KR20110069225A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
KR20110069225A
KR20110069225A KR1020090125861A KR20090125861A KR20110069225A KR 20110069225 A KR20110069225 A KR 20110069225A KR 1020090125861 A KR1020090125861 A KR 1020090125861A KR 20090125861 A KR20090125861 A KR 20090125861A KR 20110069225 A KR20110069225 A KR 20110069225A
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KR
South Korea
Prior art keywords
led
body frame
led lamp
heat
voltage output
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KR1020090125861A
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Korean (ko)
Inventor
최유진
김병호
장혁
이성봉
공유찬
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티티엠주식회사
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Priority to KR1020090125861A priority Critical patent/KR20110069225A/en
Publication of KR20110069225A publication Critical patent/KR20110069225A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

PURPOSE: An LED lamp is provided to form a wick on the inner wall of a body frame, thereby quickly emitting heat generated in an LED element by quick feedback of operating fluid. CONSTITUTION: A voltage output unit(300) supplies power. The voltage output unit is made of a transformer and an inductor used in an LED lamp. A plurality of LED elements(220) is formed on a metal circuit board(210) of an LED body unit(200). A diffusion cap is formed on the front of the LED body unit. A heat emitting unit(100) includes a plurality of heat emitting fins which is formed on the outer circumference of a body frame(120).

Description

엘이디 램프{LED LAMP}LED lamp {LED LAMP}

본 발명은 엘이디 램프에 관한 것으로, 더욱 상세하게는 다수의 엘이디소자를 이용하여 램프를 형성할 때 각 엘이디소자에서 발생하는 열을 빠르고 쉽게 배출할 수 있도록 하여 엘이디소자의 효율을 극대화하고 빛의 세기를 강하게 할 수 있도록 한 엘이디 램프에 관한 것이다.The present invention relates to an LED lamp, and more particularly, to form a lamp using a plurality of LED elements to quickly and easily exhaust the heat generated from each LED element to maximize the efficiency of the LED element and the intensity of light It is about an LED lamp that can make it stronger.

엘이디소자(LED, Light Emitting Diod; 발광다이오드)는 반도체에 전압을 가할 때 발생하는 발광현상을 이용한 광원으로 지난 수년간 기술발전이 이루어져 조명용으로 사용할 수 있을 정도로 밝기가 개선되었다.LED (Light Emitting Diod) is a light source that uses the light emitting phenomenon generated when voltage is applied to the semiconductor, and the brightness has been improved enough to be used for lighting due to the development of technology over the years.

최근에는 엘이디소자를 사용하여 백열등이나 형광등을 대체할 수 있는 광원으로 사용하기 위해서 엘이디램프가 개발되고 있다. Recently, LED lamps have been developed to use LED devices as light sources that can replace incandescent and fluorescent lamps.

상기 종래의 엘이디램프는 다수개의 엘이디소자가 기판에 부착되고, 상기 기판에 전원을 공급하는 전압출력부가 형성되며, 상기 엘이디소자에서 발생하는 열을 방출할 수 있도록 방열수단이 구비되어 형성된다. In the conventional LED lamp, a plurality of LED elements are attached to a substrate, a voltage output unit for supplying power to the substrate is formed, and a heat radiating means is provided to release heat generated from the LED element.

그러나, 엘이디소자는 오랜시간 빛을 발할 경우에 많은 열이 발생하여 상기 방열수단 등에도 불구하고 조도가 떨어지는 등의 문제점이 발생하였다. However, when the LED device emits light for a long time, a lot of heat is generated, resulting in a problem that the illuminance decreases despite the heat radiating means.

이러한 문제점을 해결하기 위해서 다양한 방열수단이 구비된 엘이디램프에 대한 기술이 대한민국특허청 등록특허공보 제922946호, 공개특허공보 제2009-0046370호 등에 개시된 바 있다.In order to solve this problem, a technique for an LED lamp having various heat dissipation means has been disclosed in Korean Patent Laid-Open No. 922946 and 2009-0046370.

그러나, 종래의 엘이디램프는 다음과 같은 문제점이 있었다. However, the conventional LED lamp has the following problems.

(1) 전도에 의해서만 방열하기 때문에 열을 빠르게 방열하지 못한다.(1) It does not radiate heat quickly because it radiates only by conduction.

(2) 작동유체를 사용하여도 전반적인 작동유체의 흐름을 좋게 할 수 없어서 열전달이 빠르게 이루어지지 않는다.(2) Even though the working fluid is used, the overall working fluid flow cannot be improved, so heat transfer is not fast.

상기한 문제점을 해결하기 위해서 본 발명은 전원을 공급할 수 있도록 형성된 전압출력부와; In order to solve the above problems, the present invention includes a voltage output unit formed to supply power;

상기 전압출력부와 전선으로 연결되는 금속회로기판에 다수개의 엘이디소자가 형성된 엘이디몸체부와; An LED body part having a plurality of LED elements formed on a metal circuit board connected to the voltage output part and a wire;

상기 엘이디몸체부의 금속회로기판이 삽입될 수 있도록 홈이 형성되고, 상기 홈의 후방에 경계벽이 접촉하여 형성되며, 상기 경계벽의 외주연으로 바디프레임이 형성되고, 상기 바디프레임의 후방을 막는 플레이트가 형성되며, 상기 바디프레임의 외주연으로 다수개의 방열핀이 돌출형성된 방열수단으로 구성되는 것을 특징으로 한다.The groove is formed to insert the metal circuit board of the LED body portion, the boundary wall is formed in contact with the rear of the groove, the body frame is formed by the outer periphery of the boundary wall, the plate blocking the rear of the body frame is It is formed, characterized in that consisting of a heat dissipation means protruding a plurality of heat dissipation fins to the outer periphery of the body frame.

상기한 것과 같이 본 발명의 엘이디램프에 의하면 다음과 같은 효과가 발생한다.As described above, according to the LED lamp of the present invention, the following effects occur.

(1) 작동유체에 의해서 열전달이 빠르게 이루어지므로 엘이디소자에서 발생 하는 열을 매우 빠르게 방열한다.(1) Because heat transfer is done quickly by working fluid, it dissipates heat generated by LED element very quickly.

(2) 방열이 원활하게 이루어지므로 엘이디소자의 빛의 세기가 강해진다.(2) Since heat dissipation is performed smoothly, the light intensity of the LED element is increased.

본 발명은 전원을 공급할 수 있도록 형성된 전압출력부(300)와; The present invention and the voltage output unit 300 formed to supply power;

상기 전압출력부(300)와 전선으로 연결되는 금속회로기판(210)에 다수개의 엘이디소자(220)가 형성된 엘이디몸체부(200)와; An LED body part 200 having a plurality of LED elements 220 formed on the metal circuit board 210 connected to the voltage output part 300 by a wire;

상기 엘이디몸체부(200)의 금속회로기판(210)이 전방에 삽입되는 바디프레임(120)이 형성되고, 상기 바디프레임(120)의 후방을 막는 플레이트(104)가 형성되며, 상기 바디프레임(120)의 내벽에 다수개의 윅(127)이 형성되고, 상기 바디프레임(120)의 외주연으로 다수개의 방열핀(125)이 돌출형성된 방열수단(100)으로 구성된다. The body frame 120 into which the metal circuit board 210 of the LED body part 200 is inserted in front is formed, and a plate 104 which blocks the rear of the body frame 120 is formed, and the body frame ( A plurality of wicks 127 are formed on the inner wall of the 120, and the heat dissipation means 100 includes a plurality of heat dissipation fins 125 protruding from the outer circumference of the body frame 120.

상기 엘이디몸체부(200)의 전방에는 확산캡이 형성될 수 있는데, 상기 확산캡은 엘이디소자(220)에서 발산되는 점 광원을 면 광원으로 바꾸어 줄 수 있도록 형성된다. A diffusion cap may be formed in front of the LED body part 200, and the diffusion cap may be formed to change a point light source emitted from the LED element 220 into a surface light source.

상기 전압출력부(300)는 일반적으로 엘이디램프에 사용되는 변압기 및 인덕터로 구성되어, 교류전류를 직류전류로 변환한 후 엘이디몸체부(200)로 전원을 공급하도록 형성된다.The voltage output unit 300 is generally composed of a transformer and an inductor used in the LED lamp, it is formed to convert the AC current into a DC current to supply power to the LED body portion 200.

상기 방열수단(100)은 작동유체의 증발 및 응축을 기재로 열을 전달하고, 작동유체와 접촉하여 전도되는 열을 방열핀(125)을 통해 방열하는 방법을 사용한다. The heat dissipation means 100 transfers heat to the substrate by evaporation and condensation of the working fluid, and uses heat radiating fins 125 to dissipate heat conducted in contact with the working fluid.

상기 바디프레임(120)의 내주연에는 다수개의 윅(127)이 길이방향으로 형성되는데, 상기 윅(127)은 일종의 내벽에 이루어지는 홈으로 응축된 작동유체가 바디프레임(120)의 내벽을 따라 흐를 때 빠르게 귀환할 수 있도록 형성된다.In the inner circumference of the body frame 120, a plurality of wicks 127 are formed in the longitudinal direction, and the wick 127 flows along the inner wall of the body frame 120 by a working fluid condensed into a groove formed in a kind of inner wall. When it is formed to return quickly.

상기 바디프레임(120)의 전방은 엘이디몸체부(200)의 금속회로기판(210)의 후방에 의해서 맞닿아 형성되고, 후방은 플레이트(104)에 의해서 막혀서 내부에 공간부가 형성된다. The front of the body frame 120 is abutted by the rear of the metal circuit board 210 of the LED body portion 200, the rear is blocked by the plate 104 to form a space therein.

상기 바디프레임(120)의 공간부에는 작동유체가 삽입되는데, 상기 작동유체는 증발과 응축이 용이한 다양한 작동유체의 사용이 가능한데, 바디프레임(120)의 재질을 알루미늄으로 사용할 경우 작동유체로 아세톤 사용하는 것이 적당하다.A working fluid is inserted into the space portion of the body frame 120. The working fluid can be used with various working fluids that are easily evaporated and condensed. When the material of the body frame 120 is used as acetone, the working fluid is acetone. It is suitable to use.

상기 방열핀(125)은 알루미늄과 같은 금속재로 열전도율이 높고 가벼운 재료를 사용하는 것이 적당하다.The heat dissipation fin 125 is a metal material such as aluminum, it is suitable to use a high thermal conductivity and light material.

상기 바디프레임(120)의 내부에는 다수개의 경계벽(110)이 형성되어 상기 공간부를 나누어서 형성할 수 있다.A plurality of boundary walls 110 may be formed in the body frame 120 to divide and form the space part.

이하, 본 발명의 바람직한 실시예로 형성된 엘이디램프의 작동을 설명하면 다음과 같다.Hereinafter, the operation of the LED lamp formed in a preferred embodiment of the present invention.

전압출력부(300)에 전원을 공급하면 금속회로기판(210)에 전원이 공급되고, 엘이디소자(220)에서 빛이 발산된다. When power is supplied to the voltage output unit 300, power is supplied to the metal circuit board 210, and light is emitted from the LED device 220.

이때, 엘이디소자(220)가 발산하는 빛의 세기에 따라서 열이 발생하게 되는데, 이러한 열은 금속회로기판(210)에 전도되어 작동유체에 전달된다. At this time, heat is generated according to the intensity of the light emitted by the LED device 220, and the heat is conducted to the metal circuit board 210 and transferred to the working fluid.

열이 작동유체에 전달되면, 작동유체가 열을 흡수하면서 증발하게 되고, 증발한 작동유체는 플레이트(104)부분에서 응축되면서 바디프레임(120)의 내벽을 따라 흐르게 된다.When heat is transferred to the working fluid, the working fluid absorbs heat and evaporates, and the evaporated working fluid flows along the inner wall of the body frame 120 while condensing on the plate 104.

상기와 같이, 응축된 작동유체가 바디프레임(120)의 내벽을 따라 흐를 때 각각의 윅(127)을 따라 흐르면서 열을 방열핀(125)으로 전달한다.As described above, when the condensed working fluid flows along the inner wall of the body frame 120, it flows along each wick 127 and transfers heat to the heat dissipation fin 125.

본 발명은 바디프레임(120)의 내벽에 윅(127)이 형성되어 있어서, 작동유체의 빠른 귀환에 의하여 열전달이 속히 이루어지고, 방열핀(125)과 닿는 면적이 크므로 빠르게 열이 방출된다.In the present invention, the wick 127 is formed on the inner wall of the body frame 120, so that heat transfer is quickly performed by the quick return of the working fluid, and the heat is quickly released because the area is in contact with the heat radiating fin 125.

본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 후술하는 특허청구범위에 의해 포괄되는 본 발명의 범주를 벗어남이 없이 다양한 변형이 가능하다는 것은 명백하다.Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that various modifications may be made therein without departing from the scope of the invention, which is covered by the following claims.

도 1은 본 발명의 바람직한 실시예로 형성된 엘이디램프의 분리사시도. 1 is an exploded perspective view of an LED lamp formed in a preferred embodiment of the present invention.

도 2는 본 발명의 바람직한 실시예로 형성된 엘이디램프의 방열수단의 측단면도. Figure 2 is a side cross-sectional view of the heat dissipation means of the LED lamp formed in a preferred embodiment of the present invention.

도 3은 본 발명의 바람직한 실시예로 형성된 엘이디램프의 방열수단의 평단면도.Figure 3 is a plan sectional view of the heat dissipation means of the LED lamp formed in a preferred embodiment of the present invention.

**<도면의 주요부분에 대한 부호의 설명>**** <Description of the symbols for the main parts of the drawings> **

100 : 방열수단 104 : 플레이트100: heat dissipation means 104: plate

120 : 바디프레임 125 : 방열핀120: body frame 125: heat dissipation fin

127 : 윅 200 : 엘이디몸체부127: Wick 200: LED body

210 : 금속회로기판 220 : 엘이디소자210: metal circuit board 220: LED element

300 : 전압출력부300: voltage output unit

Claims (3)

전원을 공급할 수 있도록 형성된 전압출력부(300)와; A voltage output unit 300 formed to supply power; 상기 전압출력부(300)와 전선으로 연결되는 금속회로기판(210)에 다수개의 엘이디소자(220)가 형성된 엘이디몸체부(200)와;An LED body part 200 having a plurality of LED elements 220 formed on the metal circuit board 210 connected to the voltage output part 300 by a wire; 상기 엘이디몸체부(200)의 금속회로기판(210)이 전방에 삽입되는 바디프레임(120)이 형성되고, 상기 바디프레임(120)의 후방을 막는 플레이트(104)가 형성되며, 상기 바디프레임(120)의 내벽에 다수개의 윅(127)이 형성되고, 상기 바디프레임(120)의 외주연으로 다수개의 방열핀(125)이 돌출형성된 방열수단(100)으로 구성되는 것을 특징으로 하는 엘이디램프.The body frame 120 into which the metal circuit board 210 of the LED body part 200 is inserted in front is formed, and a plate 104 which blocks the rear of the body frame 120 is formed, and the body frame ( LED lamp, characterized in that the plurality of wick 127 is formed on the inner wall of the 120, the heat dissipation means 100 is formed by protruding the plurality of heat dissipation fins 125 by the outer periphery of the body frame (120). 제 1항에 있어서, The method of claim 1, 상기 바디프레임(120)의 전방은 엘이디몸체부(200)의 금속회로기판(210)의 후방에 의해서 직접 맞닿아 형성되고, 후방은 플레이트(104)에 의해서 막혀서 내부에 공간부가 형성되며, 상기 공간부에는 작동유체가 충진되는 것을 특징으로 하는 엘이디램프.The front of the body frame 120 is formed in direct contact with the rear of the metal circuit board 210 of the LED body portion 200, the rear is blocked by the plate 104 to form a space therein, the space LED lamp, characterized in that the filling portion is filled with a working fluid. 제 1항에 있어서, The method of claim 1, 상기 바디프레임(120)의 내부에는 적어도 하나의 경계벽(110)이 형성되는 것을 특징으로 하는 엘이디램프.LED lamp, characterized in that at least one boundary wall (110) is formed inside the body frame (120).
KR1020090125861A 2009-12-17 2009-12-17 Led lamp KR20110069225A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101335347B1 (en) * 2013-04-25 2013-12-03 주식회사 다모텍 Led illumination device
KR20150081501A (en) * 2014-01-06 2015-07-15 에너진(주) Heat-dissipating device for the lighting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101335347B1 (en) * 2013-04-25 2013-12-03 주식회사 다모텍 Led illumination device
KR20150081501A (en) * 2014-01-06 2015-07-15 에너진(주) Heat-dissipating device for the lighting

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