KR20110125992A - Led package manufacturing method - Google Patents

Led package manufacturing method Download PDF

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Publication number
KR20110125992A
KR20110125992A KR1020100045663A KR20100045663A KR20110125992A KR 20110125992 A KR20110125992 A KR 20110125992A KR 1020100045663 A KR1020100045663 A KR 1020100045663A KR 20100045663 A KR20100045663 A KR 20100045663A KR 20110125992 A KR20110125992 A KR 20110125992A
Authority
KR
South Korea
Prior art keywords
fluorescent layer
light emitting
metal plate
resin
package body
Prior art date
Application number
KR1020100045663A
Other languages
Korean (ko)
Inventor
박송이
Original Assignee
하나 마이크론(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하나 마이크론(주) filed Critical 하나 마이크론(주)
Priority to KR1020100045663A priority Critical patent/KR20110125992A/en
Publication of KR20110125992A publication Critical patent/KR20110125992A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE: An LED package production method is provided to multiply photonic efficiency which accomplishes white light by uniformly diffusing a fluorescent material capable of changing the wavelength of light which is generated in a light emitting chip to the specific location. CONSTITUTION: A package body(110) is shaped by resin in order to form a cavity having an inner protrusion. A light emitting diode(130) which is loaded on a metal plate(120) and a lead terminal of the metal plate are wire-bonded by the medium of a conductive wire(140). A lower resin part(151) is formed by filling transparent resin to the inner protrusion. A fluorescent layer(152) of constant thickness is formed on the upper side of the lower resin part. An upper resin part is formed by filling the transparent resin to the upper side of the package body in order to cover the fluorescent layer.

Description

LED Package Manufacturing Method

The present invention relates to a method of manufacturing an LED package, and more particularly, to improve light efficiency by uniformly and evenly dispersing a phosphor in a process of forming a resin part on a package body, and to reduce manufacturing costs by reducing the amount of phosphor used. It relates to a LED package manufacturing method.

In general, a light emitting diode (LED) is a semiconductor device that emits light when a current flows, and converts electrical energy into light energy using a PN junction diode made of GaAs and GaN optical semiconductors.

The range of light from these LEDs ranges from red (630 nm to 700 nm) to blue-violet (400 nm), including blue, green and white, and LEDs offer lower power consumption, higher efficiency, and higher efficiency than conventional light sources such as incandescent bulbs and fluorescent lamps. It has the advantages of long operating life and the demand is constantly increasing.

These LEDs are a kind of semiconductor used to send and receive signals by changing electricity into infrared or light by using the characteristics of group 3-5 or 2-6 compound semiconductors. Various colors such as blue, ultraviolet, and ultraviolet light can be realized, and efficient white light is realized by using fluorescent materials or combining colors.

FIG. 3 illustrates a manufacturing process of a conventional LED package. As shown in FIG. 2, the conventional LED package 20 is formed on the metal plate 22 with a resin material so as to have a cavity open to an upper portion thereof. The package body 21 is integrally molded and the light emitting chip 24 is mounted on the upper surface of the metal plate 22 with an adhesive agent. Then, the light emitting chip 24 mounted on the metal substrate 22 is formed. The wire is electrically connected with the metal substrate through the conductive wire 25.

Subsequently, the inner space of the cavity opened to the upper portion of the package body 21 is dispensed from the dispenser 29 and filled with the resin part 26 by supplying a transparent resin containing fluorescent material to implement white light. The package 20 is manufactured.

However, in the process of forming the resin part 26 covering the light emitting chip 24 in the cavity of the package body 21, the transparent resin including the fluorescent material is individually dispensed for each cavity of the package body 21. Since the filled transparent resin is unevenly applied in the cavity of the package body 21 while the fluorescent material mixed therewith is unevenly applied, the light efficiency of the white light realized during light emission is reduced. It acted as a factor.

In addition, when the size of the cavity of the package body increases, the amount of the fluorescent material included in the transparent resin to be filled also increases, increasing the manufacturing cost, and there is a problem in precisely controlling the mixing ratio between the resin and the fluorescent material.

Accordingly, the present invention is to solve the above problems, uniformly and evenly disperse the fluorescent material converting the wavelength to realize the white light in the cavity, the resin-to-mix ratio can be precisely adjusted to improve the light efficiency, the fluorescent material It is to provide a method of manufacturing an LED package that can reduce the amount of use to reduce the manufacturing cost.

In order to achieve the above object, the present invention comprises the steps of: a) molding the package body with a resin material so as to form a cavity having an internal step open to the top; b) wire bonding through conductive wires such that a light emitting chip mounted on the metal plate exposed through the cavity and a lead terminal of the metal plate are electrically connected to each other; c) forming a lower resin part by filling the transparent resin to the inner step to cover the light emitting chip; And d) forming a fluorescent layer having a predetermined thickness on an upper surface of the lower resin part. It provides an LED package manufacturing method comprising a.

Preferably, the LED package manufacturing method comprising the step of filling the transparent resin to the upper end of the package body to cover the fluorescent layer to form an upper resin portion.

Preferably, the inner step is provided at a position higher than the top height of the conductive wire to prevent interference between the conductive wire and the fluorescent layer wire-bonded with the light emitting chip.

Preferably, the fluorescent layer is formed by a rolling method of rolling a liquid fluorescent material on the upper surface of the lower resin portion as a roller or by attaching a fluorescent film having a predetermined thickness to the upper surface of the lower resin portion.

According to the present invention, the lower resin portion, the fluorescent layer and the upper resin portion are continuously formed in the cavity of the package body integrally formed on the metal plate to provide a fluorescent layer having a predetermined thickness between the upper resin portion and the lower resin portion to emit light. By uniformly and evenly distributing the fluorescent material that converts the light generated from the chip in a specific position, it is possible to increase the light efficiency of realizing white light, improve the reliability of the package product, and use the amount of the fluorescent material forming the fluorescent layer. This can be reduced as much as possible, resulting in an increase in manufacturing cost of the packaged product.

1A to 1F are process diagrams illustrating a method of manufacturing an LED package according to a preferred embodiment of the present invention.
Figure 2 is another type of LED package manufactured in the LED package manufacturing method according to a preferred embodiment of the present invention
Figure 3 is a process chart showing a LED package manufacturing method according to the prior art.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the drawings.

In the following description, the same reference numerals will be used to refer to the same elements even though they are shown in different drawings in order to add reference numerals to help understand the present invention.

Method for manufacturing an LED package according to a preferred embodiment of the present invention, as shown in Figure 1a to 1f, forming the package body 110, wire bonding step, forming the lower resin portion 151 In the process of manufacturing the LED package, including the step and forming the fluorescent layer 152, a fluorescent layer made of a fluorescent material is uniformly provided between the upper and lower resin parts formed in the cavity of the package body to realize white light efficiency. To increase.

First, as shown in FIG. 1A, the molding of the package body 110 may be performed by forming the package body 110 integrally with a resin material so as to form a cavity 112 opened upward in the metal plate 120. will be.

At this time, the inner surface of the cavity 112 forms an inner step 114 that is a boundary area so that the fluorescent layer 153 may be disposed while partitioning the upper resin part 151 and the lower resin part 153.

The metal plate 120 in which the package body 110 is integrally formed is made of a conductive metal material such as copper or an alloy material including copper, and a part of the package body is formed on the mounting surface on which the light emitting chip 130 is mounted. One end of the conductive wire is wire-bonded by the exposed metal plate 120 to form a lead terminal 123.

Side and bottom surfaces of the package body 110 are provided with external terminals 124 to be electrically mounted on the module substrate (not shown) through solder paste or solder balls.

The wire bonding may be performed by applying an adhesive to a mounting surface of the metal plate 120 that is exposed to the outside through the cavity 112 of the package body 110 integrally formed with the metal plate 120, as shown in FIG. 1B. After mounting the light emitting chip 130, the wire-bonding via the conductive wire 140 to electrically connect the mounted light emitting chip 130 with the lead terminal 123 of the metal plate 120.

The light emitting chip 130 is mounted on the bonding pad 132 formed on the top surface of the light emitting chip 130 in a fixed state mounted on the center area of the mounting surface of the metal plate 120 that is externally exposed through the cavity 112. One end is wire-bonded, and the other end is electrically connected to the metal plate 120 by the conductive wire 140 having the other end wire-bonded to the lead terminal 123 exposed outside from the mounting surface.

Here, the inner step 114 is preferably formed higher than the uppermost height of the conductive wire to prevent interference between the conductive wire 140 and the fluorescent layer 152 wire-bonded with the light emitting chip.

The forming of the lower resin part 151 may include a predetermined amount to cover the conductive wire 140 together with the light emitting chip 130 mounted on the mounting surface of the metal plate 120, as shown in FIG. 1C. The inner step 114 of the transparent resin is filled, then it is natural or ultraviolet curing.

Accordingly, the process of filling the transparent resin to form the lower resin portion 151 may be performed by a dispensing or encapsulation process that does not consider dispersion of the fluorescent material as compared with supplying the transparent resin including the fluorescent material. It can be done simply.

In the process of forming the fluorescent layer 152, as shown in FIG. 1D, the lower resin portion 152 filled to the inner step 114 is cured, and then is formed on the upper surface of the lower resin portion 151. The fluorescent layer 152 is formed of a fluorescent material and converts light generated when the light emitting chip emits light into white light with a predetermined thickness.

The fluorescent layer 152 may be formed by a rolling method of rolling a liquid fluorescent material on the upper surface of the lower resin part as a roller or by attaching a fluorescent film having a predetermined thickness to the upper surface of the lower resin part. have.

Here, the fluorescent layer 152 preferably extends to the upper surface of the inner step 114 to generate a bonding force with the package body.

On the other hand, by adding the step of forming the upper resin portion 153 on the upper surface of the fluorescent layer 152 can be manufactured LED package 100 having the upper resin portion 153, as shown in Figure 1e As described above, the transparent resin is secondarily filled to the upper end of the package body 110 so as to cover and protect the fluorescent layer 152 formed on the upper surface of the lower resin part 151, and then the upper resin may be cured by natural or ultraviolet rays. The branch 153 is formed.

The upper resin part 153 may include a fluorescent material to further increase the wavelength conversion efficiency for implementing the light generated by the light emitting chip as white light.

Subsequently, after the transparent resin filled on the upper surface of the fluorescent layer 114 is completely cured, the connection portion of the metal plate connecting the package body 110 and the package body adjacent thereto is cut, as shown in FIG. 1F. As described above, the LED package 100 in which the lower resin part 151, the fluorescent layer 152, and the upper resin part 153 are successively formed in the package body, the metal plate, the light emitting chip, the conductive wire, and the cavity 112. The manufacturing is completed.

On the other hand, the LED package 100, as shown in Figure 2, the lower body portion 151 and the fluorescent layer 152 in the package body, the metal plate, the light emitting chip, the conductive wire and the cavity 112 in a continuous multi-layer It is possible to manufacture the formed LED package 100, the fluorescent layer 152 is provided on the upper surface of the lower resin portion 151 is provided with a fluorescent film layer that is adhesively fixed when curing the resin.

The fluorescent layer 152 may be provided at the same height as the top height of the package body 110 to reduce the overall height of the package body 110 to reduce the size of the package product.

While specific embodiments of the present invention have been described in detail with reference to the drawings, the present invention is not limited to such specific embodiments. Those skilled in the art can variously change or change the present invention and use the equivalents, and the above embodiments can be applied in the same manner with appropriate modifications. However, such changes, modifications, and equivalents are clearly disclosed in advance within the scope of the present invention without departing from the technical spirit described in the claims below.

110: package body 112: cavity
120: metal plate 123: lead terminal
130: light emitting chip 140: conductive wire
151: lower resin portion 152: fluorescent layer
153: upper resin part

Claims (4)

a) forming a package body with a resin material so as to form a cavity having an internal step open to an upper portion of the metal plate;
b) wire bonding through conductive wires such that a light emitting chip mounted on the metal plate exposed through the cavity and a lead terminal of the metal plate are electrically connected to each other;
c) forming a lower resin part by filling the transparent resin to the inner step to cover the light emitting chip; And
d) forming a fluorescent layer having a predetermined thickness on an upper surface of the lower resin part; LED package manufacturing method comprising a. The method of claim 1,
And a step of filling the transparent resin to the upper end of the package body to cover the fluorescent layer to form an upper resin part. The method according to claim 1 or 2,
The inner step is an LED package manufacturing method, characterized in that provided in a position higher than the top height of the conductive wire to prevent interference between the conductive wire and the fluorescent layer wire-bonded with the light emitting chip. The method according to claim 1 or 2,
The fluorescent layer is formed by a rolling method of rolling a liquid fluorescent material on the upper surface of the lower resin portion as a roller or by attaching a fluorescent film having a predetermined thickness to the upper surface of the lower resin portion. Manufacturing method.
KR1020100045663A 2010-05-14 2010-05-14 Led package manufacturing method KR20110125992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100045663A KR20110125992A (en) 2010-05-14 2010-05-14 Led package manufacturing method

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Application Number Priority Date Filing Date Title
KR1020100045663A KR20110125992A (en) 2010-05-14 2010-05-14 Led package manufacturing method

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KR20110125992A true KR20110125992A (en) 2011-11-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150135972A (en) * 2014-05-26 2015-12-04 (주)피엔티 Light emitting diode package and method for fabricating the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150135972A (en) * 2014-05-26 2015-12-04 (주)피엔티 Light emitting diode package and method for fabricating the same

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