KR20110120080A - Light emitting device, method for fabricating the same, light emitting device package and lighting system including the same - Google Patents
Light emitting device, method for fabricating the same, light emitting device package and lighting system including the same Download PDFInfo
- Publication number
- KR20110120080A KR20110120080A KR1020100039598A KR20100039598A KR20110120080A KR 20110120080 A KR20110120080 A KR 20110120080A KR 1020100039598 A KR1020100039598 A KR 1020100039598A KR 20100039598 A KR20100039598 A KR 20100039598A KR 20110120080 A KR20110120080 A KR 20110120080A
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- South Korea
- Prior art keywords
- light emitting
- emitting device
- semiconductor layer
- conductivity type
- conductive semiconductor
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
Abstract
Description
Embodiments relate to a light emitting device, a method of manufacturing the light emitting device, a light emitting device package and an illumination system.
A light emitting device (LED) may be generated by combining elements of group III and group V on a periodic table of a p-n junction diode having a characteristic in which electrical energy is converted into light energy. LED can realize various colors by adjusting the composition ratio of compound semiconductors.
On the other hand, according to the prior art, there is a problem in that the lifespan and reliability due to current crowding is reduced.
In addition, according to the related art, current flows in the reverse direction during electrostatic discharge (ESD), thereby causing damage to the active layer, which is a light emitting region. To solve this problem, a Zener diode is applied to a package. When mounted, there is a problem that absorption of the amount of light occurs.
Embodiments provide a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and an illumination system capable of improving current spreading efficiency as well as improving light extraction efficiency.
Embodiments provide a light emitting device, a manufacturing method of a light emitting device, a light emitting device package, and an illumination system capable of preventing damage caused by electrostatic discharge without loss of light absorption.
The light emitting device according to the embodiment includes a substrate; A light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on the substrate, wherein the light emitting structure exposes a portion of the first conductive semiconductor layer to an upper portion thereof; A second conductivity type region having a higher concentration than the second conductivity type semiconductor layer in a portion of the second conductivity type semiconductor layer; A second electrode on the second conductive semiconductor layer; And a first electrode on the exposed first conductive semiconductor layer.
In addition, the manufacturing method of the light emitting device according to the embodiment comprises the steps of forming a light emitting structure including a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer on a substrate; Mesa-etching the light emitting structure to expose a portion of the first conductivity type semiconductor layer to the top; Forming a second conductivity type region at a higher concentration than the second conductivity type semiconductor layer in a portion of the second conductivity type semiconductor layer; And forming a second electrode on the second conductive semiconductor layer and a first electrode on the exposed first conductive semiconductor layer.
In addition, the light emitting device package according to the embodiment includes a package body; The light emitting device disposed on the package body; And an electrode electrically connecting the package body and the light emitting device.
In addition, the lighting system according to the embodiment includes a light emitting module unit having the light emitting device package.
According to the light emitting device, the method of manufacturing the light emitting device, the light emitting device package, and the lighting system according to the embodiment, light extraction efficiency can be increased by controlling the current flow.
Further, according to the embodiment, the reliability of the light emitting device can be improved by current spreading.
In addition, according to the embodiment, it is possible to prevent electrostatic discharge (ESD) of the LED without loss of light absorption.
1 is a cross-sectional view of a light emitting device according to an embodiment.
2 and 3 are conceptual diagrams of electric field induction in the light emitting device according to the embodiment.
4 to 6 are cross-sectional views of a method of manufacturing a light emitting device according to the embodiment.
7 is a cross-sectional view of a light emitting device package according to the embodiment.
8 is a perspective view of a lighting unit according to an embodiment;
9 is an exploded perspective view of the backlight unit according to the embodiment;
In the description of an embodiment according to the present invention, each layer (film), region, pattern or structure may be “on / over” or “below” the substrate, each layer (film), region, pad or pattern. In the case described as being formed under, "on / over" and "under" are formed "directly" or "indirectly" through another layer. It includes everything that is done. In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.
In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.
(Example)
1 is a cross-sectional view of a light emitting device according to an embodiment.
The
The second
In addition, the second
The embodiment may further include a
The embodiment is a structure for increasing the breakdown voltage, and may form the second
The second
According to an embodiment, through this structure, the concentrated strong electric field generated in the mesa edge region according to the prior art is induced or relaxed to the second
In addition, the embodiment may improve the current spreading of the LED by forming a high concentration of the second
2 and 3 are conceptual views of electric field induction in the light emitting device according to the embodiment.
LED destruction due to electrostatic discharge occurs during semiconductor reverse voltage. Charged at reverse voltage, a strong electric field is induced in the LED active region.
And, during electrostatic discharge, carriers (electrons, holes) are accelerated to collide with atoms to create other carriers, and the resulting carriers produce numerous carriers. This phenomenon is called avalanche breakdown. If the charge is induced to a strong stationary field and the electrostatic charge is exceeded by the semiconductor, the avalanche breakdown eventually leads to the destruction of the LED semiconductor.
The embodiment is a structure for increasing the breakdown voltage, and may form the second
According to the embodiment, as the doping concentrations N A and N D become larger as shown in FIGS. 2 and 3 and the following equations, a strong electric field is induced by the ionized charge in the depletion region.
Accordingly, according to the embodiment, the concentrated strong electric field generated in the mesa edge region may be induced or relaxed to the second
Hereinafter, a method of manufacturing a light emitting device according to an embodiment will be described with reference to FIGS. 4 to 6. The light emitting device in the embodiment may be formed of III-V group materials such as GaN, GaAs, GaAsP, GaP, but is not limited thereto. In addition, the order of the process described below is not limited, and the order may be different.
First, the
Thereafter, the light emitting structure 110 including the first
In an embodiment, an undoped semiconductor layer (not shown) may be formed on the
The first
The first
Thereafter, an active layer 114 is formed on the first conductivity
Thereafter, a second
The active layer 114 may be formed of any one or more of InGaN / GaN, InGaN / InGaN, AlGaN / GaN, InAlGaN / GaN, GaAs, / AlGaAs (InGaAs), and GaP / AlGaP (InGaP).
The second conductivity
Next, the light emitting structure 110 may be mesa-etched to expose a portion of the first
Next, as shown in FIG. 5, the second
For example, the second
The second
The embodiment is a structure for increasing the breakdown voltage, and may form the second
The second
According to an embodiment, through this structure, the concentrated strong electric field generated in the mesa edge region according to the prior art is induced or relaxed to the second
In addition, the embodiment may improve the current spreading of the LED by forming a high concentration of the second
Next, the
Next, a
The
According to the light emitting device, the method of manufacturing the light emitting device, the light emitting device package, and the lighting system according to the embodiment, light extraction efficiency can be increased by controlling the current flow.
Further, according to the embodiment, the reliability of the light emitting device can be improved by current spreading.
In addition, according to the embodiment, it is possible to prevent electrostatic discharge (ESD) of the LED without loss of light absorption.
7 is a cross-sectional view of a light emitting
Referring to FIG. 7, the light emitting device package according to the embodiment may include a
The
The
The
The
The
The light emitting device package according to the embodiment may be applied to an illumination system. The lighting system includes a lighting unit shown in FIG. 8 and a back light unit shown in FIG. 9, and may include a traffic light, a vehicle headlight, a signboard, and the like.
8 is a
Referring to FIG. 8, the
The
The light emitting
The
In addition, the
The at least one light emitting
The light emitting
The
9 is an exploded
The
The
The light emitting
The light emitting
The
The plurality of light emitting device packages 200 may be mounted on the
The
The
The
The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.
In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.
Claims (10)
A light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on the substrate, wherein the light emitting structure exposes a portion of the first conductive semiconductor layer to an upper portion thereof;
A second conductivity type region having a higher concentration than the second conductivity type semiconductor layer in a portion of the second conductivity type semiconductor layer;
A second electrode on the second conductive semiconductor layer; And
And a first electrode on the exposed first conductive semiconductor layer.
The second conductivity type region,
A light emitting device is formed so as not to contact the mesa edge region.
The second conductivity type region,
The light emitting device is formed between the second electrode and the mesa edge region.
The light emitting device further comprises a transparent electrode formed on the second conductive semiconductor layer.
Mesa-etching the light emitting structure to expose a portion of the first conductivity type semiconductor layer to the top;
Forming a second conductivity type region at a higher concentration than the second conductivity type semiconductor layer in a portion of the second conductivity type semiconductor layer; And
And forming a second electrode on the second conductive semiconductor layer and a first electrode on the exposed first conductive semiconductor layer.
Forming the second conductivity type region,
A method of manufacturing a light emitting device that is formed so as not to contact the mesa edge region.
Forming the second conductivity type region,
Method of manufacturing a light emitting device formed by ion implantation or diffusion.
The second conductivity type region,
The manufacturing method of the light emitting device is formed between the second electrode and the mesa edge region.
The light emitting device of any one of claims 1 to 4 disposed on the package body; And
Light emitting device package comprising; an electrode for electrically connecting the package body and the light emitting device.
Priority Applications (1)
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KR1020100039598A KR20110120080A (en) | 2010-04-28 | 2010-04-28 | Light emitting device, method for fabricating the same, light emitting device package and lighting system including the same |
Applications Claiming Priority (1)
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KR1020100039598A KR20110120080A (en) | 2010-04-28 | 2010-04-28 | Light emitting device, method for fabricating the same, light emitting device package and lighting system including the same |
Publications (1)
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KR20110120080A true KR20110120080A (en) | 2011-11-03 |
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KR1020100039598A KR20110120080A (en) | 2010-04-28 | 2010-04-28 | Light emitting device, method for fabricating the same, light emitting device package and lighting system including the same |
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