TWI429525B - Mold release film - Google Patents

Description

Release film

The present invention relates to a film for mold release which is used in the molding of a resin or in the production of a printed circuit board or a flexible printed circuit board or the like.

For example, a transistor, an IC (integrated circuit), an LSI (large-scale integrated circuit), a semiconductor element such as a super LSI, or an LED (light emitting diode), an optical isolator, a phototransistor, a photodiode, and a CCD (charge coupled device) An optical semiconductor element such as a CMOS (Complementary Metal Oxide Semiconductor) is obtained by sealing an epoxy resin composition or a polyoxyxylene resin composition as a sealing material by resin molding by transfer molding.

When the semiconductor element or the optical semiconductor element is sealed, a molding apparatus is used, and a sealing material containing an epoxy resin composition or a polyoxymethylene resin composition is injected as a molding resin into a molding die to perform a forming process.

As a method of demolding a molding die and a molded article obtained by a molding process, for example, a method of interposing a film for mold release between a molding die and a molding resin has been put into practical use (see Patent Document 1). The film for mold release is supplied to the molding apparatus in a Roll to Roll manner, and is introduced into a molding die whose temperature is adjusted to a molding processing temperature, and is vacuum-impregnated and adhered to the molding die, followed by Fill the molding resin. When the molding die is opened after the molding resin has been hardened for a certain period of time, the film for mold release is kept sucked in the mold, and the molded article is peeled off from the film for mold release. For the release film, for example, a monolayer film of a tetrafluoroethylene-ethylene copolymer resin (ETFE resin) containing a thermoplastic fluororesin or a tetrafluoroethylene-hexafluoropropylene copolymer resin (FEP resin) is used (refer to the patent document). 2).

However, such a mold release film is excellent in peelability from a molding die or a molded article in normal resin molding at about 180 ° C, but film formation occurs at a temperature exceeding 200 ° C. Bad condition.

In addition, as a film for mold release containing a thermoplastic resin other than a thermoplastic fluororesin, a film containing a polyethylene terephthalate resin (PET resin) or a polymethylpentene resin (PMP resin) is put into the film. practical. Moreover, as a film for mold release containing a thermoplastic elastomer other than a thermoplastic fluororesin, it is known to use a film containing a crystalline aromatic polyester-containing resin composition containing a butylene terephthalate in a crystal component. Method (refer to Patent Document 3).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 8-142105

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2001-310336

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2007-224311

However, as shown in Patent Document 3, a polyethylene terephthalate resin (PET resin), a polymethylpentene resin (PMP resin), or a butylene terephthalate is contained in the crystal component. When a film of a resin composition containing a crystalline aromatic polyester is used as a film for mold release, there is a problem that the peeling property with a mold or a molded article is lacking in normal resin molding at about 180 °C. As described above, in actuality, a film other than the thermoplastic fluororesin cannot be suitably used as a film for mold release in resin molding.

The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a molded article obtained by molding a molding resin or a molded article, which is excellent in releasability, and which does not occur even at a use temperature exceeding 200 ° C. A film for mold release which is heat-resistant and has a heat resistance.

In order to solve the above problems, the film for mold release of the present invention is characterized in that at least one side of a film obtained by molding a resin composition containing a thermoplastic resin or a resin composition mainly comprising a thermoplastic resin and mixing a thermoplastic elastomer is used. The release compound containing a fluoropolyoxyl compound having a hydrocarbyl group having a hydrolyzable moiety in the molecule is applied and dried to form a fluoropolyoxymethane layer.

Further, the above invention is characterized in that the thermoplastic resin is a polyphenylene sulfide resin (PPS resin), a polyfluorene resin (PSF resin), a polyether oxime resin (PES resin), a polyetheretherketone resin (PEEK resin), and a polyfluorene. Imine resin (PI resin), polyamidoximine resin (PAI resin), polyether phthalimide resin (PEI resin), polyethylene naphthalate resin (PEN resin), polyamine resin (PA) Resin), polyacetal resin (POM resin), polycarbonate resin (PC resin), polyphenylene ether resin (PPE resin), polybutylene terephthalate resin (PBT resin), polyethylene terephthalate Diester resin (PET resin), cyclic polyolefin resin (COP resin), aligned polystyrene resin (SPS resin), polymethylpentene resin (PMP resin), polymethyl methacrylate resin (PMMA resin) ), polyethylene resin (PE resin), polypropylene resin (PP resin), polystyrene resin (PS resin), polyvinyl acetate resin (PVAc resin), acrylonitrile butadiene styrene resin (ABS resin) and At least one of acrylonitrile styrene resin (AS resin), the thermoplastic elastomer is a polyester elastomer (abbreviated as TPEE), and a polyamine amine elastomer (abbreviated as T) At least one of PA), a polyurethane-based elastomer (abbreviated as TPU), a styrene-based elastomer (abbreviated as TPS), and an olefin-based elastomer (abbreviated as TPO).

Furthermore, the above-mentioned invention is characterized in that the mold release compound is 100 parts by mass of the fluoropolysiloxane having a hydrolyzable moiety in the molecule, and is contained in an amount selected from the group consisting of 0.05 to 20 parts by mass. A composition of one or a mixture of two or more compounds of a titanium compound, an organic zirconium compound, and an organic cerium compound.

Furthermore, the above-mentioned invention is characterized in that the mold release compound is 100 parts by mass of the fluoropolysiloxane having a hydrolyzable moiety in the molecule, and is contained in an amount selected from the group consisting of 0.05 to 20 parts by mass. A composition of a compound consisting of a titanium compound and an organozirconium compound or a combination of two or more compounds.

Furthermore, the above-mentioned invention is characterized in that the mold release compound is 100 parts by mass of the fluoropolysiloxane having a hydrolyzable moiety in the molecule, and is contained in an amount selected from the group consisting of 0.05 to 20 parts by mass. A compound or a mixture of two or more compounds of the group consisting of a titanium compound and an organic zirconium compound, and further comprising an organic germanium compound in an amount of from 0.05 part by mass to 20 parts by mass.

Further, the above invention is characterized in that the thickness of the single layer film or the two or more layers of the resin composition obtained by molding the resin composition containing the thermoplastic resin or the thermoplastic resin and mixing the thermoplastic elastomer is 5 The thickness of the fluoropolyoxyl compound layer obtained by coating and drying a mold release compound containing a fluoropolyoxyl compound having a hydrolyzable moiety in the molecule of μm to 500 μm is 0.05 μm. A range of 10 μm.

The film for mold release according to the present invention is excellent in peelability from a molding die or a molded article obtained by molding a molding resin, and also has heat resistance at a use temperature exceeding 200 °C.

In order to achieve the above object, the present inventors have conducted various studies, and as a result, have found a film obtained by molding a resin composition containing a thermoplastic resin or a resin composition mainly comprising a thermoplastic resin and mixing a thermoplastic elastomer. On at least one side, a mold release compound containing a fluoropolyoxyl compound having a hydrolyzable moiety in the molecule is coated and dried to form a fluoropolysiloxane layer, and a mold or a mold can be obtained. The molded article obtained by the molding of the molding resin is excellent in the releasability of the molded article, and also has a film for mold release having a heat resistance strength exceeding the use temperature of 200 ° C.

Further, as a result of the investigation, it was found that the release-formation compound is in a range of 0.05 parts by mass to 20 parts by mass per 100 parts by mass of the fluoropolysiloxane having a hydrolyzable moiety in the molecule. It is more effective to contain a compound selected from the group consisting of an organotitanium compound, an organozirconium compound, and an organic cerium compound, or a combination of two or more compounds.

Here, as the thermoplastic resin, for example, polyphenylene sulfide resin, polyfluorene resin, polyether oxime resin, polyether ether ketone resin, polyimide resin, polyamidoximine resin, polyether phthalate can be used. Amine resin, polyethylene naphthalate resin, polyamide resin, polyacetal resin, polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate resin, polyethylene terephthalate Resin, cyclic polyolefin resin, aligned polystyrene resin, polymethylpentene resin, polymethyl methacrylate resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl acetate resin, propylene At least any one of a nitrile butadiene styrene resin and an acrylonitrile styrene resin.

Further, as the thermoplastic elastomer, for example, at least one of a polyester-based elastomer, a polyamide-based elastomer, a polyurethane-based elastomer, a styrene-based elastomer, and an olefin-based elastomer can be used.

These thermoplastic resins and thermoplastic elastomers can be appropriately selected and used depending on the required heat resistance. Preferred thermoplastic resins are, for example, polyphenylene sulfide resin, polyfluorene resin, polyether oxime resin, polyetheretherketone resin, polyimine resin, polyamidimide resin, polyether fluorene imide resin. , polyethylene naphthalate resin, polyamide resin, polyacetal resin, polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate resin, polyethylene terephthalate resin, Cyclic polyolefin resin, aligned polystyrene resin, and polymethylpentene resin. Further, as a more preferable thermoplastic resin, for example, a polyphenylene sulfide resin, a polyfluorene resin, a polyether oxime resin, a polyetheretherketone resin, a polyimide resin, a polyamidimide resin, a polyether oxime Amine resin, polyethylene naphthalate resin, cyclic polyolefin resin, aligned polystyrene resin, and polymethylpentene resin. Further, as a preferred thermoplastic elastomer, for example, a polyester elastomer, a polyamide-based elastomer, a styrene elastomer, and an olefin elastomer are used. Further, as a more preferable thermoplastic elastomer, it is a polyester elastomer, a polyamide elastomer, and a styrene elastomer.

In the present invention, a polyether phthalimide resin which is an amorphous thermoplastic resin is exemplified as the resin composition containing a thermoplastic resin. In addition, as a resin composition in which a thermoplastic resin is used as a main component and a thermoplastic elastomer is mixed, a resin composition in which a styrene-based elastomer is mixed as a main component of a crystalline thermoplastic resin as a main component is exemplified. Things. However, the present invention is not limited to these resin compositions.

The polyether quinone imine resin is represented, for example, by the following chemical formula (1) or (2). Further, the chemical formula (1) or (2) is represented as a resin having a repeating unit.

[Chemical 1]

[Chemical 2]

Specific examples of the polyether oxime imide resin include Ultem 1000-1000 (manufactured by SABIC Innovative Plastics Japan Co., Ltd.) having a glass transition point of 211 ° C, and Ultem 1010-1000 (SABIC Innovative Plastics Japan) having a glass transition point of 223 ° C. The company manufactures, trade name), and the Ultem CRS5001-1000 (manufactured by SABIC Innovative Plastics Japan Co., Ltd.) whose glass transfer point is 235 °C.

Further, as the polyether quinone imine resin, a block copolymer, a random copolymer or a modified product with other copolymerizable monomers can also be used. For example, Ultem XH6050-1000 (manufactured by SABIC Innovative Plastics Japan Co., Ltd.) having a glass transition point of 225 ° C as a polyether oxime oxime copolymer can be used. Further, the polyether oxime imide resin may be used singly or in combination of two or more kinds.

The stereostructure of the above-mentioned aligned polystyrene resin as the crystalline thermoplastic resin is different from the usual polystyrene resin, and the stereoregularity has a aligned structure. More specifically, it has a three-dimensional structure in which the phenyl groups of the side chains are alternately located in opposite directions with respect to the main chain formed by the carbon-carbon bond. The aligned polystyrene resin having such a structure is a crystallized polystyrene resin because of its high stereoregularity.

Specific examples of the polystyrene resin are XAREC C102 (manufactured by Idemitsu Kosan Co., Ltd., trade name) having a melting point of 270 °C. Further, the aligned polystyrene resin to be used in the present invention may be a mixture with a general polystyrene resin.

Similarly, the aligned polystyrene resin may be a mixture of a styrene-based elastomer to impart flexibility. Examples of the styrene-based elastomer include a styrene-butadiene-styrene triblock copolymer (SBS for short) and a hydrogenated derivative of a styrene-butadiene-styrene triblock copolymer (abbreviation) SEBS), styrene-isoprene-styrene triblock copolymer (SIPS for short), hydrogenated derivative of styrene-isoprene-styrene triblock copolymer (SEPS for short), and the like.

Specific examples of the styrene-based elastomer include hydrogenated derivative KRATON G-1657 (trade name, manufactured by Kraton Polymers Co., Ltd.) of a styrene-butadiene-styrene triblock copolymer having a styrene content of 13% by mass.

Further, the film may be composed of a single layer or a multilayer film of two or more layers in a range in which the heat resistance is maintained.

The composition for mold release used in the present invention is a composition comprising a fluoropolyoxymethylene compound having a decyl group having a hydrolyzable moiety in the molecule. In addition, various compounds have been proposed for such fluoropolyoxy compounds. These fluoropolysiloxanes are usually applied to a mold and used. However, the present invention is characterized in that the fluoropolysiloxane is applied to the surface of the film to form a fluoropolyoxygen compound layer. Fig. 1 is a cross-sectional view showing an embodiment of a release film formed in this manner. In the figure, reference numeral 20 denotes a film, and reference numeral 30 denotes a mold release compound. Here, the film 20 may be a single layer film or a multilayer film of two or more layers. Further, the mold release composition 30 may be formed on the other side of the film 20 or may be formed on both sides.

The fluoropolyfluorene compound (an alkylene group having a hydrolyzable moiety in the molecule) may, for example, be a compound represented by the following chemical formula (3).

[Chemical 3]

In the formula (3), R ¹ to R ¹⁰ may preferably be a C _1-20 , more preferably a C _1-20 substituted or unsubstituted alkyl group, or a C _6-20 More preferred are substituted or unsubstituted aryl groups of C _6-12 . The above alkyl group may be substituted with a halogen atom such as a chlorine atom. Further, the aryl group may be substituted with a halogen atom such as a chlorine atom or a C _1-10 alkyl group such as a methyl group. R ¹ to R ¹⁰ include, for example, an unsubstituted alkyl group such as a methyl group, an ethyl group, a propyl group, a hexyl group or a dodecyl group; a substituted alkyl group such as a chloromethyl group; an unsubstituted aromatic group such as a phenyl group or a naphthyl group; a substituted aryl group such as 4-chlorophenyl or 2-methylphenyl. Among these, an alkyl group is preferred, and an unsubstituted alkyl group is particularly preferred, and a methyl group is more preferred.

R ³ and R ¹⁰ may also be Rf-X- or ZY-. Here, X and Y are the same or different divalent organic groups, Rf is a C _1-6 fluoroalkyl group, and Z is a hydrolyzable moiety decyl group.

X and Y are preferably a C _1-20 , more preferably a C _1-12 divalent organic group. The divalent organic group is preferably an alkylene group of C _1-12 , such as an extended ethyl group, a propyl group, a methyl ethyl group, a decyl group and a decyl group, and preferably a C _{2 - 2} group. _An alkoxyalkylene group of ₁₂ , for example, an ethoxymethylene group, a propoxyoxymethylene group, a propoxylated ethyl group, and an ethoxylated butyl group. Further, X is preferably a C _1-12 alkyl amide group such as an ethyl allysine group, a propyl decylamino group, and a fluorenyl amide group. Preferably, X and Y are -(CH ₂ ) _r -. Here, in the formula, r is 2 to 200, particularly 2 to 12.

Rf is a fluoroalkyl group, preferably a perfluoroalkyl group, and contains 1 to 6 carbon atoms, for example 1 to 5 carbon atoms, particularly 1 to 4 carbon atoms. Rf specifically includes trifluoromethyl, pentafluoroethyl, 1,1,2,2-tetrafluoroethyl, 2-trifluoromethyl-perfluoroethyl, perfluorobutyl, perfluoropentyl and all Fluoryl group. Of these, pentafluoroethyl is preferred.

Z is, for example, a decyl group having a hydrolyzable moiety having a carbon number of 1 to 60. Z may also be -Si(R ¹¹ ) _q (X') _3-q (R ¹¹ is a carbon number of 1 to 20, preferably an alkyl group having 1 to 4 carbon atoms, and X' is a hydrolyzable moiety. , q is 0, 1 or 2). Also, Z can also be

-(Si(R ¹¹ ) ₂ O) _r -Si(R ¹¹ ) _q (X') ₃

(R ¹¹ is a carbon number of 1 to 20, preferably an alkyl group having 1 to 4 carbon atoms, and X' is a hydrolyzable moiety, and r is 1 to 200). R ¹¹ may also be methyl, ethyl, propyl, hexyl or dodecyl, most preferably methyl. X' as a hydrolyzable moiety includes, for example, a halogen such as chlorine or bromine; and a methoxy group, an ethoxy group, a propoxy group, a methoxyethoxy group, a butoxy group or the like preferably has 1 to 12 carbon atoms. The alkoxy group; an ethoxy group, a propenyloxy group, a benzamidine group or the like is preferably an anthracene group having 1 to 12 carbon atoms; an alkenyloxy group such as an isopropenyloxy group and an isobutenyloxy group; The dimethyl ketone oxime group, the methyl ethyl ketone oxime group, the diethyl ketoximino group and the cyclohexyl fluorenyl group are preferably an imido fluorenyl group having 1 to 12 carbon atoms; the ethylamine group and the second group; The ethylamino group and the dimethylamino group are preferably a substituted amine group having 1 to 12 carbon atoms and substituted with at least one alkyl group; N-methylacetamido group and N-ethylethylammonium group, etc. Preferred are amidino groups having 1 to 12 carbon atoms; dimethylaminooxy group and diethylaminooxy group preferably have 1 to 12 carbon atoms and at least one of them preferably has 1 A substituted amino group substituted with an alkyl group of ~4 carbon atoms.

Here, m is 1 to 100, n is 1 to 50, and o is 0 to 200. Preferably, m is 1 to 50, n is 3 to 20, and o is 0 to 100. More preferably, m can be 2 to 50, n is 3 to 20, and o is 1 to 100.

Specific examples of the compound include a compound represented by the chemical formula (4), and among the compounds, A includes -(CH ₂ ) ₃ OCH ₂ CF ₂ CF ₃ or -(CH ₂ ) ₃ OCH ₂ CH ₂ CF _{2 .} CF ₂ CF ₂ CF ₃ , B contains -(CH ₂ ) ₃ Si(OCH ₃ ) ₃ .

[Chemical 4]

Here, in the formula, Me is a methyl group. x is 1~100, y is 1~50 and z is 0~200.

Further, the fluoropolyfluorene compound (an alkylene group having a hydrolyzable moiety in the molecule) may be a compound represented by the chemical formula (5).

[Chemical 5]

The compound of the formula (5) has a fluorenylalkylene group represented by the formula -R ¹ -SiR ² _(3-m) X _m each having one or more fluorene atoms bonded to the main chain in one molecule, and A fluorine-containing organic group represented by the formula -R ¹ -C _n F _(2n+1) . In the above formula, R ¹ is an alkylene group or an alkyleneoxyalkylene group, and examples of the alkylene group include an exoethyl group, a methyl group ethyl group, an ethyl group ethyl group, a propyl group ethyl group, and a butyl group ethyl group. , propyl, butyl, 1-methylpropyl, pentyl, hexyl, heptyl, octyl, hydrazino, hydrazino Exemplified by ethoxylated ethyl, ethoxylated propyl, ethoxylated butyl, propyloxyethyl, propyloxypropyl, propyloxybutyl, butyloxyethyl Stretching butyloxypropyl. R ² is the same or different group selected from the group consisting of an alkyl group, an aryl group and a 3,3,3-trifluoropropyl group, and examples of the alkyl group include a methyl group, an ethyl group, a propyl group and a butyl group. A group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a decyl group, a decyl group, a hexadecyl group, and an octadecyl group, and examples of the aryl group include a phenyl group, a tolyl group, and a xylyl group. X is a halogen atom or an alkoxy group, and examples of the halogen atom include a fluorine atom, a chlorine atom, and a bromine atom. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, and a group. Oxyethoxyl. Here, m is an integer of 1 to 3. n is an integer of 4 or more, preferably an integer of 4 to 12. Examples of the fluorine-containing organic group represented by the above formula include nonafluorohexyl group, decafluoroisooctyl group, tridecafluorooctyl group, heptadecafluorodecyl group, nonafluorobutylethoxyethyl group, and nonafluoro group. Butylethoxypropyl, nonafluorobutylethoxybutyl, undecafluoropentylethoxyethyl, undecafluoropentylethoxypropyl. The bonding position of the alkylenealkylene group and the fluorine-containing organic group shown in the above formula may be the terminal of the molecular chain, the side chain, or both. Examples of the group bonded to the ruthenium atom other than the group include a monovalent hydrocarbon group, and specific examples thereof include the groups exemplified above for R ² . The organopolyoxane constituting the main chain is preferably linear or partially branched, cyclic or network. The organopolyoxane is preferably liquid at normal temperature and has a viscosity of from 5 to 100,000 centositol at 25 ° C. As the component, one type of the above-mentioned organopolyoxane may be used, or two or more types may be used.

Wherein R ³ is the same or different selected from the group consisting of an alkyl group, an aryl group, a 3,3,3-trifluoropropyl group, and a fluorine-containing organic group represented by the formula -R ¹ -C _n F _(2n+1) At least one of the groups in the group formed is a fluorine-containing organic group represented by the above formula. Examples of the alkyl group, the aryl group and the fluorine-containing organic group include the same groups as described above. R ¹ , R ² , X, m and n are the same as described above. Here, d is an integer of 1 to 10,000, preferably an integer of 1 to 1,000. Further, e is an integer of 1 to 1,000, preferably an integer of 1 to 100.

In the present invention, the compound represented by the chemical formula (4) is suitably used for the fluoropolyfluorene compound (the alkylene group having a hydrolyzable moiety in the molecule).

The mold release composition to be used in the present invention must contain a fluoropolyoxyl compound having a decyl group having a hydrolyzable moiety in the molecule. The reason for this is that when a fluoropolyoxyalkylene compound containing no hydrolyzable moiety in the molecule is used as the mold release compound, when it is used as a film for mold release, the molded article is a film for mold release. When peeling off, the mold release compound peels from the film surface and moves to the surface of the molded article to contaminate the molded article. On the other hand, in the case of using a fluoropolysiloxane having a hydrocarbyl group having a hydrolyzable moiety in the molecule, since a chemical bond is formed by crosslinking with the surface of the film, peeling of the mold release compound from the film surface during use can be avoided. Adverse conditions on the surface of contaminated molded products. In addition, the fluoropolyfluorene compound having a decyl group having a hydrolyzable moiety in the molecule of the present invention is not limited to the above-mentioned compound, and examples thereof include compounds represented by the chemical formula (6) and the chemical formula (7).

[Chemical 6]

Here, in the formula, q is an integer of 1 to 3. m, n, and o are integers from 0 to 200, respectively. p is 1 or 2. X is oxygen or a divalent organic group. r is an integer from 2 to 20. R ¹ is a linear or branched hydrocarbon group of C1-22. a is an integer from 0 to 2. X' is a hydrolyzable group. And when a is 0 or 1, z is an integer from 0 to 10.

[Chemistry 7]

Here, in the formula, q is an integer of 1 to 3. m, n, and o are integers from 0 to 200, respectively. p is 0, 1, or 2. X is oxygen or a divalent organic group. X" is a divalent organic polyoxyl spacer. X' is a hydrolyzable group, and when a is 0 or 1, z is an integer from 0 to 10.

The fluoropolyoxy compound (the decyl group having a hydrolyzable moiety in the molecule) is preferably dissolved in an organic solvent or the like and used as a solution. Specific examples of the solvent include aliphatic saturated hydrocarbon solvents such as hexane, isohexane, heptane, octane, and isooctane; and fats such as cyclohexane, methylcyclohexane, and dimethylcyclohexane. Family solvent; aromatic solvents such as benzene, toluene and xylene; ester solvents such as ethyl acetate and butyl acetate; alcohol solvents such as ethanol and isopropanol; trichloroethylene, chloroform and hexachloro-xylene Chlorine solvent; ketone solvent such as acetone, methyl ethyl ketone or methyl isobutyl ketone; ether solvent such as diethyl ether, diisopropyl ether and tetrahydrofuran; methyl perfluorobutyl ether and ethyl perfluorobutyl ether A fluorine-based solvent, a polyfluorene-based solvent such as hexamethyldioxane, hexamethylcyclotrioxane or heptamethyltrioxane.

The above-mentioned mold release compound may also contain an organic titanium compound, an organic zirconium compound, and an organic cerium compound. These compounds have a function as a crosslinking agent for the surface of the film and a crosslinking agent of a fluoropolyoxy compound (a fluorenyl group having a hydrolyzable moiety in the molecule), and a crosslinking curing agent as a fluoropolyoxy compound. Further, these compounds may be used alone or in combination of two or more.

Here, examples of the organotitanium compound include diisopropoxy bis(acetate ethyl acetate) titanium, dioctyloxybis(octanediol)titanium, tetrakis(acetonitrile)titanium, and diisopropoxy group. a titanium chelate compound such as bis(acetonitrile) titanium or a titanium alkoxide such as titanium tetra-2-ethylhexoxide, titanium dimer butoxide, titanium tetra-n-butoxide or titanium tetraisopropoxide; It is appropriately selected and used in consideration of the stability of the compound itself, the crosslinking speed, the crosslinking hardening speed, and the like. Among these, diisopropoxy bis(acetic acid ethyl acetate) titanium, tetra-2-ethylhexyl ethoxide titanium, titanium tetraisopropoxide, and the like are usually preferably used.

Further, examples of the organic zirconium compound include zirconium tetrakis(acetonitrile), zirconium dibutoxy bis(acetate ethyl acetate), zirconium monobutoxy (acetoxime) bis(acetonitrile), and zirconium. a zirconium chelate such as zirconium mono(acetonitrile)zirconium or tetrakis(acetonitrile)zirconium or zirconium alkoxide such as zirconium tetra-n-butoxide or zirconium tetra-n-propoxide; the stability of the compound itself may be considered It is appropriately selected for use in terms of properties, crosslinking speed, cross-linking hardening speed, and the like.

The above-mentioned organotitanium compound and organozirconium compound mainly function as a crosslinking agent between a film surface and a fluoropolyoxyl compound. The amount to be added may be added in the range of 0.05 parts by mass to 20 parts by mass, preferably 0.1 parts by mass to 10 parts by mass, per 100 parts by mass of the fluoropolysiloxane. At this time, if the amount added is less than 0.05 parts by mass, the crosslinking of the surface of the film with the fluoropolysiloxane is insufficient, which is not preferable. Further, when it is added in an amount of more than 20 parts by mass, the crosslinking of the surface of the film with the fluoropolysiloxane is sufficient, and the unreacted organotitanium compound or the organozirconium compound or both may remain, which is not preferable.

As the organic ruthenium compound, a compound generally called a decane coupling agent can be used. Examples of the organic hydrazine compound include 3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane, 3-(2-aminoethyl)aminopropyltrimethoxydecane, and 3 -(2-Aminoethyl)aminopropyltriethoxydecane, 3-(2-aminoethyl)aminopropylmethyldimethoxydecane, 3-triethoxydecyl- N-(1,3-dimethyl-butylene)propylamine, 3-phenylaminopropyltrimethoxydecane and N-(p-vinylbenzyl)-N-(trimethoxydecylpropyl Aminodiamine-containing decane coupling agent such as ethylenediamine; 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, 3-glycidoxypropyl Epoxy-containing decane coupling agent such as triethoxy decane, 3-glycidoxy propyl methyl diethoxy decane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane a vinyl-containing decane coupling agent such as vinyl trimethoxy decane, vinyl triethoxy decane, vinyl triisopropoxy decane, vinyl triethoxy decane or vinyl trichloro decane; Methyl propylene methoxy propyl trimethoxy decane, 3-methyl propylene oxime Methyl methacrylate containing propyl propyl dimethoxy decane, 3-methyl propylene methoxy propyl triethoxy decane and 3-methyl propylene methoxy propyl methyl diethoxy decane Base decane coupling agent; 3-mercaptopropyltrimethoxydecane, 3-mercaptopropylmethyldimethoxydecane, 3-mercaptopropyltriethoxydecane and 3-mercaptopropylmethyldiethoxylate a decane-containing decane coupling agent such as decane or the like; an allyl-containing decane coupling agent such as allyltrimethoxydecane and diallyldimethyloxane; bis(3-(triethoxydecyl)propyl) a thioether-containing decane coupling agent such as disulfide or bis(3-(triethoxydecyl)propyl)tetrasulfide. Among these compounds, preferred are amine group-containing decane coupling agents, epoxy group-containing decane coupling agents, more preferably 3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxylate. Baseline, 3-(2-aminoethyl)aminopropyltrimethoxydecane, 3-(2-aminoethyl)aminopropyltriethoxydecane, 3-(2-aminoethyl Aminopropylmethyldimethoxydecane, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, 3-glycidoxypropyl Preferred are triethoxy decane and 3-glycidoxy propyl methyl diethoxy decane, more preferably 3-aminopropyltrimethoxydecane and 3-aminopropyltriethoxydecane.

The organic ruthenium compound mainly functions as a cross-linking hardener of a fluoropolyoxy compound (a decyl group having a hydrolyzable moiety in the molecule). The amount to be added is in the range of 0.1 part by mass to 20 parts by mass, preferably 0.05 part by mass to 10 parts by mass per 100 parts by mass of the fluoropolyfluorene compound (the alkylene group having a hydrolyzable moiety in the molecule). The range of parts can be added. In this case, when the amount is less than 0.05 parts by mass, the curing of the fluoropolyfluorene compound (the alkylene group having a hydrolyzable moiety in the molecule) is insufficient, which is not preferable. In addition, even if it is added in an amount of more than 20 parts by mass, the crosslinking hardening of the fluoropolyfluorene compound (the alkylene group having a hydrolyzable moiety in the molecule) is sufficient, and the unreacted organic hydrazine compound may remain, which is not preferable.

The mold release composition of the present invention is preferably a compound selected from the group consisting of an organotitanium compound and an organozirconium compound or a compound of two or more kinds, which is used in combination with an organic ruthenium compound. The organic titanium compound and the organic zirconium compound mainly promote crosslinking of the surface of the film with the fluoropolyoxy compound, and the organic cerium compound mainly promotes crosslinking hardening of the fluoropolyoxy compound. Therefore, by using these compounds in combination, the fluoropolyoxy compounds are cross-linked to each other in a state where the surface of the film and the fluoropolyoxygen compound have been crosslinked to form a network structure. Therefore, when used as a film for mold release, even if the film is stretched, the coating film containing the fluoropolysiloxane compound follows the film and the coating film is held without being damaged, so that the molding resin can be maintained. The peeling property and the fluoropolyoxygen compound forming the coating film are not transferred to the molded article. Further, in the production stage, an incidental effect of shortening the drying time after coating can be obtained.

A film of a resin composition containing a thermoplastic resin or a resin composition containing a thermoplastic resin as a main component and mixing a thermoplastic elastomer (hereinafter sometimes referred to as a matrix film) may be, for example, a melt extrusion method or a melt casting method. Formed by a previously known method.

In the following examples, a method of forming a matrix film by melt extrusion using a T mold is exemplified.

The matrix film obtained by such a method is obtained by using a uniaxial extrusion for a resin composition containing a thermoplastic resin or a resin composition containing a thermoplastic resin as a main component and mixing a thermoplastic elastomer. An extruder such as a press or a twin-screw extruder performs melt-kneading in an environment in which air is replaced by nitrogen in a gap between the extruder and the molding material in accordance with the characteristics of the resin composition. The die lip disposed at the front end of the T mold at the front end of the extruder is melt-extruded, and the matrix film obtained by melt extrusion is clamped between the crimping roller and the cooling roller in the extracting machine for cooling, and then sequentially taken by the coiler Taken on the take-up tube.

Fig. 2 is a schematic block diagram showing a film production apparatus for producing a matrix film by the above method. Moreover, FIG. 3 is a cross-sectional view of the periphery of the material input hopper of the film manufacturing apparatus shown in FIG. In FIG. 2, the film manufacturing apparatus is basically configured to include a material loading hopper 2, an extruder 1, a T mold 7, a extracting machine 11, and a coiler 15. The material loading hopper 2 is for inserting a molding material. As shown in FIG. 3, the material supply hopper 2 is connected to the extruder 1, and the nitrogen gas supply pipe 3 is inserted through the spacer 3a. Further, the nitrogen supply pipe 3 is bent so as to extend along the substantially central axis of the material inlet 1c, and its tip end is extended to the vicinity of the outer periphery of the extrusion screw 1a in the extruder 1. The oxygen supplied from the nitrogen supply pipe 3 is mixed with the extrusion screw 1a of the extruder 1 and the oxygen is contained in the molding material supplied from the material supply hopper 2, and the oxygen is supplied from the extrusion screw 1a of the extruder 1. Replacement.

In the extruder 1, the molding material is conveyed in the direction of the arrow B while being mixed and stirred by the extrusion screw 1a, and the material is heated and melted by the electrothermal mechanism incorporated in the cylinder 1b of the extruder 1. The molding material thus melted and conveyed is sent to the filter mechanism 5 via the connecting pipe 4 shown in FIG. Then, the unmelted molding material is separated by the filtering mechanism 5, and the molten molding material is supplied to the gear pump 6. The gear pump 6 presses the molten molding material toward the T mold 7 while increasing the pressure of the molten molding material. The T mold 7 presses the melt-molded material at a specific pressure, and forms a film 8 of a specific thickness and a specific width from the lip portion 7a of the T mold 7. The film 8 thus formed is drawn to the outer peripheral surface of the cooling roll 10 of the extractor 11, and is adjusted to a specific thickness by the pressure roller 9, and further cooled and solidified, and transported to the transfer roller pairs 12 and 13 to Coiler 15.

In the coiler 15, the film 8 is guided by the guide rolls 15a, 15b, 15c and taken up by the take-up tube 16. Further, a thickness measuring device 14 is disposed between the pair of conveying rollers 12 and 13 and the guide roller 15a to adjust the thickness of the cooling roller 10 according to the thickness measured by the thickness measuring device 14 so as to achieve a desired thickness. speed. Thereby, the above matrix film is formed.

The matrix film forms a surface shape corresponding to the surface shape of the molded article. For example, since an IC, an LSI, or the like forms fine irregularities on the surface thereof, a film for mold release having fine irregularities formed on the surface of the substrate film is used. Further, in the case where the surface of the LED or the like is mirror-finished, a film for mold release in which the surface of the substrate film is mirror-finished is used.

As a method of forming the surface shape of the matrix film, when fine irregularities are formed on the surface, the following method is simple: fine irregularities are formed in advance on the outer peripheral surface of the metal cooling roll, and the molten film is in a molten state. When the substrate film is pressed against the cooling roll, the fine unevenness formed on the outer peripheral surface of the cooling roll is transferred to the surface of the substrate film. Further, in the case where the surface is mirror-finished, the following method is simple: the surface of the metal cooling roll is previously mirror-finished, and the matrix film in a molten state is crimped to the cooling roll by a pressure roller. The surface of the substrate film is mirror-finished.

Thereafter, the mold release compound is applied and dried on at least one side of the substrate film to form a fluoropolyoxymethane layer. A previously known coating method can be used for the coating of the mold release compound. For example, it can be applied from a bar coater, a reverse roll coater, a positive roll coater, a gravure coater, an anastomotic coater, a cast coater, a spray coater, a curtain coater, and a die coater. A cloth machine, an air knife coater, a knife coater, a bar coater, a blade coater, an extrusion coater, an impregnation coater, and the like are appropriately selected and used.

The thickness of the film-based matrix film for mold release of the present invention is in the range of 5 μm to 500 μm, preferably in the range of 10 μm to 400 μm, and may be appropriately selected depending on the shape of the molding die to be used. When the thickness of the matrix film is set to less than 5 μm, there is a problem that it is broken due to the pressure of the molding resin at the time of use, which is not preferable. In addition, when it exceeds 500 μm, there is a problem that heat conduction is hindered, and dents are formed on the surface of the molded article, which causes a decrease in yield, which is not preferable. Further, the thickness of the fluoropolysiloxane layer is in the range of 0.05 μm to 10 μm, preferably in the range of 0.1 μm to 5 μm. When the thickness of the fluoropolyoxymethylene compound layer is set to less than 0.05 μm, the fluoropolyoxygenated compound layer is broken due to the pressure of the molding resin at the time of use, and the peeling property is deteriorated, which is not preferable. In addition, when the thickness exceeds 10 μm, the peeling property is not expected to be further improved, and drying after application requires a long time, so that productivity is lowered, which is not preferable. Further, there is a problem that undulation occurs in the flat portion of the molded article due to the flexibility of the fluoropolysiloxane layer itself, which is not preferable.

[Examples]

Hereinafter, Examples 1 to 10 of the film for mold release of the present invention will be described using Tables 1 and 2.

In Table 1, the contents of Embodiments 1 to 5 are shown in the horizontal direction in the drawing, and in Table 2, the contents of Embodiments 6 to 10 are shown in the horizontal direction in the drawing. Further, in Tables 1 and 2, the matrix, the mold release compound, and the film for mold release were sequentially classified in the longitudinal direction of the drawing. In the item of the matrix, the resin composition and the thickness of the matrix film are classified, and in the item of the mold release compound, the composition, the wet film thickness, and the film thickness after drying are classified. Further, among the components, solid components (parts by mass), organotitanium compounds (parts by mass), organozirconium compounds (parts by mass), and organic cerium compounds (parts by mass) are classified. In the evaluation of the film for release mold, the peeling property and the heat resistance strength were classified. Further, in the item of the peeling property, it was classified into drying for 2 minutes, drying for 5 minutes, drying for 10 minutes, and drying for 15 minutes, and in the term of heat resistance, E' (Pa) in the longitudinal and lateral directions was shown. Further, the film for mold release of the present invention is not limited to any of Examples 1 to 10.

Here, the resin composition 1, the resin composition 2, the fluoropolysiloxane, the organotitanium compound, the organozirconium compound, and the organic sulfonium compound shown in Table 1 and Table 2 are the materials shown below. In addition, Tables 3 and 4 show the comparative examples (Comparative Example 1 to Comparative Example 7) corresponding to the examples of the present invention together with the evaluations thereof. Therefore, the following description is applied in the same manner as in the case of the comparative example.

(Resin Composition 1: Thermoplastic Resin)

Ultem 1010-1000: trade name, manufactured by SABIC Innovative Plastics Japan, polyether oximine resin, melting point 223 ° C

(Resin Composition 2: Mixing of Thermoplastic Resin and Thermoplastic Elastomer)

XAREC C102: trade name, manufactured by Idemitsu Kosan Co., Ltd. Vinyl resin with a melting point of 270 ° C

KRATON G-1657: trade name, manufactured by Kraton Polymers, hydrogenated derivative of styrene-butadiene-styrene triblock copolymer, styrene content 13% by mass

XAREC C102: KRATON G-1657 = 90% by mass: 10% by mass

(fluoropolyoxymethane)

Preparation and use of the above chemical formula (4) wherein A is -(CH ₂ ) ₃ OCH ₂ CF ₂ CF ₃ , B is -(CH ₂ ) ₃ Si(OCH ₃ ) ₃ , x is 21, y is 5, and z is 38. Fluoropolyoxynitride.

(organic titanium compound)

Orgatics TC-750: trade name, manufactured by Matsumoto Trading, diisopropoxy bis(acetonitrile ethyl acetate) titanium

(organic zirconium compound)

Orgatics ZC-580: trade name, manufactured by Matsumoto Trading, dibutoxy bis(acetonitrile ethyl acetate) zirconium

(organic bismuth compound)

KBM-903: trade name, manufactured by Shin-Etsu Chemical Co., Ltd., 3-aminopropyltrimethoxydecane

Hereinafter, the preparation of the matrix film, the preparation of the mold release compound, the application and drying of the mold release compound, the peeling property, and the heat resistance strength will be described in detail based on Tables 1 and 2. In addition, Tables 3 and 4 show the comparative examples (Comparative Example 1 to Comparative Example 7) corresponding to the examples of the present invention together with the evaluations thereof. Therefore, the following description is applied in the same manner as in the case of the comparative example.

(Production of matrix film)

Supplying the resin composition to 40mm, L/D=25 single-axis extruder (manufactured by IKG), using a full-thread extrusion screw with a compression ratio of 2.5 for melt-kneading at the following cylinder temperature, from a mold with a width of 400 mm Continuous extrusion at the mold temperature. The extruded substrate film is cooled between the pressure roller and the cooling roller in the extracting machine, and the both ends are cut by a slit knife in the coiler, and the matrix film is taken up in the winding tube. Thus, a matrix film having a width of 250 mm and a length of 50 m was produced in the thicknesses shown in Tables 1 to 4. Here, in the resin composition 1, the cylinder temperature was set to 320 ° C to 350 ° C, and the mold temperature was set to 350 ° C to 360 ° C. For the resin composition 2, the cylinder temperature was set to 280 ° C to 300 ° C, and the mold temperature was set to 300 ° C to 320 ° C.

(Preparation of demolding compound)

The above fluoropolyoxymethylene compound was diluted with isopropyl alcohol to prepare a solution having a solid concentration of 10% by mass. Then, an organic titanium compound, an organic zirconium compound, and an organic cerium compound were added to the solid components of the solution in the compositions described in Tables 1 to 4 to prepare a mold release compound.

(application and drying of the release module)

The mold release composition was applied to one surface of the prepared matrix film so as to have a wet film thickness as shown in Tables 1 to 4 using a bar coater. The bar coater is selected in such a way that the desired wet film thickness can be obtained. Then, drying was carried out in a hot air oven equipped with an exhaust port adjusted to 150 °C. The drying time was set to 2 minutes, 5 minutes, 10 minutes, and 15 minutes, and a film for mold release was produced. Here, the film thickness after drying described in Table 1 is based on wet film thickness and demolding. Calculated value calculated from the solid content concentration of the composition.

(peelability)

The peeling property was evaluated for the peeling property of the film for mold release and the epoxy resin used as a molding resin. An epoxy resin sealing material KMC-284 (manufactured by Shin-Etsu Chemical Co., Ltd.) was placed on the film surface of the mold release film on which the mold release compound was applied, and the film was sandwiched between the inner surface and the hard chrome plating. The flat die was subjected to hot press forming, and the peeling property of the film for release of the formed laminated product and the epoxy resin was evaluated.

The hot press forming was carried out under the conditions of a temperature of 200 ° C and a pressure of 50 kg/cm ² for 3 minutes. In addition, in the evaluation of the peeling property, the case where the cured epoxy resin does not remain on the film and is peelable is shown as "○", and the case where the cured epoxy resin remains on the film for mold release is shown as "×".

(heat resistance)

The heat resistance was evaluated by the storage elastic modulus E' of the film in both the machine direction and the transverse direction at a temperature of 200 ° C in the dynamic viscoelasticity measurement. The reason for this is that the film for demolding installed in the molding apparatus enters the molding die and is vacuum-sucked and adhered to the molding die, so the storage elastic modulus at 200 ° C in the dynamic viscoelasticity measurement E' is suitable as an indicator of the heat resistance at 200 ° C.

Specifically, the storage of the film in the longitudinal direction and the transverse direction at a temperature of 200 ° C measured at a frequency of 1 Hz, a temperature increase rate of 5 ° C/min, and a strain of 0.1% was used using SOLIDS ANALYZER RSAII (trade name) manufactured by Rheometrics Co., Ltd. Elastic modulus E'. The storage elastic modulus E' is preferably from 5.0 × 10 ⁷ Pa to 3.0 × 10 ⁹ Pa, more preferably from 5.0 × 10 ⁷ Pa to 2.0 × 10 ⁹ Pa. When the storage elastic modulus E' is less than 5.0 × 10 ⁷ Pa, the elastic deformability is weak, and the film is broken due to the pressure of the molding resin during use, and the heat resistance is insufficient. On the other hand, when the storage elastic modulus E' exceeds 3.0 × 10 ⁹ Pa, although the heat resistance is sufficiently obtained, the elastic deformability is too strong, and the follow-up to the molding die is insufficient.

According to the above results, in the case where the mold release compound was not applied as shown in Comparative Example 1, peelability could not be obtained. When the mold release compound having a small content of the organic titanium compound and the organic zirconium compound was applied as shown in Comparative Example 2, Comparative Example 3, and Comparative Example 4, peeling property could not be obtained. When the film thickness was thick as shown in Comparative Example 5, it was not able to obtain peelability after drying for 15 minutes after application. In Comparative Example 6, the ETFE film manufactured by Asahi Glass Co., Ltd. and Aflex (trade name) having a thickness of 50 μm were compared, but the film was melted at the peeling property evaluation at 200 °C. Further, the storage elastic modulus E' which is an index of the heat resistance is clearly out of the proper range as compared with the examples. In Comparative Example 7, the release agent Daifree GF-6332 (trade name, solid content concentration: 3% by mass) manufactured by Daikin Industries was used as a comparison object of the mold release composition, but peelability was not obtained.

On the other hand, the film for mold release of each Example of this invention can obtain the peeling property, and also has the heat-resistant strength. Thus, according to the present invention, it is possible to obtain a film for mold release which is excellent in peelability from a molded article obtained by molding a molding resin and also has heat resistance at 200 °C.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is of course not limited to the scope described in the above embodiments. It is obvious to those skilled in the art that various modifications and improvements can be made to the above embodiments. Further, the description of the scope of the patent application indicates that such a modification or improvement may be included in the technical scope of the present invention.

1‧‧‧Extrusion machine

2‧‧‧Materials

3‧‧‧Nitrogen supply pipe

4‧‧‧Connecting tube

5‧‧‧Filter

6‧‧‧ Gear pump

7‧‧‧T mould

7a‧‧‧Lip lip

8‧‧‧ film

9‧‧‧Crimp roller

10‧‧‧Cooling roller

11‧‧‧ extractor

12, 13‧‧‧Transport roller pair

14‧‧‧ Thickness measuring device

16‧‧‧Winding tube

20‧‧‧ film

30‧‧‧De-formed compound

Fig. 1 is a cross-sectional view showing an embodiment of a film for mold release of the present invention.

Fig. 2 is a schematic configuration view showing an embodiment of a film production apparatus for producing a release film of the present invention.

Fig. 3 is a cross-sectional view showing the periphery of a material loading hopper of the film manufacturing apparatus shown in Fig. 2;

20. . . membrane

30. . . Demoulding compound

Claims (9)

A film for mold release, which is formed on at least one surface of a film obtained by molding a resin composition containing a thermoplastic resin or a resin composition containing a thermoplastic resin as a main component and mixing a thermoplastic elastomer. There is a fluoropolyoxyl compound layer obtained by coating and drying a mold release compound containing a fluoropolysiloxane having a hydrolyzable moiety in a molecule. The film for mold release according to claim 1, wherein the film comprises a single layer film or a multilayer film of two or more layers. The film for mold release according to claim 1 or 2, wherein the thermoplastic resin is a polyphenylene sulfide resin, a polyfluorene resin, a polyether oxime resin, a polyetheretherketone resin, a polyimine resin, a polyamidimide Resin, polyether oxime imide resin, polyethylene naphthalate resin, polyamine resin, polyacetal resin, polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate resin, poly pair Ethylene phthalate resin, cyclic polyolefin resin, aligned polystyrene resin, polymethylpentene resin, polymethyl methacrylate resin, polyethylene resin, polypropylene resin, polystyrene resin, poly At least one of a vinyl acetate resin, an acrylonitrile butadiene styrene resin, and an acrylonitrile styrene resin, wherein the thermoplastic elastomer is a polyester elastomer, a polyamide elastomer, or a polyurethane resin. At least one of an elastomer, a styrene elastomer, and an olefin elastomer. The film for mold release according to claim 1, wherein the mold release compound is contained in an amount of 0.05 parts by mass to 20 parts by mass based on 100 parts by mass of the fluoropolysiloxane having a hydrolyzable moiety in the molecule. Freedom of choice A compound of a group consisting of an organic titanium compound, an organic zirconium compound, and an organic cerium compound, or a combination of two or more compounds. The film for mold release according to claim 1, wherein the mold release compound is contained in an amount of 0.05 parts by mass to 20 parts by mass based on 100 parts by mass of the fluoropolysiloxane having a hydrolyzable moiety in the molecule. A compound of a group consisting of an organotitanium compound and an organozirconium compound or a combination of two or more compounds is selected. The film for mold release according to claim 5, wherein the mold release compound is in an amount of from 0.05 part by mass to 20 parts by mass based on 100 parts by mass of the fluoropolysiloxane having a hydrolyzable moiety in the molecule. A composition containing an organic cerium compound. The film for mold release according to claim 1, wherein the resin composition containing the thermoplastic resin or the resin composition obtained by mixing a thermoplastic resin as a main component and a thermoplastic elastomer is formed into a single layer film or two or more layers. The thickness of the multilayer film is in the range of 5 μm to 500 μm, and the thickness of the fluoropolyfluorene compound layer obtained by coating and drying the mold release compound containing the fluoropolyoxy compound having a hydrolyzable moiety in the molecule is 0.05. The range of μm~10μm. A method for producing a film for mold release, comprising: preparing a resin composition containing a thermoplastic resin or a resin composition obtained by mixing a thermoplastic elastomer as a main component and mixing a thermoplastic elastomer; On at least one side, a mold release compound containing a fluoropolysiloxane having a hydrolyzable moiety in the molecule is applied and dried to form the fluoropolyoxymethane layer. The method for producing a film for mold release according to claim 8, wherein the film comprises a single layer film or a multilayer film of two or more layers.