KR20110102211A - Method of manufacturing multi-layer circuit board having through via hole filled with conductive material, apparatus for filling through via hole with conductive material, and method of using the same - Google Patents

Abstract

The conductive material charged to the through via is prevented from falling out while the metal powder contained in the conductive material becomes invalid.
The multilayer circuit board 10 is provided on the blotter paper 21b, and the conductive paste 1 is filled in the through via 11. Thereby, the solvent of the electrically conductive paste 1 is adsorb | sucked in the blotter paper 21b, and metal powder is concentrated in the through via 11, and can leave a required quantity. For this reason, the ratio of a metal powder with respect to a ratio of a solvent can be reduced, and the metal material contained in an invalid paste can be reduced. In addition, the conductive paste 1 is made of a material which solidifies at room temperature, the through via 11 is filled with the conductive paste 1, and the multilayered circuit board 10 is cooled to solidify the conductive paste 1. . Thereby, even if the multilayer circuit board 10 is peeled off from the sorbent paper 21b, the electrically conductive paste 1 can be prevented from coming out.

Description

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD HAVING THROUGH VIA HOLE FILLED WITH CONDUCTIVE MATERIAL, APPARATUS FOR FILLING THROUGH VIA HOLE WITH CONDUCTIVE MATERIAL, AND METHOD OF USING THE SAME}

This invention relates to the manufacturing method of the multilayer circuit board formed by superposing | polymerizing in several layers of resin films, and to which the wiring pattern between each layer consists of the electrically-conductive material filled in the through via.

TECHNICAL FIELD The present invention relates to a conductive material filling apparatus for filling a conductive material into a through via provided in a multilayer circuit board formed by polymerizing a plurality of resin films, and a method of using the same.

Conventionally, for example, a multilayer circuit board is formed by polymerizing a plurality of resin films having a wiring pattern formed thereon and then heating and compressing the resin film. In this multilayer circuit board, in order to electrically connect the wiring patterns between the layers, a via hole is opened in the multilayer circuit board by a laser processing machine or the like, and then a metal is melted with a solvent to form a paste (hereinafter referred to as "conductive paste"). Is filled into the via hole, and a method of sintering the metal in the conductive paste is employed (see Patent Documents 1 and 2, for example).

The via hole has a 'bottomed via' with a bottom surface (hereinafter referred to as a "via bottom") consisting of a through via penetrating a multilayer circuit board and a lead circuit. In the bottomed via, when the conductive paste is filled into the via hole, the conductive paste is blocked by the bottom of the via, so that the conductive paste does not fall out from the opposite side to the filling inlet of the via hole. However, in the through via, the conductive paste may come off from the side opposite to the filling inlet of the via hole.

For example, a pseudoviscosity fluid composed of a metal powder of silver or tin and a high viscosity solvent such as terpineol is used. Moreover, squeegee printing is employ | adopted as the filling method of a conductive paste in a fine through via (opening diameter Φ150-300 micrometers, depth 100-250 micrometers) (for example, refer patent document 1). Specifically, the opposite side of the charged surface of the multilayer circuit board is provided on the adsorption plate, the air in the through via is exhausted by intake by the adsorption plate, and the conductive paste is pushed into the squeegee on the charged surface. As a result, the filling failure caused by the presence of the internal air is suppressed, and the conductive paste can be filled in the through via.

JP2003-182023 A JP2005-329570 A

However, when the thickness of the multilayer circuit board becomes thin (the depth of the through via is shallow) with respect to the opening diameter of the through via, the squeegee printing becomes in the same state as the mask printing, and the conductive paste is adhered to the adsorption plate or the like to form the multilayer circuit board. There is a problem in that it comes out from the through via when peeled off from the suction plate. In particular, when the thickness d of the multilayer circuit board is 50 μm or less and the opening diameter is Φ150 μm, that is, the thickness d becomes 1/3 or less of the opening diameter, the conductive via cannot be filled in the through vias at all. It is confirmed. For this reason, it is necessary to thicken the thickness d of a multilayer circuit board according to opening diameter, and it becomes a factor which hinders high integration, and raises the cost of a multilayer circuit board.

In addition, after the conductive paste is filled in the through vias, excess portions protruding from the through vias are rubbed off by a squeegee. Since the excess conductive paste (hereinafter referred to as " invalid paste ") also contains metal powders of silver and tin, such metal powders are not used and are discarded. For this reason, it is expected that the quantity of the metal material contained in an invalid paste can be reduced.

In view of the above point, the present invention can prevent the conductive material filled with the through via formed in the multilayer circuit board from being pulled out, and can reduce the metal powder contained in the conductive material which becomes invalid. An object of the present invention is to provide a method for producing the same.

In order to achieve the above object, in the invention described in claim 1, an installation step of installing the multilayer circuit board 10 on the solvent adsorption sheet 21b, a heating step of heating the multilayer circuit board 10, and a conductive material Solvent adsorption of the solvent contained in the conductive material 1 while the melting process of bringing (1) into contact with the heated multilayer circuit board 10 to melt and filling the molten conductive material 1 into the through via 11. A filling process adsorbed on the sheet 21b, a solidification step of solidifying the conductive material 1 filled in the through via 11 after completing the filling of the conductive material 1 in the through via 11, and conduction. It is characterized by including the peeling process of peeling the multilayer circuit board 10 from the solvent adsorption sheet 21b after the material 1 solidifies.

Thus, the multilayer circuit board 10 is provided on the solvent adsorption sheet 21b, and the through via 11 is filled with the conductive material 1. For this reason, the solvent of the electrically-conductive material 1 is adsorb | sucked in the solvent adsorption sheet 21b, and the metal powder contained in the electrically-conductive material 1 is concentrated in the through via 11, and can leave a required amount. Thereby, the ratio of metal powder with respect to the ratio of a solvent can be reduced, and the quantity of the metal material contained in the electrically-conductive material 1 which becomes invalid can be reduced.

In addition, since the conductive material 1 is composed of a material that is solidified at room temperature, the conductive material 1 is solidified by filling the through via 11 with the conductive material 1 and then cooling the multilayer circuit board 10. can do. Therefore, after solidifying the electrically-conductive material 1, the multilayer circuit board 10 can be peeled off from the solvent adsorption sheet 21b, and it can prevent that the electrically-conductive material 1 falls out from the through via 11. As shown in FIG.

Therefore, the conductive material 1 filled in the through via 11 formed in the multilayer circuit board 10 can be prevented from falling out, and the metal powder contained in the conductive material 1 which becomes invalid can be reduced. Will be.

In the invention described in claim 2, the step of forming the wiring pattern forming metal layers 12a and 12b on both surfaces of the front and back surfaces of the multilayer circuit board 10 peeled off the solvent adsorption sheet 21b, and the metal layers 12a and 12b. ), Mask forming steps of forming etching masks 13a and 13b having patterns covering the conductive material 1 disposed in the through vias 11, and etching masks 13a and 13b formed in the mask forming step. ) To form a wiring pattern by simultaneously etching the metal layers 12a and 12b on both sides of the front and back surfaces of the multilayer circuit board 10, and after forming the wiring pattern, the etching masks 13a and 13b. It is characterized in that it comprises a step of removing).

Thus, by forming a wiring pattern on the front and back of the multilayer circuit board 10 peeled from the solvent adsorption sheet 21b, the multilayer circuit board 10 can be completed finally. At this time, since the etching for forming the wiring pattern is performed on the metal layers 12a and 12b formed on both surfaces of the front and back surfaces, the etching process can be simplified compared with the case of etching on the front and back surfaces, respectively. Reduction of a manufacturing process can be aimed at.

For example, as described in claim 3, in the installation step, the multilayer circuit board 10 is provided on the mounting surface 21a of the filling base 21 having the mounting surface 21a via the solvent adsorption sheet 21b. In the heating step, the multilayer circuit board 10 is heated by heating the filling base 21, and in the melting step, the conductive material 1 is used as the multilayer circuit board 10 heated by the heating of the filling base 21. In the filling step, the conductive material 1 can be filled in the through via 11 with the multilayer circuit board 10 and the solvent adsorption sheet 21b mounted on the mounting surface 21a of the filling base 21. have.

In the invention according to claim 4, the solidification step is performed in the through via 11 filled with the multilayer circuit board 10 together with the solvent adsorption sheet 21b on the mounting surface 21a of the filling base 21. It is characterized by being carried out by heat dissipation of the conductive material 1. In this way, the electrically-conductive material 1 can be easily solidified after filling.

In addition, as described in Claim 5, in the mounting process, the solvent adsorption sheet 21b and the multilayer circuit board 10 mounted on this mounting surface 21a are adsorbed from the mounting surface 21a, and the solvent adsorption sheet 21b is carried out. ) And the multilayer circuit board 10 may be held in the charging base 21.

In order to achieve the above object, in the invention described in claim 6, the conductive material 1 is filled in the through via 11 by heating the multilayer circuit board 10 held on the mounting surface 21a with the heating heater 22. The filling head conveying mechanism is provided between the mounting surface 21a of the filling base 21 and the multilayer circuit board 10 having a solvent adsorption sheet 21b for adsorbing the solvent contained in the conductive material 1. The charging head 30 is moved by the 40 in the horizontal direction and the vertical direction with respect to the surface of the multilayer circuit board 10, and the conductive material 1 is moved from the charging head 30 to the surface of the multilayer circuit board 10. It is characterized in that it is configured to fill the through via 11 by supplying a.

Thus, the multilayer circuit board 10 is provided on the mounting surface 21a of the filling base 21 via the solvent adsorption sheet 21b, and the conductive material 1 can be filled in the through via 11. Doing. For this reason, the solvent of the electrically-conductive material 1 is adsorb | sucked in the solvent adsorption sheet 21b, and the metal powder contained in the electrically-conductive material 1 is concentrated in the through via 11, and can leave a required amount. Thereby, the ratio of the metal powder to the ratio of the solvent can be reduced, and the amount of the metal material contained in the conductive material 1 which becomes ineffective can be reduced.

In addition, since the conductive material 1 is composed of a material that is solidified at room temperature, the conductive material 1 is solidified by filling the through via 11 with the conductive material 1 and then cooling the multilayer circuit board 10. can do. Therefore, after solidifying the electrically-conductive material 1, the multilayer circuit board 10 can be peeled off from the solvent adsorption sheet 21, and it can prevent that the electrically-conductive material 1 is pulled out from the through via 11. FIG.

Therefore, the conductive material 1 filled in the through via 11 formed in the multilayer circuit board 10 can be prevented from falling out, and the metal powder contained in the conductive material 1 which becomes invalid can be reduced. .

For example, as described in claim 7, the charging head 30 is in contact with the surface of the multilayer circuit board 10 and passes through the conductive material 1 supplied to the surface of the multilayer circuit board 10. In addition to providing a filling squeegee 31c printed on the cross-section 11 in the end face, the conductive material 1 which is able to swing in the horizontal direction with respect to the surface of the multilayer circuit board 10 and is solid is held. The conductive material 1 has a filling squeegee holder 31 having a pusher 31a that moves the conductive material 1 in a direction perpendicular to the surface of the multilayer circuit board 10.

Moreover, as described in Claim 8, the filling base 21 is equipped with the solvent adsorption sheet 21b mounted in the mounting surface 21a, and the adsorption mechanisms 21c-21f, 25 which adsorb | suck the multilayer circuit board 10. As shown in FIG. Thus, the multilayer circuit board 10 can be held on the mounting surface 21a of the charging base 21.

In the invention according to claim 9, the adsorption mechanism has adsorption grooves 21c and 21d formed in the mounting surface 21a, and the solvent adsorption sheet 21b and the multilayer circuit board 10 are formed through the adsorption grooves 21c and 21d. At least a part of the suction grooves 21c and 21d and at least 21d is composed of an annular groove.

Thus, by making the suction groove 21d into an annular groove rather than a linear groove, when the filling squeegee 31c or the like passes over the suction groove 21d, the filling squeegee 31c and the suction groove 21d overlap with each other. You can do less to lose. Therefore, as in the case where the suction groove 21d and the linear groove are formed, the filling squeegee 31c or the like is pushed into the suction groove 21d, so that the conductive material 1 filled in the through via 11 is sucked in the suction groove. It can be prevented from being pushed into the 21d.

In the invention according to claim 10, the charging base 21 and the upper surface are disposed so as to be provided, and an air base 26 for cooling the conductive material 1 disposed in the charging head 30 is provided. do.

In this way, when the through via 11 is filled with the conductive material 1 by providing the atmospheric base 26, the conductive material is electrically charged by simply moving the charged head 30 to the atmospheric base 26 after being filled. The molten portion of the material 1 can be solidified. For this reason, the conductive material 1 can be prevented from melting more than necessary.

Invention of Claim 11 uses the electrically-conductive material filling apparatus in any one of Claims 6-10, The electrically-conductive material filling which fills the electrically-conductive material 1 with respect to the through via 11 formed in the multilayer circuit board 10 is carried out. It relates to a method of using the device.

Specifically, the multilayer circuit board 10 having the through vias 11 formed thereon is held on the mounting surface 21a of the charging base 21 through the solvent adsorption sheet 21b, and is filled with the heating heater 22. The process of heating the multilayer circuit board 10 hold | maintained at the mounting surface 21a of the base 21, and the charging head 30 provided with the electrically-conductive material 1 as the charging head conveyance mechanism 40 are multilayer circuit boards. The process of melting the electrically-conductive material 1 which moved to the surface of (10) and contacted this multilayer circuit board 10 by the heated multilayer circuit board 10, and the filling head by the charging head conveyance mechanism 40 are carried out. By moving the 30 in the horizontal direction with respect to the surface of the multilayer circuit board 10, the conductive material 11 is filled in the through via 11 and the solvent contained in the conductive material 1 is filled with the solvent adsorption sheet 21b. The filling head 30 is filled with the filling head conveyance mechanism 40 after the step of adsorbing to the filling material and the filling of the conductive material 1 in the through via 11 are completed. ) Is moved to the standby position to solidify the conductive material 1 filled in the through via 11, and after the conductive material 1 is solidified, the solvent adsorption sheet 21b on the multilayer circuit board 10. By carrying out the process of peeling, the multilayer circuit board 10 in which the electrically-conductive material 1 was filled with respect to the through via 11 using the electrically-conductive material filling apparatus can be manufactured.

In this case, as described in Claim 12, the process of solidifying the electrically-conductive material 1 filled in the through via 11 is multilayered with the solvent adsorption sheet 21b in the mounting surface 21a of the filling base 21. It can be performed by dissipating the conductive material 1 filled in the through via 11 with the circuit board 10 arranged.

In this way, the electrically-conductive material 1 can be easily solidified after filling. For example, since the conductive material 1 can be solidified when the charging head 30 is made to stand by the atmospheric base 26 as described in claim 10, the charging base 21 is cooled or the multilayer circuit The conductive material 1 can be easily solidified even if the substrate 10 is not cooled elsewhere.

In addition, the code | symbol in the parentheses of said each means shows the correspondence with the specific means described in embodiment mentioned later.

1 is a partial cross-sectional side view of a conductive material filling apparatus 100 for a through via according to a first embodiment of the present invention.
FIG. 2 is a partial cross-sectional view of the arrow on the AA line in FIG. 1. FIG.
FIG. 3 is a cross-sectional view of the arrow portion on the line BB in FIG. 2. FIG.
4 is a schematic top view of the charging base 21 and the atmospheric base 26.
5 is a cross-sectional view taken along line CC of FIG. 4.
6 is a cross-sectional view taken along the line DD of FIG. 5.
7 is a schematic cross-sectional view showing the state of each paste filling head 30 and the like during charging standby and charging.
8 is a cross-sectional schematic diagram showing the state of the paste filling head 30 and the like when the excess conductive paste 1 is rubbed off by the squeegee 35a after completion of filling.
9 is a schematic cross-sectional view showing the manufacturing process of the multilayer circuit board 10 including the filling process of the conductive paste 1 in the through via 11.
FIG. 10 is a schematic cross-sectional view illustrating a manufacturing process of the multilayer circuit board 10 following FIG. 9.
Fig. 11 is a schematic diagram showing the state when the filling squeegee 31c or the squeegee 35a passes over the adsorption groove 21d.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing. In addition, in each following embodiment, the same code | symbol is attached | subjected to the mutually same or equivalent part in drawing.

(First embodiment)

1 is a partial cross-sectional side view of the conductive material filling apparatus 100 for through vias according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line A-A in FIG. 1. FIG. 3 is a cross-sectional view of the portion of the arrow taken along the line B-B in FIG. 2.

The electrically conductive material filling apparatus 100 shown in FIG. 1 is an apparatus which fills the through via 11 formed in the multilayer circuit board 10 corresponded to the workpiece | work as the electrically conductive paste 1 as a conductive material. The electrically conductive material filling apparatus 100 of this embodiment is comprised by the workpiece holding mechanism part 20, the paste filling head 30, the filling head conveyance mechanism 40, and the controller which is not shown in figure which controls these.

In the present embodiment, the conductive paste 1 is a stick paste having a stick shape (bar shape), and is embedded in the paste filling head 30. The electrically conductive paste 1 consists of a high melting point paste which becomes a solid state at room temperature and melts by heating, for example, 3-10 wt% of a paraffin having a melting point of 43 ° C. in a powder of silver or tin that has been conventionally used. (For example, 8 wt%), and kneaded to harden to form a stick. As described later, the conductive paste 1 is set in such a manner that it can be supplied to one surface side of the multilayer circuit board 10 in the paste filling head 30.

The multilayer circuit board 10 is formed by laminating | stacking the several resin film in which the wiring pattern was formed, and then heating and compressing. Through-layers 11 are formed in the multilayer circuit board 10 to electrically connect the wiring patterns of the respective layers. The conductive material filling apparatus 100 according to the present embodiment fills the conductive paste 1 into the through via 11. In the present embodiment, as the multilayer circuit board 10, for example, a plurality of acquisitions are possible in a target region of 50 µm in thickness and 450 mm 2, and through vias having an opening diameter of Φ 150 and a depth of 50 µm are formed in the target region. About 40,000 installed ones are in use.

The workpiece holding mechanism 20 is used to hold the multilayer circuit board 10 when the conductive paste 1 is filled into the through via 11. The work holding mechanism 20 includes a filling base 21, a work heating heater 22, a base plate 23, a base support 24, a work chuck vacuum pump 25, and an air base ( 26) and a cooling mechanism 27.

The charging base 21 has the mounting surface 21a in which the multilayer circuit board 10 was provided, and is hold | maintained by adsorb | sucking the multilayer circuit board 10 provided on the mounting surface 21a using the adsorption mechanism mentioned later. In this embodiment, the suction paper 21b which functions as a solvent adsorption sheet is arrange | positioned between the multilayer circuit board 10 on the mounting surface 21a of the filling base 21. As shown in FIG. The filling base 21 adsorbs the sorbent paper 21b and adsorbs it to the multilayer circuit board 10 through the gap in the sorbent paper 21b, thereby holding the multilayer circuit board 10 on the sorbent paper 21b. The blotter paper 21b should just be a material which can absorb the solvent used for the electrically conductive paste 1, and general quality paper etc. are used. In addition, although the blotter paper 21b constitutes a part of the filling base 21, since the solvent is absorbed in the blotter paper 21b according to the filling of the electrically conductive paste 1 in the through via 11, the degree of solvent absorption is limited. In exchange for new ones.

The adsorption mechanism of the filling base 21 is comprised as follows. 4 is a schematic top view of the filling base 21 and the atmosphere base 26, a cross-sectional view of the CC of FIG. 4 is shown in FIG. 5, and a cross-sectional view of the DD arrow of FIG. 5 is shown in FIG. Explain about.

As shown in FIG. 4, adsorption | suction grooves 21c and 21d are formed in the mounting surface 21a of the filling base 21, and adsorption is performed through these suction grooves 21c and 21d. The adsorption groove 21c is formed so as to surround the outer edge of the mounting surface 21a, and the adsorption paper 21b and the multilayer circuit board 10 can be adsorb | sucked at the outer edge part. The suction groove 21b is composed of an annular groove, and the groove width is, for example, 0.3 mm. These suction grooves 21c and 21d of suction holes are connected to the inner communication space 21e of the filling base 21 as shown in FIG. The suction groove 21d is configured by fitting a cylindrical member 21f whose radius is smaller by the groove width than the circular hole in the plurality of circular holes formed in the mounting surface 21a. In addition, as shown to FIG. 5 and FIG. 6, the support rod 21g is fastened through the screw 21h to the surface corresponded to the back surface of the mounting surface 21a among the communication spaces 21e, and to this support rod 21g. Each cylindrical member 21f is fixed via a vis 21i. And since the communication space 21e is connected to the work chuck vacuum pump 25, suction from the suction grooves 21c and 21d is made through the communication space 21e. By this structure, the adsorption mechanism of the filling base 21 is comprised.

The workpiece heating heater 22 is driven based on energization from a power supply source (not shown), and is provided on the mounting surface 21a of the charging base 21 via the suction paper 21b. Is heated to melt the conductive paste 1 in contact with the multilayer circuit board 10 during charging in the through via 11. Then, the conductive paste 1 melted by the work heating heater 22 is filled into the through via 11. In the present embodiment, the work heating heater 22 can heat the lower surface of the charging base 21 extensively so that the portion of the mounting surface 21a that faces the portion where the multilayer circuit board 10 is disposed can be heated. It is made to be able to do it.

The base plate 23 keeps the filling base 21 or the standby base 26 in a horizontal state, or moves along the mounting surface 21a of the filling base 21, as will be described later with the paste filling head 30. It is a support to make it possible. The base strut 24 supports the filling base 21 and the atmospheric base 26 on the base plate 23. By this base support 24, the filling base 21 and the atmospheric base 26 are fixed to the base plate 23 while making the upper surface match.

As described above, the work chuck vacuum pump 25 is connected to an adsorption mechanism provided in the filling base 21 and is vacuum sucked to thereby suck the suction paper 21b and the multilayer circuit board 10 through the suction grooves 21c and 21d. ) Is adsorbed.

The atmospheric base 26 is for holding the paste filling head 30 in the through via 11 of the multilayer circuit board 10 when the conductive paste 1 is charged before or after charging. The cooling mechanism 27 is provided inside the atmospheric base 26, and cools the atmospheric base 26. The cooling mechanism 27 becomes, for example, a structure in which cooling water can circulate. Since the air base 26 is cooled by this cooling mechanism 27, when the paste filling head 30 is made to stand on the air base 26 at the time of air | atmosphere, the electrically conductive paste 1 will be prevented by the air base 26. The cooled, molten portion can be solidified again. By such a structure, the workpiece | work holding mechanism part 20 is comprised.

The paste filling head 30 fills the holding paste of the conductive paste 1 and the conductive paste 1 in the through vias 11 of the multilayer circuit board 10. The paste filling head 30 has a structure having a filling squeegee holder 31, a case 32, a case plate 33, a squeegee holder drive mechanism 34, and a squeegee mechanism 35.

As shown in FIG. 3, the filling squeegee holder 31 has a long cylindrical shape and functions as a case for holding the conductive paste 1 in a stick shape therein, and the through paste 1 is formed through the conductive paste 1. 11) Functions as a squeegee when charging in. As shown in FIG.1 and FIG.2, the pusher 31a is provided in the filling squeegee holder 31, and the mounting surface 21a of the filling base 21 is made to push the electrically conductive paste 1 with the pusher 31a. It can be configured to move in the vertical direction. Specifically, the air supply chamber 31b is formed above the pusher 31a in the filling squeegee holder 31. The supply and extraction of air in the air supply chamber 31b can be performed by an air pump or the like not shown, and the pusher 31a is pushed toward the multilayer circuit board 10, or the pusher 31a is reversed. It is made to move in the direction away from the multilayer circuit board 10. Moreover, the filling squeegee 31c is comprised by the front-end | tip part of the filling base 21 side among the filling squeegee holder 31. As shown in FIG. Since the filling squeegee 31c is in contact with the surface of the multilayer circuit board 10 during charging, the conductive paste 1 is printed and the excess is rubbed off.

The case 32 accommodates the filling squeegee holder 31 and constitutes a space R in which the filling squeegee holder 31 can move. An O-ring 32a is provided at the front end of the casing 32 on the multilayer circuit board 10 side, and the space R in the casing 32 is a sealed space. The case plate 33 is connected to the tip of the case 32 on the opposite side to the multilayer circuit board 10. The O-ring 32b is also provided in the front end surface of the case plate 33 side in the case 32, and the sealed state of the space in the case 32 is maintained.

The squeegee holder drive mechanism 34 is disposed on the case plate 33 and includes a swing motor 34a, a rotation guide 34b, and the like. The swinging motor 34a is driven based on power supply from a power source (not shown), and is held by the motor plate 34d fixed to the case plate 33 via the support 34c. The rotational shaft of the oscillation motor 34a is connected to a sway core core 34e via a joint (not shown), and the eccentric portion of the tip of the sway core shaft 34e is filled with a squeegee holder. (31) Rotation is fitted freely on one end side (left side of the page in Fig. 2) of the upper end face. The rotation guide 34b is held by the motor plate 34g fixed through the support 34f. An eccentric shaft 34h freely rotates is attached to the rotation guide 34b, and an eccentric portion of the tip of the eccentric shaft 34h is freely rotated on the other end side (right side of the paper in Fig. 2) of the upper surface of the filling squeegee holder 31. Is fitted. The rotation guide 34b is driven by the rotation of the swinging motor 34a.

Specifically, the swing timing pulley 34i is provided on the swing motor 34a side from the eccentric portion among the eccentric swing core shafts 34e, and the rotation guide 34b side of the eccentric shaft 34h from the eccentric portion. The timing pulley 34j is provided, and these are connected via the timing belt 34k. For this reason, when the swinging motor 34a is rotated and the unsteady swinging core shaft 34e is rotated, the eccentric shaft 34h is made through the swinging timing pulley 34i, the timing belt 34k, and the timing pulley 34j accordingly. Will also be rotated. Thereby, the eccentric oscillation core shaft 34e and the eccentric shaft 34h are rotated in conjunction with each other, and the filling squeegee holder 31 fixed to these eccentric portions is eccentrically rotated in the space R of the case 32, that is, It is rocked up, down, left and right in FIG.

The squeegee mechanism 35 is provided outside the filling squeegee holder 31, and is provided with the squeegee 35a, the squeegee holder 35b, and the squeegee lifting cylinder 35c. The squeegee mechanism 35 holds the squeegee 35a formed of a member separate from the filling squeegee 31c by the squeegee holder 35b, and the squeegee holder 35b with the squeegee lifting cylinder 35c. To lift 35a). This squeegee mechanism 35 makes it possible to remove the excess conductive paste 1 from the multilayer rotating substrate 10 after filling the conductive paste 1 with the through via 11. By this structure, the paste filling head 30 is comprised.

The filling head conveyance mechanism 40 supports the paste filling head 30 from both sides, moves the paste filling head 30 in the vertical direction, or moves the paste filling head 30 to the filling base 21 and the standby base. It moves to the arrangement direction of 26, ie, it moves to the left-right vertical direction of FIG. The filling head feed mechanism 40 includes a slide guide 41, a slide block 42, a feed screw 43, a feed motor 44, a guide shaft 45, an end plate 46, and a lift cylinder 47. In the configuration having the elevating block 48 and the elevating plate 49, each portion is provided in pairs on both sides of the paste filling head 30.

The slide guides 41 are respectively disposed on both sides with the filling base 21 interposed therebetween, and extend along the arrangement direction of the filling base 21 and the atmospheric base 26 on the upper surface of the base plate 23. The slide block 42 is engaged with the slide portion of the slide guide 41 and is movable along the longitudinal direction of the slide guide 41. The slide block 42 is provided with a screw nut 42a that engages with the feed screw 43.

The feed screw 43 and the feed motor 44 are held by the base plate 23 via the guide 43a and the motor plate 44a, respectively. The feed screw 43 is rotatably held relative to the guide 43a and is fixed to the feed motor 44 via a joint (not shown). And when the feed motor 44 is driven based on the electric power supply from the power supply which is not shown in figure, the feed screw 43 can be rotated. For example, the feed motor 44 is rotated forward and backward by changing the direction of the supplied electric current, and the feed screw 43 is also rotated forward and backward. Thereby, the slide block 42 provided with the screw nut 42a couple | bonded with the feed screw 43 can be moved in the both directions of the longitudinal direction of the feed screw 43. As shown in FIG.

The lower end of the guide shaft 45 is fixed to the slide block 42, and the upper end of the guide shaft 45 is fixed to the end plate 46, and serves as a guide when the lifting block 48 moves. . The lifting cylinder 47 is also fixed to the slide block 42. The lifting block 48 is fixed to the shaft end of the lifting cylinder 47, and the lifting block 48 is moved in the vertical direction by the operation of the lifting cylinder 47. In addition, the elevating plate 49 is fixed to the upper end of the elevating block 48, and the case plate 33 is fixed to the elevating plate 49, whereby the paste filling head 30 is filled with the filling head transfer mechanism 40. Is fixed to.

With such a configuration, when the slide block 42 is moved in the longitudinal direction of the feed screw 43 by the drive of the feed motor 44, the paste filling head 30 also moves in the same direction, thereby raising and lowering the cylinder. When the lifting block 48 is moved in the vertical direction by the operation of 47, the paste filling head 30 is also moved in the same direction. By this structure, the filling head conveyance mechanism 40 is comprised.

As mentioned above, the electrically-conductive material filling apparatus 100 which concerns on this embodiment is comprised. Next, the manufacturing method of the multilayer circuit board 10 which filled the conductive paste 1 in the through via 11 using this electrically conductive material filling apparatus 100 is demonstrated. That is, the usage method of this electrically conductive material filling apparatus 100 is demonstrated. 7 is a schematic cross-sectional view showing the state of each paste filling head 30 and the like during charging standby and charging. 8 is a sectional schematic diagram which shows the state of the paste filling head 30 etc. when the excess conductive paste 1 is rubbed off by the squeegee 35a after completion of filling. 9 and 10 are schematic cross-sectional views showing the manufacturing process of the multilayer circuit board 10 including the filling process of the conductive paste 1 in the through via 11. Hereinafter, with reference to these drawings, the manufacturing method of the multilayer circuit board 10 which filled the via via 11 with the electrically conductive paste 1 is demonstrated, and the usage method of the electrically-conductive material filling apparatus 100 is demonstrated. .

First, as a preliminary preparation, the multilayer circuit board 10 is manufactured by the conventional manufacturing method (refer FIG. 9 (a)), and the through via 11 is formed in the multilayer circuit board 10 by a laser processing machine or the like. (See FIG. 9 (b)). In addition, a conductive paste 1 having a stick shape is set in the filling squeegee holder 31 in the paste filling head 30. Subsequently, the workpiece to be filled with the conductive paste 1, that is, the multilayer circuit board 10 having the through vias 11 formed thereon is formed on the mounting surface 21a of the charging base 21 via the suction paper 21b. Install. And [1] planar maintenance and heating of the multilayer circuit board 10, [2] movement to the filling start position of the paste filling head 30, [3] of the conductive paste 1 in the paste filling head 30, and Pressurization and printing start, [4] moving the paste filling head 30 to the end of filling, [5] pressing and stopping printing of the conductive paste 1 in the paste filling head 30, [6] paste filling head ( 30 are moved to the air base 26, cooling of the conductive paste 1, and [7] seven steps of removing the multilayer circuit board 10 in sequence.

Specifically, in the process of [1], electric power is supplied to the workpiece heating heater 22 to thereby be heated to the vicinity of the melting point of the conductive paste 1 in the shape of a stick. For example, in the case where the electrically conductive paste 1 has a melting point of 43 ° C. paraffin solidified with silver or tin powder, the work heating heater is maintained such that the surface of the multilayer circuit board 10 is maintained at about 43 ° C. ± 3 ° C. It is heated by 22). At the same time, vacuum suction by the work chuck vacuum pump 25 is performed, and suction from the suction grooves 21c and 21d is performed through the communication space 21e. As a result, the blotter paper 21b and the multilayer circuit board 10 are adsorbed. By these, the plane maintenance and heating of the multilayer circuit board 10 are performed.

Next, in the process of [2], the elevating block 48 is moved upward by the operation of the elevating cylinder 47 to move the paste filling head 30 upward. Subsequently, the feed screw 43 is rotated by driving the feed motor 44, and the slide block 42 is moved to the right side of the paper in FIG. 1 along the longitudinal direction of the feed screw 43 to move the paste filling head 30. It moves to the right side of the paper of FIG. 1 from a charge standby position. And when the paste filling head 30 reaches the edge part of the left side of the paper surface of FIG. 1 in the multilayer circuit board 10, the lifting block 48 is moved downward by the operation of the lifting cylinder 47. The paste filling head 30 is processed to the multilayer circuit board 10 side. In this way, the movement of the paste filling head 30 to the filling start position is performed.

In the subsequent process of [3], the electrically conductive paste 1 is pressed toward the multilayer circuit board 10 by supplying air into the air supply chamber 31b by an air pump or the like (not shown) and pressing the pusher 31a. Further, the swinging motor 34a is driven to drive the unevenly swinging core shaft 34e, and the eccentric shaft 34h is rotated through the swinging timing pulley 34i, the timing belt 34k, and the timing pulley 34j. . Then, the eccentric oscillation core shaft 34e and the eccentric shaft 34h rotate in conjunction with each other, and the filling squeegee holder 31 fixed to these eccentric portions swings in the space R of the case 32. As a result, the conductive paste 1 set in the paste filling head 30 is melted by the heated multilayer circuit board 10, and the conductive paste 1 melted by the shaking of the filling squeegee holder 31 passes through the vias. The oscillating stirring operation printed in (11) is performed. In this way, pressurization and printing of the electrically conductive paste 1 in the paste filling head 30 are started (refer FIG. 9 (c)).

In addition, in the process of [4], the paste filling head 30 is moved to the charge end position while continuing to pressurize and print the electrically conductive paste 1. That is, the feed screw 43 is rotated by driving the feed motor 44, and the paste filling head 30 is moved to the right side of the page of FIG. 1 to reach the right end portion of the multilayer circuit board 10. FIG. The filling speed at this time is set to 20 mm / sec, and the boundary speed after filling (the speed of sliding the filling squeegee 31c away from the through via 11 and distanced) is finished at a high speed of 60 mm / sec. In the through via 11, the concave surface of the conductive paste 1 is set to 5 μm or less. As a result, as shown in FIG. 7B, the conductive paste 1 in all the through vias 11 existing in the path is filled. At this time, of the conductive paste 1 filled in the through via 11, a surplus solvent (for example, paraffin) is soaked into the sorbent paper 21b, and metal powder such as silver or tin in the conductive paste 1 is absorbed. It can be left in the through via 11. For this reason, regardless of the composition ratio of the electrically conductive paste 1, ie, the ratio of metal powder, such as silver and tin, and a solvent, the metal powder in the through via 11 can be concentrated and remain in the required quantity.

In the process of [5], the air supply is stopped in the air supply chamber 31b by an air pump or the like not shown, and the pressurization of the pusher 31a is stopped so that the conductive paste 1 End pressurization. In addition, the driving of the swinging motor 34a is also stopped, so that the eccentric rotation of the filling squeegee holder 31 is also stopped, and the conductive paste 1 is also finished in the through via 11. In this way, pressurization and printing of the electrically conductive paste 1 in the paste filling head 30 are stopped.

Subsequently, in the step [6], the paste filling head 30 is moved upward by moving the lifting block 48 upward by the operation of the lifting cylinder 47. Subsequently, the feed motor 44 is reversely rotated with the process of [3] to reversely rotate the feed screw 43, and the slide block 42 is moved along the longitudinal direction of the feed screw 43 to make the paste filling head ( 30) is moved from the charging standby position to the left side of the page of FIG. At the same time, the elevating cylinder 35c is driven to lower the squeegee holder 35b and the squeegee 35a, and the tip of the squeegee 35a contacts the surface of the multilayer circuit board 10 to move to the left side of the paper. The speed is, for example, 60 mm / sec. In this case, when the paste filling head 30 is moved to the left side of the page, the excess conductive paste 1 can be rubbed off by the squeegee 35a. Then, when the paste filling head 30 reaches the end of the left side of the page of FIG. 1 of the multilayer circuit board 10, the lifting cylinder 35c is driven to raise the squeegee holder 35b and the squeegee 35a. Thereafter, the paste filling head 30 is moved to the left side of the page of FIG. 1 as it is, and then the elevating block 48 is lowered by the operation of the elevating cylinder 47, and as shown in FIG. The charging head 30 is mounted on the atmospheric base 26. Thereby, the electrically conductive paste 1 is cooled by the atmospheric base 26 cooled by the cooling mechanism 27. In this way, the paste filling head 30 is moved to the atmospheric base 26 and the conductive paste 1 is cooled (see FIG. 9 (d)).

Finally, in the process of [7], vacuum suction by the work chuck vacuum pump 25 is stopped, and the conductive paste 1 filled in the through via 11 is solidified by cooling the multilayer circuit board 10. . At this time, since the sorbent paper 21b having low thermal conductivity is disposed between the charging base 21 and the multilayer circuit board 10, the multilayer circuit board 10 is not pressed to the charging base 21 side by atmospheric pressure. If not, the conductive paste 1 in the through via 11 is solidified by heat dissipation even without actively cooling the multilayer circuit board 10. If the conductive paste 1 is solidified in this manner, the conductive paste 1 can be solidified when the paste filling head 30 is held in the air base 26, and the filling base 21 is cooled. The conductive paste 1 can be easily solidified even if the multilayer circuit board 10 is not cooled elsewhere.

Then, when the conductive paste 1 is solidified, the multilayer circuit board 10 is peeled off from the sorbent paper 21b (see Fig. 9E). At this time, since the conductive paste 1 has already solidified, as in the case of using the electrically conductive paste with a viscous fluid composed of a metal powder of silver or tin and a high viscosity solvent such as terpineol as in the prior art, the sorbent paper 21b is used. The conductive paste 1 does not adhere to the through via 11.

Subsequently, the multilayer circuit board 10 is completed by performing each process shown in FIG. 10 with respect to the multilayer circuit board 10 peeled from the blotter paper 21b. Specifically, copper foils 12a and 12b corresponding to the metal layer for wiring pattern formation are attached to both surfaces of the front and back surfaces of the multilayer circuit board 10 having the conductive paste 1 embedded in the through vias 11. (See FIG. 10 (a)). Subsequently, etching masks 13a and 13b made of photoresist are formed on the surfaces of the copper foils 12a and 12b (see FIG. 10 (b)). For example, after forming a photoresist on the surface side copper foil 12a of the multilayer circuit board 10, it exposes and forms the etching mask 13a of a predetermined | prescribed pattern, and then the back side of the multilayer circuit board 10 A photoresist is formed on the copper foil 12b, and then exposed to form an etching mask 13b of a predetermined pattern. At this time, since the desired positions of the wiring patterns on the front and back surfaces are electrically connected through the conductive paste 1, the etching masks 13a and 13b become the same pattern as covering the positions corresponding to the through vias 11. . Then, etching is performed using the etching masks 13a and 13b, and the copper foils 12a and 12b are patterned to form a wiring pattern (see Fig. 10 (c)). At this time, since the front and back surfaces can be etched at once, the etching process can be simplified and the manufacturing process can be reduced as compared with the case of etching on the front and back surfaces, respectively. Thereafter, the etching masks 13a and 13b are removed. In this way, the multilayered circuit board 10 in which the through via 11 is embedded with the conductive paste 1 can be manufactured.

As described above, according to the conductive material filling apparatus 100 of the present embodiment, the following effects can be obtained.

(a) First, the multilayer circuit board 10 is provided on the mounting surface 21a of the charging base 21 via the sorbent paper 21b, and the conductive paste 1 can be charged to the through via 11. To be able. For this reason, the solvent of the electrically conductive paste 1 is adsorb | sucked in the blotting paper 21b, and the metal in the through via 11 is irrespective of the composition ratio of the electrically conductive paste 1, the ratio of metal powder, such as silver and tin, and a solvent. The powder may be concentrated to leave the required amount. Thereby, the ratio of the metal powder to the ratio of the solvent can be reduced, and the metal material contained in the invalid paste can be reduced.

In addition, since the conductive paste 1 is made of a material which solidifies at room temperature, the conductive paste 1 is filled in the through via 11 and then the multilayer circuit board 10 is cooled to solidify the conductive paste 1. can do. Therefore, after the conductive paste 1 is solidified, the multilayer circuit board 10 can be peeled off from the sorbent paper 21b to prevent the conductive paste from falling out from the through via 11.

Therefore, according to the electrically-conductive material filling apparatus 100 of this embodiment, the electrically conductive paste 1 filled with respect to the light-through via 11 formed in the multilayer circuit board 10 can be prevented from falling out, and it is in the ineffective paste. The metal material contained can be reduced.

(b) In the electrically conductive material filling apparatus 100 of this embodiment, in the mounting surface 21a of the charging base 21, the area | region where the through-via 11 of the multilayer circuit board 10 forms is arrange | positioned. The formed suction groove 21d is not a linear groove but an annular groove. For this reason, when the filling squeegee 31c or the squeegee 35a passes over the suction groove 21d, the portion where the filling squeegee 31c or the squeegee 35a and the respective suction grooves overlap can be reduced. This will be described with reference to FIG. 11.

11 is a schematic diagram showing this state. As shown in this figure, the filling squeegee 31c and the squeegee 35a basically form a straight line shape with the modification direction in the longitudinal direction with respect to the moving direction of the paste filling head 30. For this reason, when the filling squeegee 31c or the squeegee 35a passes over the adsorption groove 21d, the filling squeegee 31c or the squeegee 35a does not overlap with each suction groove 21d in a straight line shape. Even if it is many, we can let you overlap only two places.

When the filling squeegee 31c or the squeegee 35a overlaps the suction groove 21d in a straight line, the filling squeegee 31c or the squeegee 35a is pushed into the suction groove 21d, and the through via 11 There is a possibility that the filled conductive paste 1 is pushed into the suction groove 21d. However, as in this embodiment, the adsorption groove 21d can be an annular groove, so that such a problem can be prevented from occurring.

(c) In the conductive material filling apparatus 100 of the present embodiment, when the through via 11 is filled with the conductive paste 1, the paste filling head 30 can be waited on the atmospheric base 26. Doing. And since the atmospheric base 26 is equipped with the cooling mechanism 27 which can cool at the temperature which can solidify the electrically conductive paste 1, the paste filling head 30 after filling is made into the atmospheric base 26. By making it move, the molten part of the electrically conductive paste 1 in the filling squeegee holder 31 can be solidified. For this reason, the conductive paste 1 can be prevented from melting more than necessary.

(d) In the electrically conductive material filling apparatus 100 of this embodiment, the stick-shaped electrically conductive paste 1 which solidifies at normal temperature is used. For this reason, it becomes possible to produce continuously by making the capacity | capacitance of the electrically conductive paste 1 into a stick shape to the stick volume according to the production volume equivalent to the conventional charger. Therefore, problems such as the loss of productivity due to the maintenance of the conductive paste, which is a problem in the conventional squeegee printing, the reduction of productivity due to the work such as the renewal cleaning, and the disposal of the paste with the crushed composition can be solved.

Moreover, what is necessary is just to be able to provide the electrically conductive paste 1 which solidifies also the filling squeegee holder 31 using the stick shape electrically conductive paste 1. For this reason, the filling squeegee holder 31 and the paste filling head 30 provided therewith do not need to be provided in the filling squeegee holder 31 with a space necessary for stirring and defoaming required in the past paste filling. Can be miniaturized. In addition, since the stick-shaped conductive paste 1 held by the filling squeegee holder 31 is solid, there is little contact with the atmosphere, and the paste composition can be stabilized in the long term. Also in the filling quality, since the conductive paste 1 used for filling has a contact portion only in the multilayer circuit board 10, the filling of the through via 11 is performed, and then the conductive paste 1 or the filling squeegee ( By cleaning the contact portions with the multilayer circuit board 10 in 31c), it is possible to prevent a defect due to secondary contamination or the like caused by foreign matter adhesion to these portions.

Further, by miniaturization of the solid conductive paste 1 and the paste filling head 30, the paste filling head 30 can be moved to any position on the multilayer circuit board 10 serving as the workpiece, and any position. The conductive paste 1 can be filled in.

That is, in the conventional paste filling head, since it is a liquid paste, a surface serving as a bottom plate of the paste filling head is required even when the paste filling head is moved from the air base to the work surface, and it is shifted so as to slide by connecting the work surface from the air base to the work surface. There was a need. In contrast, in the paste filling head 30 as in the present embodiment, the solid conductive paste 1 can be held in the filling squeegee holder 31, and thus, the paste filling head 30 is moved to any position of the multilayer circuit board 10 serving as the work. Thereafter, the through via 11 may be filled.

Similarly, the paste filling head 30 can be lifted back to the atmospheric base 26 at any position of the multilayer circuit board 10.

By realizing such an operation, it becomes possible to partially charge the partially pasted portion of the electrically conductive paste 1 which has been difficult in the past to the multilayer circuit board 10 or to place a different kind of paste for each place.

(Other Embodiments)

In the said embodiment, although the paraffin which is the low melting point solvent which does not need high temperature heating was used as the solvent of the electrically conductive paste 1 in both work safety and an installation environment, other solvent may be sufficient. That is, a high melting point paste which solidifies at room temperature and melts by heating may be used, and other paraffinic hydrocarbons (eico acid), terebin oil (e.g., α-terpineol), fatty acids (e.g., For example, the metal powder is kneaded against capric acid, undecyl acid, lauric acid, tridecyl acid, myristic acid, pentadecyl acid, partic acid, heptadecyl acid, stearic acid, nonadecanoic acid, arachnic acid), and the like. What was put can be used as the electrically conductive paste 1. All of these solvents are materials which melt by simple heating and at a temperature lower than the sintering temperature of the metal powder. Specifically, melting | fusing point of all these solvents is 100 degrees C or less (for example, eicos acid has melting | fusing point 37 degreeC).

The material of the metal powder contained in the conductive paste 1 is not limited to silver and tin, but other metal materials may be used. The powder may be any of spherical or fibrous fillers. In addition, although the electrically conductive paste 1 was made into stick shape, even if it is a powder or stick shape high melting point paste, it is not cared about. Similarly, other materials and the like exemplified in the above embodiments can be appropriately changed. For example, although copper foil 12a, 12b was used as a metal layer for wiring pattern formation, it may be another metal layer.

In addition, in the said embodiment, only the reciprocating movement of the paste filling head 30 to the paper left-right direction in FIG. 1 once fills the through via 11 of the electrically conductive paste 1, and the excess electrical conduction by the squeegee 35a is carried out. The paste 1 was rubbed off. However, this is also a simple example. The electrically conductive paste 1 is filled in the through vias 11 during the reciprocation of the paste filling head 30 in the left and right directions in Fig. 1, and then the squeegee 35a is then filled. The excess conductive paste 1 may be removed by this.

In the above embodiment, the case where the suction groove 21d is an annular groove has been described as a circular annular groove, but may be an elliptical shape or the like.

In the above embodiment, after the conductive paste 1 has been charged to the through via 11, the multilayer circuit board 10 is cooled on the charging base 21. The board | substrate 10 may be taken out from the charging base 21, and the multilayer circuit board 10 may be cooled in room temperature or a cooling chamber. It is also conceivable to stop the power supply to the work heating heater 22 when cooling the multilayer circuit board 10, but if the multilayer circuit board 10 is taken out from the suction base 21b-th filling base 21, the multilayer The circuit board 10 does not have to be completely solidified. This eliminates the need to stop supplying power to the workpiece heating heater 22 when cooling the multilayer circuit board 10.

100: charging device 1: conductive paste (conductive material)
10: Multilayer Circuit Board 11: Through Vias
20: Work holding mechanism 21: Filling base
21a: mounting surface 21b: sorbent paper (solvent adsorption sheet)
21d: adsorption groove 22: work heating heater (heating heater)
30: Paste Filling Head (Filling Head)
31: filling squeegee holder 31a: pusher
31c: filling squeegee 40: filling head feed mechanism part

Claims (12)

A multilayer circuit board 10 having through vias 11, which are formed by polymerizing a resin film having a plurality of wiring patterns formed thereon and penetrating through the plurality of resin films, is prepared. An installation step of installing (10) on the solvent adsorption sheet 21b,
A heating step of heating the multilayer circuit board 10 disposed on the solvent adsorption sheet 21b;
A melting step of melting the metal powder and the solvent by preparing a conductive material 1 which solidifies at room temperature and melts by heating, and bringing the conductive material 1 into contact with the heated multilayer circuit board 10;
A filling step of adsorbing the solvent contained in the conductive material 1 to the solvent adsorption sheet 21b while filling the molten conductive material 1 into the through via 11;
A solidification process of solidifying the conductive material 1 filled in the through via 11 after the filling of the through via 11 with the conductive material 1 is completed;
After the conductive material 1 is solidified, the multilayer circuit board 10 includes a peeling step of peeling the solvent adsorption sheet 21b. Manufacturing method. The method according to claim 1,
Forming metal layers 12a and 12b for wiring pattern formation on both surfaces of the front and back surfaces of the multilayer circuit board 10 peeled off the solvent adsorption sheet 21b;
A mask forming step of forming etching masks 13a and 13b having patterns covering the conductive material 1 disposed in the through vias 11 on the surfaces of the metal layers 12a and 12b;
Etching using the etching masks 13a and 13b formed in the mask forming step and simultaneously etching the metal layers 12a and 12b on both surfaces of the front and back surfaces of the multilayer circuit board 10 to form a wiring pattern. Fair,
And removing said etching mask (13a, 13b) after forming said wiring pattern. The manufacturing method of a multilayer circuit board filled with a conductive material in said through via. The method according to claim 1 or 2,
In the installation step, the multilayer circuit board 10 is provided on the mounting surface 21a of the filling base 21 having the mounting surface 21a via the solvent adsorption sheet 21b,
In the heating step, the multilayer circuit board 10 is heated by heating the filling base 21,
In the melting step, the conductive material 1 is melted by the multilayer circuit board 10 heated by the heating of the filling base 21,
In the filling step, the conductive material 1 is formed in the through via 11 in a state where the multilayer circuit board 10 and the solvent adsorption sheet 21b are mounted on the mounting surface 21a of the charging base 21. ) Is a method for producing a multilayer circuit board filled with a conductive material in the through via. The method according to claim 3,
In the solidification step, the multilayer circuit board 10 is disposed on the mounting surface 21a of the filling base 21 together with the solvent adsorption sheet 21b, and the filler is filled in the through via 11. A method for producing a multilayer circuit board in which a through material is filled with a through via, which is performed by heat radiation of the conductive material (1). The method according to claim 3 or 4,
In the installation step, the solvent adsorption sheet 21b and the multilayer circuit board 10 mounted on the mounting surface 21a are adsorbed from the mounting surface 21a to thereby provide the solvent adsorption sheet 21b and the multilayer circuit. A method of manufacturing a multilayer circuit board in which a conductive material is filled in through vias, wherein the substrate (10) is held as the filling base (21). In the electrically conductive material filling apparatus which fills in the through via 11 which is the via hole formed through the multilayer circuit board 10, and the electrically-conductive material 1 which melts at the temperature higher than room temperature containing a metal powder and a solvent,
A charging base 21 having a mounting surface 21a provided with the multilayer circuit board 10 and holding the multilayer circuit board 10 on the mounting surface 21a, and held by the charging base 21. A heating heater 22 for heating the conductive material 1 filled in the through via 11 by heating the multilayer circuit board 10, the mounting surface 21a of the filling base 21, and the multilayer. A work holding mechanism part 20 disposed between the circuit boards 10 and having a solvent adsorption sheet 21b for adsorbing a solvent contained in the conductive material 1 filled in the through via 11;
A charging head 30 for supplying the conductive material 1 to the surface of the multilayer circuit board 10 held in the charging base 21 and filling the through via 11 with the conductive material 1. Wow,
And a charging head transfer mechanism (40) for moving the charging head (30) in the horizontal direction and the vertical direction with respect to the surface of the multilayer circuit board (10). The method of claim 6,
The charging head 30,
A cross section of a filling squeegee 31c which contacts the surface of the multilayer circuit board 10 and prints the conductive material 1 supplied to the surface of the multilayer circuit board 10 on the through via 11 is formed. ) And at the same time, the conductive material 1 which is capable of oscillating in the horizontal direction with respect to the surface of the multilayer circuit board 10 and becomes solid is held. And a filling squeegee holder (31) having a pusher (31a) moving in a direction perpendicular to the surface of (10). The method of claim 6,
The said charge base 21 is equipped with the adsorption mechanism 21c-21f which adsorb | sucks the said solvent adsorption sheet 21b mounted on the said mounting surface 21a, and the said multilayer circuit board 10, It is characterized by the above-mentioned. Material filling device. The method according to claim 8,
The adsorption mechanism has adsorption grooves 21c and 21d formed in the mounting surface 21a, and sucks the solvent adsorption sheet 21b and the multilayer circuit board 10 through the adsorption grooves 21c and 21d. ,
At least a portion (21d) of the suction groove (21c, 21d) is composed of an annular groove, characterized in that the conductive material filling apparatus. The method according to any one of claims 6 to 9,
And an atmospheric base (26) arranged to align the upper surface with the filling base (21) and cooling the conductive material (1) disposed in the filling head (30). Use of the electrically-conductive material filling apparatus which fills the said electrically-conductive material 1 with respect to the said through via 11 formed in the said multilayer circuit board 10 using the electrically-conductive material filling apparatus in any one of Claims 6-10. In the method,
Holding the multilayer circuit board 10 having the through vias 11 formed thereon on the mounting surface 21a of the charging base 21 through the solvent adsorption sheet 21b;
Heating the multilayer circuit board 10 held on the mounting surface 21a of the charging base 21 by the heating heater 22;
The charging head transfer mechanism 40 moves the charging head 30 provided with the conductive material 1 to the surface of the multilayer circuit board 10 so as to be moved by the heated multilayer circuit board 10. Melting the conductive material 1 in contact with the multilayer circuit board 10, and
By filling the through via 11 with the conductive material 1 by moving the filling head 30 in the horizontal direction with respect to the surface of the multilayer circuit board 10 with the filling head conveying mechanism 40, Adsorbing the solvent contained in the conductive material (1) to the solvent adsorption sheet (21b);
After the filling of the conductive material 1 to the through via 11 is completed, the filling head 30 is moved to the standby position by the filling head transfer mechanism 40 to be filled in the through via 11. Solidifying the conductive material 1 thus prepared,
And the step of peeling the multilayer circuit board (10) from the solvent adsorption sheet (21b) after the conductive material (1) is solidified. The method of claim 11,
The step of solidifying the conductive material 1 filled in the through via 11 includes the multilayer circuit board 10 together with the solvent adsorption sheet 21b on the mounting surface 21a of the filling base 21. And heat dissipating the conductive material (1) filled in the through vias (11) in a state of arranging).

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