KR20110055867A - 발광 장치 - Google Patents
발광 장치 Download PDFInfo
- Publication number
- KR20110055867A KR20110055867A KR1020090112476A KR20090112476A KR20110055867A KR 20110055867 A KR20110055867 A KR 20110055867A KR 1020090112476 A KR1020090112476 A KR 1020090112476A KR 20090112476 A KR20090112476 A KR 20090112476A KR 20110055867 A KR20110055867 A KR 20110055867A
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- South Korea
- Prior art keywords
- light emitting
- emitting device
- lens
- substrate
- package
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000005538 encapsulation Methods 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
- G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (12)
- 기판;상기 기판 상에 설치된 발광 소자 패키지; 및상기 기판에 지지되고 상기 발광 소자 패키지 상에 배치되는 렌즈를 포함하고,상기 렌즈는 상면의 중앙부에 제1 함몰부가 형성되고 하면의 중앙부에 제2 함몰부가 형성되며 상기 제1 함몰부와 제2 함몰부 사이에 배치된 에어 갭이 형성되는 렌즈 몸체와, 상기 렌즈 몸체의 하면에 형성되어 상기 렌즈 몸체가 상기 기판과 이격되도록 상기 렌즈 몸체를 지지하는 렌즈 서포터를 포함하는 발광 장치.
- 제 1항에 있어서,상기 발광 소자 패키지는 적어도 일부분이 상기 제2 함몰부 내에 배치되는 발광 장치.
- 제 1항에 있어서,상기 렌즈 서포터는 복수개가 서로 이격되어 형성되는 발광 장치.
- 제 3항에 있어서,상기 렌즈 서포터는 적어도 3개 이상 형성되는 발광 장치.
- 제 1항에 있어서,상기 렌즈 몸체의 상면 주변부는 평탄하게 형성되는 발광 장치.
- 제 1항에 있어서,상기 렌즈 서포터는 상기 기판에 접착되어 고정되는 발광 장치.
- 제 1항에 있어서,상기 렌즈 몸체의 하면에는 요철 또는 거칠기가 형성되는 발광 장치.
- 제 1항에 있어서,상기 발광 소자 패키지는 상기 기판 상에 패키지 몸체와, 상기 패키지 몸체 상에 적어도 하나의 발광 소자와, 상기 발광 소자를 포위하는 형광체층과, 상기 형광체층 및 패키지 몸체 상에 봉지 수지층을 포함하는 발광 장치.
- 기판;상기 기판 상에 발광 소자 패키지; 및상기 기판에 지지되어 상기 발광 소자 패키지를 포위하고, 상기 발광 소자 패키지 상에 배치되는 렌즈를 포함하고,상기 렌즈는 상기 발광 소자 패키지를 포위하는 봉지부와, 상기 봉지부에서 상측 방향으로 연장되는 지지부와, 상기 지지부에 의해 지지되는 렌즈부를 포함하는 발광 장치.
- 제 9항에 있어서,상기 발광 소자 패키지는 상기 기판 상에 설치된 패키지 몸체와, 상기 패키지 몸체 상에 적어도 하나의 발광 소자와, 상기 발광 소자를 포위하는 형광체층을 포함하는 발광 장치.
- 제 9항에 있어서,상기 봉지부와 렌즈부는 에어 갭을 사이에 두고 이격되어 배치되는 발광 장치.
- 제 9항에 있어서,상기 렌즈부는 상면이 볼록하게 형성되고, 상면 중앙부에 오목한 제1 함몰부가 형성되는 발광 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090112476A KR101039950B1 (ko) | 2009-11-20 | 2009-11-20 | 발광 장치 |
Applications Claiming Priority (1)
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KR1020090112476A KR101039950B1 (ko) | 2009-11-20 | 2009-11-20 | 발광 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20110055867A true KR20110055867A (ko) | 2011-05-26 |
KR101039950B1 KR101039950B1 (ko) | 2011-06-09 |
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KR1020090112476A KR101039950B1 (ko) | 2009-11-20 | 2009-11-20 | 발광 장치 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013081417A1 (en) | 2011-12-02 | 2013-06-06 | Seoul Semiconductor Co., Ltd. | Light emitting module and lens |
KR20130073328A (ko) * | 2011-12-23 | 2013-07-03 | 서울반도체 주식회사 | 발광 모듈 및 렌즈 |
WO2014069880A1 (en) * | 2012-10-30 | 2014-05-08 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
KR20150001978A (ko) * | 2013-06-28 | 2015-01-07 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
US9121555B2 (en) | 2013-04-04 | 2015-09-01 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
KR20170011869A (ko) * | 2015-07-24 | 2017-02-02 | 삼성전자주식회사 | 발광 다이오드 모듈 |
US10047930B2 (en) | 2011-12-02 | 2018-08-14 | Seoul Semiconductor Co., Ltd. | Light emitting module and lens |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101322455B1 (ko) * | 2012-02-15 | 2013-10-28 | 서울반도체 주식회사 | 발광 모듈 및 렌즈 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4029918B2 (ja) | 2005-09-09 | 2008-01-09 | 松下電工株式会社 | Led照明装置 |
KR101429911B1 (ko) * | 2007-12-07 | 2014-08-14 | 엘지디스플레이 주식회사 | 액정표시장치의 광원과 이를 이용한 백라이트 유닛 |
JP4557037B2 (ja) * | 2008-04-08 | 2010-10-06 | ウシオ電機株式会社 | Led光放射装置 |
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2009
- 2009-11-20 KR KR1020090112476A patent/KR101039950B1/ko active IP Right Grant
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10047930B2 (en) | 2011-12-02 | 2018-08-14 | Seoul Semiconductor Co., Ltd. | Light emitting module and lens |
CN104040740A (zh) * | 2011-12-02 | 2014-09-10 | 首尔半导体株式会社 | 发光模块和透镜 |
EP4242516A3 (en) * | 2011-12-02 | 2023-11-22 | Seoul Semiconductor Co., Ltd. | Light emitting module and lens |
EP2786428A4 (en) * | 2011-12-02 | 2015-08-12 | Seoul Semiconductor Co Ltd | LIGHT EMITTING MODULE AND ASSOCIATED LENS |
WO2013081417A1 (en) | 2011-12-02 | 2013-06-06 | Seoul Semiconductor Co., Ltd. | Light emitting module and lens |
EP4001747A1 (en) * | 2011-12-02 | 2022-05-25 | Seoul Semiconductor Co., Ltd. | Lens for a light-emitting diode chip |
US10060579B2 (en) | 2011-12-02 | 2018-08-28 | Seoul Semiconductor Co., Ltd. | Light emitting module and lens |
KR20130073328A (ko) * | 2011-12-23 | 2013-07-03 | 서울반도체 주식회사 | 발광 모듈 및 렌즈 |
WO2014069880A1 (en) * | 2012-10-30 | 2014-05-08 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
US9484510B2 (en) | 2012-10-30 | 2016-11-01 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
US9851059B2 (en) | 2012-10-30 | 2017-12-26 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
US9121555B2 (en) | 2013-04-04 | 2015-09-01 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
US9618181B2 (en) | 2013-04-04 | 2017-04-11 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
KR20150001978A (ko) * | 2013-06-28 | 2015-01-07 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
KR20170011869A (ko) * | 2015-07-24 | 2017-02-02 | 삼성전자주식회사 | 발광 다이오드 모듈 |
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KR101039950B1 (ko) | 2011-06-09 |
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