KR20110055483A - 반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법 - Google Patents

반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법 Download PDF

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Publication number
KR20110055483A
KR20110055483A KR1020107026670A KR20107026670A KR20110055483A KR 20110055483 A KR20110055483 A KR 20110055483A KR 1020107026670 A KR1020107026670 A KR 1020107026670A KR 20107026670 A KR20107026670 A KR 20107026670A KR 20110055483 A KR20110055483 A KR 20110055483A
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KR
South Korea
Prior art keywords
wafer
polishing
pressure plate
support plate
polishing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107026670A
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English (en)
Korean (ko)
Inventor
피터 디. 알브레츠
장 구오치앙
Original Assignee
엠이엠씨 일렉트로닉 머티리얼즈, 인크.
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Publication date
Application filed by 엠이엠씨 일렉트로닉 머티리얼즈, 인크. filed Critical 엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Publication of KR20110055483A publication Critical patent/KR20110055483A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020107026670A 2008-05-30 2009-05-19 반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법 Withdrawn KR20110055483A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/130,190 2008-05-30
US12/130,190 US8192248B2 (en) 2008-05-30 2008-05-30 Semiconductor wafer polishing apparatus and method of polishing

Publications (1)

Publication Number Publication Date
KR20110055483A true KR20110055483A (ko) 2011-05-25

Family

ID=40941363

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107026670A Withdrawn KR20110055483A (ko) 2008-05-30 2009-05-19 반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법

Country Status (6)

Country Link
US (1) US8192248B2 (https=)
EP (1) EP2293902A1 (https=)
JP (1) JP2011522416A (https=)
KR (1) KR20110055483A (https=)
CN (1) CN102046331A (https=)
WO (1) WO2009146274A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600634B2 (en) 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
US11498182B2 (en) * 2016-02-26 2022-11-15 Fujimi Incorporated Polishing method and polishing pad
US10456696B2 (en) 2016-09-13 2019-10-29 Universal City Studios Llc Systems and methods for customizing amusement park attraction experiences using pneumatic robotic systems
CN108296931B (zh) * 2018-02-02 2024-06-21 成都精密光学工程研究中心 一种带磨损补偿的偏摆式平面抛光装置
US11081359B2 (en) 2018-09-10 2021-08-03 Globalwafers Co., Ltd. Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
CN109454547A (zh) * 2018-12-27 2019-03-12 杭州众硅电子科技有限公司 一种用于cmp抛光垫寿命在线检测的系统和方法
CN112894594A (zh) * 2019-05-23 2021-06-04 黄彬庆 一种半导体晶片机械抛光加工系统及方法
CN110421479B (zh) * 2019-07-19 2021-01-26 许昌学院 一种电子器件用半导体晶片抛光设备
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN111906600B (zh) * 2020-08-29 2021-09-28 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
EP4063069B1 (en) * 2021-03-23 2022-12-07 Andrea Valentini Plate-like backing pad adapted for releasable attachment to a hand-held polishing or sanding power tool
CN114871941B (zh) * 2022-04-25 2024-04-05 季华实验室 一种抛光头及抛光机
CN116394153B (zh) * 2023-02-28 2023-10-24 名正(浙江)电子装备有限公司 一种晶圆研磨抛光系统

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US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5664987A (en) 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US5934974A (en) 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
US6531397B1 (en) 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
US6176764B1 (en) * 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
US6120350A (en) * 1999-03-31 2000-09-19 Memc Electronic Materials, Inc. Process for reconditioning polishing pads
JP4056205B2 (ja) * 1999-10-15 2008-03-05 株式会社荏原製作所 ポリッシング装置および方法
JP4307674B2 (ja) * 2000-01-26 2009-08-05 不二越機械工業株式会社 ウェーハの研磨装置
US6878302B1 (en) 2000-03-30 2005-04-12 Memc Electronic Materials, Spa Method of polishing wafers
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6616513B1 (en) 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US6592434B1 (en) 2000-11-16 2003-07-15 Motorola, Inc. Wafer carrier and method of material removal from a semiconductor wafer
JP2004520705A (ja) 2000-11-21 2004-07-08 エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ 半導体ウエハ、研磨装置及び方法
US6764387B1 (en) 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US7207871B1 (en) 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers

Also Published As

Publication number Publication date
JP2011522416A (ja) 2011-07-28
US20090298399A1 (en) 2009-12-03
US8192248B2 (en) 2012-06-05
CN102046331A (zh) 2011-05-04
EP2293902A1 (en) 2011-03-16
WO2009146274A1 (en) 2009-12-03

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