KR20120000901A - Apparatus for transferring and fixing a substrate - Google Patents

Apparatus for transferring and fixing a substrate Download PDF

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Publication number
KR20120000901A
KR20120000901A KR1020100061422A KR20100061422A KR20120000901A KR 20120000901 A KR20120000901 A KR 20120000901A KR 1020100061422 A KR1020100061422 A KR 1020100061422A KR 20100061422 A KR20100061422 A KR 20100061422A KR 20120000901 A KR20120000901 A KR 20120000901A
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KR
South Korea
Prior art keywords
substrate
receiving groove
deformation
vacuum suction
air
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KR1020100061422A
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Korean (ko)
Inventor
박홍진
조윤채
서종현
임세환
선상필
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주식회사 엘티에스
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Priority to KR1020100061422A priority Critical patent/KR20120000901A/en
Publication of KR20120000901A publication Critical patent/KR20120000901A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Abstract

PURPOSE: A substrate transfer and fixing apparatus is provided to prevent the damage and the deformation of a substrate by transferring the substrate as a state adhering closely to the bottom surface of the substrate using a porosity cushion material. CONSTITUTION: The deformation supporting part(100) of a porosity cushion material supports a substrate(20). A fixed supporting part(200) forms an accommodating groove(210) in center. The fixed supporting part forms a discharge hole(220) which inhales and discharges air to the floor side of the accommodating groove. A vacuum suction part(300) is connected to the lower side of the fixed supporting part. The vacuum suction part inhales the air of the accommodating groove in order to create a vacuum in the accommodating groove.

Description

기판 이송 및 고정장치 {apparatus for transferring and fixing a substrate}{Apparatus for transferring and fixing a substrate}

본 발명은 기판 이송 및 고정장치에 관한 것으로, 더욱 상세하게는 웨이퍼 등의 기판을 진공흡착방식으로 파지하되 다공성 쿠션재를 이용하여 기판의 저면과 밀착된 상태를 유지하면서 이송시키는 기판 이송 및 고정장치에 관한 것이다.The present invention relates to a substrate transfer and fixing device, and more particularly to a substrate transfer and fixing device for holding a substrate such as a wafer in a vacuum adsorption method while maintaining a state in close contact with the bottom of the substrate using a porous cushioning material It is about.

평판 디스플레이 장치의 제조에서 실리콘 또는 유리로 이루어진 기판 상에는 전기적인 회로 패턴들이 형성될 수 있다. 상기 회로 패턴들은 증착 공정, 포토리소그래피 공정, 식각 공정 및 세정 공정 등과 같은 일련의 단위 공정들을 수행함으로써 형성될 수 있다. 그리고 상기 단위 공정들은 인-라인으로 수행될 수 있다. Electrical circuit patterns may be formed on a substrate made of silicon or glass in the manufacture of a flat panel display device. The circuit patterns may be formed by performing a series of unit processes such as a deposition process, a photolithography process, an etching process, and a cleaning process. The unit processes may be performed in-line.

이에, 상기 단위 공정들은 이송이 이루어지는 상태에서 수행될 수 있다. 그러므로 상기 단위 공정들을 수행하는 모듈들에는 기판을 이송하는 이송 장치가 구비된다. 아울러, 상기 단위 공정들을 수행하는 모듈들 사이에도 기판을 이송하는 이송 장치가 구비된다.Thus, the unit processes may be performed in a state where the transfer is made. Therefore, the modules performing the unit processes are provided with a transfer device for transferring the substrate. In addition, a transfer device for transferring the substrate is also provided between the modules performing the unit processes.

그러나, 최근들어 웨이퍼의 대면적화로 인해 웨이퍼가 완전한 평면이되지 못하고, 표면굴곡이 발생하거나 웨이퍼 자체가 휘어짐에 따라 단면의 형태가 곡선형을 이루게 된다.However, in recent years, due to the large area of the wafer, the wafer is not completely planar, and as the surface is curved or the wafer itself is bent, the cross-sectional shape becomes curved.

상기와 같이 평면이 아닌 자체적으로 휘어진 곡선형의 웨이퍼 및 표면굴곡이 있는 웨이퍼는 기존에 평면의 웨이퍼와 마찬가지로 단단한 평면의 진공척을 그대로 사용하여 고정 및 이송시킬 경우 웨이퍼의 표면굴곡 및 휘어진 아치형의 형태에 따라 균일한 압력이 가해지지 못하게되어 웨이퍼의 일부가 파손되거나, 안전한 파지가 이루어지지 않게 되는 문제점이 있었다.As described above, curved wafers with curved surfaces and wafers with surface curvatures, rather than flat surfaces, have surface curvatures and curved arch shapes when the wafers are fixed and transported using the same vacuum flat chuck as the flat wafers. As a result, a uniform pressure cannot be applied, and thus a part of the wafer is broken or a safe gripping is not performed.

상기와 같은 종래 문제점을 해결하기 위한 본 발명은 웨이퍼의 대면적화로 인해 웨이퍼가 완전한 평면이되지 못하고, 표면굴곡이 발생하거나 웨이퍼 자체가 휘어짐에 따라 단면의 형태가 곡선형을 이루게 되더라도, 상기 웨이퍼의 굴곡에 대응하도록 탄력적인 파지가 이루어져 웨이퍼가 손상되지 않을 뿐더러 웨이퍼 전면에 안전한 파지가 이루어지고 이송시킬 수 있도록 하는 기판 이송 및 고정장치를 제공하는 데 그 목적이 있다.According to the present invention for solving the above-mentioned problems, the wafer is not completely flat due to the large area of the wafer, and even if the shape of the cross section becomes curved as the surface is curved or the wafer itself is bent, It is an object of the present invention to provide a substrate transfer and fixing device that is elastically gripped to cope with bending to prevent damage to the wafer and to secure and grip the wafer in front of the wafer.

상기와 같은 목적을 달성하기 위한 본 발명은 웨이퍼를 비롯한 각종 기판을 진공흡착 방식으로 파지하고 이송시키는 기판 이송 및 고정장치에 있어서, 상면에 기판을 지지하는 다공성 쿠션재질의 변형지지부와, 상기 변형지지부가 안착되도록 중앙영역에 수용홈이 형성되고, 상기 수용홈의 바닥면에 공기가 흡입 및 배출되도록 배출공이 형성된 고정지지부와, 상기 고정지지부의 하부에 연결되고 상기 수용홈을 진공상태로 만들도록 상기 배출공으로 수용홈의 공기를 흡입하는 진공흡입부를 포함하며, 상기 배출공으로 공기가 빠져나가면 상기 변형지지부는 상기 기판의 저면 형상과 대응하도록 변형되어 상기 기판과 밀착되면서 기판을 파지하는 기판 이송 및 고정장치를 제공한다.The present invention for achieving the above object is a substrate transport and holding device for holding and transporting a variety of substrates, including wafers in a vacuum suction method, the deformation support portion of the porous cushion material for supporting the substrate on the upper surface, and the deformation support A receiving groove is formed in the central region so that the additional seat is seated, and a fixed support portion having a discharge hole formed in the bottom surface of the receiving groove so as to suck and discharge air, and connected to a lower portion of the fixed support portion to make the receiving groove into a vacuum state. And a vacuum suction unit for sucking the air in the accommodation groove into the discharge hole, and when the air escapes through the discharge hole, the deformation support part is deformed to correspond to the shape of the bottom surface of the substrate so as to be in close contact with the substrate and to hold the substrate. To provide.

본 발명은 웨이퍼의 대면적화로 인해 웨이퍼가 완전한 평면이되지 못하고, 표면굴곡이 발생하거나 웨이퍼 자체가 휘어짐에 따라 단면의 형태가 곡선형을 이루게 되더라도, 상기 웨이퍼의 굴곡에 대응하도록 탄력적인 파지가 이루어져 웨이퍼가 손상되지 않을 뿐 더러 웨이퍼 전면에 안전한 파지가 이루어지고 이송시킬 수 있도록 하는 매우 유용한 효과가 있다.According to the present invention, the wafer is not completely flat due to the large area of the wafer, and even if the cross-section is curved due to the surface bending or the wafer itself bending, the elastic gripping is made to correspond to the bending of the wafer. Not only does the wafer get damaged, but it also has a very useful effect of ensuring that the wafer is securely grasped and transported.

도 1은 본 발명에 따른 기판 이송 및 고정장치의 분해사시도,
도 2는 본 발명에 따른 기판 이송 및 고정장치의 사시도,
도 3은 본 발명에 따른 기판 이송 및 고정장치와 기판의 모습을 보인 단면도,
도 4는 본 발명에 따른 기판 이송 및 고정장치에 기판이 파지된 모습을 보인 단면도.1 is an exploded perspective view of a substrate transfer and fixing device according to the present invention;
2 is a perspective view of a substrate transfer and fixing device according to the present invention;
Figure 3 is a cross-sectional view showing a state of the substrate transfer and fixing device and the substrate according to the present invention,
Figure 4 is a cross-sectional view showing a state that the substrate is gripped on the substrate transfer and fixing device according to the present invention.

이하, 첨부된 도면에 따라 본 발명 기판 이송 및 고정장치의 구성 및 작용을 더욱 상세히 설명하면 다음과 같다.Hereinafter, the configuration and operation of the substrate transport and fixing device of the present invention according to the accompanying drawings in more detail.

도 1은 본 발명에 따른 기판 이송 및 고정장치의 분해사시도이고, 도 2는 본 발명에 따른 기판 이송 및 고정장치의 사시도이며, 도 3은 본 발명에 따른 기판 이송 및 고정장치와 기판의 모습을 보인 단면도이고, 도 4는 본 발명에 따른 기판 이송 및 고정장치에 기판이 파지된 모습을 보인 단면도이다.1 is an exploded perspective view of a substrate transfer and fixing device according to the present invention, Figure 2 is a perspective view of a substrate transfer and fixing device according to the present invention, Figure 3 is a view of the substrate transfer and fixing device and the substrate according to the present invention 4 is a cross-sectional view showing a state in which the substrate is gripped by the substrate transfer and fixing device according to the present invention.

본 발명에 따른 기판 이송 및 고정장치(10)는 웨이퍼를 비롯한 각종 기판(20)을 진공흡착방식으로 파지하되, 상면에 기판(20)을 지지하는 다공성 쿠션재질의 변형지지부(100), 상기 변형지지부(100)가 안착되도록 중앙영역에 수용홈(210)이 형성되고, 상기 수용홈(210)의 바닥면에 공기가 흡입 및 배출되도록 배출공(220)이 형성된 고정지지부(200)와, 상기 고정지지부(200)의 하부에 연결되고 상기 수용홈(210)을 진공상태로 만들도록 상기 배출공(220)으로 수용홈(210)의 공기를 흡입하는 진공흡입부(300)를 포함하며, 상기 배출공(220)으로 공기가 빠져나가면 상기 변형지지부(100)는 상기 기판(20)의 저면 형상과 대응하도록 변형되어 상기 기판(20)과 밀착되면서 기판(20)을 파지하도록 구성된다.Substrate transfer and fixing device 10 according to the present invention, while holding the various substrates 20, including the wafer in a vacuum suction method, the deformation support portion 100 of the porous cushion material for supporting the substrate 20 on the upper surface, the deformation Receiving groove 210 is formed in the central region so that the support portion 100 is seated, the fixed support portion 200 is formed with a discharge hole 220 so that air is sucked and discharged to the bottom surface of the receiving groove 210, It is connected to the lower portion of the fixed support 200 and includes a vacuum suction unit 300 for sucking the air of the accommodation groove 210 to the discharge hole 220 to make the receiving groove 210 in a vacuum state, When the air escapes to the discharge hole 220, the deformation support part 100 is deformed to correspond to the bottom shape of the substrate 20 and is configured to grip the substrate 20 while being in close contact with the substrate 20.

먼저, 변형지지부(100)는 상면에 기판(20)을 지지하는 다공성 쿠션재질로 구성된다.First, the deformation support part 100 is composed of a porous cushion material for supporting the substrate 20 on the upper surface.

상기 변형지지부(100)가 다공성재질로 구성된 이유는 다수의 미세공으로 공기가 빠져나가면서 기판(20)을 파지할 수 있도록 하기 위한 것이고, 쿠션재질로 구성된 이유는 상기 변형지지부(100)가 기판(20)을 진공흡착할 경우 변형방지부(100)와 접하는 기판(20)의 굴곡진 형상에 맞춰 변형지지부(100)가 변형되어 기판(20)과 밀착되도록 하기 위한 것이다.The deformation support part 100 is formed of a porous material to allow the air to escape into the plurality of micropores so that the substrate 20 can be gripped, and the reason that the deformation support part 100 is formed of a substrate ( In the case of vacuum adsorption 20, the deformation support part 100 is deformed to closely contact the substrate 20 in accordance with the curved shape of the substrate 20 in contact with the deformation preventing part 100.

고정지지부(200)는 상기 변형지지부(100)가 안착되도록 중앙영역에 수용홈(210)이 형성되고, 상기 수용홈(210)의 바닥면에 공기가 흡입 및 배출되도록 배출공(220)이 형성된 구성이다.The fixed support 200 has an accommodation groove 210 formed in a central area so that the deformation support 100 is seated, and a discharge hole 220 is formed so that air is sucked and discharged on the bottom surface of the accommodation groove 210. Configuration.

상기 고정지지부(200)는 종래 진공척과 같은 기능을 한다.The fixed support part 200 functions like a conventional vacuum chuck.

상기 고정지지부(200)는 변형지지부(100)가 안착하도록 수용홈(210)을 형성하고, 상기 수용홈(210)의 바닥면에는 고정지지부(200) 하부와 연결된 진공흡입부(300)의 작용으로 수용홈(210) 및 상기 수용홈(210)에 안착된 변형지지부(100)의 미세공으로 공기가 빠져나갈 수 있도록 한다.The fixed support portion 200 forms a receiving groove 210 so that the deformation support portion 100 is seated, and the action of the vacuum suction unit 300 connected to the bottom of the fixed support portion 200 on the bottom surface of the receiving groove 210. In order to allow the air to escape into the micropores of the deformation support part 100 seated in the receiving groove 210 and the receiving groove 210.

진공흡입부(300)는 상기 고정지지부(200)의 하부에 연결되고 상기 수용홈(210)을 진공상태로 만들도록 상기 배출공(220)으로 수용홈(210)의 공기를 흡입하는 작용을 한다.The vacuum suction unit 300 is connected to the lower portion of the fixed support portion 200 and serves to suck the air of the accommodation groove 210 into the discharge hole 220 to make the receiving groove 210 in a vacuum state. .

상기 진공흡입부(300)가 수용홈(210) 및 상기 수용홈(210)에 안착된 변형지지부(100)의 미세공의 공기를 흡입하게되면, 상기 변형지지부(100)의 상부에 위치한 기판(20)은 변형지지부(100)와 밀착되고 진공흡착방식으로 파지할 수 있다.When the vacuum suction part 300 sucks the air of the micropores of the receiving groove 210 and the deformation support part 100 seated in the receiving groove 210, a substrate located above the deformation support part 100 ( 20 may be in close contact with the deformation support part 100 and gripped by a vacuum suction method.

이때, 상기 변형지지부(100)는 미세공으로 공기가 빠져나가면서 압축되는데, 그 압축된 형상이 기판(20)의 굴곡진 형상과 대응하도록 변형되어 상기 기판(20)과 변형지지부(100)는 전면이 밀착된 상태로 지지될 수 있다.
At this time, the deformation support part 100 is compressed while the air escapes into the micropores, and the compressed shape thereof is deformed to correspond to the curved shape of the substrate 20 so that the substrate 20 and the deformation support part 100 are front. It can be supported in an intimate state.

본 발명의 바람직한 실시 예에 따르면, 상기 변형지지부(100)는 스펀지(sponge)로 이루진다.According to a preferred embodiment of the present invention, the deformation support portion 100 is made of a sponge (sponge).

상기 변형지지부(100)는 다공성이면서도, 탄력을 구비한 공지의 다양한 쿠션재질 및 추후 개발되는 다양한 소재로 구비될 수 있으나, 특히 스펀지로 구비될 수 있다.The deformation support part 100 may be provided with various cushion materials and various materials to be developed later, while being porous and having elasticity, but may be particularly provided as a sponge.

상기 스펀지는 다공성이면서도 탄력을 구비한 대표적인 다공성쿠션재로서, 천연고무나 합성수지로 만든 해면(海綿)을 일컬으며, 탄성이 있는 해면상의 다공질물질도 스펀지라고 한다. 이런 것에는 천연고무의 원액을 발포시켜 만든 라버형, 합성수지로 만든 우레탄형이 있다. 라버형은 햇볕을 쬐면 노화현상을 일으키고, 또 비누에 약하므로 현재로는 합성수지 제품이 대부분을 차지한다.The sponge is a representative porous cushion material having a porosity and elasticity, and refers to a sponge made of natural rubber or synthetic resin, and the porous material on the sponge is also called a sponge. These include a rubber type made by foaming natural rubber stock and a urethane type made of synthetic resin. Raver type causes aging phenomenon in the sun and is weak in soap.

또한, 스펀지의 쿠션력을 이용하여 침구(요나 방석)나 여러 가지 바킹의 재료, 청소용구 등 여러 방면에 쓰이며, 해면의 대용으로 목욕용·화장용·의료용·세척용 등 다양하게 쓰인다.In addition, it is used in various fields such as bedding (yona cushion), various barking materials, cleaning equipment, etc. by using the cushioning force of sponge, and it is used in various ways such as bathing, cosmetics, medical care and washing as a substitute for sponges.

상기와 같은 본 발명에 따르면, 웨이퍼 등 기판(20)의 대면적화로 인해 기판(20)이 완전한 평면이되지 못하고, 표면굴곡이 발생하거나 기판(20) 자체가 휘어짐에 따라 단면의 형태가 곡선형을 이루게 되더라도, 상기 기판(20)의 굴곡에 대응하도록 탄력적인 파지가 이루어져 기판(20)이 손상되지 않을 뿐 더러 기판(20) 전면에 안전한 파지가 이루어지고 이송시킬 수 있도록 하는 장점이 있다.According to the present invention as described above, due to the large area of the substrate 20, such as a wafer, the shape of the cross section is curved as the substrate 20 does not become a perfect plane and surface bending occurs or the substrate 20 itself is bent. Even if it is achieved, the elastic gripping is made so as to correspond to the bending of the substrate 20, the substrate 20 is not damaged and there is an advantage that the safe gripping can be made and transferred to the entire surface of the substrate 20.

본 발명은 첨부된 도면에 도시된 일 실시 예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 당해 기술분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 수 있을 것이다. 따라서, 본 발명의 진정한 보호 범위는 첨부된 청구 범위에 의해서만 정해져야 할 것이다.Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible therefrom. Could be. Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

10 : 기판 이송 및 고정장치
20 : 기판
100 : 변형지지부
200 : 고정지지부
210 : 수용홈
220 : 배출공
300 : 진공흡입부10: substrate transfer and fixing device
20: substrate
100: deformation support
200: fixed support
210: receiving home
220: discharge hole
300: vacuum suction unit

Claims (2)

웨이퍼를 비롯한 각종 기판을 진공흡착 방식으로 파지하고 이송시키는 기판 이송 및 고정장치에 있어서
상면에 기판을 지지하는 다공성 쿠션재질의 변형지지부;
상기 변형지지부가 안착되도록 중앙영역에 수용홈이 형성되고, 상기 수용홈의 바닥면에 공기가 흡입 및 배출되도록 배출공이 형성된 고정지지부;
상기 고정지지부의 하부에 연결되고 상기 수용홈을 진공상태로 만들도록 상기 배출공으로 수용홈의 공기를 흡입하는 진공흡입부;를 포함하며, 상기 배출공으로 공기가 빠져나가면 상기 변형지지부는 상기 기판의 저면 형상과 대응하도록 변형되어 상기 기판과 밀착되면서 기판을 파지하는 것을 특징으로 하는 기판 이송 및 고정장치.In the substrate transfer and fixing device for holding and conveying various substrates including wafers by vacuum suction method
Deformation support portion of the porous cushion material for supporting the substrate on the upper surface;
A fixed support having a receiving groove formed in a central area to seat the deformable supporting part, and a discharge hole formed at a bottom surface of the receiving groove to suck and discharge air;
And a vacuum suction part connected to a lower portion of the fixed support part and sucking the air of the accommodation groove into the discharge hole to make the receiving groove into a vacuum state. The substrate transfer and holding device, characterized in that to be deformed to correspond to the shape while holding the substrate in close contact with the substrate. 제 1항에 있어서,
상기 변형지지부는 스펀지(sponge)로 이루진 것을 특징으로 하는 기판 이송 및 고정장치. The method of claim 1,
And the deformation support part is made of a sponge.
KR1020100061422A 2010-06-28 2010-06-28 Apparatus for transferring and fixing a substrate KR20120000901A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101329621B1 (en) * 2012-04-26 2013-11-14 주식회사 엘지실트론 Grinder chuck
KR20210049447A (en) * 2019-10-25 2021-05-06 (주)에스티아이 Substrate supporting apparatus and substrate transperring method using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101329621B1 (en) * 2012-04-26 2013-11-14 주식회사 엘지실트론 Grinder chuck
KR20210049447A (en) * 2019-10-25 2021-05-06 (주)에스티아이 Substrate supporting apparatus and substrate transperring method using the same

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