe 22: drinking fountain
30: intake fan 31: exhaust fan
33: exhaust pipe 40: temperature sensor
50: computer parts

Claims

A cooling device for computer parts provided in a computer body for cooling computer parts,
A housing body having a space portion formed therein, the heat dissipation panel having a plurality of heat dissipation fins protruding from the space portion, the housing body having a contact portion interviewing the horizontally arranged computer parts;
Supply / drainage means installed on both sides of the housing main body and selectively supplying cooling water onto the heat dissipation panel; And
And an intake / exhaust means for selectively supplying outside air into the space part and installed on both sides of the upper surface of the housing body.

The method according to claim 1,
The supply / drainage means may include a supply / drainage device provided at an external side outside the computer main body and configured to supply and recover cooling water therein, and one end of which is connected to one side of the supply / drainage device and the other end of the housing main body. A water supply pipe connected to a high position to supply the cooling water to the soundproof panel, and one end connected to the other side of the water supply / drainage device, and the other end connected to a lower position of the housing body to flow down the soundproof panel And a drainage pipe for draining the wastewater to the side of the water supply / drainage device.

The method according to claim 1,
The intake / exhaust means may include an intake fan installed at a higher position of the housing body and supplying external air to the soundproof panel side in the space portion, and an outside installed at a lower position of the housing body and supplied to the soundproof panel side. An exhaust fan for forced exhaust of air and one end connected to the exhaust fan side and the other end connected to the outside of the computer main body to exhaust the external air contained in the moisture by the cooling water to the outside of the computer main body. Complex cooling device for a computer component comprising a.

The method according to claim 1,
The heat dissipation fins are arranged on the heat dissipation panel, the cooling device for a computer component, characterized in that the heat dissipation fins are arranged densely in parallel in the flow direction in the same direction as the space portion.

The method according to any one of claims 1 to 4,
And a temperature sensor on the contact portion of the housing body to determine whether the supply / drain means and the intake / exhaust means are operated.

The method according to claim 1,
The contact portion is a structure in which the screw is coupled to the cooling unit main body, and the cooling unit can be applied by appropriately combining the position of the contact portion with the position of the corresponding computer component (heating unit) through the contact hole coupling screw hole in the cooling unit body. Combined cooling system for computer parts.

The water supply of the cooling water of claim 2 is first supplied to the water supply top of the housing
Cooling water from the inside of the drinking fountain is attached to the heat sink fin through the water supply hole in the bottom of the drinking fountain, and the water flows down the heat sink fin while uniformly wets the entire area of the vertical heat sink fin at the same time the water is supplied.