KR20120002157U - Semiconductor chip pick-up apparatus - Google Patents

Semiconductor chip pick-up apparatus Download PDF

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KR20120002157U
KR20120002157U KR2020100009706U KR20100009706U KR20120002157U KR 20120002157 U KR20120002157 U KR 20120002157U KR 2020100009706 U KR2020100009706 U KR 2020100009706U KR 20100009706 U KR20100009706 U KR 20100009706U KR 20120002157 U KR20120002157 U KR 20120002157U
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semiconductor chip
film
needle
needle hole
vacuum
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KR2020100009706U
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Korean (ko)
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KR200460715Y1 (en
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고윤성
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주식회사 프로텍
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 고안은, 필름으로부터 반도체 칩을 분리하는 과정에서 반도체 칩이 파손되거나 위치와 방향이 변경되지 않으면서 낮은 가격으로 제작할 수 있는 구조를 가진 반도체 칩 픽업 장치를 제공하는 것을 목적으로 한다.
본 고안은, 필름에 부착된 반도체 칩을 필름에서 디태칭(detaching)하는 반도체 칩 픽업 장치에 있어서, 진공에 의해 상기 필름을 흡착하도록 다공성 재질로 형성되고 니들 구멍이 마련된 이젝트 후드; 상기 이젝트 후드의 니들 구멍 상측에 배치되어 상기 필름에 부착된 반도체 칩을 흡착하여 상승시키면서 상기 필름으로부터 상기 반도체 칩을 디태칭하는 픽업 헤드; 및 상기 이젝트 후드의 니들 구멍에 배치되어 상기 픽업 헤드가 반도체 칩을 흡착하여 상승시킬 때 상기 니들 구멍으로부터 상승하여 상기 필름을 밀어 올리는 니들;을 포함하는 점에 특징이 있다.
본 고안의 반도체 칩 픽업 장치는, 작은 크기의 반도체 칩도 파손시키거나 방향과 각도를 변경시키지 않으면서 필름을 흡착하고 디태칭을 할 수 있는 반도체 칩 픽업 장치를 낮은 가격에 제공하는 효과가 있다.An object of the present invention is to provide a semiconductor chip pickup device having a structure that can be manufactured at a low price without damaging the semiconductor chip or changing position and orientation in the process of separating the semiconductor chip from the film.
The present invention provides a semiconductor chip pick-up apparatus for detaching a semiconductor chip attached to a film from a film, comprising: an eject hood formed of a porous material and provided with needle holes to adsorb the film by vacuum; A pickup head disposed above the needle hole of the eject hood to detach the semiconductor chip from the film while absorbing and raising the semiconductor chip attached to the film; And a needle disposed in a needle hole of the eject hood to lift from the needle hole to push up the film when the pickup head picks up and lifts the semiconductor chip.
The semiconductor chip pick-up apparatus of the present invention has the effect of providing a semiconductor chip pick-up apparatus capable of adsorbing and detaching a film without damaging a small size semiconductor chip or changing direction and angle at a low price.

Description

반도체 칩 픽업 장치{SEMICONDUCTOR CHIP PICK-UP APPARATUS}Semiconductor chip pick-up device {SEMICONDUCTOR CHIP PICK-UP APPARATUS}

본 고안은 반도체 칩 픽업 장치에 관한 것으로, 더욱 상세하게는 필름에 부착된 다수의 반도체칩을 필름으로부터 분리하여 패키지나 기판에 실장되도록 공급하는 반도체 칩 픽업 장치에 관한 것이다.The present invention relates to a semiconductor chip pick-up apparatus, and more particularly, to a semiconductor chip pick-up apparatus for supplying a plurality of semiconductor chips attached to the film to be mounted on a package or a substrate separated from the film.

다수의 반도체 칩이 형성된 웨이퍼는 개개의 반도체 칩으로 절단(sawing)되고 얇은 필름에 일정한 방향과 간격으로 부착된 상태에서 다음 공정으로 전달된다. The wafer on which a plurality of semiconductor chips are formed is sawed into individual semiconductor chips and transferred to the next process in a state of being attached to a thin film at regular directions and intervals.

이와 같은 필름과 다수의 반도체 칩의 조립체는 도 1에 도시된 것과 같은 이젝트 후드(1)에 흡착된 상태에서 픽업 헤드(7)에 의해 반도체 칩(3)이 하나씩 필름(2)으로부터 분리되어 패키지나 기판에 부착된다. An assembly of such a film and a plurality of semiconductor chips is packaged in which the semiconductor chips 3 are separated from the film 2 one by one by the pickup head 7 while being adsorbed by the eject hood 1 as shown in FIG. 1. B is attached to the substrate.

도 1에 도시된 것과 같은 종래의 반도체 칩 픽업 장치의 이젝트 후드(1)는 금속으로 제작되며 상하로 관통하는 다수의 흡착 구멍(4, 5, 6)을 구비한다. 그 흡착 구멍(4, 5, 6)을 통해 진공이 전달되어 필름(2)을 흡착함으로써, 픽업 헤드(7)가 반도체 칩(3)을 흡착하여 필름(2)으로부터 반도체 칩(3)을 분리할 때 이젝트 후드(1)가 필름(2)을 잡아 주게 된다. The eject hood 1 of the conventional semiconductor chip pick-up apparatus as shown in FIG. 1 is made of metal and has a plurality of suction holes 4, 5, 6 penetrating up and down. The vacuum is transmitted through the adsorption holes 4, 5, 6 to adsorb the film 2, so that the pickup head 7 adsorbs the semiconductor chip 3 to separate the semiconductor chip 3 from the film 2. When the eject hood (1) is to hold the film (2).

그런데 최근에는 반도체 칩(3)의 크기가 150㎛ 이하로 작아지는 경우가 있다. 반도체 칩(3)의 크기가 작아지면서 필름(2)에 흡착된 반도체 칩(3)이 이젝트 후드(1)의 흡착 구멍(4, 5, 6)으로 빠지거나 반도체 칩(3)의 모서리가 흡착 구멍(4, 5, 6)의 가장자리에 걸려서 파손됨으로써 공정 불량률을 상승시키는 문제점이 발생하였다. 또한, 경우에 따라서는 반도체 칩(3)의 일부분이 흡착 구멍(4, 5, 6)에 놓인 상태에서 흡착 구멍(4, 5, 6)을 통해 진공이 가해지면서, 필름(2) 위에 부착된 일부 반도체 칩(3)의 정렬 방향이나 위치가 틀어지는 문제가 발생하였다. 반도체 칩(3)의 방향이나 위치가 틀어지면 그 반도체 칩(3)을 패키지나 기판에 부착하는 공정에서 불량의 원인이 된다. 이러한 문제점을 방지하기 위해 반도체 칩(3)을 디태칭 한 후 위치와 방향을 보정하는 경우도 있으나 이는 공정의 효율과 생산성을 감소시키는 원인이 된다.By the way, the size of the semiconductor chip 3 may become small to 150 micrometers or less in recent years. As the size of the semiconductor chip 3 decreases, the semiconductor chip 3 adsorbed on the film 2 falls into the adsorption holes 4, 5, 6 of the eject hood 1, or the corners of the semiconductor chip 3 adsorb. The problem of raising the process failure rate occurred by being caught by the edges of the holes 4, 5, 6 and broken. Further, in some cases, a vacuum is applied through the adsorption holes 4, 5 and 6 while a part of the semiconductor chip 3 is placed in the adsorption holes 4, 5 and 6, and is attached to the film 2. There arises a problem that the alignment direction or the position of some of the semiconductor chips 3 are distorted. If the direction or position of the semiconductor chip 3 is changed, it may cause a defect in the process of attaching the semiconductor chip 3 to a package or a substrate. In order to prevent such a problem, the position and the orientation may be corrected after detaching the semiconductor chip 3, but this may cause a decrease in the efficiency and productivity of the process.

이러한 문제점을 해결하기 위하여 종래에는 금속 재질의 이젝트 후드(1)에 형성되는 흡착 구멍(4, 5, 6)의 크기를 더욱 작게 하는 방법을 사용하였다. 그러나 금속 재질의 이젝트 후드(1)에 200㎛ 이하의 구멍(4, 5, 6)을 형성하는 것은 매우 높은 가공 비용을 요하는 문제점이 있다. 이로 인해 이젝트 후드(1)의 제작 비용이 증가하고 전체적인 공정의 원가를 상승시키는 원인이 된다.In order to solve this problem, conventionally, a method of further reducing the size of the suction holes 4, 5, 6 formed in the metal eject hood 1 is used. However, the formation of holes 4, 5, and 6 having a thickness of 200 μm or less in the eject hood 1 made of metal has a problem of requiring a very high processing cost. This increases the manufacturing cost of the eject hood 1 and increases the cost of the overall process.

본 고안은 상술한 바와 같은 문제점을 해결하기 위해 안출된 것으로, 필름으로부터 반도체 칩을 분리하는 과정에서 반도체 칩이 파손되거나 위치와 방향이 변경되지 않으면서 낮은 가격으로 제작할 수 있는 구조를 가진 반도체 칩 픽업 장치를 제공하는 것을 목적으로 한다.The present invention has been made to solve the above problems, semiconductor chip pickup having a structure that can be manufactured at a low price without damaging or changing the position and direction of the semiconductor chip in the process of separating the semiconductor chip from the film It is an object to provide a device.

이와 같은 목적을 달성하기 위하여 본 고안은, 필름에 부착된 반도체 칩을 필름에서 디태칭(detaching)하는 반도체 칩 픽업 장치에 있어서, 진공에 의해 상기 필름을 흡착하도록 다공성 재질로 형성되고 니들 구멍이 마련된 이젝트 후드; 상기 이젝트 후드의 니들 구멍 상측에 배치되어 상기 필름에 부착된 반도체 칩을 흡착하여 상승시키면서 상기 필름으로부터 상기 반도체 칩을 디태칭하는 픽업 헤드; 및 상기 이젝트 후드의 니들 구멍에 배치되어 상기 픽업 헤드가 반도체 칩을 흡착하여 상승시킬 때 상기 니들 구멍으로부터 상승하여 상기 필름을 밀어 올리는 니들;을 포함하는 점에 특징이 있다.In order to achieve the above object, the present invention is a semiconductor chip pick-up apparatus for detaching a semiconductor chip attached to a film from a film, the needle is formed of a porous material to adsorb the film by vacuum Eject hood; A pickup head disposed above the needle hole of the eject hood to detach the semiconductor chip from the film while absorbing and raising the semiconductor chip attached to the film; And a needle disposed in a needle hole of the eject hood to lift from the needle hole to push up the film when the pickup head picks up and lifts the semiconductor chip.

본 고안의 반도체 칩 픽업 장치는, 작은 크기의 반도체 칩도 파손시키거나 방향과 각도를 변경시키지 않으면서 필름을 흡착하고 디태칭을 할 수 있는 반도체 칩 픽업 장치를 낮은 가격에 제공하는 효과가 있다.The semiconductor chip pick-up apparatus of the present invention has the effect of providing a semiconductor chip pick-up apparatus capable of adsorbing and detaching a film without damaging a small size semiconductor chip or changing direction and angle at a low price.

도 1은 종래의 반도체 칩 픽업 장치를 설명하기 위한 단면도이다.
도 2 내지 도 4는 본 고안의 일실시예에 따른 반도체 칩 픽업 장치를 설명하기 위한 단면도이다.1 is a cross-sectional view illustrating a conventional semiconductor chip pickup device.
2 to 4 are cross-sectional views illustrating a semiconductor chip pickup device according to an embodiment of the present invention.

이하, 본 고안에 따른 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2 내지 도 4는 본 고안의 일실시예에 따른 반도체 칩 픽업 장치를 설명하기 위한 단면도이다.2 to 4 are cross-sectional views illustrating a semiconductor chip pickup device according to an embodiment of the present invention.

도 2를 참조하면, 본실시예의 반도체 칩 픽업 장치는 이젝트 후드(20)와 픽업 헤드(40)와 니들(30)을 포함하여 이루어진다.Referring to FIG. 2, the semiconductor chip pick-up apparatus of the present embodiment includes an eject hood 20, a pickup head 40, and a needle 30.

이젝트 후드(20)는 다공성 세라믹 재질로 형성된다. 이젝트 후드(20)에는 니들 구멍(21)이 형성되어 있다. 이젝트 후드(20)의 상면에는 다수의 반도체 칩(61, 62, 63)들이 부착되어 있는 필름(50)이 놓여진다. 이젝트 후드(20)의 하면에 진공이 가해지면 다공성 재질의 이젝트 후드(20)를 거쳐서 진공이 필름(50)에 전달됨으로써, 이젝트 후드(20)가 필름(50)을 흡착하게 된다. The eject hood 20 is formed of a porous ceramic material. The needle hood 21 is formed in the eject hood 20. On the upper surface of the eject hood 20, a film 50 to which a plurality of semiconductor chips 61, 62, and 63 are attached is placed. When a vacuum is applied to the lower surface of the eject hood 20, the vacuum is transferred to the film 50 through the eject hood 20 made of porous material, so that the eject hood 20 adsorbs the film 50.

이젝트 후드(20) 위에 놓여진 필름(50)의 상측에는 픽업 헤드(40)가 배치된다. 픽업 헤드(40)는 필름(50)에 부착된 상태인 반도체 칩(61, 62, 63)을 흡착하여 상승시키는 방법으로 반도체 칩(61, 62, 63)을 필름(50)으로부터 디태칭(detaching)한다. 이와 같이 필름(50)으로부터 디태칭된 반도체 칩(61, 62, 63)은 패키지나 기판으로 옮겨져서 어태칭된다. 픽업 헤드(40)는 콜릿(41)과 흡착 캡(42)을 구비한다. 콜릿(41)에는 흡착 경로(411)가 형성되고 그 흡착 경로(411)를 통해서 진공이 전달된다. 콜릿(41)의 하단에는 다공성 재질의 흡착 캡(42)이 설치된다. 흡착 캡(42)에 형성된 작은 크기의 다수의 기공을 통해 흡착 경로(411)의 진공이 전달되어 반도체 칩(61, 62, 63)을 흡착하게 된다. 흡착 캡(42)은 소결에 의해 제작된 세라믹 재료 등을 이용하여 제작될 수 있다.The pickup head 40 is disposed above the film 50 placed on the eject hood 20. The pickup head 40 detaches the semiconductor chips 61, 62, and 63 from the film 50 in a manner of absorbing and raising the semiconductor chips 61, 62, and 63 attached to the film 50. )do. Thus, the semiconductor chips 61, 62, and 63 detached from the film 50 are transferred to a package or a board | substrate, and are etched. The pickup head 40 has a collet 41 and an adsorption cap 42. An adsorption path 411 is formed in the collet 41, and a vacuum is transmitted through the adsorption path 411. At the bottom of the collet 41 is a suction cap 42 of a porous material is installed. The vacuum of the adsorption path 411 is transmitted through a plurality of small pores formed in the adsorption cap 42 to adsorb the semiconductor chips 61, 62, and 63. The adsorption cap 42 can be manufactured using a ceramic material produced by sintering or the like.

니들(30)은 이젝트 후드(20)의 니들 구멍(21)에 끼워져서 도 2에 도시한 것과 같이 그 끝부분의 높이가 이젝트 후드(20)의 상면의 높이와 동일하도록 배치된다. 이와 같은 니들(30)의 배치에 의해, 니들 구멍(21) 상측에 배치된 필름(50)과 그 필름(50)에 부착된 반도체 칩(62)을 하측에서 니들(30)이 지지하게 된다. 픽업 헤드(40)가 반도체 칩(62)을 흡착하여 상승시킬 때 니들(30)도 니들 구멍(21)으로부터 상승하여 필름(50)을 밀어 올리게 된다. 니들(30) 주위의 필름(50)은 이젝트 후드(20)에 의해 흡착된 상태에서 니들(30) 부분의 필름(50)만 상승하게 되므로, 도 4에 도시한 것과 같이 픽업 헤드(40)가 필름(50)으로부터 반도체 칩(62)을 디태칭하는 것이 용이해 진다. 니들(30)은 몸체부(31)와 접촉부(32)를 구비한다. 몸체부(31)는 니들(30)이 니들 구멍(21)에 대해 승강 가능할 정도의 여유(공차)만을 남기고 니들 구멍(21)을 가득 채울 수 있을 정도의 외경 크기로 형성된다. 접촉부(32)는 몸체부(31) 상측에 형성되어 필름(50)과 직접 접촉하는 부분이다. 접촉부(32)의 외경은 몸체부(31)의 외경보다 작게 형성된다. 접촉부(32)의 외경은 몸체부(31)의 외경보다 작기 때문에 니들 구멍(21)의 내벽과 접촉부(32)의 사이에 빈 공간이 마련되고, 그 여유 공간을 통해 이젝트 후드(20)에 가해진 진공이 니들 구멍(21) 내벽을 거쳐서 필름(50)으로 전달된다. 접촉부(32)의 형상은 도 2 내지 도 4에 도시한 것과 같은 원추형으로 형성될 수도 있으며, 몸체부(31)의 외경보다 작은 외경을 가지는 다른 다양한 형상으로 구성하는 것도 가능하다.The needle 30 is inserted into the needle hole 21 of the eject hood 20 so that the height of the end portion thereof is equal to the height of the upper surface of the eject hood 20 as shown in FIG. 2. By the arrangement of the needles 30, the needles 30 support the films 50 disposed on the needle holes 21 and the semiconductor chips 62 attached to the films 50 from below. When the pickup head 40 picks up and lifts the semiconductor chip 62, the needle 30 also rises from the needle hole 21 to push up the film 50. Since the film 50 around the needle 30 is only lifted by the film 50 of the portion of the needle 30 in the state of being adsorbed by the eject hood 20, the pickup head 40 as shown in FIG. Detaching the semiconductor chip 62 from the film 50 becomes easy. The needle 30 has a body portion 31 and a contact portion 32. The body portion 31 is formed to have an outer diameter enough to fill the needle hole 21 with only a margin (tolerance) enough to allow the needle 30 to move up and down with respect to the needle hole 21. The contact part 32 is formed above the body part 31 to be in direct contact with the film 50. The outer diameter of the contact portion 32 is formed smaller than the outer diameter of the body portion 31. Since the outer diameter of the contact portion 32 is smaller than the outer diameter of the body portion 31, an empty space is provided between the inner wall of the needle hole 21 and the contact portion 32, and applied to the eject hood 20 through the free space. The vacuum is transmitted to the film 50 via the inner wall of the needle hole 21. The contact portion 32 may be formed in a conical shape as shown in FIGS. 2 to 4, and may be configured in various other shapes having an outer diameter smaller than that of the body portion 31.

한편, 필름(50) 위에 부착된 어느 하나의 반도체 칩(61, 62, 63)의 디태칭 작업이 완료된 후에는 이젝트 후드(20)의 진공을 해제된 상태에서 다음 반도체 칩(61, 62, 63)이 픽업 헤드(40)의 하측에 배치되도록 필름(50)을 클램핑하여 이동시키는 이동부재(미도시)를 더 포함한다.Meanwhile, after the detaching operation of any one of the semiconductor chips 61, 62, and 63 attached on the film 50 is completed, the next semiconductor chips 61, 62, and 63 may be released while the vacuum of the eject hood 20 is released. ) Further includes a moving member (not shown) for clamping and moving the film 50 such that the film 50 is disposed below the pickup head 40.

이하, 상술한 바와 같이 구성된 본 실시예의 반도체 칩 픽업 장치의 작용에 대해 설명한다. Hereinafter, the operation of the semiconductor chip pickup device of the present embodiment configured as described above will be described.

도 2에 도시된 것과 같이 반도체 칩(61, 62, 63)들 중 어느 하나가 니들 구멍(21) 위에 배치되도록 필름(50)이 이젝트 후드(20)에 대해 위치를 잡은 상태에서 이젝트 후드(20)에 진공이 가해져서 필름(50)을 흡착하게 된다. As shown in FIG. 2, the eject hood 20 with the film 50 positioned relative to the eject hood 20 such that any one of the semiconductor chips 61, 62, 63 is disposed over the needle hole 21. ) Is applied to the film 50 to adsorb the film 50.

다음으로 도 3에 도시된 것과 같이 픽업 헤드(40)가 하강하여 반도체 칩(62)에 접촉하여 반도체 칩(62)을 흡착하게 된다. 픽업 헤드(40)의 흡착 경로(411)를 통해 가해진 진공이 다공성 재질의 흡착 캡(42)을 통해 전달되어 반도체 칩(62)을 흡착하는 것을 가능하게 한다. 이때 니들(30)은 필름(50)의 하측에서 이젝트 후드(20)의 상면 높이와 동일한 높이에 배치되어 필름(50)을 하측에서 지지한다. Next, as shown in FIG. 3, the pickup head 40 descends to contact the semiconductor chip 62 to adsorb the semiconductor chip 62. The vacuum applied through the adsorption path 411 of the pickup head 40 is transferred through the adsorption cap 42 of the porous material to make it possible to adsorb the semiconductor chip 62. At this time, the needle 30 is disposed at the same height as the upper surface of the eject hood 20 at the lower side of the film 50 to support the film 50 from the lower side.

도 4에 도시한 것과 같이 이젝트 후드(20)와 니들(30)이 함께 상승하면 반도체 칩(62)은 흡착 캡(42)에 부착된 상태로 필름(50)에서 떨어지게 된다. 이때 이젝트 후드(20)의 니들 구멍(21) 내벽과 니들(30)의 접촉부(32) 사이의 공간으로 전달된 진공에 의해 니들 구멍(21) 상측의 필름(50)도 흡착함으로써 반도체 칩(62)과 필름(50)의 분리가 용이해 진다.As shown in FIG. 4, when the eject hood 20 and the needle 30 are raised together, the semiconductor chip 62 is separated from the film 50 while being attached to the suction cap 42. At this time, the semiconductor chip 62 is also absorbed by adsorbing the film 50 on the upper side of the needle hole 21 by the vacuum transferred to the space between the inner wall of the needle hole 21 of the eject hood 20 and the contact portion 32 of the needle 30. ) And the film 50 can be easily separated.

이와 같이 하나의 반도체 칩(62)에 대한 디태칭 작업이 완료되면, 이젝트 후드(20)의 진공이 해제되고 이동부재(미도시)에 의해 필름(50)은 다음 반도체 칩(61)이 니들 구멍(21)에 배치되도록 위치가 옮겨진다.When the detaching operation on one semiconductor chip 62 is completed as described above, the vacuum of the eject hood 20 is released and the film 50 is moved by a moving member (not shown). The position is shifted so as to be disposed at 21.

이젝트 후드(20)는 다공성 재질로 형성되어 있으므로, 도 1을 참조하여 설명한 종래의 반도체 칩 픽업 장치와 달리 진공을 전달하기 위한 흡착 구멍을 구비하지 않는다. 따라서, 미세한 크기의 다수의 기공을 통해 필름(50)을 흡착하므로, 종래의 반도체 칩 픽업 장치와 같이 흡착 구멍에 의해 반도체 칩이 파손되거나 위치가 틀어질 염려가 없는 장점이 있다. 또한, 종래의 반도체 칩 픽업 장치의 경우 흡착 구멍을 작게 가공하기 위하여 제작 비용이 높은 반면에, 본 고안의 반도체 칩 픽업 장치는 미세 구멍을 가공할 필요가 없으므로 제작 비용이 낮아지는 장점이 있다. Since the eject hood 20 is formed of a porous material, unlike the conventional semiconductor chip pickup apparatus described with reference to FIG. 1, the eject hood 20 does not have a suction hole for transferring a vacuum. Therefore, since the film 50 is adsorbed through a plurality of pores of fine size, there is no fear that the semiconductor chip is damaged or displaced by the adsorption holes as in the conventional semiconductor chip pickup device. In addition, the conventional semiconductor chip pick-up device has a high manufacturing cost in order to process a small suction hole, while the semiconductor chip pick-up device of the present invention does not need to process fine holes, there is an advantage that the manufacturing cost is low.

또한, 도 1을 참조하여 설명한 종래의 반도체 칩 픽업 장치의 경우 픽업 헤드에 의해 반도체 칩을 흡착할 때 반도체 칩의 중앙부와 그 테두리 부분에 불균일한 응력이 가해지므로 픽업 과정에서 반도체 칩이 파손될 우려가 있으나, 본 실시예의 반도체 칩 픽업 장치의 경우 픽업 헤드에 설치된 다공성 재질의 흡착 캡에 의해 반도체 칩(61, 62, 63)을 흡착하게 되므로 반도체 칩(61, 62, 63)의 표면에 균일한 응력을 가한 상태에서 반도체 칩(61, 62, 63)을 흡착하게 된다. 따라서 종래의 반도체 칩 픽업 장치에 비해 픽업 과정에서 반도체 칩(61, 62, 63)이 파손될 가능성이 대폭 감소하게 되는 장점이 있다.In addition, in the conventional semiconductor chip pick-up apparatus described with reference to FIG. 1, since the non-uniform stress is applied to the center portion and the edge portion of the semiconductor chip when the semiconductor chip is attracted by the pickup head, the semiconductor chip may be damaged during the pickup process. However, in the case of the semiconductor chip pick-up device of the present embodiment, since the semiconductor chips 61, 62, and 63 are adsorbed by the adsorption cap of the porous material installed on the pickup head, the stress is uniformly applied to the surfaces of the semiconductor chips 61, 62, and 63. The semiconductor chips 61, 62, and 63 are adsorbed in the state of applying. Therefore, compared with the conventional semiconductor chip pick-up apparatus, there is an advantage that the possibility of damage to the semiconductor chips 61, 62, and 63 during the pickup process is greatly reduced.

이상, 본 고안의 반도체 칩 픽업 장치에 대해 바람직한 실시예를 들어 설명하였으나, 본 고안의 범위가 앞에서 설명하고 도시한 구조로 한정되는 것은 아니다.As mentioned above, although the preferred embodiment of the semiconductor chip pick-up apparatus of this invention was given and demonstrated, the scope of this invention is not limited to the structure demonstrated and shown above.

예를 들어, 앞에서 픽업 헤드(40)에는 다공성 재질의 흡착 캡(42)이 설치되는 것으로 설명하였으나, 흡착 캡을 사용하지 않고 흡착 경로의 진공이 반도체 칩에 직접 가해지도록 구성하는 것도 가능하다.For example, although the pickup head 40 has been described as having the adsorption cap 42 made of a porous material, it is also possible to configure the vacuum of the adsorption path directly to the semiconductor chip without using the adsorption cap.

20: 이젝트 후드 30: 니들
40: 픽업 헤드 50: 필름20: eject hood 30: needle
40: pickup head 50: film

Claims (3)

필름에 부착된 반도체 칩을 필름에서 디태칭(detaching)하는 반도체 칩 픽업 장치에 있어서,
진공에 의해 상기 필름을 흡착하도록 다공성 재질로 형성되고 니들 구멍이 마련된 이젝트 후드;
상기 이젝트 후드의 니들 구멍 상측에 배치되어 상기 필름에 부착된 반도체 칩을 흡착하여 상승시키면서 상기 필름으로부터 상기 반도체 칩을 디태칭하는 픽업 헤드; 및
상기 이젝트 후드의 니들 구멍에 배치되어 상기 픽업 헤드가 반도체 칩을 흡착하여 상승시킬 때 상기 니들 구멍으로부터 상승하여 상기 필름을 밀어 올리는 니들;을 포함하는 것을 특징으로 하는 반도체 칩 픽업 장치.A semiconductor chip pick-up apparatus for detaching a semiconductor chip attached to a film from a film,
An eject hood formed of a porous material and provided with a needle hole to adsorb the film by vacuum;
A pickup head disposed above the needle hole of the eject hood to detach the semiconductor chip from the film while absorbing and raising the semiconductor chip attached to the film; And
And a needle disposed in a needle hole of the eject hood to lift from the needle hole to push up the film when the pickup head picks up and lifts the semiconductor chip. 제1항에 있어서,
상기 픽업 헤드는, 진공이 전달되는 흡착 경로가 형성된 콜릿과, 그 콜릿의끝부분에 설치되어 상기 흡착 경로로부터 진공을 전달받아 상기 반도체 칩을 흡착할 수 있도록 다공성 재질로 형성된 흡착 캡을 구비하는 것을 특징으로 하는 반도체 칩 픽업 장치.The method of claim 1,
The pickup head includes a collet having an adsorption path through which a vacuum is transmitted, and an adsorption cap formed at a tip of the collet and receiving a vacuum from the adsorption path to adsorb the semiconductor chip. A semiconductor chip pickup device characterized by the above-mentioned. 제1항 또는 제2항에 있어서
상기 니들은, 상기 이젝트 후드의 니들 구멍을 가득 채우는 외경 크기의 몸체부와, 상기 니들 구멍의 내벽과의 사이 공간을 통해 상기 니들 구멍 상측의 필름에 진공이 전달되도록 상기 몸체부의 상측에 형성되어 상기 몸체부의 외경보다 작은 외경을 가지는 접촉부를 구비하는 것을 특징으로 하는 반도체 칩 픽업 장치.The method according to claim 1 or 2
The needle is formed on the upper side of the body portion so that a vacuum is transmitted to the film on the upper side of the needle hole through a space between the body portion having an outer diameter filling the needle hole of the eject hood and the inner wall of the needle hole. And a contact portion having an outer diameter smaller than the outer diameter of the body portion.
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JP3915613B2 (en) 2002-07-01 2007-05-16 松下電器産業株式会社 Pickup device and pick-up method of chip on wafer sheet
JP3918661B2 (en) * 2002-07-08 2007-05-23 松下電器産業株式会社 Pickup device and pick-up method of chip on wafer sheet
KR100817049B1 (en) * 2005-08-09 2008-03-26 삼성전자주식회사 Method of manufacturing chips of wafer for packaging

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101513226B1 (en) * 2013-12-17 2015-04-17 아메스산업(주) Method for picking-up semiconductor chip using low frequency vibration
WO2020204394A1 (en) * 2019-03-29 2020-10-08 (주)포인트엔지니어링 Microelement adsorption picker

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