KR20110107257A - Mold release film - Google Patents

Abstract

An object of the present invention is to provide a release film that is excellent in peelability with a molded product obtained by molding a mold mold or a mold resin, and furthermore has a heat resistance strength that the film does not melt even at a use temperature exceeding 200 ° C. .
In the present invention, a fluorosilicon compound layer is formed on at least one side of the film. The said film is obtained by shape | molding the resin composition containing a thermoplastic resin, or the resin composition which mainly uses a thermoplastic resin and mixes a thermoplastic elastomer. The said fluorosilicon compound layer is obtained by apply | coating and drying the release composition containing the fluorosilicon compound which has the silyl group containing a hydrolysable site | part in a molecule | numerator to the said film.

Description

Release film {MOLD RELEASE FILM}

This invention relates to the film for mold release used at the time of resin mold shaping | molding or manufacture of a printed wiring board, a flexible printed wiring board, etc.

For example, a semiconductor device such as a transistor, an IC, an LSI, an ultra LSI, or an optical semiconductor device such as an LED, a photoisolator, a phototransistor, a photodiode, a CCD, a CMOS, and the like may be an epoxy resin composition or a silicone resin composition as a sealing material. It is sealed by resin mold molding by transfer molding.

A mold shaping | molding apparatus is used for sealing the above-mentioned semiconductor element and an optical semiconductor element, The sealing material containing an epoxy resin composition and a silicone resin composition is inject | poured into a mold metal mold | die, and is shape-molded.

As a method of mold-releasing a mold metal mold | die and the molded processed article, the method of interposing the film for mold release between a mold metal mold | die and mold resin, for example is utilized (refer patent document 1). The release film is supplied to a roll to roll in a mold molding apparatus, enters a mold mold temperature controlled at a molding process temperature, is sucked by vacuum, and adheres to the mold mold, and then the mold resin is filled. If the mold die is opened when the mold resin is cured after a certain time, the molded article is peeled from the mold release film while the mold release film is attracted to the mold die. As the release film, for example, a single layer film made of a thermoplastic fluororesin ethylene tetrafluoride-ethylene copolymer resin (ETFE resin) or a tetrafluoroethylene-hexafluoropropylene copolymer resin (FEP resin) is used (see Patent Document 2). ).

However, such a release film is excellent in peelability with a mold mold and a molded article in general resin mold molding at about 180 ° C, but a problem arises in that the film is melted in molding at a temperature exceeding 200 ° C.

Moreover, as a release film which consists of thermoplastic resins other than a thermoplastic fluororesin, the film which consists of polyethylene terephthalate resin (PET resin), polymethyl pentene resin (PMP resin), etc. is put into practical use. Moreover, as a film for releases which consists of thermoplastic elastomers other than a thermoplastic fluororesin, the method of using the film which consists of a resin composition containing crystalline aromatic polyester containing butylene terephthalate as a crystal component is known (refer patent document 3).

Japanese Patent Laid-Open No. 8-142105 Japanese Patent Laid-Open No. 2001-310336 Japanese Patent Publication No. 2007-224311

However, as a release film, as shown in patent document 3, the resin composition containing crystalline aromatic polyester which contains butylene terephthalate in a polyethylene terephthalate resin (PET resin), a polymethyl pentene resin (PMP resin), or a crystalline component. When using the film which consists of these, a problem arises that peelability with a mold metal mold | die and a molded article is inferior in general resin mold shaping | molding at around 180 degreeC. Thus, it is a fact that the film which consists of resins other than a thermoplastic fluororesin cannot be used suitably as a film for peeling in resin mold shaping | molding.

This invention is made | formed in view of the above, The release film which is excellent in peelability with the molded article obtained by shape | molding a mold metal mold | die and mold resin, and also has heat resistance which the film does not melt even at the use temperature exceeding 200 degreeC. The purpose is to provide.

In order to solve the said subject, the film for mold release of this invention has a hydrolyzable site | part on at least one side of the film obtained by shape | molding the resin composition containing a thermoplastic resin, or the resin composition which mainly uses a thermoplastic resin and mixes a thermoplastic elastomer. A release composition comprising a fluorosilicon compound having a silyl group in a molecule is applied and dried to form a fluorosilicon compound layer.

In the above invention, the thermoplastic resin is polyphenylene sulfide resin (PPS resin), polysulfone resin (PSF resin), polyether sulfone resin (PES resin), polyether ether ketone resin (PEEK resin), polyimide resin (PI resin), polyamideimide resin (PAI resin), polyetherimide resin (PEI resin), polyethylene naphthalate resin (PEN resin), polyamide resin (PA resin), polyacetal resin (P0M resin), polycarbonate Resin (PC resin), polyphenylene ether resin (PPE resin), polybutylene terephthalate resin (PBT resin), polyethylene terephthalate resin (PET resin), cyclic polyolefin resin (COP resin), syndiotactic polystyrene resin ( SPS resin), polymethylpentene resin (PMP resin), polymethyl methacrylate resin (PMMA resin), polyethylene resin (PE resin), polypropylene resin (PP resin), polystyrene resin (PS resin), polyacetic acid It is at least one of a resin (PVAc resin), acrylonitrile butadiene styrene resin (ABS resin) and acrylonitrile styrene resin (AS resin), the thermoplastic elastomer is a polyester elastomer (abbreviation, TPEE), a polyamide elastomer ( Symbol, TPA), polyurethane-based elastomer (symbol, TPU), styrene-based elastomer (symbol, TPS) and olefin elastomer (symbol, TPO) is characterized in that at least one.

In the above invention, the release composition is one selected from the group consisting of an organic titanium compound, an organic zirconium compound, and an organosilicon compound with respect to 100 parts by mass of a fluorosilicone compound having a silyl group containing a hydrolyzable moiety in a molecule thereof. It is characterized by being a composition which contains a compound of a species or 2 or more types of compounds in 0.05 mass part-20 mass parts.

In the above invention, the release composition is one compound selected from the group consisting of an organic titanium compound and an organic zirconium compound with respect to 100 parts by mass of a fluorosilicone compound having a silyl group containing a hydrolyzable moiety in a molecule or It is a composition containing 2 or more types of compounds in 0.05 mass part-20 mass parts.

In the above invention, the release composition is one compound selected from the group consisting of an organic titanium compound and an organic zirconium compound with respect to 100 parts by mass of a fluorosilicone compound having a silyl group containing a hydrolyzable moiety in a molecule or It is a composition which contains 2 or more types of compounds in 0.05 mass part-20 mass parts, and contains an organosilicon compound in 0.05 mass part-20 mass parts.

In the above invention, the thickness of the single-layer film or the multilayer film of two or more layers obtained by molding a resin composition containing a thermoplastic resin or a resin composition mainly comprising a thermoplastic resin and mixed with a thermoplastic elastomer is 5 μm to 500 μm. Wherein the thickness of the fluorosilicon compound layer obtained by applying and drying a release composition comprising a fluorosilicone compound having a silyl group in the molecule containing a hydrolyzable moiety is in the range of 0.05 μm to 10 μm. .

According to the release film of this invention, while being excellent in peelability with the molded article obtained by shape | molding a mold metal mold | die and a mold resin, it can also have heat resistance at the use temperature exceeding 200 degreeC.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows one Embodiment of the release film of this invention.
It is a figure which shows schematic structure which shows one Embodiment of the film manufacturing apparatus which manufactures the film for mold release of this invention.
It is sectional drawing which shows the periphery of the material input hopper of the film manufacturing apparatus shown in FIG.
Fig. 4 is a table showing Examples 1 to 5 of the present invention together with their evaluations.
5 is a table showing Examples 6 to 10 of the present invention together with their evaluations.
6 is a table showing Comparative Examples 1 to 5 together with their evaluation in correspondence with Examples of the present invention.
7 is a table showing Comparative Example 6 and Comparative Example 7 together with their evaluation in correspondence with Examples of the present invention.

MEANS TO SOLVE THE PROBLEM The present inventors examined variously in order to achieve the said objective, and, as a result, it is hydrolyzable to at least one side of the film obtained by shape | molding the resin composition containing a thermoplastic resin, or the resin composition which mainly consists of a thermoplastic resin and mixes a thermoplastic elastomer. When the release composition containing the fluorosilicon compound which has a silyl group containing a site | part in a molecule | numerator is apply | coated and dried, and a fluorosilicon compound layer is formed, it is excellent in peelability with the molded article obtained by shape | molding a mold metal mold | die or a mold resin, It was clarified that the film for mold release which also has heat resistance in the use temperature exceeding 200 degreeC is obtained.

Moreover, as a result of examination, 1 type chosen from the group which consists of an organic titanium compound, an organic zirconium compound, and an organosilicon compound with respect to 100 mass parts of the fluorosilicone compound which has a silyl group containing a hydrolysable site | part in a mold release composition in a molecule | numerator It was clarified that the compound or two or more compounds contained in the composition contained in the range of 0.05 parts by mass to 20 parts by mass in total were more effective.

Here, as the thermoplastic resin, for example, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, polyether ether ketone resin, polyimide resin, polyamideimide resin, polyetherimide resin, polyethylene naphthalate resin, poly Amide resin, polyacetal resin, polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate resin, polyethylene terephthalate resin, cyclic polyolefin resin, syndiotactic polystyrene resin, polymethylpentene resin, polymethyl methacrylate resin , At least one of polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl acetate resin, acrylonitrile butadiene styrene resin and acrylonitrile styrene resin can be used.

As the thermoplastic elastomer, for example, at least one of a polyester elastomer, a polyamide elastomer, a polyurethane elastomer, a styrene elastomer, and an olefin elastomer can be used.

These thermoplastic resins and thermoplastic elastomers can be appropriately selected and used according to the heat resistance required. As preferable thermoplastic resin, for example, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, polyether ether ketone resin, polyimide resin, polyamideimide resin, polyetherimide resin, polyethylene naphthalate resin, polyamide Resins, polyacetal resins, polycarbonate resins, polyphenylene ether resins, polybutylene terephthalate resins, polyethylene terephthalate resins, cyclic polyolefin resins, syndiotactic polystyrene resins and polymethylpentene resins. And as a more preferable thermoplastic resin, for example, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, polyether ether ketone resin, polyimide resin, polyamideimide resin, polyetherimide resin, polyethylene naphthalate resin , Cyclic polyolefin resins, syndiotactic polystyrene resins and polymethylpentene resins. Preferable thermoplastic elastomers are, for example, polyester elastomers, polyamide elastomers, styrene elastomers and olefin elastomers. Further preferred thermoplastic elastomers include polyester elastomers, polyamide elastomers and styrene elastomers.

In this invention, the polyetherimide resin which is an amorphous thermoplastic resin is illustrated as a resin composition containing a thermoplastic resin. Moreover, the resin composition which consists of a thermoplastic resin as a main component and mixes a thermoplastic elastomer is illustrated as a resin composition which mixes styrene-type elastomer with the syndiotactic polystyrene resin which is a crystalline thermoplastic resin as a main component. However, the present invention is not limited to these resin compositions.

Polyetherimide resin is represented by following General formula (1) or (2), for example. In addition, general formula (1) or (2) is shown as resin which has a repeating unit.

Specifically, this polyetherimide resin has Ultem 1000-1000 (manufactured by SABIC Innovative Plastics Japan, trade name) at 211 ° C, and Ultem 1010-1000 (SABIC Ino) at 223 ° C. And VETEM CRS5001-1000 (manufactured by SABIC Innovative Plastics Japan, trade name) having a glass transition point of 235 ° C, and the like.

Moreover, as a polyetherimide resin, the block copolymer, random copolymer, or modified body with another copolymerizable monomer can also be used. For example, Ultem XH6050-1000 (SABIC Innovative Plastics Japan Co., Ltd. brand name) of the glass transition point which is a polyether imide sulfone copolymer of 252 degreeC can be used. In addition, a polyether imide resin can be used by alloying or blending 2 or more types individually by 1 type.

The above-described syndiotactic polystyrene resin, which is a crystalline thermoplastic resin, has a three-dimensional structure different from a general polystyrene resin, and its stereoregularity has a syndiotactic structure. More specifically, it has a three-dimensional structure in which the phenyl groups of the side chain are alternately located in the opposite direction with respect to the main chain formed by the carbon-carbon bond. Since the syndiotactic polystyrene resin which consists of such a structure has high stereoregularity, it becomes a polystyrene resin to crystallize.

Specific examples of the syndiotactic polystyrene resin include XAREC C102 (manufactured by Idemitsu Koyama Co., Ltd., product name) having a melting point of 270 ° C. In addition, as syndiotactic polystyrene resin applied to this invention, what was alloyed with general polystyrene resin may be sufficient.

Similarly, the syndiotactic polystyrene resin may be a mixture of styrenic elastomers in order to impart flexibility. Examples of the styrene-based elastomers include styrene-butadiene-styrene triblock copolymers (abbreviated as SBS), hydrogenated derivatives of styrene-butadiene-styrene triblock copolymers (abbreviated as SEBS), and styrene-isoprene-styrene triblock copolymers. A coalescence (symbol, SIPS), the hydrogenated derivative of a styrene-isoprene-styrene triblock copolymer (symbol, SEPS), etc. are mentioned.

Specific examples of this styrene-based elastomer include KRATON G-1657 (trade name, manufactured by Krayton Polymer Co., Ltd.), which is a hydrogenated derivative of a styrene-butadiene-styrene triblock copolymer having a styrene content of 13% by mass. .

In addition, the film mentioned above can be comprised by the single | mono layer or the multilayer film of two or more layers within the range which maintains heat resistance preferably.

The composition for mold release used for this invention is a composition containing the fluorosilicone compound which has a silyl group containing a hydrolysable site | part in a molecule | numerator. In addition, various compounds have been proposed for such fluorosilicon compounds. These fluorosilicon compounds are usually applied to a mold and used. However, the fluorosilicon compound is applied to the surface of the film and formed as a fluorosilicon compound layer, which has the characteristics of the present invention. FIG. 1: is sectional drawing which shows one Embodiment of the release film comprised in this way. In the figure, code | symbol 20 is a film, and code | symbol 30 has shown the mold release composition. Here, the film 20 may be a single | mono layer film or a multilayer film of two or more layers. In addition, the release composition 30 may be formed in the other surface of the film 20, and may be formed in both surfaces.

As a above-mentioned fluorosilicon compound (having a silyl group containing a hydrolyzable site | part in a molecule | numerator), the compound represented by following formula (3) is mentioned, for example.

In the formula of the formula 3, R ¹ to R ¹⁰ is preferably at the C _{1 -20,} more preferably substituted or unsubstituted of C _{1 -20} unsubstituted alkyl group, or C _{6 -20,} more preferably C ₆ Or a substituted or unsubstituted aryl group of _-12 . The said alkyl group may be substituted by halogen atoms, such as a chlorine atom. In addition, the aryl group for example a halogen atom, or for example, such as a chlorine atom, may be substituted with an alkyl group of C _1-10 group and the like. R ¹ to R ¹⁰ are, for example, unsubstituted alkyl groups such as methyl group, ethyl group, propyl group, hexyl group and dodecyl group; Unsubstituted aryl groups such as substituted alkyl groups such as chloromethyl group, phenyl group and naphthyl group; Substituted aryl groups, such as 4-chlorophenyl group and 2-methylphenyl group, are contained. Among these, an alkyl group, especially an unsubstituted alkyl group, is preferable and a methyl group is more preferable.

R ³ and R ¹⁰ may be Rf-X- or ZY-. Wherein, X and Y are the same or different divalent organic groups, respectively, Rf is a fluoroalkyl C _{1 -6} alkyl group, Z is a silyl group containing a hydrolyzable site.

X and Y are preferably at the C _{1 -20,} more preferably a divalent organic group of C _{1 -12.} Examples of the divalent organic group is preferably C _{1 -12} alkylene group, for example an ethylene group, a propylene group, a methylethylene group, an octyl group and a group having xylene, and preferably alkyl of C _2-12 alkylene Oxyalkylene groups such as ethyleneoxymethylene group, propyleneoxymethylene group, propyleneoxyethylene group and ethyleneoxybutylene group. X is preferably a C _1-12 alkyleneamide group, for example, an ethyleneamide group, a propyleneamide group, a decyleneamide group, or the like. Preferably, X and Y are-(CH ₂ ) _r- . Here, in the formula, r is 2 to 200, especially 2 to 12.

Rf is a fluoroalkyl group, preferably a perfluoroalkyl group, containing 1 to 6 carbon atoms, for example 1 to 5 carbon atoms, in particular 1 to 4 carbon atoms. Rf is specifically trifluoromethyl group, pentafluoroethyl group, 1,1,2,2-tetrafluoroethyl group, 2-trifluoromethyl-perfluoroethyl group, perfluorobutyl group, perfluoro Pentyl and perfluorohexyl groups. Among these, pentafluoroethyl group is preferable.

Z is a silyl group containing a hydrolyzable moiety having, for example, 1 to 60 carbon atoms. Z is —Si (R ¹¹ ) _q (X ′) _3-q (R ¹¹ is an alkyl group having 1 to 20 carbon atoms, preferably 1 to 4 carbon atoms, X ′ is a hydrolyzable moiety, q is 0, 1 or 2). Further, Z is-(Si (R ¹¹ ) ₂ O) _r -Si (R ¹¹ ) _q (X ') ₃ (R ¹¹ is an alkyl group having 1 to 20 carbon atoms, preferably 1 to 4 carbon atoms, X' Is a hydrolyzable moiety, and r is 1 to 200. R ¹¹ may be a methyl group, an ethyl group, a propyl group, a hexyl group, or a dodecyl group, and most preferably a methyl group. X 'which is a hydrolyzable moiety is, for example, halogen such as chlorine and bromine; Alkoxy group which preferably has a carbon atom of 1-12, such as a methoxy group, an ethoxy group, a propoxy group, a methoxyethoxy group, and a butoxy group; Acyloxy group which preferably has 1 to 12 carbon atoms, such as an acetoxy group, a propionyloxy group, and a benzoyloxy group; Alkenyloxy groups such as isopropenyloxy group and isobutenyloxy group; Iminooxime groups having preferably 1 to 12 carbon atoms, such as a dimethyl ketoxime group, a methyl ethyl ketoxime group, a diethyl ketoxime group, and a cyclohexane oxime group: preferably 1, such as an ethylamino group, a diethylamino group, and a dimethylamino group A substituted amino group having from 12 to 12 carbon atoms and substituted with at least one alkyl group; Amide groups preferably having 1 to 12 carbon atoms such as N-methylacetamide group and N-ethylacetamide group; And a substituted amineoxy group preferably having 1 to 12 carbon atoms and substituted with an alkyl group having at least one preferably 1 to 4 carbon atoms such as a dimethylamineoxy group and a diethylamineoxy group.

M is 1 to 100, n is 1 to 50, and o is 0 to 200. Preferably m is 1 to 50, n is 3 to 20, and o is 0 to 100. More preferably, m may be 2-50, n may be 3-20, and o may be 1-100.

Specific examples of the compound of the compound represented by the following general formula (4), that in, A is _{- (CH 2) 3 OCH 2} CF 2 CF 3 or _{- (CH 2) 3 OCH 2} CH 2 CF 2 CF 2 CF 2 CF 3 And the compound in which B contains-(CH ₂ ) ₃ Si (OCH ₃ ) ₃ .

In the formula, Me is a methyl group. x is 1 to 100, y is 1 to 50 and z is 0 to 200.

In addition, the above-mentioned fluorosilicon compound (having a silyl group containing a hydrolyzable moiety in the molecule) may be a compound represented by the formula (5).

The compound of formula 5 is a silylalkylene group represented by the formula: -R ¹ -SiR ² _(3-m) X _m bonded to the silicon atom of the main chain, and is represented by the formula: -R ¹ -C _n F _{(2n + 1)} Each of the fluorine-containing organic groups represented is one or more in 1 molecule. In the above formula, R ¹ is an alkylene group or an alkyleneoxyalkylene group, and examples of the alkylene group include an ethylene group, methyl ethylene group, ethyl ethylene group, propyl ethylene group, butyl ethylene group, propylene group, butylene group, 1 -Methyl propylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, and examples of the alkyleneoxyalkylene group include, for example, ethyleneoxyethylene group, ethyleneoxypropylene group, ethyleneoxy A butylene group, a propylene oxyethylene group, a propylene oxy propylene group, a propylene oxy butylene group, butylene oxyethylene group, butylene oxypropylene group is mentioned. R ² is a group selected from the group consisting of the same or different alkyl group, aryl group and 3,3,3-trifluoropropyl group, and examples of the alkyl group include methyl group, ethyl group, propyl group, butyl group, pentyl group, Hexyl group, heptyl group, octyl group, nonyl group, decyl group, hexadecyl group, octadecyl group are mentioned, As an aryl group, a phenyl group, a tolyl group, a xylyl group is mentioned, for example. X is a halogen atom or an alkoxy group, and as a halogen atom, a fluorine atom, a chlorine atom, a bromine atom is mentioned, for example, As an alkoxy group, a methoxy group, an ethoxy group, a propoxy group, butoxy group, a methoxy group is mentioned, for example. A oxyethoxy group is mentioned. Here m is an integer of 1-3. n is an integer of 4 or more, Preferably it is an integer of 4-12. Examples of the fluorine-containing organic group represented by the above formula include nonafluorohexyl group, tridecafluoroisooctyl group, tridecafluorooctyl group, heptadecafluorodecyl group, nonafluorobutylethyloxyethyl group and nona A fluorobutyl ethyl oxypropyl group, a nonafluoro butyl ethyl oxy butyl group, an undecafluoro pentyl ethyloxy ethyl group, and an undecafluoro pentyl ethyl oxypropyl group are mentioned. The bonding position of the silylalkylene group and fluorine-containing organic group represented by the said formula may be a molecular chain terminal, a side chain, or both. As group couple | bonded with the silicon atom other than these groups, a monovalent hydrocarbon group is mentioned, for example, The group illustrated by said R <^2> is mentioned specifically ,. The organopolysiloxane constituting the main chain is preferably linear, but some may be branched, cyclic, or mesh-like. It is preferable that this organopolysiloxane is liquid at normal temperature, and the preferable viscosity in 25 degreeC is the range of 5-100,000 centistokes. As this component, the said organopolysiloxane may be used by 1 type, and what mixed 2 or more types can also be used.

Of the formula, R ³ are the same or different alkyl group, an aryl group, 3,3,3-trifluoro propyl group, and the formula: -R ¹ -C _n F group consisting of fluorine-containing organic represented by _{(2n + 1)} Is a group selected from among, at least one of which is a fluorine-containing organic group represented by the above formula. Examples of the alkyl group, the aryl group, and the fluorine-containing organic group include the same groups as described above. R ¹ , R ² , X, m and n are the same as described above. Here, d is an integer of 1 to 10,000, Preferably it is an integer of 1 to 1,000. In addition, e is an integer of 1-1,000, Preferably it is an integer of 1-100.

In the present invention, the compound represented by the formula (4) is preferably used among the above-described fluorosilicon compounds (having a silyl group containing a hydrolyzable moiety in the molecule).

The release composition applied in this invention must contain the fluorosilicone compound which has in its molecule the silyl group containing a hydrolysable site | part. As the release composition, if a fluorosilicon compound containing no silyl group containing a hydrolyzable moiety in a molecule is used, when the molded article is peeled from the release film when used as a release film, the release composition is also peeled off the film surface to This is because a problem of transferring to the surface and contaminating the molded article occurs. On the other hand, when using a fluorosilicone compound having a silyl group containing a hydrolyzable moiety in the molecule, crosslinks with the film surface to form a chemical bond, so that the release composition peels off from the film surface during use to contaminate the surface of the molded article. Can be avoided. In addition, the fluorosilicone compound which has a silyl group containing a hydrolysable site in a molecule | numerator in a molecule | numerator is not limited only to the above, For example, the compound represented by General formula (6) and General formula (7) is mentioned.

Here, in formula, q is an integer of 1-3. m, n and o are each an integer of 0 to 200. p is 1 or 2. X is oxygen or a divalent organic group. r is an integer from 2 to 20. R ¹ is a C _1-22 straight or branched hydrocarbon group. a is an integer of 0-2. X 'is a hydrolyzable group. In addition, when a is 0 or 1, z is an integer of 0-10.

Here, in formula, q is an integer of 1-3. m, n and o are each an integer of 0 to 200. p is 0, 1 or 2. X is oxygen or a divalent organic group. X "is a divalent organic silicon spacer group. X 'is a hydrolysable group. Moreover, when a is 0 or 1, z is an integer of 0-10.

The above-mentioned fluorosilicon compound (having a silyl group containing a hydrolyzable moiety in the molecule) is preferably dissolved in an organic solvent or the like and used as a solution. Specific examples of the solvent include aliphatic saturated hydrocarbon solvents such as hexane, isohexane, heptane, octane and isooctane, aliphatic solvents such as cyclohexane, methylcyclohexane and dimethylcyclohexane, aromatic solvents such as benzene, toluene and xylene, and acetic acid Ester solvents such as ethyl and butyl acetate, alcohol solvents such as ethanol and isopropyl alcohol, chlorine solvents such as trichloroethylene, chloroform and m-xylene hexachloride, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone Ether solvents such as solvents, diethyl ether, diisopropyl ether and tetrahydrofuran, fluorine solvents such as methyl perfluorobutyl ether and ethyl perfluorobutyl ether, hexamethyldisiloxane, hexamethylcyclotrisiloxane and Silicone solvents, such as heptamethyl trisiloxane, etc. are mentioned.

The release composition described above may contain an organic titanium compound, an organic zirconium compound and an organosilicon compound. These compounds have a function as a crosslinking agent of a film surface and a fluorosilicone compound (having a silyl group containing a hydrolyzable moiety in a molecule), and a function as a crosslinking curing agent of fluorosilicon compounds. In addition, these compounds can be used by 1 type or in combination of 2 or more types.

Here, the organic titanium compound is, for example, titanium diisopropoxy bis (ethylacetoacetate), titanium dioctyloxy bis (octylene glycolate), titanium tetraacetylacetonate, and titanium diisopropoxy bis (acetylacetonate). And titanium alkoxides such as titanium chelates, and titanium tetra-2-ethylhexoxide, titanium butoxy dimer, titanium tetranormal butoxide and titanium tetraisopropoxide. It may be appropriately selected and used in consideration of the rate and the crosslinking curing rate. Among these, titanium diisopropoxy bis (ethylacetoacetate), titanium tetra-2-ethylhexoxide, titanium tetraisopropoxide and the like are preferably used.

The organic zirconium compound is, for example, zirconium tetraacetylacetonate, zirconium dibutoxybis (ethylacetoacetate), zirconium monobutoxyacetylacetonate bis (ethylacetoacetate), zirconium tributoxy monoacetylacetonate and zirconium Zirconium chelates such as tetraacetylacetonate and zirconium alkoxides such as zirconium tetranormal butoxide and zirconium tetranormal propoxide, and the like. Can be used.

The organic titanium compound and the organic zirconium compound described above mainly function as a crosslinking agent between the film surface and the fluorosilicon compound. The addition amount can be added in 0.05 mass part-20 mass parts with respect to 100 mass parts of a fluorosilicone compound, Preferably it can add in 0.1 mass part-10 mass parts. In this case, if the added amount is less than 0.05 part by mass, it is not preferable because the crosslinking between the film surface and the fluorosilicon compound is insufficient. In addition, if it exceeds 20 parts by mass, crosslinking between the film surface and the fluorosilicone compound is sufficient, which is not preferable because unreacted organic titanium compound or organic zirconium compound or both thereof may remain.

As the organosilicon compound, a compound which can generally be called a silane coupling agent can be used. The organosilicon compound is, for example, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-aminoethyl) amino Propyltriethoxysilane, 3- (2-aminoethyl) aminopropylmethyldimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, 3-phenylaminopropyltri Amino group-containing silane coupling agents such as methoxysilane and N- (p-vinylbenzyl) -N- (trimethoxysilylpropyl) ethylenediamine, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyl Epoxy group-containing silane coupling agents such as dimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; Vinyltrimethoxysilane, vinyltriethoxysilanevinyltriisopropoxysilane, vinyltriacetoxysilane Vinyl group-containing silane coupling agents such as vinyltrichlorosilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane and 3-methacryl Methacrylic group containing silane coupling agents, such as oxypropylmethyl diethoxysilane, 3-mercaptopropyl trimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyl triethoxysilane, and 3-mercapto Mercapto group-containing silane coupling agents such as propylmethyldiethoxysilane, allyl group-containing silane coupling agents such as allyltrimethoxysilane and diallyldimethylsilane, bis (3- (triethoxysilyl) propyl) disulfide and bis ( And sulfide group-containing silane coupling agents such as 3- (triethoxysilyl) propyl) tetrasulfide. Among these compounds, an amino group-containing silane coupling agent and an epoxy group-containing silane coupling agent are preferable, and more preferably 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane and 3- (2-aminoethyl) amino Propyltrimethoxysilane, 3- (2-aminoethyl) aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-gly Cydoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane and 3-glycidoxypropylmethyldiethoxysilane, more preferably in 3-aminopropyltrimethoxysilane and 3-aminopropyltri Oxysilane.

The organosilicon compound mainly functions as a crosslinking curing agent between fluorosilicon compounds (having a silyl group containing a hydrolyzable moiety in a molecule). The addition amount thereof is added in the range of 0.1 parts by mass to 20 parts by mass, preferably in the range of 0.05 parts by mass to 10 parts by mass with respect to 100 parts by mass of the fluorosilicone compound (having a silyl group containing a hydrolyzable site in the molecule). can do. In this case, if the added amount is less than 0.05 parts by mass, it is not preferable because the curing of the fluorosilicon compound (having a silyl group containing a hydrolyzable moiety in the molecule) is insufficient. Moreover, even if it adds more than 20 mass parts, crosslinking hardening of a fluorosilicon compound (having a silyl group containing a hydrolyzable site | part in a molecule | numerator) is sufficient, and since unreacted organosilicon compound may remain, it is unpreferable. not.

It is preferable that the mold release composition in this invention uses together the 1 type compound or 2 or more types of compound chosen from the group which consists of an organic titanium compound and an organic zirconium compound, and an organosilicon compound. The organic titanium compound and the organic zirconium compound mainly promote crosslinking of the film surface with the fluorosilicon compound, and the organosilicon compound mainly promotes crosslinking curing of the fluorosilicon compound. For this reason, by using these together, fluorosilicone compounds bridge | crosslink and a mesh structure is formed in the state which the film surface and the fluorosilicone compound bridge | crosslinked. As a result, when used as a release film, even if the film is stretched, the coating film made of the fluorosilicon compound follows the film, is stretched and is maintained without breaking the coating film, so that the peelability to the mold resin is maintained. The formed fluorosilicon compound disappears into a molded article. In addition, in the manufacturing step, a secondary effect of shortening the drying time after application is also obtained.

The resin composition containing the above-mentioned thermoplastic resin or the film (hereinafter sometimes referred to as a base film) of a resin composition obtained by mixing a thermoplastic elastomer with a thermoplastic resin as a main component may be, for example, a melt extrusion method or a melt casting method. Etc., it can shape | mold by a conventionally well-known method.

In the following example, the method of shape | molding a base film by the melt extrusion method using T dice | dye is illustrated.

The base film obtained by such a method uses the extruder, such as a single screw extruder or a twin screw extruder, as the molding material of the resin composition containing a thermoplastic resin, or the resin composition which mixes thermoplastic elastomer with a thermoplastic resin as a main component, and has the characteristics of a resin composition. According to the present invention, melt-kneading is carried out under an atmosphere in which air present in the gap between the extruder and the molding material is replaced with nitrogen gas, and the base film melt-extruded from the lip portion of the T-die tip disposed at the tip of the extruder, It is obtained by sandwiching between cooling rolls and cooling, and then winding the winding tube sequentially with a winding machine.

2 is a configuration diagram showing an outline of a film production apparatus for manufacturing a base film by the above-described method. 3 is sectional drawing around the material input hopper of the film manufacturing apparatus shown in FIG. In FIG. 2, the film manufacturing apparatus is comprised substantially including the material input hopper 2, the extruder 1, the T dice 7, the take-out machine 11, and the winding machine 15. In FIG. The material input hopper 2 is configured to inject a molding material, and as shown in FIG. 3, the nitrogen gas supply pipe 3 is connected to a spacer (3) while being connected to the extruder 1 of the material input hopper 2. Inserted through 3a). In addition, the pipe 3 for nitrogen gas supply is bent along the substantially central axis of the material inlet 1c, and the front-end | tip is extended and installed in the vicinity of the outer periphery of the extrusion screw 1a in the extruder 1. As shown in FIG. Oxygen contained in the molding material introduced from the material input hopper 2 or in the extruder 1 is supplied to the nitrogen gas supply pipe 3 when the molding material is mixed and stirred in the extrusion screw 1a of the extruder 1. It is substituted with nitrogen gas supplied.

The extruder 1 conveys a molding material in the direction of arrow B, mixing and stirring it with the extrusion screw 1a, and heats and melts a molding material by the heat transfer means assembled in the cylinder 1b of the extruder 1. As shown in FIG. The molding material melted and conveyed in this way is fed to the filter means 5 via the connection pipe 4 shown in FIG. Subsequently, the filter means 5 separates the unmolten molding material and supplies the molten molding material to the gear pump 6. In the gear pump 6, the molten molding material is extruded to the T die 7 while increasing the pressure of the molten molding material. In the T die 7, the melt molding material is extruded at a predetermined pressure, and the film 8 having a predetermined thickness and a predetermined width is formed from the lip portion 7a of the T die 7. The film 8 thus formed is adjusted to a predetermined thickness in the pressing roll 9 while being drawn on the outer circumferential surface of the cooling roll 10 of the take-up machine 11, and further cooled and solidified, thereby conveying the pair of conveying rolls 12. , 13 is conveyed to the winder 15.

In the winding machine 15, the film 8 is guided by the guide rolls 15a, 15b, and 15c, and wound up by the winding pipe 16. As shown in FIG. Moreover, the thickness measuring machine 14 is arrange | positioned between the conveying roll pairs 12 and 13, and the guide roll 15a, and based on the thickness measured by the thickness measuring machine 14 so that it may become desired thickness, a cooling roll The circumferential speed of (10) is adjusted and controlled. As a result, the base film is formed.

The surface shape of a base film is formed according to the surface shape of a molded article. For example, since IC, LSI, etc. form fine unevenness | corrugation on the surface, the release film which formed the fine unevenness | corrugation on the surface of a base film is used. Moreover, when the surface becomes a mirror surface in LED etc., the release film which used the surface of the base film as a mirror surface is used.

As a method of forming the surface shape of the base film, when the minute unevenness is formed on the surface, fine unevenness is formed on the outer circumferential surface of the above-described metal cooling roll, and the base film in the molten state is pressed onto the cooling roll by a compression roll. At that time, a method of transferring the fine irregularities formed on the outer circumferential surface of the cooling roll onto the surface of the base film is simplified. In addition, when making a surface into a mirror surface, let the surface of the metal cooling roll mentioned above be a mirror surface, and the base film in a molten state is crimped | bonded by the said compression roll with the said cooling roll, and the surface of a base film is mirror-frontally faced. It becomes simple.

Thereafter, the release composition is applied to at least one surface of the base film and dried to form a fluorosilicon compound layer. A conventionally well-known coating system can be used for application | coating of a release composition. For example, bar coater, reverse roll coater, plus rolling roll coater, gravure coater, kiss coater, casting coater, spray coater, curtain coater, die coater, air doctor coater, blade coater, rod coater, knife coater, squeeze coater, It can select suitably from an impregnation coater etc., and can use.

The film for mold release of this invention is 5 micrometers-500 micrometers in thickness, Preferably it can select suitably according to the shape of the mold metal mold | die used in the range of 10 micrometers-400 micrometers. When the thickness of the base film is less than 5 µm, it is not preferable because there is a problem of tearing under pressure of the mold resin during use. Moreover, when it exceeds 500 micrometers, since heat conduction is inhibited, the surface of a molded article etc. generate | occur | produce, and since there exists a problem of causing a fall of a yield, it is unpreferable. Further, the thickness of the fluorosilicon compound layer is in the range of 0.05 μm to 10 μm, preferably in the range of 0.1 μm to 5 μm. When the thickness of the fluorosilicon compound layer is less than 0.05 µm, it is not preferable because the fluorosilicon compound layer is destroyed due to the pressure of the mold resin during use and the peelability is lost. Moreover, when it exceeds 10 micrometers, further peelability improvement cannot be expected and since it requires a long time for drying after application | coating, since productivity falls, it is unpreferable. In addition, the flexibility of the fluorosilicon compound layer itself is not preferable because there is a problem that wrinkles occur in the flat portion of the molded article.

<Examples>

Hereinafter, Example 1-10 Example of the release film of this invention is demonstrated using FIG. 4 and FIG.

In FIG. 4, each content of Example 1 thru | or 5 is shown in the horizontal direction in the figure, and FIG. 5 shows each content of Example 6 thru 10 in the horizontal direction in the figure. In addition, in FIG.4 and FIG.5, the base, a mold release composition, and the film evaluation for mold release are classified and shown in the longitudinal direction in the figure, respectively. In the term of the base, the resin composition and the base film thickness are classified and shown. In the term of the release composition, the composition, the wet film thickness and the film thickness after drying are classified and shown. In addition, in terms of composition, solid content (mass part), organic titanium compound (mass part), organic zirconium compound (mass part), and organosilicon compound (mass part) are shown and classified. Peelability and heat resistance are classified and shown in the term of the film evaluation for mold release. In addition, 2 minutes of drying, 5 minutes of drying, 10 minutes of drying, and 15 minutes of drying are divided | segmented and shown in the term of peelability, and each E '(Pa) of a longitudinal and a lateral direction is shown in the term of heat resistance. In addition, the film for mold release which concerns on this invention is not limited to Examples 1-10.

Here, the material shown next is used for the resin composition (1), the resin composition (2), the fluorosilicon compound, the organic titanium compound, the organic zirconium compound, and the organosilicon compound shown in FIG.4 and FIG.5. 6 and 7 are table views showing comparative examples (Comparative Examples 1 to 7) corresponding to the examples of the present invention together with their evaluations. For this reason, in the following description, it is the content applied similarly also in the case of a comparative example.

(Resin composition 1; thermoplastic resin)

Ultem 1010-1000: Brand name, SABIC Innovative Plastics Japan, polyetherimide resin, melting point 223 ° C

(Resin Composition 2; Mixture of Thermoplastic Resin and Thermoplastic Elastomer)

XAREC C102: A brand name, the product of Idemitsu Kosan Corporation, syndiotactic polystyrene resin, melting | fusing point 270 degreeC

Creton G-1657: Brand name, Creton Polymer Co., Ltd. product, Hydrogenated derivative of styrene-butadiene-styrene triblock copolymer, Styrene content 13 mass%

XAREC C102: Creton G-1657 = 90 mass%: 10 mass%

(Fluorosilicone compound)

In Chemical Formula 4, A is-(CH ₂ ) ₃ OCH ₂ CF ₂ CF ₃ , B is-(CH ₂ ) ₃ Si (OCH ₃ ) ₃ , wherein x is 21, y is 5 and z is 38. Fluorosilicon compounds were prepared and used.

(Organic titanium compound)

Organics TC-750: Trade name, Matsumoto Kosho Co., Ltd., titanium diisopropoxy bis (ethylacetoacetate)

(Organic Zirconium Compounds)

Organics ZC-580: Trade name, Matsumoto Kosho Co., Ltd., zirconium dibutoxybis (ethylacetoacetate)

(Organic silicon compound)

KBM-903: Brand name, Shin-Etsu Chemical Co., Ltd. make, 3-aminopropyltrimethoxysilane

Hereinafter, based on FIG. 4 and FIG. 5, preparation of a base film, manufacture of a release composition, application and drying of a release composition, peelability, and heat resistance are explained in full detail. 6 and 7 are table views showing comparative examples (Comparative Examples 1 to 7) corresponding to the examples of the present invention together with their evaluations. For this reason, in the following description, it is the content applied similarly also in the case of a comparative example.

(Production of base film)

The resin composition was supplied to a Φ40 mm, L / D = 25 single screw extruder (manufactured by IKK, Inc.), melt kneaded at the following cylinder temperature using a flupolite extrusion screw with a compression ratio of 2.5, and a T of 400 mm in width. The die was continuously extruded from the die to the following die temperature. The extruded base film is sandwiched between the press roll in the take-up machine and the cooling roll, cooled, cut at both ends with a slit blade in the winder, and the base film is wound in the take-up tube, to the thickness shown in FIGS. 4 to 7. A base film 250 mm wide and 50 m long was produced. Here, in the resin composition (1), cylinder temperature was 320 degreeC-350 degreeC, and die temperature was 350 degreeC-360 degreeC. In the resin composition (2), cylinder temperature was 280 degreeC-300 degreeC, and die temperature was 300 degreeC-320 degreeC.

(Preparation of Release Composition)

The above-mentioned fluorosilicon compound was diluted with isopropyl alcohol to prepare a solution having a solid content concentration of 10% by mass. Subsequently, an organic titanium compound, an organic zirconium compound, and an organosilicon compound were added to the solid content of this solution, and a release composition was prepared, respectively.

(Application and Drying of Release Composition)

On one side of the produced base film, the release composition was applied using a bar coater so as to have a wet film thickness shown in FIGS. 4 to 7. The bar coater was chosen so that the desired wet film thickness was obtained. Then, it dried in the hot air oven with an exhaust port adjusted to 150 degreeC. The drying time was 2 minutes, 5 minutes, 10 minutes, and 15 minutes, and the release film was produced, respectively. Here, the film thickness after drying described in FIG. 4 is a calculated value calculated from the wet film thickness and the solid content concentration of the release composition.

(Peelability)

Peelability evaluated the peelability of the film for mold release and the epoxy resin used as mold resin. Epoxy resin sealant KMC-284 (manufactured by Shin-Etsu Chemical Co., Ltd.) was placed on the film surface to which the release composition of the release film was applied, and these were sandwiched by two flat metal molds whose inner surface was hard chromium plated, followed by hot press molding. Peelability of the film for mold release of the molded laminated product and an epoxy resin was evaluated.

Hot press molding was performed under conditions of a temperature of 200 ° C., a pressure of 50 kg / cm 2, and 3 minutes. In addition, evaluation of peelability was shown as "(x)" when "(circle)" and the solidified epoxy resin remained on the film for mold release when the solidified epoxy resin could peel without leaving on a film.

(Heat resistance strength)

Heat resistance was evaluated by the storage elastic modulus E 'of the film longitudinal and horizontal directions in the temperature of 200 degreeC in the dynamic viscoelasticity measurement of a base film. The reason for this is that the release film attached in the mold forming apparatus enters the mold die, is sucked under vacuum, and adheres to the mold die, so that the 200 ° C. storage elastic modulus E ′ in the dynamic viscoelasticity measurement is an index of the heat resistance at 200 ° C. Based on what is preferred as.

Specifically, using the SOLIDS ANALYZER RSAII (trade name) manufactured by Leometrics, the film length and width in both directions were measured at a temperature of 200 ° C. under conditions of a frequency of 1 Hz, a heating rate of 5 ° C./min, and a deformation of 0.1%. Is the storage modulus of E '. The storage modulus E 'is preferably 5.0 × 10 ⁷ Pa to 3.0 × 10 ⁹ Pa, more preferably 5.0 × 10 ⁷ Pa to 2.0 × 10 ⁹ Pa. When storage elastic modulus E 'is less than 5.0x10 <^7> Pa, elastic deformation property is weak, a film is torn by the pressure of a mold resin at the time of use, and heat resistance is insufficient. On the contrary, when the storage elastic modulus E 'exceeds 3.0 x 10 ⁹ Pa, the heat resistance strength is sufficiently obtained, but the elastic deformation property is too strong, and tracking to the mold die is insufficient.

From these results, peelability was not obtained when the release composition was not applied as shown in Comparative Example 1. As shown in Comparative Example 2, Comparative Example 3 and Comparative Example 4, the release property was not obtained when the release composition having a small content of the organic titanium compound and the organic zirconium compound was applied. As shown in the comparative example 5, the thing with thick film thickness after drying did not obtain peelability in 15 minutes of drying after application | coating. In Comparative Example 6, a ETFE film manufactured by Asahi Glass Co., Ltd. and a 50 μm-thickness of Aflex (trade name) were used as comparison targets, but the film was melted in the peelability evaluation at 200 ° C. In addition, the storage elastic modulus E 'which is an index of heat resistance was not in a preferable range so as to become clear in comparison with the examples. In Comparative Example 7, a Daikin high mold release agent and dipri GF-6332 (trade name, solid content concentration of 3% by mass) were used as comparison targets of the release composition, but peelability was not obtained.

On the other hand, it became clear that the film for mold release of each Example of this invention has heat resistance in addition to being peelable. According to this invention, the release film which is excellent in peelability with the molded article obtained by shape | molding mold resin, and also has heat resistance in 200 degreeC can be obtained.

As mentioned above, although this invention was demonstrated using embodiment, it cannot be overemphasized that the technical scope of this invention is not limited to the range as described in the said embodiment. It is apparent to those skilled in the art that various changes or improvements can be made to the above embodiment. Moreover, it is clear from description of a claim that the form which added such a change or improvement can also be included in the technical scope of this invention.

1 extruder
2 material input hopper
3 Nitrogen gas supply pipes
4 connector
5 filters
6 gear pump
7 T dice
7a ribs
8 film
9 crimp roll
10 cooling rolls
11 takers
12, 13 conveying roll pair
14 thickness meter
16 winding
20 films
30 Release Compositions

Claims (9)

A fluorosilicon compound having a silyl group containing a hydrolyzable moiety on at least one side of a film obtained by molding a resin composition containing a thermoplastic resin or a resin composition comprising a thermoplastic resin as a main component and a mixture of thermoplastic elastomers. The fluorosilicon compound layer obtained by apply | coating and drying the mold release composition containing is formed, The film for mold release characterized by the above-mentioned. The release film according to claim 1, wherein the film comprises a single layer film or a multilayer film of two or more layers. The method of claim 1 or 2, wherein the thermoplastic resin is polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, polyether ether ketone resin, polyimide resin, polyamideimide resin, polyetherimide resin, polyethylene Naphthalate resin, polyamide resin, polyacetal resin, polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate resin, polyethylene terephthalate resin, cyclic polyolefin resin, syndiotactic polystyrene resin, polymethylpentene resin, poly Methyl methacrylate resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl acetate resin, acrylonitrile butadiene styrene resin and acrylonitrile styrene resin, the thermoplastic elastomer is a polyester-based elastomer, polyamide Total Elastomeric, polyurethane-based elastomer, yihyeongyong film of at least any one of said styrene elastomer and olefin elastomer. The mold release composition according to claim 1, wherein the release composition is selected from the group consisting of an organic titanium compound, an organic zirconium compound, and an organosilicon compound with respect to 100 parts by mass of a fluorosilicone compound having a silyl group containing a hydrolyzable moiety in a molecule thereof. It is a composition containing a compound of 2 types or 2 or more types of compounds in 0.05 mass part-20 mass parts, The release film characterized by the above-mentioned. The said release composition is 1 type compound chosen from the group which consists of an organic titanium compound and an organic zirconium compound with respect to 100 mass parts of the fluorosilicone compound which has a silyl group containing a hydrolysable site | part in a molecule | numerator, or It is a composition containing 2 or more types of compounds in 0.05 mass part-20 mass parts, The release film characterized by the above-mentioned. The said release composition is 1 type compound chosen from the group which consists of an organic titanium compound and an organic zirconium compound with respect to 100 mass parts of the fluorosilicone compound which has a silyl group containing a hydrolysable site | part in a molecule | numerator, or It is a composition which contains an organosilicon compound in the range of 0.05 mass part-20 mass parts in 2 or more types of compound in 0.05 mass part-20 mass parts, The release film characterized by the above-mentioned. The thickness of the single-layer film or the multilayer film of two or more layers obtained by molding the resin composition containing the said thermoplastic resin, or the resin composition which mixes a thermoplastic elastomer with a thermoplastic resin as a main component is 5 micrometers-500, The thickness of the fluorosilicon compound layer obtained by applying and drying the release composition containing the fluorosilicone compound which has a silyl group containing a hydrolyzable site | part in a molecule in the range of micrometers, and has a range is 0.05 micrometer-10 micrometers, It is characterized by the above-mentioned. Release film. A resin composition containing a thermoplastic resin or a film obtained by molding a resin composition comprising a thermoplastic resin as a main component and a mixture of thermoplastic elastomers is prepared, and a silyl group including a hydrolyzable moiety on at least one side of the film is contained in a molecule. The release composition containing the fluorosilicon compound which has, is apply | coated and dried, and the said fluorosilicon compound layer is formed, The manufacturing method of the release film characterized by the above-mentioned. The method for producing a release film according to claim 8, wherein the film comprises a single layer film or a multilayer film of two or more layers.

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