KR102397685B1 - Laser processing apparatus - Google Patents

Abstract

In one embodiment of the present invention, an incident surface on which a laser beam is incident, a first area through which a part of the incident laser beam is transmitted and emitted as a first beam, and another part of the incident laser beam are formed. It is disposed on a movement path of an optical member including an exit surface having a second area for diffraction and output as a second beam, and the first beam and the second beam emitted from the optical member, It provides a laser processing apparatus including a condensing member for condensing the first beam and the second beam, respectively.

Description

Laser processing equipment {LASER PROCESSING APPARATUS}

An embodiment of the present invention relates to a laser processing apparatus.

There are mainly laser processing methods and mechanical processing methods as a method of cutting glass, and these methods are used in various ways depending on the type of material. _The laser processing method is a non-contact method, which generates less dust compared to the mechanical processing method, and is used to increase the strength due to external impact by improving the quality of the cut surface. ), an infrared laser (IR laser), etc. are used.

In the past, a standardized display such as a rectangle has been developed, but recently displays of various shapes rather than a simple rectangle have been developed, and a thin film of a different material is formed on the glass surface or in the middle rather than simple glass. In the conventional laser processing method of cutting in a straight line, there was a limitation in cutting brittle materials.

An embodiment of the present invention is to provide a laser processing apparatus using an interference beam.

In one embodiment of the present invention, an incident surface on which a laser beam is incident, a first area through which a part of the incident laser beam is transmitted and emitted as a first beam, and another part of the incident laser beam are formed. It is disposed on a movement path of an optical member including an exit surface having a second area for diffraction and output as a second beam, and the first beam and the second beam emitted from the optical member, It provides a laser processing apparatus including a condensing member for condensing the first beam and the second beam, respectively.

In one embodiment of the present invention, the first area of the exit surface may be formed of a plane parallel to the incident surface.

In an embodiment of the present invention, the second region of the emission surface may be formed of a diffraction grating.

In one embodiment of the present invention, the first area of the emission surface is located at a central portion of the emission surface, and the second area of the emission surface is located on both sides of the first area with respect to the first area. can be placed.

In one embodiment of the present invention, an imaginary center line passing through the center of the first region may pass through the center of the light collecting member.

In one embodiment of the present invention, the first beam passing through the light collecting member is focused on one point, and the second beam passing through the light collecting member has a depth of focus in the form of an interference beam. ; can be focused into the area within the DOF).

Another embodiment of the present invention is a light splitting member for splitting an incident laser beam into a first beam and a second beam, disposed on the path of the second beam to diffract the second beam A diffraction unit including an optical member for emitting a first beam, is disposed on the path of the 2-1 beam so that the path of the 2-1 beam overlaps the path of the first beam. A laser processing apparatus including an optical path changing unit for changing a path and a condensing member disposed on the path of the first beam and the 2-1 beam to condense each of the first beam and the 2-1 beam to provide.

In an embodiment of the present invention, the incident laser beam includes a first wavelength beam and a second wavelength beam having a wavelength different from that of the first wavelength beam, and the light splitting member includes the first wavelength beam and the second wavelength beam. The second wavelength beam may be divided into the first beam and the second beam, respectively.

In one embodiment of the present invention, the optical member may be formed of a reflective surface having a diffraction grating on one surface on which the second beam is incident.

In an embodiment of the present invention, the first beam passing through the light collecting member is focused on a single point, and the 2-1 beam passing through the light collecting member has a depth of focus (Depth) in the form of an interference beam. Of focus (DOF) can be focused.

In an embodiment of the present invention, the light splitting member divides a portion of the laser beam into the first beam polarized to one of P-polarized light and S-polarized light, and divides another portion of the laser beam into the P-polarized light and the S-polarized light. It may be a polarization beam splitter that splits the second beam polarized into the other one of the S-polarized lights.

In one embodiment of the present invention, a laser irradiation means for irradiating the laser beam and disposed between the laser irradiation means and the light splitting member, changing the phase of the incident laser beam to provide the light splitting member It may further include a first phase delay member.

In one embodiment of the present invention, the laser processing apparatus may adjust the intensity ratio of the first beam and the second beam by adjusting the angle of the first phase delay member.

In an embodiment of the present invention, the optical path changing unit may include a mirror member for reflecting the incident 2-1 beam, and a lens member disposed between the mirror member and the optical member.

In one embodiment of the present invention, the laser processing apparatus can adjust the position at which the first beam and the 2-1 beam are focused by moving the position of the lens member.

Other aspects, features and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

The laser processing apparatus according to the embodiments of the present invention forms two types of laser beams having different energy properties, and can easily cut brittle bodies having various structures, such as laminated glass or single plate glass including a thin film. .

1 is a view showing a laser processing apparatus according to an embodiment of the present invention.
FIG. 2 is a view for explaining only the components of the laser processing apparatus of FIG. 1 .
FIG. 3 is an enlarged view of part A of FIG. 1 .
4 is a view showing a laser processing apparatus according to another embodiment of the present invention.
FIG. 5 is an enlarged view of part B of FIG. 4 .
6 is a view for explaining a processing method of the laser processing apparatus of FIG.
FIG. 7 is a view showing another embodiment of the laser processing apparatus of FIG. 6 .
8 is a view showing a laser processing apparatus according to another embodiment.

Hereinafter, the following embodiments will be described in detail with reference to the accompanying drawings, and when described with reference to the drawings, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted.

Since the present embodiments can apply various transformations, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present embodiments, and a method of achieving them will become clear with reference to the details described later in conjunction with the drawings. However, the present embodiments are not limited to the embodiments disclosed below and may be implemented in various forms.

In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from other components without limiting meaning.

In the following examples, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have means that the features or components described in the specification exist, and the possibility that one or more other features or components will be added is not excluded in advance.

In the following embodiments, when it is said that a part, such as a unit, region, or component, is on or on another part, not only when it is directly on the other part, but also other units, regions, components, etc. are interposed therebetween. cases are included.

In the following examples, terms such as connect or combine do not necessarily mean direct and/or fixed connection or coupling of two members unless the context clearly indicates otherwise, and does not necessarily mean that another member is interposed between two members. It's not about exclusion.

It means that a feature or element described in the specification is present, and does not preclude the possibility that one or more other features or elements may be added.

In the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the following embodiment is not necessarily limited to the illustrated bar.

Figure 1 is a view showing a laser processing apparatus 100 according to an embodiment of the present invention, Figure 2 is a view for explaining only the components of the laser processing apparatus 100 of Figure 1, Figure 3 is Figure 1 It is an enlarged view of part A of .

1 to 3 , the laser processing apparatus 100 according to an embodiment of the present invention includes an optical member 110 and a light collecting member 120 . In addition, although not shown, the laser processing apparatus 100 may include a laser irradiation means (not shown) and a processing table (not shown) to cut the brittle body M such as glass.

In the present specification, the brittle body (M) means a cutting object such as glass used in a display device, and as a cutting object such as a tubular glass as well as a plate-shaped glass, the shape is not limited. The brittle body M may be made of a brittle material including a glass material such as quartz, sodalime, and borosilicate, but the technical spirit of the present invention is not limited thereto. Of course, it can be applied to cutting objects of various materials that can be cut. For example, the brittle body M may be made of a single glass, and as shown, a thin film 2 of a different material may be provided between the upper glass 1 and the lower glass 3 . Alternatively, the brittle body M may have a structure in which a thin film is provided on a single glass surface.

A laser irradiation means (not shown) may generate a laser beam L and irradiate it to the optical member 110 . In this case, various optical systems capable of changing or processing the path of the laser beam L may be disposed between the laser irradiation means (not shown) and the optical member 110 . Also, the laser irradiation means (not shown) may be a picosecond laser generator or a femtosecond to microsecond laser generator. For example, a picosecond laser generator uses pulses of several picoseconds to minimize heat transfer and thermal deformation from the brittle body (M) to the periphery of the laser processing area to produce a high-precision shape, that is, a shape with an error within 10 μm. can be processed

The optical member 110 may include an incident surface 111 on which a laser beam L is incident, and an exit surface 112 opposite to the incident surface 111 . At this time, the emitting surface 112 transmits a part of the incident laser beam L and diffracts the other part of the first area A1 and the laser beam L that is emitted to the first beam L1 by diffraction. A second area A2 emitting to the second beam L2 may be provided. Specifically, the first area A1 of the exit surface 112 is made of a plane parallel to the incidence surface 111 , and the first beam L1 can be emitted in the incident direction of the laser beam L as it is. there is. The second area A2 of the emission surface 112 may be formed of a diffraction grating. The diffraction grating may be a plurality of groove patterns formed in one direction.

As an embodiment, the first area A1 of the emission surface 112 is located at the center of the emission surface 112 , and the second area A2 of the emission surface 112 forms the first area A1 . It may be disposed on both sides of the first area A1 as a center. In other words, the optical member 110 emits the laser beam L incident to the center as it is, and diffracts and emits the laser beam L incident through the peripheral region, so that the first beam L1 having high energy density. Although the excess energy density is low, the second beam L2 having a coherence property may be generated.

The light collecting member 120 is disposed on a movement path of the first beam L1 and the second beam L2 emitted from the optical member 110 , and transmits the first beam L1 and the second beam L2 respectively. can be condensed. The light collecting member 120 may be an image lens positioned on the emitting surface side of the optical member 110, and although it is expressed as one lens in the drawing, the first beam L1 and the second beam L2 can be focused. It may consist of a plurality of lens groups. In this case, the imaginary center line S1 passing through the center O1 of the first area A1 of the optical member 110 may pass through the center O2 of the light collecting member 120 .

Through this, the first beam L1 passing through the light collecting member 120 is focused on one point f1, and the second beam L2 passing through the light collecting member 120 is interfered with the depth of focus. It can be focused on the area within the (Depth Of Focus). Specifically, the first beam L1 forms a focusing beam focused on one point f1 through the light collecting member 120 , and the second beam L2 passes through the light collecting member 120 and interferes By this phenomenon, an interference beam having a long depth of focus can be formed. Here, the interference beam may be defined as a Bessel beam in which energy density is distributed in the depth-of-focus area DOF due to the coherence property.

That is, since the focusing beam formed by the first beam L1 is focused on one point, the energy density per unit area is high, and since the interference beam formed by the second beam L2 is focused on a larger area than the focusing beam, per unit area energy density is low. The laser processing apparatus 100 according to an embodiment of the present invention forms the above two types of beams having different properties through one optical member 110, so that not only the brittle body M made of a single material but also the heterogeneous (M) It is possible to effectively cut the brittle body M provided with the material of the same species.

Meanwhile, as shown in FIG. 3 , a point f1 at which the first beam L1 is focused may be located in a depth-of-focus area DOF at which the second beam L2 is focused. However, the present invention is not limited thereto, and by adjusting the focal length of the light collecting member 120 or the distance between the optical member 110 and the light collecting member 120, the positions of the point f1 and the depth of focus area DOF are determined. You can also change it.

Figure 4 is a view showing a laser processing apparatus 200 according to another embodiment of the present invention, Figure 5 is a view showing an enlarged portion B of Figure 4, Figure 6 is a laser processing apparatus 200 of Figure 4 ) is a diagram for explaining the processing method.

4 to 6 , the laser processing apparatus 200 according to another embodiment of the present invention includes a light splitting member 202 , a diffraction unit 210 , an optical path changing unit 230 and a light collecting member 220 . includes

The light splitting member 202 may split the incident laser beam L into a first beam L1 and a second beam L2 . For example, the light splitting member 202 may be a polarized beam splitter that separates incident light from each other according to a polarization component. To this end, although not shown, the laser processing apparatus 200 may further include a first phase delay member 201 between the laser irradiation means (not shown) and the light splitting member 202 .

The first phase delay member 201 may change the phase of the incident laser beam L to provide the light splitting member 202 . The laser beam L whose phase is delayed while passing through the first phase delay member 201 is divided into a first beam L1 and a second beam L2 having different polarization components through the light splitting member 202 . can be divided. For example, the first phase delay member 201 may be a λ/2 waveplate, and when it is configured as a λ/2 waveplate, the laser beam L has the same ratio as the P-polarized laser beam and , may include an S-polarized laser beam.

The light splitting member 202 divides a part of the laser beam L that has passed through the first phase delay member 201 into a first beam L1 polarized to one of P-polarized light and S-polarized light, and the laser beam L ) may be split into the second beam L2 polarized to the other of P-polarized light and S-polarized light. In this case, the laser processing apparatus 200 may adjust the intensity ratio of the first beam L1 and the second beam L2 by adjusting the angle of the first phase delay member 201 . By using this, the laser processing apparatus 200 differently adjusts the intensity ratio of the first beam (L1) and the second beam (L2) according to the material, thin film structure, thickness, etc. of the brittle body (M), more effectively brittle body (M) can be cleaved.

The diffraction unit 210 is disposed on the path of the second beam L2 to diffract the second beam L2 and includes an optical member 211 for emitting the second beam L2-1. can do. Here, in the optical member 211 according to another embodiment, unlike the optical member according to the embodiment, one surface on which the second beam L2 is incident is a diffraction mirror ( grating mirror).

On the other hand, the diffraction unit 210 provides the 2-1 th beam L2-1 that is reflected and emitted to the light collecting member 220 through the light splitting member 202 and the light path changing unit 230, One or more second phase delay members 213 and 214 may be further included between the split member 202 and the optical member 211 . For example, the 2-1 th phase delay member 213 may be a λ/4 wave plate, and the 2-2 th phase delay member 214 may be a λ/2 wave plate. In other words, the one or more second phase delay members 213 and 214 change the polarization component of the second beam L2 provided to the optical member 211, and pass through the light splitting member 202 to the optical path changing unit ( 230) can be provided.

The light path changing unit 230 is disposed on the path of the 2-1 (L2-1) so that the path of the 2-1 beam (L2-1) overlaps the path of the first beam (L1). -1 The path of the beam L2-1 may be changed. The optical path changing unit 230 includes a mirror member 232 for reflecting the incident 2-1 beam L2-1, and a lens member 231 disposed between the mirror member 232 and the optical member 211. may include More specifically, the lens member 231 may be disposed between the light splitting member 202 and the mirror member 232 in the path of the 2-1 beam L2-1.

Like the diffraction unit 210 , the light path changing unit 230 provides the 2-1 th beam L2-1 to the light collecting member 220 via the light splitting member 202 , the light splitting member 202 . ) and one or more third phase delay members 233 and 234 between the mirror member 232 may be further included. For example, the 3-1 th phase delay member 233 may be a λ/4 wave plate, and the 3-2 th phase delay member 234 may be a λ/2 wave plate. In addition, the 3-1 th phase delay member 233 may be disposed between the lens member 231 and the mirror member 232 , and the 3-2 phase delay member 234 includes the light splitting member 202 and the lens. It may be disposed between the members 231 . The one or more third phase delay members 233 and 234 change the polarization component of the 2-1 beam L2-1 provided to the optical path changing unit 230, and pass through the light splitting member 202 It may be provided as a light collecting member 220 .

On the other hand, the laser processing apparatus 200 according to another embodiment may move the position of the lens member 231 to adjust the position where the first beam (L1) and the 2-1 beam (L2-1) are focused. More specifically, the lens member 231 may adjust the focusing position of the first beam L1 and the 2-1 beam L2-1 by adjusting the distance from the light splitting member 202 .

The light collecting member 220 is disposed on a path of the first beam L1 and the 2-1 beam L2-1 to condense the first beam L1 and the 2-1 beam L2-1, respectively. can do it As an embodiment, as shown in FIG. 5 , a point f1 on which the first beam L1 is focused is spaced apart from the depth of focus area DOF on which the 2-1 beam L2-1 is focused. can In this case, in cutting the brittle body M' having the thin film 2 of a different material on the lower glass 3, as shown in FIG. The beam L1 is positioned on the thin film 2 , and the second-first beam L2-1 focused on the depth-of-focus area DOF is positioned on the glass 3 to simultaneously perform cutting. Meanwhile, between the light collecting member 220 and the light splitting member 202, one or more fourth phase delay members 221 for changing the phases of the first beam L1 and the 2-1 beam L2-1 are further provided. may include As an embodiment, the fourth phase delay member 221 may be a λ/4 wave plate.

As another embodiment, by moving the position of the lens member 231 , a point f1 at which the first beam L1 is focused may be located within the depth of focus area DOF. Through this, as shown in (a) of FIG. 6 , it is possible to position the first beam L1 focused on the thin film 2 provided between the upper glass 1 and the lower glass 3 , The glass (1), the thin film (2) and the lower glass (3) can be cut at the same time.

FIG. 7 is a view showing another embodiment of the laser processing apparatus of FIG. 6 .

Referring to FIG. 7, the laser processing apparatus 200-1 of another embodiment has the same optical system configuration as the laser processing apparatus 200 of FIG. 6, but the laser beam incident through the laser irradiation means (not shown) is It characterized in that it includes a one-wavelength beam (B1) and a second-wavelength beam (B2) having a wavelength different from that of the first-wavelength beam (B1).

The laser processing apparatus 200-1 of another embodiment may be utilized in various ways according to the structure or properties of the brittle body M by using two types of lasers having different wavelengths. To this end, the laser irradiating means (not shown) may include a first wavelength laser irradiating means and a second wavelength laser irradiating means.

In this case, the light splitting member 202 may split the first wavelength beam B1 and the second wavelength beam B2 to become the first beam L1 and the second beam L2 , respectively. To this end, the first wavelength beam B1 may be light polarized by any one of P-polarized light and S-polarized light, and the second wavelength beam B2 may be light polarized to the other one of P-polarized light and S-polarized light. In this case, even if the first phase delay member is not provided between the laser irradiation means (not shown) and the light splitting member 202 , the light splitting member 202 may be capable of splitting the polarization.

8 is a view showing a laser processing apparatus 200-2 according to another embodiment.

Referring to FIG. 8 , the laser processing apparatus 200 - 2 according to another embodiment includes a transmissive optical member 211', unlike the reflective optical member 211 of the laser processing apparatus 200 of FIG. 6 . characterized in that

The optical member 211 ′ according to another embodiment may include an incident surface on which the first wavelength beam B1 is incident, and an exit surface that is opposite to the incident surface and diffracts the incident first wavelength beam B1 to be emitted. can In other words, the laser processing apparatus 200 - 2 directs the first wavelength beam B1 to the incident surface of the optical member 211 ′, and a second wavelength beam having a wavelength different from that of the first wavelength beam B1 . (B2) may be directly incident on the light splitting member 202 . In this case, the first wavelength beam B1 and the second wavelength beam B2 may have different polarization components, and accordingly, by changing the configuration of the phase delay member of the optical system, the first beam L1 and the second beam L2 ) may be provided as the light collecting member 220 .

As described above, the laser processing apparatus according to the embodiments of the present invention forms two types of laser beams having different energy properties to easily cut brittle objects having various structures such as laminated glass or single plate glass including thin films. can be cut sharply.

As described above, the present invention has been described with reference to one embodiment shown in the drawings, but it will be understood that various modifications and variations of the embodiments are possible therefrom by those of ordinary skill in the art. Accordingly, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

100: laser processing device
110: optical member
111: incident surface
112: exit surface
120: light collecting member

Claims (9)

In the laser processing apparatus,
a light splitting member that splits the incident laser beam into a first beam and a second beam;
a diffraction unit disposed on the path of the second beam to diffract the second beam and include an optical member emitting the second beam as a 2-1 beam;
a mirror member for reflecting the incident 2-1 beam, and a lens member disposed between the mirror member and the optical member, disposed on the path of the 2-1 beam an optical path changing unit for changing the path of the 2-1 beam so that the path overlaps the path of the first beam; and
and a light collecting member disposed on a path of the first beam and the 2-1 beam to condense each of the first beam and the 2-1 beam;
The first beam passing through the light collecting member is focused on one point,
The 2-1 beam passing through the condensing member is condensed to a depth of focus (DOF) region in the form of an interference beam,
The laser processing apparatus moves the position of the lens member to adjust the distance between the first beam and the 2-1 beam to be condensed, a laser processing apparatus. According to claim 1,
The incident laser beam includes a first wavelength beam and a second wavelength beam having a wavelength different from that of the first wavelength beam,
The light splitting member divides the beam of the first wavelength and the beam of the second wavelength to be the first beam and the second beam, respectively. 3. The method of any one of claims 1 and 2,
The optical member is made of a reflective surface having a surface on which the second beam is incident is a diffraction grating (diffraction grating), laser processing apparatus. delete 3. The method of any one of claims 1 and 2,
The light splitting member divides a part of the laser beam into the first beam polarized to one of P polarization and S polarization, and divides another part of the laser beam into the second beam polarized to the other one of P polarization and S polarization A laser processing device that is a polarization beam splitter that splits into two beams. 6. The method of claim 5,
laser irradiation means for irradiating the laser beam; and
The laser processing apparatus further comprising; a first phase delay member disposed between the laser irradiation means and the light splitting member, by changing the phase of the incident laser beam to provide the light splitting member. 7. The method of claim 6,
The laser processing apparatus for adjusting the angle of the first phase delay member to adjust the intensity (intensity) ratio of the first beam and the second beam, laser processing apparatus.



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