KR20110056377A

KR20110056377A - Multilayer antenna arrangement

Info

Publication number: KR20110056377A
Application number: KR1020117004784A
Authority: KR
Inventors: 프랑크 미르케; 게랄트 쉴마이어; 토마스 랑케스
Original assignee: 카트라인-베르케 카게
Priority date: 2008-09-22
Filing date: 2009-07-23
Publication date: 2011-05-27
Also published as: DE102008048289B3; CA2737225A1; CN102160235B; ES2523347T3; EP2304842B1; JP5296876B2; EP2304842A1; WO2010031459A1; CA2737225C; CN102160235A; KR101540223B1; JP2012503382A; BRPI0919321A2

Abstract

The invention relates in particular to a multi-layered antenna array characterized by the following: having a dielectric carrier 105 and a radiating surface 107 above the base- or central segment 53 "of the patch array 13. One further patch-antenna (B) is provided, in which case the radiating surface 107 is provided on the upper surface 105a of the dielectric carrier 105 opposite to the base- or center segment 53 ". And the additional patch antenna B is at least partially locked / locked in a parasitic patch-array 13 shaped like a box or shaped like a box or shaped like a box or shaped like a box. 13 is formed in whole or in part as the conductive surface 253d, the conductive surfaces surrounding the additional patch-antenna in at least partial regions of the additional patch-antenna B. FIG. It is provided on the edge- or outer surface 105d.

Description

Multilayer Antenna Array {MULTILAYER ANTENNA ARRANGEMENT}

The present invention relates to a multilayer antenna array, in particular with a flat structural shape, according to the preamble of patent claim 1.

Conventional multilayer antennas are known from DE 10 2006 027 694 B3.

The multi-layered antenna of the flat structural shape disclosed in the above publication has a conductive ground plane, a conductive radiation plane (the conductive radiation plane is disposed at a parallel interval with respect to the ground plane) and a sandwich form between the ground plane and the radiation plane. And a dielectric carrier provided by. A support device is disposed on the radiation surface, and an electrically conductive patch element is positioned on the support device. The support device for the patch element has a thickness or height smaller than the thickness or height of the patch element.

The patch element itself may be formed as a volume body, that is to say as a bulk material. The patch material may be made of a metal sheet or metal plate with peripheral protrusions, edges or the like extending in a direction away from the dielectric carrier, for example by a cutting or punching process.

Such an antenna is particularly suitable as an automotive antenna, for example for SDARS services. For this purpose such patch-antennas can be placed next to additional antenna radiators for other services on a common base array.

Such an antenna array with multiple antennas under a common hood is known, for example, from EP 1 616 367 B1.

In the above-mentioned preliminary publication, a multifunctional antenna having a base is known, in which case four different antennas are arranged on the base in a state displaced from each other in the longitudinal direction, and are covered by one hood covering all antennas. have. The prior publication only deals with one example of an antenna array in which four different antennas are used. In many cases, however, it is also referred to as an antenna device for the SDARS-service, which differs from the above-mentioned antennae, for example, and additional patch-antennas for detecting the structural position, ie often briefly GPS-antennas. Antenna arrays are also required that require only a suitable antenna, in which case it does not matter what principle the antenna arrays are based on and / or by which operator such systems are provided (so-called GPS-position detection system). , Galileo-systems and the like are known).

In particular, an improved and improved patch-antenna compared to previous antennas for receiving SDARS-services or for receiving services comparable to the SDARS-services broadcast on the ground in parallel via and / or to satellites. It is known from DE 10 2006 027 694 B3, mentioned in the foreword dealing with objects of the same kind.

Similarly known are patch-antenna-arrays with a plurality of radial planes arranged up and down. In this case, typically one patch-face is arranged on the other patch-face, in particular arranged so as to be inserted in the middle of each substrate. By such an arrangement, antennas operating in different frequency bands may also be implemented. Such antenna arrays are described, for example, in DE 10 2004 035 064 A1, US 7,253,770 B2, US 6,850,191 B1 or in prior publications Pigaglio, O .; Raveu, N .; Pascal, O., "Design of multi-frequency band Circularly Polarized Stacked Microstrip patch Antenna," cited as known from IEEE Antennas and Propagation Society International Symposium, July 5-11, 2008, DOI 10.1109 / APS.2008.4619109. In this case, for example, in the last mentioned "Stacked Patch-Antenna", a plurality of plate-shaped substrate-planes having conductive patch-planes formed on the plate-shaped substrate-plane are overlapped up and down. It is arranged.

US 2008/0218418 A1 discloses, for example, a housing-shaped antenna array with a conductive outer housing, which antenna array is internally filled with a substrate and has parasitic patches on the top surface. have. Under the parasitic patch there is provided one patch face which is active within the substrate, in which case there is another additional patch face which is placed between them, if necessary, between the active patch and the parasitic patch provided on the upper surface of the substrate. Can be formed.

The fact that antenna arrays with active patches and parasitic patches thereon are also basically known in connection with the so-called "horn" connection, is further described, for example, in the further preliminary publication Nasimuddin; Esselle, K. P .; Verma, A. K .; See "Wideband High-Gain Circularly Polarized Stacked Microstrip Antennas With an Optimized C-Type Feed and a Short Horn," IEEE Transactions on Antennas and Propagation, February 2008, Vol. 56, No. 2, pages 578-581.

However, a superior and fundamentally improved improvement over previous antennas, in particular for receiving SDARS-services or for comparable services to the SDARS-services broadcast over the ground and / or in parallel to the satellites. The fact that the patch-antenna is known from DE 10 2006 027 694 B3, mentioned in the preface dealing with the same subject matter, can be mentioned irrespective of the above-disclosed embodiments and disclosed in advance It should be mentioned irrespective of the embodiments described.

If such a patch-antenna with an additional patch-antenna provided for example for GPS service has to be used, the structure essentially emerges from the schematic vertical cross-sectional view of FIG. 1.

FIG. 1 shows an antenna having only a base S, which is only schematically implied and generally conductive, in which case the base is covered by a hood H which transmits electromagnetic radiation. By doing so, the antennas inside the hood H are protected.

In a schematic cross-sectional view there is shown an improved multilayer antenna A with a structure as known, for example, from DE 10 2006 027 694 B3 mentioned in the preface corresponding to WO 2007/144104 A1.

In addition, in the case of the antenna array which is schematically reproduced in the horizontal and vertical cross-sectional view of FIG. 1, a second antenna B, which is generally disposed in the driving direction when installed in a vehicle, is provided, that is, a ground plane lying below. (M), a conventional patch-antenna is provided having an active patch surface R vertically spaced thereon and a dielectric substrate D interposed therebetween. The patch-antenna is-as is known-powered by a power supply line (L), which is supplied from the bottom through the hole to the patch surface (R) via the ground plane (M) and the substrate (D). ), It is galvanically connected to the said patch surface R from there. In this case, the substrate D is preferably made of ceramic, that is, a material having a high dielectric constant.

It is an object of the present invention to supplement conventional antenna arrays by using additional antennas as the basic type for additional services (e.g., mobile wireless communication services in various frequency ranges) as needed.

The problem is solved by the features mentioned in claim 1 of the present invention. Preferred embodiments of the invention are mentioned in the dependent claims.

Within the framework of the present invention, a solution is made in which an antenna array is constructed which is comparable to the antenna array according to FIG. 1 but is much more compact than the example according to FIG.

In the framework of the solution according to the invention, at least a segment of a peripheral edge or wall is arranged on the radiating surface of the first or primary patch antenna, spaced with respect to the radiating surface and extending in a direction away from the radiating surface of the antenna A. An antenna is proposed in which a further patch-antenna B shown in FIG. 1 is arranged in a (passive or parasitic) conductive patch element provided in a manner.

In other words, for example, an additional second or secondary patch-antenna provided for GPS service is housed in a parasitic patch element shaped like a box or shaped like a box, which parasitic patch element is initially mentioned. The antenna A is disposed on the radiation surface.

The additional patch-antenna may be submerged in a partial height within the box-like or box-like patch element. The top surface of the patch element may protrude over the peripheral edge of the box-like or box-like patch element of the first antenna.

However, the edge of the parasitic patch element of the first patch-antenna surrounding at least in a segmented manner terminates on the surface of the further patch-antenna such that the further patch-antenna has a peripheral edge or a peripheral edge segment. It is also possible to be completely locked in the receiving space.

The additional patch antenna, in particular provided for the GPS service, can be seated and / or fixed on the box-shaped or box-like parasitic patch element of the first patch antenna by an intermediate connection of the insulating layer. .

In particular, the additional patch-antenna provided for GPS service does not have its own ground plane, but rather the substrate is supported directly on the box-shaped or box-like parasitic patch element of the first patch-antenna, resulting in the It is also possible for a parasitic patch element of one patch antenna to simultaneously form the ground plane of the additional patch antenna.

Finally, it is revealed in the framework of the present invention that parasitic patch elements with at least a peripheral edge or a peripheral wall formed in a segmented manner can be formed on the underside of the additional patch-antenna and / or on the peripheral edge side. Thus, the box-shaped or box-like patch elements described above are not provided as separate parts in some circumstances, that is to say that box-shaped or box-like patch elements are not provided in whole or in part as separate parts, Rather, corresponding conductive segments of a so-called box-shaped or box-like patch element are formed as a wholly or partially metal deposited layer on corresponding segments of the further patch antenna.

In this case the parasitic patch element of the primary antenna may be formed of a metal deposited layer in whole or in part on the bottom surface of the further patch-antenna and / or on the peripheral sidewall. Such processes can already be implemented when fabricating additional patch antennas, in particular the conductive ground plane in the transmission direction on the substrate of the patch antenna as described above in the form of metal deposition. In the case where the patch-antenna is deposited on the upper and lower surfaces of the substrate, the above processes may be implemented similarly to when the patch-antenna itself is manufactured. In other words, in this case, additional parasitic patch elements that are box-like or box-like provided on the radiating surface of the patch-antenna in the prior art may be omitted as physically independent elements.

The above-described metal deposition layers on the patch-antenna, on the underside of the patch-antenna and / or on one or a plurality of peripheral sides need not be formed to completely surround the periphery, but rather in the circulating direction. For example, it may have interruptions in the corner areas, may differ in height, and may even be galvanically separated from the underlying ground plane or from the underlying parasitic patch element. The aforementioned metal deposition layers on the side can even reach the top surface of the additional patch-antenna, but there it must be separated from the active antenna-patch of the powered additional antenna.

In particular the shape of the additional patch-antenna, in other words the shape of the substrate, among other things, the shape of the lower ground plane, which may at the same time be the face of the parasitic patch element of the first patch-antenna, and the active provided on the transmit / receive side. The shape of the patch face need not necessarily be square or rectangular. The face may be formed in an n-polygon, and may even have other shapes that deviate from the shape having a regular angle. Finally, the sidewalls of the substrate of the additional patch-antenna and / or the sidewalls or sidewalls provided therein at least in a segmented manner and extending in a direction away from the first patch-antenna must also be parallel to the axial direction of the patch-antenna. It does not need to be formed (ie, perpendicular to the various ground planes and / or patch planes), but may have rounded edges, angled edges, and the like. There is no limit in this respect either.

According to the prior art and within the framework of the present invention as compared to the previously known solution described with reference to FIG. 1, the required space for the antenna combination according to the present invention can be significantly reduced. This reduction in overall size is important for vehicle roof-antenna systems manufactured in a critical design, among other things, in which design instructions for the shape of the antenna sheath, which are previously determined by the vehicle manufacturer, are determined. In general, only a small amount of demand space is used.

Unexpectedly, the excellent electrical properties of the corresponding car antenna according to the previously known DE 10 2006 027 694 B3 not only continued to be maintained but even improved, and the required installation space was nevertheless reduced. . However, this is not self-explanatory because additional antennas are inserted into the provided patch-antenna. This is even more unexpected because the antenna system must be suitable for receiving SDARS-services and corresponding antenna structures must be considered very critical to receive such services, because antennas Since they do not have corresponding certain good reception characteristics.

Within the framework of the present invention, the characteristics of the upper GPS antenna are not adversely affected. The same is surprising. Also, within the framework of the present invention, the upper GPS antenna can be made larger, that is, depending on the situation, it can even be formed with the same size as the SDARS-patch surface underneath the GPS antenna. This is an important further difference compared to the prior art, since in the prior art the upper patch antenna was always smaller and must be smaller than the lower patch antenna. The expansion of the GPS-patch antenna also guarantees a clear improvement result for receiving such a service. Even within the framework of the present invention, a preferred embodiment is possible in which the size of the top patch antenna or top dielectric carrier is made larger than the SDARS-patch below it. After all, this fact even leads to improvements in SDARS-patch characteristics.

In addition, within the framework of the present invention, an entire antenna with two patch-radiators can be implemented, in which case the patch-radiators are assembled as a unit after being fully assembled in one proposed step within the framework of mass production. It can be mounted on an antenna-chassis or antenna-base. This has significant advantages over the production flow when manufacturing a conventional antenna array according to the prior art (as shown with reference to FIG. 1).

The invention is explained in detail below with reference to the drawings.
1 is a schematic cross-sectional view of an antenna that can be installed in the roof of an automobile, in particular using a first patch-antenna known in accordance with the prior art and an additional patch-antenna for other services arranged next to it;
2 is a cross-sectional view of an antenna array according to the present invention using first (primary) and second (secondary) patch-antennas;
FIG. 3 is a schematic plan view of the embodiment according to FIG. 2 further showing the major parts of the first patch-antenna under the upper (parasitic) patch element; FIG.
4 is a schematic stereoscopic view of a patch-antenna array according to the invention with two separate patch-antennas;
FIG. 5 is a stereoscopic view corresponding to FIG. 4 but without a second patch-antenna; FIG.
6 is a cross sectional view equivalent to the cross sectional view according to FIG. 2 for a modified embodiment;
7 is a further cross sectional view equivalent to the view according to FIG. 2 or 6 for a further modified embodiment;
FIG. 8 is a three-dimensional view of an antenna array according to the invention with two patch-antennas for the antenna shown in vertical section in FIG. 7;
FIG. 9 is a further variant of the patch-antenna array according to the invention stereoscopically reproduced in FIG. 8;
FIG. 10 is a stereogram of further modifications to FIG. 9; FIG.
FIG. 11 is a further modification of the stereograms reproduced in FIGS. 9 and 10;
12 is a stereoscopic reproduction of further modifications to the embodiment shown in FIG. 8, in particular;
13 is a cross sectional view of a further modified embodiment to illustrate different substrate cross sections for additional patch-antennas;
FIG. 14 is a variant embodiment, in particular with respect to FIG. 4 or 8, in which case the parasitic patch array is partly shaped like a box or like a box, and the partially metallized (conductive) layers are for example added. Formed on the peripheral wall or sidewall of the patch-antenna;
FIG. 15 shows a further variant embodiment, in which case further patch-antennas in the corner areas, for example in the two opposite corner areas, omit the box-shaped or box-like conductive patch elements, but are not parasitic patches. Protrude above the device.

In the following, reference is first made to the embodiment according to FIGS. 2 to 5, which shows a patch-antenna having surfaces and layers arranged overlapping one another along an axis Z in the axial direction. Such patch elements are basically known from DE 10 2006 027 694 B3, the disclosure of which is cited in its entirety. However, the patch elements known from DE 10 2006 027 694 B3 do not have additional patch antennas.

It can be seen from the schematic cross-sectional view according to FIG. 2 that the patch-antenna A has a conductive ground plane 3 on its so-called bottom or installation surface 1. Typically a dielectric carrier 5 having a contour 5 ′ corresponding to the contour 3 ′ of the ground plane 3, when viewed in plan view, is arranged on the ground plane 3 or is in contact with the ground plane 3. It is arrange | positioned in the state off to the side. However, the dielectric carrier 5 may be designed to be larger or smaller in size and / or have a contour 5 'different from the contour 3' of the ground plane 3. The contour 3 ′ of the ground plane may be generally n-polygonal and / or may be formed with curved segments or with segments that are not conventional but curved.

The upper and lower surfaces 5a and 5b of the dielectric carrier 5 generally have a sufficient height or thickness that corresponds to several times the thickness of the ground plane 3. In other words, the dielectric carrier 5 was formed as a three-dimensional body with a sufficient height and thickness, unlike the ground plane 3 consisting of almost only a two-dimensional plane.

Unlike dielectric carrier 5, other types of dielectric or other types of dielectric-structures may be provided that use air or have an air layer in addition to additional dielectric bodies. In the case of using air as a dielectric, the corresponding carrier device must of course be provided with, for example, struts, bolts, pillars, etc., the purpose of which is a patch-antenna above the struts, bolts, pillars and which will be described in more detail below. This is to support and fix additional parts.

A conductive radiation surface 7 is formed on the upper surface 5a opposite to the lower surface 5b, and the conductive radiation surface can again be understood as an almost two-dimensional surface again. The radiation surface 7 is excited by being supplied with power via a power supply line 9, which power supply line is preferably in the transverse direction, in particular perpendicular to the radiation surface 7 from below the base (chassis) ( S), through the ground plane 3 and through the dielectric carrier 5 extend into the corresponding hole or corresponding channel 5c.

In general, an underlying conductor 11 of the coaxial cable, not shown in the drawing, is connected to the power supply line 9 by means of a connection 11 lying below, which may be connected to a coaxial cable not shown in detail in the drawing. The galvanic is electrically connected, and thereby also connected to the radiation surface 7. The outer conductor of the coaxial cable, not shown in the figure, is galvanically connected to the underlying ground plane 3. Instead of connected coaxial lines, micro strip-lines may be used and correspondingly connected.

In the embodiment according to FIG. 2 or less, a patch-antenna having a dielectric 5 and in the form of a square when viewed in plan view is described. However, this shape or the corresponding contour or outer line 5 'may be out of the shape of a square and generally have the shape of an n-polygon. Although not customary, it may even be provided with an outer restriction in the form of a curve.

The radiating surface 7 disposed on the dielectric 5 may have the same contour or external line 7 'as the dielectric 5 beneath it. In the illustrated embodiment, the basic shape is similarly adapted to the outer line 5 'of the dielectric 5 and is formed in a square shape, but at two opposite corners, the basic shape is formed by omitting an isosceles right triangle. Part 7 " (this flat part is only shown in a plan view according to Fig. 3.) In other words, in general, the outer line 7 'can also be an n-polygonal outer line or contour or even It may be provided with a restricting portion which is a curved outer line 7 '.

The ground plane 3 and the radiating plane 7 described above are also partly denoted as "two-dimensional" planes because the thicknesses of the planes are so thin that they cannot be marked as "volumes". to be. The thickness of the ground plane 3 and the radiation plane 7 is typically less than 1 mm, that is to say generally less than 0.5 mm, in particular less than 0.25 mm, 0.20 mm, 0.10 mm.

The patch-antenna mentioned so far may for example consist of a conventional patch-antenna, preferably of a so-called ceramic-patch-antenna with a dielectric carrier layer 5 of ceramic material. Correspondingly to the further statement, the fact that the patch-antenna surpasses the patch-antennas mentioned so far continues to form a stacked-patch-antenna (A), in which case the upper radiating surface (7) ) Is further provided with a parasitic patch element 13 (preferably displaced in parallel with the radiation plane at a distance perpendicular to the radiation plane 7). The parasitic patch element 13 is designed so that the patch element has a different height or thickness with respect to the ground plane 3 and the radiation plane 7 described above, that is to say unlike the ground plane 3 or the radiation plane 7. It was formed into a three dimensional structure to have a higher height or greater thickness.

Preferably a support device 19 (particularly a dielectric support device) having a thickness or height 17 is used, on which the parasitic patch element 13 is fixed and supported. The dielectric support device 19 preferably consists of a cohesive-or coarse layer 19 ', which can be formed, for example, of a so-called double-sided adhesive coarse-and coarse layer 19'. For this purpose, double-sided adhesive adhesive bands or double-sided adhesive foam bands, adhesive pads, and the like, having the corresponding thicknesses typically described above, can be used. This use example opens the simple possibility of fixing and assembling the patch element 13 described above on a conventional patch-antenna, in particular on a top surface of a conventional ceramic-patch-antenna.

The stack-patch-antenna A is positioned on the chassis S, which is indicated only by a line in FIG. 2, that is to say on the base additionally denoted by reference numeral 20. The base can for example be a base-chassis 20 for a car-antenna, on which the antenna according to the invention can be mounted next to additional antennas for other services, depending on the situation. The stack-patch-antenna A according to the invention can be used, for example, as an antenna especially for receiving satellite- or terrestrial signals, such as so-called SDARS-services. However, there are no restrictions on using it for other services.

The patch element 13 may for example consist of an upwardly open box-shaped conductive metal body having a corresponding longitudinal and transverse extension and a sufficient height.

As can be seen from the stereograms according to FIGS. 4 and 5, the patch element 13 can have a rectangular or square structure with a corresponding contour 53 ′, and there is no limitation on such a shape. . In FIG. 4 the upper patch element 13 is shown rectangular or square with a peripheral edge or wall which will be described in more detail below when viewed in plan view. According to the top view of FIG. 3, the parasitic patch element 13 may have a shape which deviates from the original shape, for example, may have an n-polygonal shape. It can be seen in FIG. 3 that the patch element 13 has, for example, two flat vertices 13 " at the two opposite vertices, for example the active radiating surface 7 overlying the patch antenna A. FIG. Is arranged adjacent to the flat portion 7 ".

In the illustrated embodiment, the patch element 13 has a longitudinal extension and a transverse extension, which extensions on one side are larger and / or larger than the longitudinal- and transverse extensions of the radiating surface 7. It is larger than the longitudinal and transverse extensions of the dielectric carrier 5 and / or the ground plane 3 beneath it.

As can be seen from the figures, a parasitic patch element 13 formed in an upwardly open box form seated on or secured to the support device 19 is provided with a base- or segment 53 ". The base- or central plane has a peripheral edge or peripheral projection 53d (generally corresponding ridge 53d) in the illustrated embodiment, the peripheral edge or peripheral projection being at the ground plane. They also protrude horizontally, in particular vertically, from the plane of the parallel base center segment 53 ". Such a patch element 13 can be produced, for example, by a cutting and edging process from a conductive metal sheet, in which case the peripheral protrusion 53d in the corner region is for example by soldering. It may be electrically connected / galvanically connected to one another (there may also be further provided with a recess in the central segment 53 "which will be described in detail below).

Above the secondary patch element 13 there is a second patch-antenna B-as shown in further figures. With regard to the length and width of the second patch-antenna B, the free inner longitudinal and transverse extensions of the length and width of the second patch-antenna are for example between the peripheral protrusions 53d of the parasitic patch element 13. Dimensionally designed at least slightly smaller than. In other words, such a dimensional design opens the possibility that the patch-antenna B can be locked to a different degree in the inner space 53a of the patch element 13. In other words, the lowest level, i.e., the lowest limiting plane 101, lies within the interior space 53a of the parasitic patch element 13, in more detail, the protrusion, edge or upper peripheral edge of the parasitic patch 53d. It lies below the upper limit plane 53c previously set.

The second patch-antenna B again likewise has a substrate (dielectric body) 105 having an upper surface 105a and a lower surface 105b, in this case in the transmit / receive direction (that is, patch- In the direction from the antenna A to the other side), the active radiation surface 107 of the second or secondary patch-antenna B is formed on the upper surface 105a of the substrate 105 as a conductive surface. In the direction towards the patch-antenna A, an associated second ground plane 103 of the second patch-antenna B (ie on the lower surface 105b) is provided.

It can be seen from the figures that additional channels or additional holes 105c are provided horizontally and in particular vertically (ie in the axial Z-direction of the entire antenna array) with respect to the patch-radiator-plane. The channel is passed through the chassis 20, via the first or primary patch-antenna A (ie, via the ground plane, dielectric body and upper radiating plane of the patch-antenna), the patch-antenna A second ground belonging to the patch-antenna B, via a support device 19 and a parasitic patch element 13 connected thereto, via a subsequent support layer for the second patch-antenna B, which in turn It extends through the face 103 and via the dielectric carrier 105 to the overlying second radiation surface 107, ie to the second radiation surface 107 of the second patch-antenna B.

The presence of coaxial connections on the bottom surface of the chassis 20 results in the radiating surface 107 being powered through a power supply line 109 extending into the channel. The outer conductor of the coaxial connection line is galvanically connected to the ground plane 3 at the connection. In the present embodiment, of course, a micro strip connection line may be provided instead of the coaxial connection line.

In the embodiments described so far (in some cases, a carrier layer formed in the form of a support-and / or fixation-and / or adhesive layer adjacent to the top surface of the parasitic patch element 13 at the bottom of the ground plane 103) The height 115 of the second patch-antenna B with 111 is higher than the height 117, ie, the peripheral edge 53d of the parasitic patch element 13, but the height of the patch element is parasitic patch. It may be exactly equal to the height of the peripheral edge 53d of the element 13.

As can be seen with reference to FIG. 6, since the peripheral edge 53d of the parasitic patch element 13 may even be higher than the height of the second patch-antenna B, as a result the second patch-antenna (B) is completely locked into the inner space 53a of the parasitic patch element 13. In addition, FIG. 6 shows that, unlike FIG. 2, the longitudinal and transverse extensions of the additional patch-antenna B, which extend toward the Z-axis, are relatively large so as to at least almost completely fill the internal space of the parasitic patch element 13. It shows the facts.

It can be seen from the cross section according to FIG. 7 that the parasitic patch element 13 (used for the radiation formation of the patch-antenna A) is in this case connected directly to the second patch-antenna B. Is there. The upper patch element 13 belonging to the first or primary patch-antenna A may be made of, for example, a metal deposition layer 253 formed directly on the upper surface of the second patch-antenna B. The deposition process of the metal deposition layer is such that a patch surface or ground plane or a metal deposition layer can be deposited correspondingly to the top or bottom surface of the second patch-antenna B during fabrication of the second patch-antenna (B). It may likewise be carried out in advance when the second patch-antenna B is manufactured. Thus, the parasitic patch element 13 no longer exists as a physically independent element, but rather as a fixed component part of the second patch-antenna (B).

As can be seen from FIGS. 7 and 8, even the separate lower ground plane 103 of the second patch-antenna B is omitted, so that eventually the metal deposition layer 253 is formed of the dielectric carrier 105. The metal deposition layer 253 also has a parasitic patch element 13 at the same time, replacing and / or forming the ground plane 103 of the second patch-antenna B as layer 253d at the bottom surface 105b. Will form. In this embodiment the metal deposition layer 253 is formed at least partially at the peripheral edge 105d, that is to say at the outer surface 105d of the second patch-antenna B, covering the dielectric carrier 105 therein. have. In this case, the lower layer 253b formed on the lower surface 105b in the dielectric carrier 105 of the second patch-antenna B is entirely or at least a segment of the metal deposition layer 253d provided at least partially at the outer circumferential surface. Galvanic electrically connected in a manner.

It can be seen from the diagram according to FIG. 9 that the metal deposition layer 253 formed in the circumferential direction at the outer surface 105d of the second dielectric carrier 105, in other words at the second patch-antenna B, is always present. You don't have to have the same height. Another fact that can be seen from the figures is that, for example, the metal deposition layer 253d formed at one circumferential edge 105d has a recess 253 ', resulting in one having a relatively lower height. While the metal deposition layer remains, one metal deposition layer 253d is formed on the dielectric carrier 105 from the outer surface 105d on the right side of FIG. 9 to the top surface 105a of the substrate 105. It is.

In the variant according to FIG. 10, the peripheral metal deposition layer 253d does not need to be formed to completely surround the periphery, but rather a separate metal deposition layer 253d is formed at the peripheral edge 105d of the dielectric carrier 105. 253 ", wherein the stop is formed to the level of the bottom surface 105b of the dielectric carrier 105. In the variant according to FIG. 10, the stop or recess 253" is an edge region of the substrate. Is provided.

In fact, in a further variant shown with reference to FIG. 11, the fact that the peripheral metal deposition layer 253d formed on the dielectric carrier 105 is even by the separating segment 253e is the bottom surface of the dielectric carrier 105. It is separated from the metal deposition layer 253b formed at 105a, that is, in this embodiment, it is galvanically separated. In the present embodiment, the metal deposition layer 253d is connected to the corner region of the substrate in a galvanic manner so as to surround the periphery.

It can be seen from the embodiment according to FIG. 12 that the metal deposition layer 253 not only extends to the bottom surface 105b and across the peripheral edge or outer wall or outer peripheral surface 105d but also even the outer outer edge. Starting from the surface 105d and extending to the upper surface 105a of the dielectric carrier 105 as the substrate by a predetermined size, but terminated at an interval in front of the upper radiation surface 107 of the second patch-antenna B, Eventually, galvanic electrical separation occurs between the metallization layer 253 and the emissive surface 107 provided on the top surface of the dielectric carrier 105, which is a substrate. In the illustrated embodiment, the conductive layer 253a formed on the upper surface 105a of the dielectric carrier 105 as the substrate is connected to the conductive layer 105d around the outer periphery of the substrate 105.

As can be seen with reference to the cross-sectional view of FIG. 13, the dielectric carrier 105, which is the substrate of the second patch-antenna B, also has a rectangular shape when viewed in a vertical cross-sectional view (vertically with respect to the individual radiating plane). It is not necessary, but rather, a chamfer may be formed on the upper and lower surfaces, or a curved element may be formed on the dielectric carrier 105 as the substrate. If a metal deposition layer 253 is correspondingly provided, the layers are formed along the corresponding outer contour of the substrate.

Further facts to supplement the description are the dielectric carrier 5 of the first patch-antenna A, a ground plane 3 belonging to and lying underneath the dielectric carrier and facing up against the ground plane. The radiating surface 7 is also not necessarily required to have a square or rectangular shape like the dielectric carrier 105 of the second patch-antenna B and the ground plane 103 provided according to the situation and the corresponding radiating surface 107. Rather, it may be very generally equipped with n-polygonal shapes or even with curved edges. In particular, what can be seen with reference to the embodiment shown with reference to FIG. 3 is, for example, flatness (formed in the first patch-antenna A) in two corner regions with the radial surface 7 facing diagonally. While having a portion 7 ", the flat surface 107" is formed corresponding to two diagonally opposite corner regions, the radial surface 107 is to be formed in the second patch-antenna B. It may be. The two flat portions 107 "of the second patch-antenna B are formed to lie in the first patch-antenna A in a state of being rotated by 90 ° with respect to the flat portions 107". In addition, the parasitic patch element may even have opposed flat portions 13 "(as shown in Figure 3), unlike Figures 2 and 4. Also, irregular outer contours, in particular opposite flat portions, Dielectric carriers 5 or 105 may also be formed avoiding corresponding corner areas.

A further embodiment according to FIG. 14 is further cited below, and this embodiment finally reproduces an embodiment that can be described as a combination of the embodiment according to FIG. 4 and the embodiment according to FIG. 11.

As can be seen in the embodiment according to FIG. 14, an upper parasitic patch array 13 is provided similarly to what has been described with reference to FIG. 4 and other embodiments. However, furthermore, an additional patch-antenna B has a metal deposition segment, more specifically a metal deposition layer 253d, on its periphery sidewall, ie on its outer peripheral surface 105d, which is the metal deposition layer. Is only extended to a partial height in this embodiment (but can also be formed to the full height of the additional patch-antenna B). In the illustrated embodiment, the metal deposition layer 253d extends by a height which, when viewed from the side, at least partially protrudes above the peripheral edge 13 'of the upper patch array 13 but also terminates below it. The metal deposition layer 253d may also have segments of different heights across the circumferential surface, the segments being connected to the metal deposition layer formed on the stop, partly on the lower surface of the further patch-antenna B. FIG. Etc. can be provided. In other words, there is no restriction in this respect as well.

It can be seen with reference to FIG. 15 that, for example, the parasitic patch array 13 described above has two, for example, facing each other as already shown in the top view of FIG. 3 and reproduced in a three-dimensional view in FIG. 15. It may be provided with a flat portion, a recess or a so-called omission 13 "in the corner region. In other words, in the present embodiment, the peripheral edge, the wall or the projection 53d also has the flat portion 13 in the corner region. "), In which case an additional patch-antenna B in said box-shaped or box-like parasitic patch element 13 is placed between two neighboring edge segments 53d in the corner region. By protruding outwardly through the opening region 13a formed in the opening, the peripheral edge 105d of the additional patch antenna B can be visually identified.

Claims

A plurality of faces and / or having an inverted F-antenna connected to the patch-antenna A and arranged laterally displaced or not laterally displaced along the axial axis Z; A multilayer antenna having a flat structural shape with layers,
-A conductive ground plane (3) is provided,
A conductive radiation surface 7 which is displaced with respect to the ground plane 3 in the direction of the axial axis Z and extends parallel to the ground plane,
A dielectric carrier 5 is arranged next to the cavity, depending on the situation, at least in part height and / or in the partial region between the ground plane 3 and the radiation plane 7,
The radiating surface 7 is electrically connected to a conductive power supply line 9,
A support device 19 is provided on the side of the radiating surface 7 which faces the ground plane 3,
A conductive parasitic patch-array 13 is provided on the side of the support device 19 opposite to the radiation surface 7,
The support device 19 has a thickness or height 17 smaller than the thickness or height 114 of the parasitic patch-array 13,
The parasitic patch-array 13 has a ridge, edge-, protrusion- or wall segment 53b that is formed in a box shape or similar to a box or at least surrounds it in a segmented manner, the segments being parasitic As a multi-layer antenna, which extends transversely from the base- or central segment 53 "of the patch-array 13, and extends away from the radiation surface 7,
On the base- or central segment 53 "of the patch-array 13 an additional patch-antenna B with a dielectric carrier 105 and a radiating surface 107 is provided, wherein the radiating surface ( 107 is provided on the top surface 105a of the dielectric carrier 105 opposite to the base or center segment 53 ",
The further patch-antenna B is at least partially submerged in a parasitic patch-array 13 shaped like a box or shaped like a box and / or a parasitic patch-array formed to be shaped like a box or shaped like a box ) Is formed in whole or in part by the conductive surface 253d, which is provided at the peripheral edge- or outer surface 105d of the additional patch-antenna in at least a partial region of the additional patch-antenna B. A multi-layer antenna, characterized in that.

The method of claim 1,
The parasitic patch-array 13 has ridges, edges and / or protrusions 53b extending in a direction transversely away from the base- or central segment 53 ", and the ridges, edges and / or protrusions A height (117) is characterized in that it corresponds to or is higher than the height (115) of the further patch-antenna (B).

The method of claim 1,
The parasitic patch-array 13 has ridges, edges, protrusions and / or walls 53b and / or conductive surfaces 253b extending in a direction transversely away from the base- or central segment 53 ", The height 117 of the ridges, edges, protrusions and / or walls and / or conductive surfaces corresponds to the height 115 of the further patch-antenna B or is lower than the height. antenna.

The method according to any one of claims 1 to 3,
Multi-layer antenna, characterized in that the ground plane (103) is formed on the lower surface (105b) of the dielectric carrier (105) of the second patch-antenna (B).

The method of claim 4, wherein
A carrier layer 111 formed in the form of a double-sided adhesive layer, made of a non-conductive material, is provided between the base- or central segment 53 "of the parasitic patch-array 13 and the ground plane 103. Multilayer antenna.

6. The method according to any one of claims 1 to 5,
And a lower surface (105b) of said dielectric carrier (105) is arranged directly on the upper surface of the base- or center segment (53 ") of said parasitic patch-array (13).

The method according to any one of claims 1 to 6,
The longitudinal- and / or transverse extensions of the additional patch-antenna B are parallel to the base- or central segment 53 "of the parasitic patch-array 13, the melting of the parasitic patch-array 13 A multi-layer antenna, characterized in that it extends between the base, edge, protrusion and / or conductive face (53b) by a dimension smaller than the internal dimension measured in the longitudinal and transverse directions.

The method according to any one of claims 1 to 7,
The base- or central segment 53 "of the parasitic patch-array 13 is provided directly to the bottom surface of the dielectric carrier 105 of the second patch-antenna B as a conductive layer or metal deposition layer 253b. A multilayer antenna.

The method according to any one of claims 1 to 8,
The ridges, edges, protrusions and / or walls 53b of the parasitic patch-array 13 deposit a conductive surface or metal on the outer surface 105d of the dielectric carrier 105 of the second patch-antenna B. Formed as a layer (253d).

The method of claim 9,
Wherein the conductive layer or metal deposition layer (253d) formed on the outer circumferential surface (105d) of the dielectric carrier (105) extends in partial height or in full height.

The method according to claim 9 or 10,
The conductive surface or metal deposition layer 253d formed on the outer peripheral surface 105d of the dielectric carrier 105 is galvanic from the conductive layer or metal deposition layer 253d formed on the lower surface 105b of the dielectric carrier 105. A multi-layer antenna, characterized in that it is electrically separated.

The method according to any one of claims 1 to 11,
The upper surface 105a of the dielectric carrier 105 is provided with a conductive surface or a metal deposition layer 253a separated from the radiation surface 107 provided on the upper surface 105a, and the conductive surface or metal deposition layer is provided. And galvanically connected to a conductive surface formed on the outer wall (105d) of the dielectric carrier (105) or the metal deposition layer (253d).

The method according to any one of claims 1 to 12,
The flat surface facing the radiating surface 7 of the patch-antenna A, the radiating surface 107 of the further patch-antenna B and / or the dielectric carrier 105 of the second patch-antenna B And a portion (7 ";107"; 53 ").

The method according to any one of claims 1 to 13,
The metal deposition layer 253d formed at least in the peripheral edge- of the additional patch-antenna B or in the partial region of the outer surface 105 is parallel to the ground plane 3 when viewed from the side, the ground plane ( Multi-layer antenna, characterized in that it protrudes over the edge (13 ') or edge of the box-shaped or box-like parasitic patch array (13) starting from 3).

The method according to any one of claims 1 to 14,
The box-shaped or box-like parasitic patch array 13 has a recess 13a in one corner region or preferably in two or more corner regions which face each other, wherein the peripheral edge ( 53d) with a recess or omission (13a), in which case the edges of the further patch-antenna (B) protrude freely in the region.