KR20120001889A - Wafer support apparatus - Google Patents

Abstract

PURPOSE: A wafer supporting device is provided to shorten process time by omitting the change of setting for cleaning wafers with different diameters. CONSTITUTION: A loading/unloading unit loads and unloads a plurality of wafers(10). A first wafer supporting device includes a first support unit(410) and a first guide unit(420). The first support unit is formed with a plate shape. The first guide unit is formed on the first support unit. A cleaning unit includes a cleaning bath and a second wafer supporting device.

Description

Wafer Support Device {WAFER SUPPORT APPARATUS}

Embodiments relate to a wafer support device.

 During the wet process of the wafer, the cleaning tank needs an apparatus for supporting and fixing the wafer. In particular, the wafer may be damaged if the wafer is not fixed, detached, or shaken.

Therefore, in the process for cleaning the wafer, when the wafer is mounted in the holding container, one wafer may overlap with the other wafer or the wafer may be defective due to friction with each other.

In addition, when the container on which the wafer is mounted is immersed in a cleaning tank and the wet process is performed, the wafer may be released by buoyancy or the like.

In the wafer mounting and stripping wet process, the mismounting of the wafer is a bigger problem because the larger the wafer, the larger the behavior range of the wafer.

Embodiments provide a wafer support apparatus for efficiently fixing and supporting a wafer.

According to one or more exemplary embodiments, a wafer support apparatus includes: a guide part extending in a first direction, supporting a wafer, and having a slot formed therein for inserting the wafer; And a support part supporting the guide part, wherein the slot includes: a first inclined surface inclined at a first angle with respect to a second direction perpendicular to the first direction; And a second inclined surface extending from the first inclined surface and inclined at a second angle with respect to the second direction.

The slot may further include a third inclined surface facing the first inclined surface and inclined at a third angle with respect to the second direction; And a fourth inclined surface extending from the third inclined surface and inclined at a fourth angle with respect to the second direction.

In one embodiment, a wafer support apparatus includes a support; A first guide comb fixed to the support part at a first height and extending in a first direction; A second guide comb extending in the first direction and fixed to the support at a second height lower than the first height; A third guide comb extending in the first direction and fixed to the support at a third height lower than the second height; And a fourth guide comb extending in the first direction and fixed to the support part at a fourth height higher than the first height, wherein the interval between the second guide comb and the third guide comb is the first guide comb. Greater than the spacing between the guide comb and the second guide comb.

The wafer support apparatus according to the embodiment includes a guide part having a slot including a first inclined surface inclined at a first angle with respect to a second direction and a second inclined surface inclined at a second angle. In addition, a first inclined surface that is less steeply inclined may be disposed at the inlet of the slot, and a second inclined surface that is more steeply inclined may be disposed inside the slot.

Accordingly, since the slot has a relatively wide inlet, the wafer can be easily inserted into the slot. In addition, the slot can firmly fix the wafer through the second inclined surface.

 In addition, the wafer supporting apparatus according to the embodiment may include four guide parts to support wafers having different apertures. For example, the wafer support apparatus according to the embodiment supports a 125 mm diameter wafer by using three of the four guide parts, and uses a guide combination of three guide parts, and a 150 mm diameter wafer. I can support it.

Thus, the wafer support apparatus according to the embodiment does not need to change the setting in order to clean wafers of different diameters. Accordingly, the cleaning apparatus including the wafer support apparatus according to the embodiment can save time for changing the setting and can shorten the process time.

1 is a view showing a wafer cleaning apparatus according to an embodiment.
2 is a cross-sectional view illustrating a state in which wafers are seated on a guide comb of the first guide unit.
3 is an enlarged cross-sectional view of a first slot of the first guide unit.
4 is a plan view illustrating a state in which wafers are seated on a second guide part.
5 is a cross-sectional view illustrating a state in which wafers are seated on a guide comb of a second guide part.
6 is an enlarged cross-sectional view of a second slot of a second guide part.
7 is a side view showing the side of the second wafer support apparatus.
8 is a front view of the robot arm.
9 is a cross-sectional view illustrating a state in which a wafer is gripped by a guide comb of the third guide unit.
10 is an enlarged cross-sectional view of a third slot of the third guide unit.

In the description of the embodiment, in the case where each part, the chuck, the wafer and the pad and the like are described as being formed "on" or "under" of the respective part, the chuck, the wafer and the pad, "On" and "under" include both being formed "directly" or "indirectly" through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is a view showing a wafer cleaning apparatus according to an embodiment. 2 is a cross-sectional view illustrating a state in which wafers are seated on a guide comb of the first guide unit. 3 is an enlarged cross-sectional view of a first slot of the first guide unit. 4 is a plan view illustrating a state in which wafers are seated on a second guide part. 5 is a cross-sectional view illustrating a state in which wafers are seated on a guide comb of a second guide part. 6 is an enlarged cross-sectional view of a second slot of a second guide part. 7 is a side view showing the side of the second wafer support apparatus. 8 is a front view of the robot arm. 9 is a cross-sectional view illustrating a state in which a wafer is gripped by a guide comb of the third guide unit. 10 is an enlarged cross-sectional view of a third slot of the third guide unit.

1 to 10, the wafer cleaning apparatus according to the embodiment includes a loading / unloading unit 100, a cleaning unit 200, and a robot chuck 300.

The loading / unloading unit 100 loads and unloads a plurality of wafers 10. That is, the loading / unloading unit 100 loads the wafers 10 for cleaning and unloads the wafers 10 cleaned by the cleaning unit 200.

The loading / unloading unit 100 includes a first wafer support device 400. The first wafer support device 400 fixes and supports the wafers 10.

As illustrated in FIGS. 1 to 3, the first wafer support apparatus 400 includes a first support part 410 and a first guide part 420.

The first support part 410 may have a plate shape. The first support part 410 supports the first guide part 420. The first support part 410 may support a lower portion of the first guide part 420.

The first guide part 420 is provided on the first support part 410. In more detail, the first guide part 420 may be fastened to the first support part 410 by a bolt or the like. The first guide part 420 supports and fixes the wafers 10.

The first guide part 420 includes a plurality of guide combs extending in a first direction. For example, the first guide part 420 may include four guide combs 421, 422.423, and 424. The guide combs 421, 422.423, and 424 of the first guide part 420 extend in parallel with each other.

The guide combs 421, 422.423, and 424 of the first guide part 420 include a plurality of first slots SL1. The first slots SL1 respectively accommodate the wafers 10. In more detail, the wafers 10 are partially inserted into the first slots SL1, respectively, and guided by the first slots SL1.

As illustrated in FIG. 3, the first slots SL1 may include a first inclined surface 431, a second inclined surface 432, a third inclined surface 433, and a fourth inclined surface 434.

The first inclined surface 431 is positioned near the inlet of the first slot SL1. The first inclined surface 431 is inclined with respect to the first direction. That is, the first inclined surface 431 extends from the inlet of the first slot SL1 in a direction inclined with respect to the first direction.

The second inclined surface 432 extends from the first inclined surface 431 and is inclined with respect to the first direction. The second inclined surface 432 intersects with the first inclined surface 431. The second inclined surface 432 is inclined more than the first inclined surface 431.

For example, the first inclined surface 431 and the second inclined surface 432 are inclined with respect to a second direction perpendicular to the first direction. In this case, the angle θ1 between the first inclined surface 431 and the second direction is larger than the angle θ2 between the second inclined surface 432 and the second direction.

The third inclined surface 433 is positioned near the inlet of the first slot SL1. The third inclined surface 433 faces the first inclined surface 431. The third inclined surface 433 is inclined with respect to the first direction. That is, the third inclined surface 433 extends from the inlet of the first slot SL1 in a direction inclined with respect to the first direction.

The fourth inclined surface 434 extends from the third inclined surface 433 and is inclined with respect to the first direction. The fourth inclined surface 434 intersects with the third inclined surface 433. The fourth inclined surface 434 is inclined more than the third inclined surface 433.

For example, the third inclined surface 433 and the fourth inclined surface 434 are inclined with respect to the second direction. At this time, the angle θ3 between the third inclined surface 433 and the second direction is larger than the angle θ4 between the fourth inclined surface 434 and the second direction.

The first slot SL1 may have a symmetrical structure with each other. Accordingly, the first inclined surface 431 and the third inclined surface 433 may be inclined at substantially the same angle with respect to the first direction or the second direction. In addition, the second inclined surface 432 and the fourth inclined surface 434 may be inclined at substantially the same angle with respect to the first direction or the second direction.

In addition, the second inclined surface 432 and the fourth inclined surface 434 meet with each other. Accordingly, the wafer is seated between the second inclined surface 432 and the fourth inclined surface 434 (SL11) and guided and fixed by the first guide part 420.

Since the first inclined surface 431 and the third inclined surface 433 are less inclined than the second inclined surface 432 and the fourth inclined surface 434, the entrances of the first slots SL1 have a large width. It may have (W3). Therefore, the wafers 10 may be easily inserted into the first slots SL1.

In addition, since the second inclined surface 432 is inclined rather than perpendicular to the first direction, the first inclined surface 431 and the second inclined surface 432 intersect in a less bent structure. Similarly, since the fourth inclined surface 434 is inclined rather than perpendicular to the first direction, the third inclined surface 433 and the fourth inclined surface 434 intersect in a less bent structure.

Therefore, when the portion where the first inclined surface 431 and the second inclined surface 432 intersect with the wafer 10, the first inclined surface 431 and the second inclined surface 432 cross each other. The part is less damaging to the wafer 10. Similarly, a portion where the third inclined surface 433 and the fourth inclined surface 434 intersect less damage to the wafer 10.

That is, as compared with the case where the second inclined surface 432 and the fourth inclined surface 434 are vertical, the first guide part 420 may reduce the damage of the wafer 10.

In addition, since the second inclined surface 432 and the fourth inclined surface 434 are inclined in a V shape, the wafer inserted between the second inclined surface 432 and the fourth inclined surface 434 (SL11) ( 10) may flow from side to side with a predetermined margin.

Since the wafers 10 are inserted into the first slots SL1 in a flowable manner, when the wafers 10 are loaded and unloaded into the first guide part 420, the wafers 10 are loaded. ) Can be reduced.

An angle θ2 between the second inclined surface 432 and the second direction may be about 4 ° to about 11 °. In more detail, the angle θ2 between the second inclined surface 432 and the second direction may be about 9 ° to about 11 °.

Similarly, the angle θ4 between the fourth inclined surface 434 and the second direction may be about 4 ° to about 11 °. In more detail, the angle θ4 between the fourth inclined surface 434 and the second direction may be about 9 ° to about 11 °.

In addition, the width W1 of the inlet of the first slots SL1 may be about 4 mm to about 5.5 mm, and the depth D1 of the first slot may be about 6.5 mm to about 9.5 mm, The depth D2 of the area SL11 between the second inclined surface 432 and the fourth inclined surface 434 may be about 3.5 mm to about 6.5 mm. In addition, the width W2 between the portion where the first slope 431 and the second slope 432 meet and the portion where the third slope 433 and the fourth slope 434 meet is about 1.0 mm to About 2.0 mm.

The cleaning unit 200 cleans the wafers 10. The cleaning unit 200 includes a cleaning tank 210 and a second wafer support apparatus 500.

The cleaning tank 210 accommodates the second wafer support apparatus 500. In addition, the cleaning tank 210 accommodates the wafers 10 and the cleaning liquid 11 for cleaning the wafers 10. As an example of the said washing | cleaning liquid 11, deionized water etc. are mentioned.

As shown in FIGS. 1 and 4 to 6, the second wafer support apparatus 500 includes a second support part 510 and a second guide part 520.

The second support part 510 may have a plate shape. The second support part 510 supports the second guide part 520. The second support part 510 may support both ends or the central part of the second guide part 520.

Unlike the drawing, the second support part 510 is not provided separately, and the second guide part 520 may be fixed to the cleaning tank 210. That is, the second guide part 520 may be fixed to the side wall of the cleaning tank 210.

The second guide part 520 is provided on the second support part 510. In more detail, the second guide part 520 may be fastened to the second support part 510 by a bolt or the like. The second guide part 520 supports and fixes the wafers 10.

The second guide part 520 includes a plurality of guide combs 521, 522, 523, and 524 extending in the first direction. For example, as illustrated in FIG. 7, the second guide part 520 may include a first guide comb 521, a second guide comb 522, a third guide comb 523, and a fourth guide comb ( 524). The first to fourth guide combs 521, 522, 523, and 524 extend in parallel with each other.

The first guide comb 521 is located at a first height H1. The second guide comb 522 is located at a second height H2 lower than the first height H1. The third guide comb 523 is located at a third height H3 lower than the second height H2. The fourth guide comb 524 is positioned at a fourth height H4 higher than the first height H1.

In addition, as the first guide comb 521 is moved from the first guide comb 521 to the fourth guide comb 524, a horizontal distance between each guide comb may be further increased. That is, the distance between the second guide comb 522 and the third guide comb 523 may be greater than the distance between the first guide comb 521 and the second guide comb 522. In addition, the distance between the third guide comb 523 and the fourth guide comb 524 may be greater than the distance between the second guide comb 522 and the third guide comb 523.

In addition, the horizontal distance P2 between the second guide comb 522 and the third guide comb 523 is the horizontal distance P1 between the first guide comb 521 and the second guide comb 522. May be greater than). In addition, the horizontal distance P3 between the third guide comb 523 and the fourth guide comb 524 is a horizontal distance P2 between the second guide comb 522 and the third guide comb 523. May be greater than).

As such, since the first to fourth guide combs 521, 522, 523, and 524 are disposed, the second guide part 520 may support and fix the wafers 12 and 15 having different diameters. have. For example, the second wafer support apparatus 500 may be applied to both the cleaning process of the wafer 12 having a diameter of 125 mm and the cleaning process of the wafer 15 having a diameter of 150 mm.

For example, small diameter wafers 12 are supported by the second to fourth guide combs 522, 523, 524, and large diameter wafers 15 are supported by the first, second and first Four guide combs 521, 522, 524 can be supported.

The first to fourth guide combs 521, 522, 523, and 524 include a plurality of second slots SL2. The second slots SL2 each receive the wafers 10. In more detail, the wafers 10 are partially inserted into the second slots SL2, respectively, and guided by the second slots SL2.

As illustrated in FIG. 6, the second slots SL2 include a fifth slope 531, a sixth slope 532, a seventh slope 533, and an eighth slope 534.

The fifth inclined surface 531 is located near the entrance of the second slot SL2. The fifth inclined surface 531 is inclined with respect to the first direction. That is, the fifth inclined surface 531 extends in a direction inclined with respect to the first direction from an inlet of the second slot SL2.

The sixth inclined surface 532 extends from the fifth inclined surface 531 and is inclined with respect to the first direction. The sixth slope 532 crosses the fifth slope 531. The sixth inclined surface 532 is inclined more than the fifth inclined surface 531.

For example, the fifth inclined surface 531 and the sixth inclined surface 532 are inclined with respect to the second direction. At this time, the angle θ5 between the fifth inclined surface 531 and the second direction is larger than the angle θ6 between the sixth inclined surface 532 and the second direction.

The seventh inclined surface 533 is positioned near the inlet of the second slot SL2. The seventh inclined surface 533 is inclined with respect to the first direction. That is, the seventh inclined surface 533 extends from the inlet of the second slot SL2 in a direction inclined with respect to the first direction.

The eighth inclined surface 534 extends from the seventh inclined surface 533 and is inclined with respect to the first direction. The eighth inclined surface 534 crosses the seventh inclined surface 533. The eighth inclined surface 534 is inclined more than the seventh inclined surface 533.

For example, the seventh inclined surface 533 and the eighth inclined surface 534 are inclined with respect to the second direction. At this time, the angle θ7 between the seventh inclined surface 533 and the second direction is larger than the angle θ8 between the eighth inclined surface 534 and the second direction.

The second slots SL2 may have a symmetrical structure with each other. Accordingly, the fifth inclined surface 531 and the seventh inclined surface 533 are inclined at substantially the same angle with respect to the first direction or the second direction. In addition, the sixth inclined surface 532 and the eighth inclined surface 534 are inclined at substantially the same angle with respect to the first direction or the second direction.

In addition, the sixth inclined surface 532 and the eighth inclined surface 534 meet with each other. Accordingly, the wafer is seated between the sixth inclined surface 532 and the eighth inclined surface 534 (SL21), guided and fixed by the second guide portion 520.

Since the fifth inclined surface 531 and the seventh inclined surface 533 are less inclined than the sixth inclined surface 532 and the eighth inclined surface 534, the entrances of the second slots SL2 have a large width. It may have (W3). Therefore, the wafers 10 may be easily inserted into the second slots SL2.

In addition, since the sixth inclined surface 532 is inclined rather than perpendicular to the first direction, the fifth inclined surface 531 and the sixth inclined surface 532 intersect in a less bent structure. Similarly, since the eighth inclined surface 534 is inclined rather than perpendicular to the first direction, the seventh inclined surface 533 and the eighth inclined surface 534 intersect in a less bent structure.

Therefore, when the portion where the fifth slope 531 and the sixth slope 532 intersect the wafer 10, the fifth slope 531 and the sixth slope 532 cross each other. The part is less damaging to the wafer 10. Similarly, a portion where the seventh inclined surface 533 and the eighth inclined surface 534 intersect less damage to the wafer 10.

That is, compared to the case where the sixth inclined surface 532 and the eighth inclined surface 534 are vertical, the second guide part 520 may reduce the damage of the wafer 10.

In addition, since the sixth inclined surface 532 and the eighth inclined surface 534 are inclined in a V shape, a wafer inserted between the sixth inclined surface 532 and the eighth inclined surface 534 (SL21) 10) may flow from side to side with a predetermined margin.

Since the wafers 10 are inserted into the second slots SL2 in a flowable manner, breakage of the wafers 10 is reduced when the wafers 10 are seated in the cleaning tank 210. You can.

An angle θ6 between the sixth inclined surface 532 and the second direction may be about 8 ° to about 20 °. In more detail, the angle θ6 between the sixth inclined surface 532 and the second direction may be about 13 ° to about 15 °.

Similarly, the angle θ8 between the eighth inclined surface 534 and the second direction may be about 8 ° to about 20 °. In more detail, the angle θ8 between the eighth inclined surface 534 and the second direction may be about 13 ° to about 15 °.

In addition, the width W3 of the inlet of the second slots SL2 may be about 3.5 mm to about 5.0 mm, and the depth D3 of the second slot may be about 4 mm to about 6 mm, The depth D4 of the area SL21 between the sixth inclined surface 532 and the eighth inclined surface 534 may be about 2 mm to about 3 mm. In addition, the width W4 between a portion where the fifth inclined surface 531 and the sixth inclined surface 532 meet and a portion where the seventh inclined surface 533 and the eighth inclined surface 534 meet is about 1 mm to About 2.0 mm.

The robot chuck 300 grips and transports the wafers 10. In more detail, the robot chuck 300 may transfer the wafers 10 seated on the loading / unloading unit 100 to the cleaning tank 210.

As shown in FIG. 1, the robot chuck 300 includes two robot arms 301 and 302 facing each other.

The robot arms 301 and 302 include a third wafer support device 600 and a driver 303.

As shown in FIGS. 1 and 8 to 10, the third wafer support apparatus 600 includes a third support part 610 and a third guide part 620.

The third support part 610 may have a plate shape. The third support part 610 supports the third guide part 620. The third support part 610 may support both ends of the third guide part 620.

The third guide part 620 is provided on the third support part 610. In more detail, the third guide part 620 includes the third support part 610 and the third support part 610 by bolts or the like. The third guide part 620 supports and fixes the wafers 10.

The third guide part 620 includes a plurality of guide combs 621, 622, 623, and 624 extending in the first direction. For example, two guide combs may be respectively fixed to two supports. That is, two guide combs 621 and 622 are provided on one robot arm 301, and two guide combs 623 and 624 are provided on the other robot arm 302.

The guide combs 621, 622, 623, and 624 of the third guide part 620 include a plurality of third slots SL3. The third slots SL3 accommodate the wafers 10, respectively. In more detail, the wafers 10 are partially inserted into the third slots SL3, respectively, and are gripped by the robot arms 310 and 302.

As illustrated in FIG. 9, the third slots SL3 may include a ninth inclined surface 631, a tenth inclined surface 632, an eleventh inclined surface 633, and a twelfth inclined surface 634.

The ninth inclined surface 631 is positioned near the inlet of the third slot SL3. The ninth inclined surface 631 is inclined with respect to the first direction. That is, the ninth inclined surface 631 extends from the inlet of the third slot SL3 in a direction inclined with respect to the first direction.

The second inclined surface 432 extends from the ninth inclined surface 631 and is inclined with respect to the first direction. The tenth inclined surface 632 intersects with the ninth inclined surface 631. The tenth inclined surface 632 is inclined more than the ninth inclined surface 631.

For example, the ninth inclined surface 631 and the tenth inclined surface 632 are inclined with respect to the second direction. In this case, the angle θ9 between the ninth inclined surface 631 and the second direction is larger than the angle θ10 between the tenth inclined surface 632 and the second direction.

The eleventh inclined surface 633 is positioned near the inlet of the third slot SL3. The eleventh inclined surface 633 is inclined with respect to the first direction. That is, the eleventh inclined surface 633 extends in a direction inclined with respect to the first direction from the inlet of the third slot SL3.

The twelfth inclined surface 634 extends from the eleventh inclined surface 633 and is inclined with respect to the first direction. The twelfth inclined surface 634 intersects with the eleventh inclined surface 633. The twelfth inclined surface 634 is inclined more than the eleventh inclined surface 633.

For example, the eleventh inclined surface 633 and the twelfth inclined surface 634 are inclined with respect to the second direction. In this case, an angle θ11 between the eleventh sloped surface 633 and the second direction is greater than an angle θ12 between the twelfth sloped surface 634 and the second direction.

The third slots SL3 may have a symmetrical structure with each other. Accordingly, the ninth inclined surface 631 and the eleventh inclined surface 633 are inclined at substantially the same angle with respect to the first direction or the second direction. In addition, the tenth inclined surface 632 and the twelfth inclined surface 634 are inclined at substantially the same angle with respect to the first direction or the second direction.

In addition, the tenth inclined surface 632 and the twelfth inclined surface 634 meet each other. Accordingly, the wafer 10 is seated between the tenth inclined surface 632 and the twelfth inclined surface 634 (SL31) and guided and fixed by the third guide part 620.

Since the ninth inclined surface 631 and the eleventh inclined surface 633 are less inclined than the tenth inclined surface 632 and the twelfth inclined surface 634, the entrances of the third slots SL3 have a large width. It may have (W5). Therefore, the wafers 10 may be easily inserted into the third slots SL3.

In addition, since the tenth inclined surface 632 is inclined rather than perpendicular to the first direction, the ninth inclined surface 631 and the tenth inclined surface 632 intersect in a less bent structure. Similarly, since the twelfth inclined surface 634 is inclined rather than perpendicular to the first direction, the eleventh inclined surface 633 and the twelfth inclined surface 634 intersect in a less bent structure.

Therefore, when the portion where the ninth inclined surface 631 and the tenth inclined surface 632 intersects the wafer 10, the ninth inclined surface 631 and the tenth inclined surface 632 intersect. The part is less damaging to the wafer 10. Similarly, a portion where the eleventh sloped surface 633 and the twelfth sloped surface 634 intersect less damage to the wafer 10.

That is, as compared with the case where the tenth inclined surface 632 and the twelfth inclined surface 634 are vertical, the third guide part 620 may reduce the damage of the wafer 10.

In addition, since the tenth inclined surface 632 and the twelfth inclined surface 634 are inclined in a V shape, the wafer inserted between the tenth inclined surface 632 and the twelfth inclined surface 634 (SL31) It may flow from side to side at a predetermined margin.

Since the wafers 10 are inserted into the third slots SL3 to be flowable, when the wafers 10 are transferred by the robot chuck 300, the wafers 10 may be damaged. Can be reduced.

An angle θ10 between the tenth inclined surface 632 and the second direction may be about 8 ° to about 20 °. In more detail, the angle θ10 between the tenth inclined surface 632 and the second direction may be about 13 ° to about 15 °.

Similarly, the angle θ12 between the twelfth inclined surface 634 and the second direction may be about 8 ° to about 20 °. In more detail, the angle θ12 between the twelfth inclined surface 634 and the second direction may be about 13 ° to about 15 °.

In addition, the width W5 of the inlet of the third slots SL3 may be about 3.5 mm to about 5.0 mm, and the depth D5 of the third slot SL3 is about 4 mm to about 6 mm. The depth D6 of the area SL31 between the tenth inclined surface 632 and the twelfth inclined surface 634 may be about 2 mm to about 3 mm. In addition, a width W6 between a portion where the ninth inclined surface 631 and the tenth inclined surface 632 meets and a portion where the eleventh inclined surface 633 and the twelfth inclined surface 634 meet is about 1 mm to about May be 2 mm.

As such, since the first to third wafer support apparatuses 400, 500, and 600 according to the embodiment include slots SL1, SL2, and SL3 having wide inlets, when the wafer 10 is inserted, It can prevent the departure. In addition, the slots SL1, SL2, and SL3 may reduce scratches or cracks in the wafer 10.

Accordingly, the wafer support apparatuses 400, 500, and 600 according to the embodiment may be applied to clean the wafers 12 and 15 of different diameters while minimizing damage to the wafer 10, thereby reducing the process time. Can be.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (11)

A guide part extending in a first direction and supporting a wafer, wherein a slot for inserting a portion of the wafer is formed; And
It includes a support for supporting the guide portion,
The slot is
A first inclined surface that is inclined at a first angle with respect to a second direction perpendicular to the first direction; And
And a second inclined surface extending from the first inclined surface and inclined at a second angle with respect to the second direction. The method of claim 1, wherein the slot is
A third inclined surface facing the first inclined surface and inclined at a third angle with respect to the second direction; And
And a fourth inclined surface extending from the third inclined surface and inclined at a fourth angle with respect to the second direction. The wafer support apparatus of claim 2, wherein the second inclined surface and the fourth inclined surface meet each other. The wafer supporting apparatus of claim 2, wherein a distance between a portion where the first inclined surface and the second inclined surface meet and a portion where the third inclined surface and the fourth inclined surface meet is 1 mm to 2 mm. The wafer support apparatus of claim 2, wherein the second angle and the fourth angle are 4 ° to 20 °. The method of claim 2, wherein the first angle corresponds to the third angle,
And the second angle corresponds to the fourth angle. The wafer support apparatus of claim 2, wherein the support part is disposed at an end of the guide part. A support;
A first guide comb fixed to the support part at a first height and extending in a first direction;
A second guide comb extending in the first direction and fixed to the support at a second height lower than the first height;
A third guide comb extending in the first direction and fixed to the support at a third height lower than the second height; And
A fourth guide comb extending in the first direction and fixed to the support portion at a fourth height higher than the first height,
And a spacing between the second guide comb and the third guide comb is greater than the spacing between the first guide comb and the second guide comb. The wafer support apparatus of claim 8, wherein a distance between the third guide comb and the fourth guide comb is larger than a distance between the second guide comb and the third guide comb. 9. The wafer support apparatus of claim 8, wherein the first to fourth guide combs comprise a plurality of slots. The method of claim 10, wherein the slot is
A first inclined surface that is inclined at a first angle with respect to a second direction perpendicular to the first direction; And
And a second inclined surface extending from the first inclined surface and inclined at a second angle with respect to the second direction.

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