KR20110111608A - Laser cutting method for multilayer film having cop layer - Google Patents

Abstract

The present invention relates to a laser cutting method of a multilayer film including a COP layer capable of selectively cutting a multilayer film having a COP layer, and is provided on the surface of a flat panel display to realize a clear and high brightness screen. In the method for cutting a multilayer film formed by laminating a film layer, a TAC film layer, a COP layer, and a protective film layer, a position to cut and cut a multilayer film as a cutting object under the preceding laser generation unit and the subsequent laser generation unit. Arranging; Cutting the functional coating layer and the TAC film layer while moving along the path to be cut by the preceding laser generator; Cutting the COP layer while moving the trailing laser generator along the path; Winding the multilayer film including the functional coating layer, the TAC film layer, and the COP layer laminated on the protective film layer after the cutting is completed; And disposing the multi-layer film to a position to be subsequently cut. By being configured to include a separate cutting device when cutting the multi-layer film, the cutting surface of the multi-layer film is not smooth and rough and the multi-layer film is cut. Contamination by the adhesive between the layer and the layer can be prevented, and by using a plurality of laser cutting device there is an effect that the user can selectively cut to the desired COP layer smoothly.

Description

LASER CUTTING METHOD FOR MULTILAYER FILM HAVING COP LAYER}

The present invention relates to a laser cutting method of a multilayer film including a COP layer, and more particularly, a phenomenon that the cut surface of the multilayer film is not smooth and rough due to wear of a separate cutting device when the multilayer film is cut. When cutting, it is possible to prevent contamination by adhesive between layers, and a laser cutting method of a multilayer film including a COP layer that can be cut smoothly to a desired COP layer using a plurality of laser cutting devices. It is about.

Recently, the demand for multilayer films is increasing due to various needs. The multilayer films are obtained by laminating individual films using adhesives depending on the purpose. For example, it provides the optical characteristics of a flat panel display, protects the display unit, or is used as various packaging materials to protect the contents, and to protect the contents, shading to be selectively transmitted through the light attached to the car window or glass of the building Films, special wavelength blocking films that selectively block only specific wavelengths generated from optical sensors are widely used.

The multilayer film is cut to a suitable size according to the intended use and applied to the product. The method used for cutting the flexible multilayer film includes a steel blade having a thickness of about 50 to 200 with a wheel rotating on a substrate. Cutting grooves are formed on the surface of the substrate by dicing to form a cutting groove on the substrate and a blade wheel made of steel having a thickness of about 0.6 to 2 The method of cutting etc. which generate | occur | produces is typical.

By the way, in such a conventional multilayer film cutting device, in the case of dicing, frictional heat is generated in the area where the blade is being cut, and an adhesive for adhering the multilayer film to the surface of the blade during repeated cutting is attached to the adhesive. There is a problem that the contamination caused by the need to clean or replace the blade.

In addition, there is no configuration to finely adjust the cutting depth so that the user can selectively cut only the desired layer in the multilayer film structure using the blade was not able to satisfy the user's desire at all.

An apparatus provided to solve these problems is a laser cutting device for cutting a multilayer film using a laser. The laser used in such a laser cutting device typically has a wavelength of 10.6 micrometers because the absorption rate of the laser to the cutting object is large when the wavelength of the laser is 10.6 micrometers.

However, in the case of the multilayer film having the COP layer installed in the flat panel display among the various multilayer films as described above, the laser having a wavelength of 10.6 micrometers could not cut the COP layer, which is 10.6 Since the laser having a wavelength of micrometer does not absorb at all and transmits, the multilayer film including the COP layer is inevitably cut by the dicing method, so the above-described problems remain.

As a result, there has been a technical bias that it is impossible to cut a COP layer using a laser in the related art, but the applicant can use a laser to cut a multilayer film including a COP layer through repeated experiments and data collection. Technology has been developed.

The object of the present invention devised in view of the above point, the phenomenon that the cutting surface of the multilayer film is not smooth and rough due to the wear of a separate cutting device when cutting the multilayer film, and the adhesive between the layer and the film during the multilayer film cutting It is possible to prevent contamination by, and to provide a laser cutting method of a multilayer film including a COP layer that can be cut smoothly to a desired COP layer using a plurality of laser cutting device.

Laser cutting method of a multilayer film including a COP layer to achieve the object of the present invention as described above, is provided on the surface of the flat panel display to implement a clear and high brightness screen, the functional film layer, TAC film layer and COP layer And a method of cutting a multilayer film formed by stacking a protective film layer, the method comprising: disposing a multilayer film, which is a cutting object, under a preceding laser generating section and a trailing laser generating section at a position to be cut by cutting a photo; Cutting the functional coating layer and the TAC film layer while moving along the path to be cut by the preceding laser generator; Cutting the COP layer while moving the trailing laser generator along the path; Winding the multilayer film including the functional coating layer, the TAC film layer, and the COP layer laminated on the protective film layer after the cutting is completed; And disposing the multilayer film in a position to be subsequently cut.

Here, the wavelength of the laser generated by the preceding laser generation unit is characterized in that the 1.06 micrometers or more and 10.6 micrometers or less.

In addition, the wavelength of the laser generated by the trailing laser generator is characterized in that the 0.15 micrometers or more and 0.285 micrometers or less.

In addition, the functional coating layer, the TAC film layer and the lowermost layer of the multilayer film is completed cutting the COP layer is characterized in that a separate protective film layer is provided.

As described above, in the laser cutting method of the multilayer film including the COP layer according to the present invention, the cutting surface of the multilayer film is not smooth and rough due to wear of a separate cutting device when the multilayer film is cut. Contamination by the adhesive between the layers can be prevented, and by using a plurality of laser cutting devices, the user can selectively cut smoothly to the desired COP layer.

1 is a cross-sectional view showing the structure of a multilayer film including a COP layer that is a cutting object of the present invention,
2 is a cross-sectional view schematically showing the structure of a laser cutting device of a multilayer film including a COP layer of the present invention,
3 is a graph showing the extent to which the laser penetrates the cutting object at the wavelength of the laser used in the laser cutting device.
4 is a table describing the wavelength of the laser used in the laser cutting device and the degree to which the laser penetrates the cutting object at the wavelength.
5 is a flowchart sequentially illustrating a laser cutting method of a multilayer film including a COP layer according to an embodiment of the present invention.

Hereinafter, a laser cutting method of a multilayer film including a COP layer according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing the structure of a multilayer film including a COP layer which is a cutting object of the present invention, Figure 2 is a cross-sectional view schematically showing the structure of a laser cutting device of a multilayer film including a COP layer of the present invention. 3 is a graph showing the degree of penetration of the laser beam through the cutting object at the wavelength of the laser used in the laser cutting device, and FIG. 4 is a wavelength of the laser used in the laser cutting device and the laser is cut at the wavelength. 5 is a table describing the degree of permeation of water, and FIG. 5 is a flowchart sequentially illustrating a laser cutting method of a multilayer film including a COP layer according to an embodiment of the present invention.

In general, atoms and molecules exist in high or low energy levels. Low-level atomic molecules are usually excited to a high level by heat, and once they reach a high level, they return to a low level and glow.

In a general light source, excited atomic molecules independently emit light of different colors (wavelengths). When light with a wavelength hits an atom in the brief moment when the atom is excited, the atom is in phase with the wave that stimulates itself. It is induced to emit radiation with the radiation, which reduces or amplifies the passing light.

If this phenomenon is repeated enough, the final luminous flux, consisting entirely of coherent light (i.e., monofrequency or monochromatic light with all components in the same phase), has an incredibly strong intensity, which is the laser.

Laser processing using such a laser is a technique for cutting, drilling, welding, and quenching metal, plastic, wood, and cloth using a powerful laser. It is used in many fields because of its speed of operation and precise focusing.

This is because the laser is able to focus on a very small point and has a high energy density. In addition to the hardest diamonds, jewelry heat-resistant alloy ceramics can be processed.

In addition, even the same laser processing machine can perform a variety of operations if the output is different. If you increase the power and apply light continuously, you can cut the metal. If the power is reduced enough to melt and not evaporate, it turns into a welder. Further reductions can be applied to heat treatment only on the metal surface or to check for defects on the metal surface.

As shown in FIG. 2, the laser cutting apparatus 100 of the multilayer film including the COP layer of the present invention using such a laser generates a laser beam in an infrared region and irradiates the laser beam to the outside. And a direction of cutting of the laser beam irradiated from the trailing laser generator 120 and the preceding laser generator 110 and the trailing laser generator 120 to generate the laser beam in the ultraviolet region and to irradiate it to outside. It includes a refractive optical unit 130 for switching to the multilayer film 10 side, and a focusing optical unit 140 provided to focus the laser beam by focusing the laser beam refracted by the refractive optical unit 130 Consists of.

The lowermost layer of the multilayer film 10, which is the cutting object of the present invention, is provided with a protective film layer 11 for winding the multilayer film 10 and preventing damage to foreign substances or other surfaces, and a protective film layer 11 On the upper side of the TAC film layer 13 is attached by an adhesive.

In addition, a PVA film layer 12 (hereinafter referred to as a “COP layer”) containing a COP material, which is a polymer polarizing medium, is provided on the upper side of the TAC film layer 13.

The COP layer 12 has a polarizing function through the stretching process. In the stretching process, the polarization characteristics control increases the space between the polymer chains in the swelling zone and widens the polymer chain in the dyeing zone. As the iodine complex is adsorbed in a certain direction, the iodine complex absorbs light coming in the direction, thereby making natural light polarized.

The COP layer 12 to which the iodine complex is adsorbed is attached to the TAC film layer 13 again by an adhesive after drying.

The multilayer film 10 having the TAC film layer 13 attached to the upper and lower sides of the COP layer 12 is wound by drying, and the upper surface of the TAC film layer 13 disposed on the upper side prevents reflection or sharpness. In order to improve the functional coating layer 14 is formed as part of the surface treatment.

The laser beam generated by the preceding laser generator 110 of the laser cutting device 100 for cutting the multilayer film 10 is the surface of the refractive optical unit 130 provided in front of the preceding laser generator 110. After reflected from the direction of the conversion to the multilayer film 10 side, the focal length is adjusted while passing through the focusing optical unit 140 disposed below the refractive optical unit 130, the TAC film layer 13 and the functional coating layer (14) is cut off.

Here, the TAC film layer 13 located below the COP layer 13 is also cut at the same time, which means that a laser having a wavelength of 1.06 micrometers or more and 10.6 micrometers or less passes through the COP layer 13 and the energy thereof is TAC film. This is because it is transferred to the layer 13.

The wavelength of the laser beam generated by the preceding laser generation unit 110 may be changed according to the type of the multilayer film 10 to be cut into the infrared region, and in this embodiment, the TAC film layer 13 and the functional coating layer ( 14) the wavelength of the laser generated in the preceding laser generator 110 used to cut is effective to have a range of 1.06 micrometers or more and 10.6 micrometers or less as described above.

The laser beam generated by the trailing laser generator 120 is reflected from the surface of the refractive optical unit 130 provided in front of the trailing laser generator 120, as in the preceding laser generator 110, and the traveling direction thereof is changed. After the conversion to the multilayer film 10 side, the focal length is adjusted while passing through the focusing optical unit 140 disposed below the refractive-integration unit 130 to cut the COP layer 12.

The laser wavelength of the trailing laser generating unit 130 used to cut the COP layer 12 is absorbed into the COP layer 12 as the wavelength is lower in the ultraviolet region, so that the cutting processing portion of the laser is remarkably smooth and the cutting surface is rough. It is effective to prevent the load.

The wavelength of the laser generated by the trailing laser generation unit 130 for cutting the COP layer 12 in this embodiment is effective to have a range of 0.15 micrometers or more and 0.285 micrometers or less, and most preferably 0.266 micrometers. By using a laser having a wavelength of meters, only the COP layer 12 disposed above the protective film layer 11 can be cut.

3 and 4, the lower the wavelength of the laser, the smaller the transmittance, so the degree of laser absorbed by the cutting object increases, so that the cutting of the cutting object is possible, but when the wavelength of the laser is less than 0.15 micrometer Since the laser loses its function, the wavelength of the laser should be at least 0.15 micrometer or more.

On the other hand, when the wavelength of the laser is in the range exceeding 0.285 micrometers, for example, 0.286, the transmittance is 50.7%, and the degree of laser absorbed by the cutting object is 49.3%, less than half, effectively cutting the cutting object. The wavelength of the laser should be less than 0.285 micrometers.

The laser cutting method of the multilayer film including the COP layer having such a configuration is as follows.

First, the multilayer film 10, which is a cutting object, is disposed under the preceding laser generator 110 and the trailing laser generator 120 at a position to be cut.

Then, power is applied to the preceding laser generator 110 and the trailing laser generator 120 so that the laser is generated from the preceding laser generator 110 and the trailing laser generator 120 to be irradiated toward the multilayer film 10. do.

In the state where the laser is irradiated from the preceding laser generation unit 110 and the following laser generation unit 120 to the multilayer film 10 side, the preceding laser generation unit 110 is moved along the path to be cut. The functional coating layer 14 and the TAC film layer 13 are cut by using a laser generated in the).

Then, the trailing laser generator 120 cuts the COP layer 12 using the laser generated by the trailing laser generator 120 while moving along the path where the preceding laser generator 110 has moved.

At this time, the protective film layer 11 for protecting the lower surface of the multilayer film 10 is to adjust the cutting depth by adjusting the intensity of the laser so as not to cut and then irradiated with a laser having an infrared wavelength and an ultraviolet wavelength complex. When the multilayer film 1 is cut by a laser having a plurality of wavelengths as compared with the conventional single wavelength laser, the multilayer film 10 cut surface of the peripheral part of the cut surface is uneven and has an effect of preventing roughness.

Thereafter, the multi-layer film 10 wound on the winding machine (not shown) is subsequently uncut to cut the multi-layer film 10 so that the cutting position under the preceding laser generating unit 110 and the following laser generating unit 120 is reduced. By arranging and repeatedly performing the above-described process, the cutting operation of the multilayer film 10 proceeds continuously.

In addition, the multi-layer film 10 in which the functional coating layer 14, the TAC film layer 13, and the COP layer 12 have been cut is completed using a separate winding machine (not shown) using the protective film layer 11 present at the lowermost layer. ) The cutting operation of the multilayer film 10 is performed by the equipment of the continuous processing of the roll to roll (roll to roll), and the multilayer film 10 after the cutting is stored separately, if necessary, the multilayer film 10 Unroll the roll to use.

As described above, the laser cutting method of the multilayer film including the COP layer of the present invention has been described through the preferred embodiment, which is only intended to help the understanding of the present invention, and the technical scope of the present invention is not limited thereto.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. There is no saying.

100: laser cutting device 110: leading laser generation unit
120: trailing laser generation unit 130: refractive optical unit
140: focusing optics

Claims (4)

In the method for cutting a multi-layer film is provided on the surface of the flat panel display in order to implement a clear and high brightness screen formed by stacking a functional film layer, a TAC film layer, a COP layer and a protective film layer,
Disposing the multilayer film 10, which is a cutting object, under the preceding laser generator 110 and the trailing laser generator 120 at a position to be cut off (S1);
Cutting the functional coating layer 14 and the TAC film layer 13 while moving the preceding laser generator 110 along a path to be cut (S2);
Cutting the COP layer (12) while moving the trailing laser generator (120) along the path (S3);
Winding the multilayer film 10 including the functional coating layer 14, the TAC film layer 13, and the COP layer 12 stacked on the protective film layer after the cutting is completed (S4);
Disposing the multi-layer film 10 to the position to be subsequently cut (S5); Laser cutting method of a multi-layer film containing a COP layer comprising a. The method of claim 1,
The wavelength of the laser generated by the preceding laser generation unit 110 is a laser cutting method of a multilayer film containing a COP layer, characterized in that more than 1.06 micrometers or less than 10.6 micrometers. The method of claim 1,
The laser cutting method of the multilayer film including the COP layer, characterized in that the wavelength of the laser generated in the trailing laser generating unit 120 is 0.15 micrometers or more and 0.285 micrometers or less. The method of claim 3,
The lower layer of the functional film layer 14, the TAC film layer 13 and the cutting of the COP layer 12, the bottom layer of the multi-layer film 10 is a COP layer, characterized in that a separate protective film layer 11 is provided Laser cutting method of the multilayer film included.

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